KR20100052662A

KR20100052662A - Substrate scribing apparatus

Info

Publication number: KR20100052662A
Application number: KR1020080111473A
Authority: KR
Inventors: 임주빈
Original assignee: 세메스 주식회사
Priority date: 2008-11-11
Filing date: 2008-11-11
Publication date: 2010-05-20

Abstract

PURPOSE: A substrate scribing apparatus is provided to prevent the generation of defects during a scribing process by transferring a scriber or a support unit for a substrate based on correction values which corresponds to each coordinates. CONSTITUTION: A plurality of cells is formed on a substrate(100). A support unit(200) supports the substrate. A scriber(300) forms scribe lines in order to define cells. The coordinates of the substrate and correction values which correspond to the coordinates are set. A control unit(400) transfers the scriber and the support unit based on the correction values.

Description

Substrate Cutting Device {SUBSTRATE SCRIBING APPARATUS}

The present invention relates to a substrate cutting device, and more particularly to a substrate cutting device that can prevent scribing failure.

Generally, a display panel used for a flat panel display device is provided, and the display panel is completed through the following process.

First, a plurality of cells are formed in a large mother substrate, and the mother substrate is cut into a plurality of cell units. Here, each cell separated from the mother substrate is used as the display panel.

As such, the process of cutting the large mother substrate in cell units includes a method of cutting using a laser beam and a method of using a scribe wheel. In the method of cutting the mother substrate using the scribe wheel, the scribe wheel moves while pressing the mother substrate to form a scribe line on the surface of the mother substrate. Subsequently, when a physical shock is applied to the mother substrate, cracks propagate along the scribe line and are separated into cells.

In the cutting method using the scribe wheel, a scribing apparatus including a head having a scribe wheel and a cylinder for pressing the head toward the mother substrate is used.

However, if the scribing process is performed in a state where the initial setting of the scribing apparatus is wrong, the scribing line is formed diagonally on the mother substrate, which causes a defect in the scribing process.

Accordingly, it is an object of the present invention to provide a substrate cutting apparatus capable of preventing a defect of a scribing process.

The substrate cutting apparatus according to the present invention includes a support member, a scriber, and a controller in order to cut a mother substrate on which a plurality of cells are formed in units of cells.

The support member supports the mother substrate, and the scriber is provided on the mother substrate, and forms a scribe line in the cell unit.

The control unit presets coordinate values of the mother substrate and correction values corresponding to the coordinate values. When the scriber forms the scribe line, the controller moves the scriber or the support member by the correction value corresponding to each coordinate value at each coordinate value.

Specifically, when the scriber proceeds in the first direction, the controller moves the scriber in a second direction perpendicular to the first direction by the correction value corresponding to each coordinate value, and the scriber When advancing in the second direction, the support member is moved in the first direction by the correction value corresponding to the respective coordinate values.

According to such a substrate cutting device, when a scriber setting failure is recognized, the scribing process is performed by moving the support member supporting the scriber or the mother substrate by a correction value corresponding to each coordinate value. Can be prevented.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In this embodiment, the mother substrate for the liquid crystal display panel is described as an example of the cutting object. In addition, the representations of elements in the figures have been exaggerated to emphasize a more clear description.

1 is a plan view illustrating a mother substrate for a liquid crystal display panel, and FIG. 2 is a perspective view illustrating a liquid crystal display panel.

Referring to FIG. 1, the mother substrate 100 has a structure in which first and second large substrates 110 and 120 are combined, and the plurality of cells 101 arranged in a matrix form on the mother substrate 100. This is provided. The mother substrate 100 is cut in units of the plurality of cells 101, and each of the cut cells is provided as a liquid crystal display panel.

As shown in FIG. 2, the liquid crystal display panel 105 has a structure in which a lower substrate 105a and an upper substrate 105b are combined. In the cutting process, the upper substrate 105b is cut into a smaller size than the lower substrate 105a to expose the source side end and the gate side end of the lower substrate 105a to the outside. A data pad portion for receiving a data signal from a source driver is provided at a source side end of the lower substrate 105a, and a gate pad portion for receiving a gate signal from a gate driver is provided at a gate side end.

Although the liquid crystal display panel 105 shown in FIG. 2 has a structure in which both the gate end and the source end are exposed, the liquid crystal display panel 105 may have a structure in which only the source end is exposed.

