KR101062029B1 - 반도체 디바이스에서 게이트 임계 치수를 개선시키기 위한 게이트 물질 평탄화 - Google Patents
반도체 디바이스에서 게이트 임계 치수를 개선시키기 위한 게이트 물질 평탄화 Download PDFInfo
- Publication number
- KR101062029B1 KR101062029B1 KR1020057008203A KR20057008203A KR101062029B1 KR 101062029 B1 KR101062029 B1 KR 101062029B1 KR 1020057008203 A KR1020057008203 A KR 1020057008203A KR 20057008203 A KR20057008203 A KR 20057008203A KR 101062029 B1 KR101062029 B1 KR 101062029B1
- Authority
- KR
- South Korea
- Prior art keywords
- gate
- gate material
- gate structure
- fin
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P10/00—Bonding of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
- H10D30/6212—Fin field-effect transistors [FinFET] having fin-shaped semiconductor bodies having non-rectangular cross-sections
Landscapes
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/290,276 US6787439B2 (en) | 2002-11-08 | 2002-11-08 | Method using planarizing gate material to improve gate critical dimension in semiconductor devices |
| US10/290,276 | 2002-11-08 | ||
| PCT/US2003/032655 WO2004044973A1 (en) | 2002-11-08 | 2003-10-14 | Planarizing gate material to improve gate critical dimension in semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050062655A KR20050062655A (ko) | 2005-06-23 |
| KR101062029B1 true KR101062029B1 (ko) | 2011-09-05 |
Family
ID=32229010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020057008203A Expired - Lifetime KR101062029B1 (ko) | 2002-11-08 | 2003-10-14 | 반도체 디바이스에서 게이트 임계 치수를 개선시키기 위한 게이트 물질 평탄화 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6787439B2 (https=) |
| EP (1) | EP1559137A1 (https=) |
| JP (1) | JP2006505949A (https=) |
| KR (1) | KR101062029B1 (https=) |
| CN (1) | CN100505182C (https=) |
| AU (1) | AU2003282842A1 (https=) |
| TW (1) | TWI315548B (https=) |
| WO (1) | WO2004044973A1 (https=) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7358121B2 (en) * | 2002-08-23 | 2008-04-15 | Intel Corporation | Tri-gate devices and methods of fabrication |
| US7091068B1 (en) * | 2002-12-06 | 2006-08-15 | Advanced Micro Devices, Inc. | Planarizing sacrificial oxide to improve gate critical dimension in semiconductor devices |
| US6872647B1 (en) * | 2003-05-06 | 2005-03-29 | Advanced Micro Devices, Inc. | Method for forming multiple fins in a semiconductor device |
| US6756643B1 (en) * | 2003-06-12 | 2004-06-29 | Advanced Micro Devices, Inc. | Dual silicon layer for chemical mechanical polishing planarization |
| US7456476B2 (en) | 2003-06-27 | 2008-11-25 | Intel Corporation | Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication |
| US6909151B2 (en) | 2003-06-27 | 2005-06-21 | Intel Corporation | Nonplanar device with stress incorporation layer and method of fabrication |
| US7624192B2 (en) * | 2003-12-30 | 2009-11-24 | Microsoft Corporation | Framework for user interaction with multiple network devices |
| US7105390B2 (en) * | 2003-12-30 | 2006-09-12 | Intel Corporation | Nonplanar transistors with metal gate electrodes |
| US7268058B2 (en) * | 2004-01-16 | 2007-09-11 | Intel Corporation | Tri-gate transistors and methods to fabricate same |
| US7115947B2 (en) * | 2004-03-18 | 2006-10-03 | International Business Machines Corporation | Multiple dielectric finfet structure and method |
| US7154118B2 (en) * | 2004-03-31 | 2006-12-26 | Intel Corporation | Bulk non-planar transistor having strained enhanced mobility and methods of fabrication |
| CN100461373C (zh) * | 2004-05-20 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | 化学机械抛光用于接合多晶硅插拴制造方法及其结构 |
| US7579280B2 (en) * | 2004-06-01 | 2009-08-25 | Intel Corporation | Method of patterning a film |
| US7042009B2 (en) | 2004-06-30 | 2006-05-09 | Intel Corporation | High mobility tri-gate devices and methods of fabrication |
| US7348284B2 (en) | 2004-08-10 | 2008-03-25 | Intel Corporation | Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow |
| US7071064B2 (en) * | 2004-09-23 | 2006-07-04 | Intel Corporation | U-gate transistors and methods of fabrication |
| US7422946B2 (en) | 2004-09-29 | 2008-09-09 | Intel Corporation | Independently accessed double-gate and tri-gate transistors in same process flow |
| US7332439B2 (en) | 2004-09-29 | 2008-02-19 | Intel Corporation | Metal gate transistors with epitaxial source and drain regions |
