KR101055558B1 - 방열기판 및 그 제조방법 - Google Patents
방열기판 및 그 제조방법 Download PDFInfo
- Publication number
- KR101055558B1 KR101055558B1 KR1020100002301A KR20100002301A KR101055558B1 KR 101055558 B1 KR101055558 B1 KR 101055558B1 KR 1020100002301 A KR1020100002301 A KR 1020100002301A KR 20100002301 A KR20100002301 A KR 20100002301A KR 101055558 B1 KR101055558 B1 KR 101055558B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- porous layer
- porous
- metal core
- circuit
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100002301A KR101055558B1 (ko) | 2010-01-11 | 2010-01-11 | 방열기판 및 그 제조방법 |
JP2010097185A JP4964322B2 (ja) | 2010-01-11 | 2010-04-20 | 放熱基板およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100002301A KR101055558B1 (ko) | 2010-01-11 | 2010-01-11 | 방열기판 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110082354A KR20110082354A (ko) | 2011-07-19 |
KR101055558B1 true KR101055558B1 (ko) | 2011-08-08 |
Family
ID=44457915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100002301A KR101055558B1 (ko) | 2010-01-11 | 2010-01-11 | 방열기판 및 그 제조방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4964322B2 (ja) |
KR (1) | KR101055558B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102134296B1 (ko) * | 2014-09-23 | 2020-07-15 | (주)포인트엔지니어링 | 안테나 |
KR102351183B1 (ko) * | 2014-12-31 | 2022-01-14 | 삼성전기주식회사 | 방열형 인쇄회로기판 및 그 제조 방법 |
KR102527719B1 (ko) * | 2015-05-29 | 2023-05-02 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
KR102277800B1 (ko) * | 2019-12-11 | 2021-07-16 | 현대모비스 주식회사 | 방열판 일체형 파워 모듈 및 이의 제조방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH114058A (ja) | 1997-06-13 | 1999-01-06 | Kyocera Corp | 容量素子付き回路基板 |
JP2003057461A (ja) * | 2001-05-10 | 2003-02-26 | Canon Inc | 光電融合基板および電子機器 |
JP2007251176A (ja) * | 2006-03-17 | 2007-09-27 | Samsung Electro-Mechanics Co Ltd | 陽極酸化金属基板モジュール |
US20090242023A1 (en) * | 2005-11-25 | 2009-10-01 | Israel Aircraft Industries Ltd. | System and method for producing a solar cell array |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62117350A (ja) * | 1985-11-18 | 1987-05-28 | Sumitomo Electric Ind Ltd | 半導体装置用基板の製造方法 |
JPH10135593A (ja) * | 1996-10-31 | 1998-05-22 | Shirai Denshi Kogyo Kk | プリント回路用基板 |
JP2006165363A (ja) * | 2004-12-09 | 2006-06-22 | Nikon Corp | 支持装置、ステージ装置及び露光装置 |
-
2010
- 2010-01-11 KR KR1020100002301A patent/KR101055558B1/ko not_active IP Right Cessation
- 2010-04-20 JP JP2010097185A patent/JP4964322B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH114058A (ja) | 1997-06-13 | 1999-01-06 | Kyocera Corp | 容量素子付き回路基板 |
JP2003057461A (ja) * | 2001-05-10 | 2003-02-26 | Canon Inc | 光電融合基板および電子機器 |
US20090242023A1 (en) * | 2005-11-25 | 2009-10-01 | Israel Aircraft Industries Ltd. | System and method for producing a solar cell array |
JP2007251176A (ja) * | 2006-03-17 | 2007-09-27 | Samsung Electro-Mechanics Co Ltd | 陽極酸化金属基板モジュール |
Also Published As
Publication number | Publication date |
---|---|
KR20110082354A (ko) | 2011-07-19 |
JP4964322B2 (ja) | 2012-06-27 |
JP2011142285A (ja) | 2011-07-21 |
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