3 is a view schematically showing a substrate cutting apparatus according to an embodiment of the present invention.

Referring to FIG. 3, the substrate cutting device 500 includes a support member 200, a scriber 300, and a controller 400.

The support member 200 is formed of a stage on which the mother substrate 100 is seated, and the stage 200 is provided with a vacuum hole (not shown) for adsorbing the mother substrate 100.

The scriber 300 is installed on the support member 200, and forms a scribe line SL on the surface of the mother substrate 100. The scriber 300 includes a scribing unit 320, a pressing unit 330, and a moving unit 350. The scribing unit 320 includes a cutting wheel 321, a vibrating head 322 and a holder 323.

The cutting wheel 321 is rotatable, has a generally disk shape, and a circular through hole is formed at the center thereof. In one example of the present invention, the cutting wheel 321 is made of a diamond material. The cutting wheel 321 rotates while pressing the surface of the mother substrate 100 to generate cracks on the surface of the mother substrate 100 to form a scribe line SL. The mother substrate 100 is cut along the scribe line SL and separated into units of the cell 101 (see FIG. 1).

The vibration head 322 is installed above the cutting wheel 321. The vibration head 322 moves horizontally in a predetermined direction to control the cutting wheel 321 to form a scribe line SL in the direction.

In addition, the vibration head 322 generates a vibration in the scribing process to apply vibration to the cutting wheel 321, the cutting wheel 321 is imaged by the vibration transmitted from the vibration head 322 The scribe line SL is formed on the surface of the mother substrate 100 by vibrating in a downward direction. The vibration head 322 may generate vibration by using ultrasonic waves, and in this case, an ultrasonic vibrator may be embedded in the vibration head 322.

The holder 323 fixes the cutting wheel 321 to the lower portion of the vibration head 322. The holder 323 is fixedly coupled to the lower portion of the vibration head 322, a groove is formed in the lower surface is inserted a portion of the cutting wheel 321. The holder 323 has a shaft pin penetrating the through-hole formed in the central portion of the cutting wheel 321. The shaft pin has a circular columnar shape and is mounted in the groove to fix the cutting wheel 321 to the holder 323. During the scribing process, only the cutting wheel 321 rotates while the shaft pin is fixed, and vibration of the vibration head 322 is transmitted to the cutting wheel 321 through the holder 323.

The pressing unit 330 is provided at the upper end of the vibration head 322 so that the cutting wheel 321 may press the surface of the mother substrate 100 with a suitable force during the scribing process. ) Is pressed toward the support 310. As an example of the present invention, a cylinder may be used as the pressing unit 330, and the cylinder pressurizes the vibration head 322 using pneumatic pressure.

The moving part 350 is coupled to one side of the scribing part 320 to move the scribing part 320 in an up / down direction and a horizontal direction. The moving part 350 includes a motor 351, a ball screw 352, a coupling plate 353, and an LM guide 354. When the motor 351 rotates at an appropriate speed, the ball screw 352 converts the rotational motion of the motor 351 into a linear motion. The LM guide 354 is connected to the ball screw 352 through the coupling plate 353 to transfer the linear motion to the scribing unit 320.

When the vertical position of the scribing part 320 is determined by the moving part 350, the moving part 350 performs a scribing process by horizontally moving the scribing part 320 in a predetermined direction.

On the other hand, the control unit 400 controls the driving of the moving unit 350. Specifically, the rotation of the motor 351 is set to set the vertical position of the scribing unit 320, or when the scribing process is started to control the horizontal movement of the scribing unit 320.

In addition, when the scribing line SL is diagonally formed during the scribing process due to an initial setting failure of the scribing unit 320, the controller 400 controls the moving unit 350 to control the scribing unit. Correct the position of the 320, or correct the position of the support member 200. As a result, the scribe line SL may be formed in a straight line instead of an oblique line.

4 is a plan view illustrating a case of correcting the position of the scribing unit, and FIG. 5 is a plan view of a case of correcting the position of the supporting member.

3 and 4, the scriber 300 forms a first scribe line SL1 on the mother substrate 100 while moving in the first direction D1. For example, when an error amount occurs in the first scribe line SL1 due to the twist of the scriber 300 when the scriber 300 moves, the scriber 300 is moved by the error amount. Perform a scribe process.

Specifically, when the traveling position of the scriber 300 on the mother substrate 100 is represented by a coordinate value, the coordinate value corresponding to the initial position (hereinafter, referred to as a first position) of the scriber 300 is “A ( x ₀ , y ₀ ) ", and the coordinate value corresponding to the last position (hereinafter, n-th position) is defined as" A (x ₀ , y _n ) ". Since the error amount of the scriber 300 at the first position A (x ₀ , y ₀ ) is “0”, the position correction value of the scriber 300 (hereinafter, referred to as a first correction value ΔM ₀₀₎ )) Is "0".

However, as the scriber 300 proceeds in the first direction D1, the error amount of the scriber 300 gradually increases to, for example, the second position A (x ₀ , y _n ). Increases to "+100". Therefore, the correction value of the scriber 300 also increases as the first direction D1 progresses, and thus the correction value of the scriber 300 at the second position A (x ₀ , y _n ) Hereinafter, the second correction value ΔM _0n ) becomes “-100”. Here, + and-represent directionality.

That is, the first scriber line SL1 is moved by moving the scriber 300 by a correction value corresponding to each position in the second direction D2 opposite to the direction in which the first scriber line SL1 is twisted. ) May be formed at a predetermined position. As a result, the defect of the scriber process can be prevented.

Meanwhile, referring to FIGS. 3 and 5, when the support member 200 moves in the second direction D2 while the scriber 300 is fixed, the second scribe line SL2 is formed on the mother substrate 100. ) Is formed. In FIG. 5, the support member 200 is not illustrated, but since the mother substrate 100 is seated on the support member 200, the movement of the mother substrate 100 may be represented by the movement of the support member 200. Therefore, when describing FIG. 5, the movement of the supporting member 200 will be described as the movement of the mother substrate 100.

For example, when an error amount is generated in the second scribe line SL2 due to the twist of the scriber 300 when the mother substrate 100 moves, the mother substrate 100 is moved by an error amount. Perform a scribe process.

Specifically, when the traveling position of the scriber 300 on the mother substrate 100 is represented by a coordinate value, the coordinate value corresponding to the initial position (hereinafter, the second position) of the mother substrate 100 is “A ( x0, y1) ", and the coordinate value corresponding to the last position (hereinafter m-th position) is defined as" A (xm, y1) ". Since the error amount of the scriber 300 at the second position A (x0, y1) is “0”, a position correction value of the support member 200 (hereinafter, referred to as a first correction value ΔM ₀₀ ) Is "0".

However, as the mother substrate 100 proceeds in the second direction D2, the error amount of the scriber 300 gradually increases, for example, at the m th position A (xm, y1). Increases up to 100 ". Therefore, the correction value of the support member 200 also increases as the second direction D2 progresses, and the correction value of the support member 200 at the m-th position A (xm, y0) (hereinafter, The third correction value ΔM _mo ) becomes “-100”. Here, + and-represent directionality.

That is, the second scriber line SL2 is positioned by moving the support member 200 by a correction value corresponding to each position in the first direction D1 where the second scriber line SL2 is twisted. Can be formed on. As a result, the defect of the scribing process can be prevented and the yield of a product can be improved.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

1 is a plan view illustrating a mother substrate for a liquid crystal display panel.

2 is a perspective view illustrating a liquid crystal display panel.

4 is a plan view showing a case of correcting the position of the scribing unit.

5 is a plan view showing a case of correcting the position of the support member.

* Description of the symbols for the main parts of the drawings *

100: mother substrate 200: support member

300: scriber 400: control unit

500: substrate cutting device

Claims

In a substrate cutting device for cutting a mother substrate formed with a plurality of cells in cell units,

A support member for supporting the mother substrate;

A scriber provided on the mother substrate to form a scribe line in the cell unit; And

Coordinate values of the mother substrate and correction values corresponding to the respective coordinate values are preset, and when the scribe line is formed through the scriber, the scriber or the support member is adjusted at the respective coordinate values. Substrate cutting device comprising a control unit for moving by.

The apparatus of claim 1, wherein the controller is further configured to perpendicularly scribe the scriber by the correction value corresponding to each coordinate value when the scriber proceeds in a first direction to form a first scribe line. Move in the second direction,

When the scriber proceeds in the third direction to form a second scribe line, the support member is moved in a fourth direction perpendicular to the third direction by the correction value corresponding to each coordinate value. Substrate cutting device.