| US7361958B2 (en) | 2004-09-30 | 2008-04-22 | Intel Corporation | Nonplanar transistors with metal gate electrodes |
| US20060086977A1 (en) * | 2004-10-25 | 2006-04-27 | Uday Shah | Nonplanar device with thinned lower body portion and method of fabrication |
| US7193279B2 (en) * | 2005-01-18 | 2007-03-20 | Intel Corporation | Non-planar MOS structure with a strained channel region |
| US7518196B2 (en) * | 2005-02-23 | 2009-04-14 | Intel Corporation | Field effect transistor with narrow bandgap source and drain regions and method of fabrication |
| US20060202266A1 (en) | 2005-03-14 | 2006-09-14 | Marko Radosavljevic | Field effect transistor with metal source/drain regions |
| US7563701B2 (en) * | 2005-03-31 | 2009-07-21 | Intel Corporation | Self-aligned contacts for transistors |
| JP4648096B2 (ja) * | 2005-06-03 | 2011-03-09 | 株式会社東芝 | 半導体装置の製造方法 |
| US7858481B2 (en) | 2005-06-15 | 2010-12-28 | Intel Corporation | Method for fabricating transistor with thinned channel |
| US7547637B2 (en) | 2005-06-21 | 2009-06-16 | Intel Corporation | Methods for patterning a semiconductor film |
| US7279375B2 (en) * | 2005-06-30 | 2007-10-09 | Intel Corporation | Block contact architectures for nanoscale channel transistors |
| US7402875B2 (en) | 2005-08-17 | 2008-07-22 | Intel Corporation | Lateral undercut of metal gate in SOI device |
| US7479421B2 (en) | 2005-09-28 | 2009-01-20 | Intel Corporation | Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby |
| US20070090416A1 (en) | 2005-09-28 | 2007-04-26 | Doyle Brian S | CMOS devices with a single work function gate electrode and method of fabrication |
| US7485503B2 (en) | 2005-11-30 | 2009-02-03 | Intel Corporation | Dielectric interface for group III-V semiconductor device |
| US7396711B2 (en) * | 2005-12-27 | 2008-07-08 | Intel Corporation | Method of fabricating a multi-cornered film |
| US20070152266A1 (en) * | 2005-12-29 | 2007-07-05 | Intel Corporation | Method and structure for reducing the external resistance of a three-dimensional transistor through use of epitaxial layers |
| US7544594B2 (en) * | 2006-06-28 | 2009-06-09 | Intel Corporation | Method of forming a transistor having gate protection and transistor formed according to the method |
| US8143646B2 (en) | 2006-08-02 | 2012-03-27 | Intel Corporation | Stacking fault and twin blocking barrier for integrating III-V on Si |
| US7435671B2 (en) * | 2006-08-18 | 2008-10-14 | International Business Machines Corporation | Trilayer resist scheme for gate etching applications |
| ES2489615T3 (es) * | 2007-12-11 | 2014-09-02 | Apoteknos Para La Piel, S.L. | Uso de un compuesto derivado del acido p-hidroxifenil propionico para el tratamiento de la psoriasis |
| US8362566B2 (en) | 2008-06-23 | 2013-01-29 | Intel Corporation | Stress in trigate devices using complimentary gate fill materials |
| JP2010258124A (ja) * | 2009-04-23 | 2010-11-11 | Renesas Electronics Corp | 半導体装置及び半導体装置の製造方法 |
| CN102386065A (zh) * | 2010-09-01 | 2012-03-21 | 无锡华润上华半导体有限公司 | 改善光刻临界尺寸均匀性的方法 |
| US9041125B2 (en) * | 2013-03-11 | 2015-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fin shape for fin field-effect transistors and method of forming |
| US9437445B1 (en) * | 2015-02-24 | 2016-09-06 | International Business Machines Corporation | Dual fin integration for electron and hole mobility enhancement |
| US11018225B2 (en) * | 2016-06-28 | 2021-05-25 | International Business Machines Corporation | III-V extension by high temperature plasma doping |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5315143A (en) | 1992-04-28 | 1994-05-24 | Matsushita Electric Industrial Co., Ltd. | High density integrated semiconductor device |
| US5932911A (en) * | 1996-12-13 | 1999-08-03 | Advanced Micro Devices, Inc. | Bar field effect transistor |
| US6013570A (en) | 1998-07-17 | 2000-01-11 | Advanced Micro Devices, Inc. | LDD transistor using novel gate trim technique |
| JP2000208393A (ja) * | 1999-01-12 | 2000-07-28 | Asahi Kasei Microsystems Kk | 半導体装置の製造方法 |
| DE60007208T2 (de) * | 1999-03-25 | 2004-11-18 | Infineon Technologies Ag | Reflexionsvermindernde Schicht zur Kontrolle von kritischen Dimensionen |
| US6391782B1 (en) | 2000-06-20 | 2002-05-21 | Advanced Micro Devices, Inc. | Process for forming multiple active lines and gate-all-around MOSFET |
| US6396108B1 (en) | 2000-11-13 | 2002-05-28 | Advanced Micro Devices, Inc. | Self-aligned double gate silicon-on-insulator (SOI) device |
| US6475869B1 (en) | 2001-02-26 | 2002-11-05 | Advanced Micro Devices, Inc. | Method of forming a double gate transistor having an epitaxial silicon/germanium channel region |
| FR2822293B1 (fr) * | 2001-03-13 | 2007-03-23 | Nat Inst Of Advanced Ind Scien | Transistor a effet de champ et double grille, circuit integre comportant ce transistor, et procede de fabrication de ce dernier |
| JP3543117B2 (ja) * | 2001-03-13 | 2004-07-14 | 独立行政法人産業技術総合研究所 | 二重ゲート電界効果トランジスタ |
| US6458662B1 (en) * | 2001-04-04 | 2002-10-01 | Advanced Micro Devices, Inc. | Method of fabricating a semiconductor device having an asymmetrical dual-gate silicon-germanium (SiGe) channel MOSFET and a device thereby formed |
| TW508737B (en) * | 2001-05-02 | 2002-11-01 | United Microelectronics Corp | Planarization method for bottom anti-reflective layer during dual damascene process |
| US20020171107A1 (en) * | 2001-05-21 | 2002-11-21 | Baohong Cheng | Method for forming a semiconductor device having elevated source and drain regions |
-
2002
- 2002-11-08 US US10/290,276 patent/US6787439B2/en not_active Expired - Lifetime
-
2003
- 2003-10-14 KR KR1020057008203A patent/KR101062029B1/ko not_active Expired - Lifetime
- 2003-10-14 EP EP03774839A patent/EP1559137A1/en not_active Ceased
- 2003-10-14 CN CNB2003801027603A patent/CN100505182C/zh not_active Expired - Lifetime
- 2003-10-14 AU AU2003282842A patent/AU2003282842A1/en not_active Abandoned
- 2003-10-14 JP JP2004551525A patent/JP2006505949A/ja active Pending
- 2003-10-14 WO PCT/US2003/032655 patent/WO2004044973A1/en not_active Ceased
- 2003-11-03 TW TW092130613A patent/TWI315548B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200414326A (en) | 2004-08-01 |
| WO2004044973A1 (en) | 2004-05-27 |
| US6787439B2 (en) | 2004-09-07 |
| KR20050062655A (ko) | 2005-06-23 |
| EP1559137A1 (en) | 2005-08-03 |
| US20040092062A1 (en) | 2004-05-13 |
| TWI315548B (en) | 2009-10-01 |
| AU2003282842A1 (en) | 2004-06-03 |
| CN1711630A (zh) | 2005-12-21 |
| JP2006505949A (ja) | 2006-02-16 |
| CN100505182C (zh) | 2009-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101062029B1 (ko) | 반도체 디바이스에서 게이트 임계 치수를 개선시키기 위한 게이트 물질 평탄화 | |
| KR101029383B1 (ko) | 분리된 게이트를 가지는 더블 게이트 반도체 디바이스 | |
| US6645797B1 (en) | Method for forming fins in a FinFET device using sacrificial carbon layer | |
| US6686231B1 (en) | Damascene gate process with sacrificial oxide in semiconductor devices | |
| US6833588B2 (en) | Semiconductor device having a U-shaped gate structure | |
| US6764884B1 (en) | Method for forming a gate in a FinFET device and thinning a fin in a channel region of the FinFET device | |
| US6872647B1 (en) | Method for forming multiple fins in a semiconductor device | |
| US6855607B2 (en) | Multi-step chemical mechanical polishing of a gate area in a FinFET | |
| KR20060123480A (ko) | 얇아진 바디를 갖는 좁은 바디의 다마신 3중 게이트 핀펫 | |
| JP2007501524A (ja) | 全体的な設計目標を達成すべく、半導体デバイス中のキャリア移動度の可変な半導体デバイス | |
| KR101066270B1 (ko) | 다마신 3중 게이트 핀펫 | |
| US6876042B1 (en) | Additional gate control for a double-gate MOSFET | |
| US6911697B1 (en) | Semiconductor device having a thin fin and raised source/drain areas | |
| US6967175B1 (en) | Damascene gate semiconductor processing with local thinning of channel region | |
| US7416925B2 (en) | Doped structure for finfet devices | |
| US6960804B1 (en) | Semiconductor device having a gate structure surrounding a fin | |
| US6995438B1 (en) | Semiconductor device with fully silicided source/drain and damascence metal gate | |
| US7091068B1 (en) | Planarizing sacrificial oxide to improve gate critical dimension in semiconductor devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20150729 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20160727 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20170804 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20180730 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| PC1801 | Expiration of term |
St.27 status event code: N-4-6-H10-H14-oth-PC1801 Not in force date: 20231015 Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |