KR101067996B1 - 선폭 측정 장치의 검사 방법 - Google Patents

선폭 측정 장치의 검사 방법 Download PDF

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Publication number
KR101067996B1
KR101067996B1 KR1020107003227A KR20107003227A KR101067996B1 KR 101067996 B1 KR101067996 B1 KR 101067996B1 KR 1020107003227 A KR1020107003227 A KR 1020107003227A KR 20107003227 A KR20107003227 A KR 20107003227A KR 101067996 B1 KR101067996 B1 KR 101067996B1
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South Korea
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measurement
stage
interpolation
focusing
substrate
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KR1020107003227A
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Korean (ko)
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KR20100034038A (ko
Inventor
사토시 히로카와
쇼고 고스게
시게노부 오츠카
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가부시키가이샤 히다치 고쿠사이 덴키
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Publication of KR20100034038A publication Critical patent/KR20100034038A/ko
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Publication of KR101067996B1 publication Critical patent/KR101067996B1/ko
Assigned to 브이 테크놀로지 씨오. 엘티디 reassignment 브이 테크놀로지 씨오. 엘티디 권리의 전부이전등록 Assignors: 가부시키가이샤 히다치 고쿠사이 덴키
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/045—Correction of measurements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020107003227A 2007-09-19 2008-03-07 선폭 측정 장치의 검사 방법 Active KR101067996B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007242361A JP5096852B2 (ja) 2007-09-19 2007-09-19 線幅測定装置および線幅測定装置の検査方法
JPJP-P-2007-242361 2007-09-19

Publications (2)

Publication Number Publication Date
KR20100034038A KR20100034038A (ko) 2010-03-31
KR101067996B1 true KR101067996B1 (ko) 2011-09-26

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ID=40467701

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Application Number Title Priority Date Filing Date
KR1020107003227A Active KR101067996B1 (ko) 2007-09-19 2008-03-07 선폭 측정 장치의 검사 방법

Country Status (3)

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JP (1) JP5096852B2 (https=)
KR (1) KR101067996B1 (https=)
WO (1) WO2009037875A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012111603A1 (ja) * 2011-02-17 2012-08-23 シャープ株式会社 線幅測定装置
CN103075970B (zh) * 2012-12-27 2015-07-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
US9110039B2 (en) * 2013-07-25 2015-08-18 Kla-Tencor Corporation Auto-focus system and methods for die-to-die inspection
CN103837085B (zh) * 2014-03-07 2016-07-06 哈尔滨工业大学 基于激光跟踪仪逐点标定的目标位移矢量测量装置及方法
JP7751418B2 (ja) * 2021-09-03 2025-10-08 シャープ株式会社 撮像システムおよび合焦位置判定方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228411A (ja) 2001-02-05 2002-08-14 Hitachi Kokusai Electric Inc 二次元測定装置
JP2006179532A (ja) 2004-12-20 2006-07-06 Disco Abrasive Syst Ltd 焦点調整方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004294358A (ja) * 2003-03-28 2004-10-21 Hitachi High-Technologies Corp 欠陥検査方法および装置
JP4119788B2 (ja) * 2003-05-23 2008-07-16 三菱重工業株式会社 形状計測システム及び方法
JP2007121981A (ja) * 2005-09-30 2007-05-17 Matsushita Electric Ind Co Ltd 基板検査方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228411A (ja) 2001-02-05 2002-08-14 Hitachi Kokusai Electric Inc 二次元測定装置
JP2006179532A (ja) 2004-12-20 2006-07-06 Disco Abrasive Syst Ltd 焦点調整方法

Also Published As

Publication number Publication date
JP5096852B2 (ja) 2012-12-12
WO2009037875A1 (ja) 2009-03-26
JP2009074849A (ja) 2009-04-09
KR20100034038A (ko) 2010-03-31

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