KR101055558B1 - 방열기판 및 그 제조방법 - Google Patents

방열기판 및 그 제조방법 Download PDF

Info

Publication number
KR101055558B1
KR101055558B1 KR1020100002301A KR20100002301A KR101055558B1 KR 101055558 B1 KR101055558 B1 KR 101055558B1 KR 1020100002301 A KR1020100002301 A KR 1020100002301A KR 20100002301 A KR20100002301 A KR 20100002301A KR 101055558 B1 KR101055558 B1 KR 101055558B1
Authority
KR
South Korea
Prior art keywords
layer
porous layer
porous
metal core
circuit
Prior art date
Application number
KR1020100002301A
Other languages
English (en)
Korean (ko)
Other versions
KR20110082354A (ko
Inventor
김태훈
신상현
박지현
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020100002301A priority Critical patent/KR101055558B1/ko
Priority to JP2010097185A priority patent/JP4964322B2/ja
Publication of KR20110082354A publication Critical patent/KR20110082354A/ko
Application granted granted Critical
Publication of KR101055558B1 publication Critical patent/KR101055558B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020100002301A 2010-01-11 2010-01-11 방열기판 및 그 제조방법 KR101055558B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020100002301A KR101055558B1 (ko) 2010-01-11 2010-01-11 방열기판 및 그 제조방법
JP2010097185A JP4964322B2 (ja) 2010-01-11 2010-04-20 放熱基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100002301A KR101055558B1 (ko) 2010-01-11 2010-01-11 방열기판 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20110082354A KR20110082354A (ko) 2011-07-19
KR101055558B1 true KR101055558B1 (ko) 2011-08-08

Family

ID=44457915

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100002301A KR101055558B1 (ko) 2010-01-11 2010-01-11 방열기판 및 그 제조방법

Country Status (2)

Country Link
JP (1) JP4964322B2 (ja)
KR (1) KR101055558B1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102134296B1 (ko) 2014-09-23 2020-07-15 (주)포인트엔지니어링 안테나
KR102351183B1 (ko) * 2014-12-31 2022-01-14 삼성전기주식회사 방열형 인쇄회로기판 및 그 제조 방법
KR102527719B1 (ko) * 2015-05-29 2023-05-02 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR102277800B1 (ko) * 2019-12-11 2021-07-16 현대모비스 주식회사 방열판 일체형 파워 모듈 및 이의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH114058A (ja) 1997-06-13 1999-01-06 Kyocera Corp 容量素子付き回路基板
JP2003057461A (ja) * 2001-05-10 2003-02-26 Canon Inc 光電融合基板および電子機器
JP2007251176A (ja) * 2006-03-17 2007-09-27 Samsung Electro-Mechanics Co Ltd 陽極酸化金属基板モジュール
US20090242023A1 (en) * 2005-11-25 2009-10-01 Israel Aircraft Industries Ltd. System and method for producing a solar cell array

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62117350A (ja) * 1985-11-18 1987-05-28 Sumitomo Electric Ind Ltd 半導体装置用基板の製造方法
JPH10135593A (ja) * 1996-10-31 1998-05-22 Shirai Denshi Kogyo Kk プリント回路用基板
JP2006165363A (ja) * 2004-12-09 2006-06-22 Nikon Corp 支持装置、ステージ装置及び露光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH114058A (ja) 1997-06-13 1999-01-06 Kyocera Corp 容量素子付き回路基板
JP2003057461A (ja) * 2001-05-10 2003-02-26 Canon Inc 光電融合基板および電子機器
US20090242023A1 (en) * 2005-11-25 2009-10-01 Israel Aircraft Industries Ltd. System and method for producing a solar cell array
JP2007251176A (ja) * 2006-03-17 2007-09-27 Samsung Electro-Mechanics Co Ltd 陽極酸化金属基板モジュール

Also Published As

Publication number Publication date
JP2011142285A (ja) 2011-07-21
KR20110082354A (ko) 2011-07-19
JP4964322B2 (ja) 2012-06-27

Similar Documents

Publication Publication Date Title
KR101067091B1 (ko) 방열기판 및 그 제조방법
US8541695B2 (en) Wiring board and method for manufacturing the same
JP5285525B2 (ja) 陽極酸化による微細回路パターン付きパッケージ基板の製造方法
KR101095202B1 (ko) 하이브리드형 방열기판 및 그 제조방법
US20090236130A1 (en) Multilayered printed circuit board and method of manufacturing the same
JP2010272836A (ja) 放熱基板およびその製造方法
JP2007221110A (ja) キャビティの形成された基板製造方法
JP2015170770A (ja) プリント配線板
WO2008004382A1 (fr) Procédé de fabrication d'une plaque de circuit imprimé à couches multiples
JP6189592B2 (ja) 部品組込み型印刷回路基板及びその製造方法
TWI500366B (zh) Multilayer printed wiring board and manufacturing method thereof
KR101055558B1 (ko) 방열기판 및 그 제조방법
JP2009016795A (ja) 放熱印刷回路基板及びその製造方法
JP2015170769A (ja) プリント配線板及びプリント配線板の製造方法
KR101119259B1 (ko) 하이브리드형 방열기판 및 그 제조방법
KR101089923B1 (ko) 인쇄회로기판의 제조방법
JP2007242740A (ja) メタルコアプリント配線板及びその製造方法
KR20090070117A (ko) 아노다이징을 이용한 금속 기판 및 이의 제조방법
JP2004281437A (ja) フィルドビア付き両面金属張積層板及び製造方法
KR101140890B1 (ko) 인쇄회로기판용 코어 제조방법
JP2011071358A (ja) 配線基板の製造方法
JP2010182927A (ja) プリント配線板の製造方法及びその方法で製造されたプリント配線板
JP2005294660A (ja) 半導体装置用基板及びその製造方法
JP2006165231A (ja) 多層フレキシブル回路配線基板及びその製造方法
JP2006080214A (ja) プリント配線板とその製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20140701

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20150707

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee