KR101070354B1 - 모터 냉각 시스템 - Google Patents
모터 냉각 시스템 Download PDFInfo
- Publication number
- KR101070354B1 KR101070354B1 KR1020100098191A KR20100098191A KR101070354B1 KR 101070354 B1 KR101070354 B1 KR 101070354B1 KR 1020100098191 A KR1020100098191 A KR 1020100098191A KR 20100098191 A KR20100098191 A KR 20100098191A KR 101070354 B1 KR101070354 B1 KR 101070354B1
- Authority
- KR
- South Korea
- Prior art keywords
- motor
- cooling water
- chamber
- cooling
- robot
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0054—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/19—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Motor Or Generator Cooling System (AREA)
- Manipulator (AREA)
Abstract
Description
도 2는 본 발명의 바람직한 실시 예에 따른 모터 냉각 시스템의 구성을 분해하여 도시한 분리 구성도,
도 3은 본 발명의 바람직한 실시 예에 따른 모터 냉각 시스템을 연결하여 도시한 구성도,
도 4는 본 발명의 바람직한 실시 예에 따른 냉각수공급관의 내부구조를 도시하는 세부구성도.
20: 물냉각판부(water cooling body) 21: 냉각수순환부
21a: 냉각수순환통로 22: 냉각수순환부 덮개
23a, 25a: 냉각수공급관 24a, 26a: 냉각수회수관
23, 25: 냉각관체결구 24, 26: 회수관체결구
27 : 메인 냉각수공급관 28: 메인 냉각수회수관
30: 챔버로봇 40: 챔버(chamber)
20a: 냉각효과 전달경로
40a: 챔버열(chamber heat) 전달경로
100: 모터 냉각 시스템
Claims (4)
- 삭제
- 모터와, 모터가 연결되는 모터바디와, 상기 모터바디에 연결되어 작동하는 챔버로봇과, 챔버로봇이 설치되는 챔버를 구비하여 작동하는 모터의 냉각 시스템에 있어서,
상기 모터바디와 상기 챔버로봇이 접촉하는 부분에 발생하는 열을 냉각시키기 위하여, 외부로부터 냉각수를 공급하는 냉각수공급관(23a)과, 공급된 냉각수를 회수하기 위한 냉각수회수관(24a)을 연결하고, 상기 모터바디의 내부에 물냉각판부(20)를 고정식으로 일체로 구비하되,
상기 물냉각판부(20)에 구성되는 냉각수공급관(23a) 및 냉각수회수관(24a)은 냉각수를 순환시키기 위한 오목형태의 통로를 갖는 냉각수순환부(21)를 구성하고, 상기 냉각수순환부(21)는 밑면에 설치되는 냉각수순환통로(21a)와 그 윗면을 덮는 냉각수순환부 덮개(22)를 구비하여 이루어지는 것을 특징으로 하는 모터 냉각 시스템(100).
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100098191A KR101070354B1 (ko) | 2010-10-08 | 2010-10-08 | 모터 냉각 시스템 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100098191A KR101070354B1 (ko) | 2010-10-08 | 2010-10-08 | 모터 냉각 시스템 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101070354B1 true KR101070354B1 (ko) | 2011-10-06 |
Family
ID=45032335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100098191A KR101070354B1 (ko) | 2010-10-08 | 2010-10-08 | 모터 냉각 시스템 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101070354B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103401349A (zh) * | 2013-08-19 | 2013-11-20 | 南车株洲电机有限公司 | 电机及其接线盒 |
-
2010
- 2010-10-08 KR KR1020100098191A patent/KR101070354B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103401349A (zh) * | 2013-08-19 | 2013-11-20 | 南车株洲电机有限公司 | 电机及其接线盒 |
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