KR101067996B1 - 선폭 측정 장치의 검사 방법 - Google Patents

선폭 측정 장치의 검사 방법 Download PDF

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Publication number
KR101067996B1
KR101067996B1 KR1020107003227A KR20107003227A KR101067996B1 KR 101067996 B1 KR101067996 B1 KR 101067996B1 KR 1020107003227 A KR1020107003227 A KR 1020107003227A KR 20107003227 A KR20107003227 A KR 20107003227A KR 101067996 B1 KR101067996 B1 KR 101067996B1
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KR
South Korea
Prior art keywords
measurement
stage
interpolation
focusing
substrate
Prior art date
Application number
KR1020107003227A
Other languages
English (en)
Korean (ko)
Other versions
KR20100034038A (ko
Inventor
사토시 히로카와
쇼고 고스게
시게노부 오츠카
Original Assignee
가부시키가이샤 히다치 고쿠사이 덴키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 히다치 고쿠사이 덴키 filed Critical 가부시키가이샤 히다치 고쿠사이 덴키
Publication of KR20100034038A publication Critical patent/KR20100034038A/ko
Application granted granted Critical
Publication of KR101067996B1 publication Critical patent/KR101067996B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/045—Correction of measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020107003227A 2007-09-19 2008-03-07 선폭 측정 장치의 검사 방법 KR101067996B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-242361 2007-09-19
JP2007242361A JP5096852B2 (ja) 2007-09-19 2007-09-19 線幅測定装置および線幅測定装置の検査方法

Publications (2)

Publication Number Publication Date
KR20100034038A KR20100034038A (ko) 2010-03-31
KR101067996B1 true KR101067996B1 (ko) 2011-09-26

Family

ID=40467701

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107003227A KR101067996B1 (ko) 2007-09-19 2008-03-07 선폭 측정 장치의 검사 방법

Country Status (3)

Country Link
JP (1) JP5096852B2 (zh)
KR (1) KR101067996B1 (zh)
WO (1) WO2009037875A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012111603A1 (ja) * 2011-02-17 2012-08-23 シャープ株式会社 線幅測定装置
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
CN103075970B (zh) * 2012-12-27 2015-07-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
US9110039B2 (en) * 2013-07-25 2015-08-18 Kla-Tencor Corporation Auto-focus system and methods for die-to-die inspection
CN103837085B (zh) * 2014-03-07 2016-07-06 哈尔滨工业大学 基于激光跟踪仪逐点标定的目标位移矢量测量装置及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228411A (ja) 2001-02-05 2002-08-14 Hitachi Kokusai Electric Inc 二次元測定装置
JP2006179532A (ja) 2004-12-20 2006-07-06 Disco Abrasive Syst Ltd 焦点調整方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004294358A (ja) * 2003-03-28 2004-10-21 Hitachi High-Technologies Corp 欠陥検査方法および装置
JP4119788B2 (ja) * 2003-05-23 2008-07-16 三菱重工業株式会社 形状計測システム及び方法
JP2007121981A (ja) * 2005-09-30 2007-05-17 Matsushita Electric Ind Co Ltd 基板検査方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228411A (ja) 2001-02-05 2002-08-14 Hitachi Kokusai Electric Inc 二次元測定装置
JP2006179532A (ja) 2004-12-20 2006-07-06 Disco Abrasive Syst Ltd 焦点調整方法

Also Published As

Publication number Publication date
WO2009037875A1 (ja) 2009-03-26
KR20100034038A (ko) 2010-03-31
JP5096852B2 (ja) 2012-12-12
JP2009074849A (ja) 2009-04-09

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