KR101046861B1 - Tape Attachments, Coating Systems and Masking Tapes - Google Patents

Abstract

In the masking tape attached on the substrate by the tape applying apparatus, the first lower surface edge of the first masking tape is located inside the non-coating area rather than the boundary between the non-coating area and the coating area, and the second masking tape is made of the masking tape. A protective part protruding outward from the 1 masking tape covers the exposed area of the non-coated area. For this reason, the organic EL liquid discharged on the board | substrate is prevented from adhering to an exposed area | region, and it is also prevented that an organic EL liquid adheres to the side surface of a 1st masking tape, and forms a meniscus. As a result, the generation of the meniscus at the boundary between the non-coated area and the coated area can be easily prevented.

Description

Tape Attachments, Coating Systems and Masking Tapes {TAPE ATTACHING APPARATUS, LIQUID MATERIAL APPLYING SYSTEM, AND MASKING TAPE}

The present invention provides a tape applying device for attaching a masking tape for preventing adhesion of a flowable material to an uncoated area on a non-coated area on a main surface of a substrate, and an application for applying the fluid material to a substrate while having a tape applying device. A system and a masking tape in close contact with an uncoated area on a major surface of a substrate to prevent adhesion of flowable material to the uncoated area.

Background Art Conventionally, development of organic EL display devices using organic EL (Electro Luminescence) materials has been conducted. For example, in the manufacture of an active matrix drive type organic EL display device using a polymer organic EL material, a glass substrate (hereinafter, For the sake of simplicity, a substrate is formed of a TFT (Thin Film Transistor) circuit, an Indium Tin Oxide (ITO) electrode serving as an anode, a partition, and a flowable material including a hole transporting material. (Hereinafter referred to as "hole transporting liquid") for coating, formation of a hole transporting layer by heat treatment, and application of a fluid material (hereinafter referred to as "organic EL liquid") containing organic EL material and heat treatment By the formation of the organic EL layer, the formation of the cathode, and the formation of the insulation film are sequentially performed.

In the manufacture of an organic EL display device, Japanese Patent Application Laid-Open No. 2004-111073 (Document 1) and Japanese Patent Application Laid-Open No. 2004-89771 (A) as a device for applying a hole transporting liquid or an organic EL liquid to a substrate. As shown in Document 2), a device is known in which a liquid material is applied in a stripe shape on a substrate by relatively moving a plurality of nozzles for continuously discharging the fluid material in the main scanning direction and the sub scanning direction with respect to the substrate.

On the upper surface of the substrate for an organic EL display device, a seal of an area or a coating area in which a driver circuit is incorporated around an application area (that is, a light emitting area) to which fluid materials such as a hole transport liquid or an organic EL liquid should be applied. The area required for the ring is installed. In manufacture of an organic electroluminescence display, in a formation process of a positive hole transport layer or an organic electroluminescent layer, a fluidic material may adhere to the area | region (hereinafter, a "non-coated area | region") around these application | coating areas, and a fluidic material If the post-process is carried out in the state of adhesion, there is a possibility that deterioration of the characteristics of the electrode, poor sealing, or the like may occur. Therefore, it is necessary to prevent the flowable material from adhering to the uncoated area on the substrate.

Japanese Patent Laid-Open No. 2006-216414 (Patent 3) discloses a technique for selectively applying a coating liquid to an element formation region by attaching a masking tape to an uncoated region on a substrate for an organic EL element. In the manufacturing method of the organic electroluminescent element of the document 3, by making the contact angle with the coating liquid in the side surface of a masking tape larger than the contact angle of a board | substrate and a coating liquid, the meniscus of the coating liquid in the side surface of a masking tape is carried out. Generation | occurrence | production is suppressed and defects, such as the film thickness shortage of the negative electrode which may generate | occur | produce in a post process by the protrusion of the said meniscus, are prevented.

By the way, in the manufacturing method of the organic electroluminescent element of document 3, since the material which can be used as a masking tape is limited, there exists a limit to the cost reduction of a masking tape. In addition, since the hydrophilization treatment (for example, washing with a solvent, ultraviolet irradiation, plasma irradiation) to the substrate is performed before the coating liquid is applied, the manufacturing process of the organic EL device is complicated, and the production of the organic EL device is complicated. There is a limit to the improvement of the efficiency.

The present invention relates to a tape applying apparatus for attaching a masking tape that prevents adhesion of a flowable material to an uncoated area on a non-coated area on a main surface of a substrate. The tape applying apparatus includes a substrate holding portion for holding a substrate and a first lower surface edge, which is one edge of a lower surface of a first masking tape, than the boundary between an uncoated region and a coating region on a main surface of the substrate. Attaching the first masking tape to the non-coated area in parallel with the boundary while positioning the inner side of the second masking tape, and the second lower surface edge, which is one edge of the lower surface of the second masking tape, located above the first lower surface edge. Protruding outwardly from the first masking tape by attaching the second masking tape to the top surface of the first masking tape in parallel with the boundary while positioned outside the edge of the top surface of the first masking tape; In addition, a portion of the second masking tape separated from the main surface of the substrate is provided on the substrate as a protective part. An attachment mechanism is provided. According to this invention, in the board | substrate with a masking tape which prevents adhesion of a flowable material to an uncoated area | region, the 2nd masking tape which the area | region which exposes from the 1st masking tape among the uncoated area | regions is separated from the said area | region. By covering with the protection part of, it is possible to easily prevent the occurrence of meniscus at the boundary between the non-coated area and the coated area.

In one preferable embodiment of this invention, the lower surface of the said protection part of a said 2nd masking tape becomes substantially parallel to the said main surface of the said board | substrate.

In another preferred embodiment of the present invention, the first masking tape is attached to the non-coated area, whereby the other first lower surface edge of the first masking tape is formed of the non-coated area and the other coating area. On the other side of the second masking tape, the second masking tape is attached to the upper surface of the first masking tape so as to be located inside the non-coated region from another boundary parallel to the border between the two. The second lower surface edge is located outside the edge of the upper surface of the first masking tape located above the other first lower surface edge, protrudes toward the outside from the first masking tape, and the substrate A portion of the second masking tape spaced apart from the main surface of is provided on the substrate as another protective portion. More preferably, the centerline of each of the first masking tape and the second masking tape substantially overlaps the centerline of the non-coated region. More preferably, the width of the second masking tape is equal to the width of the non-coated region.

In another preferred embodiment of the present invention, the adhesive force of the second masking tape to the first masking tape is greater than the adhesive force of the first masking tape to the substrate. For this reason, a 1st masking tape and a 2nd masking tape can be tied together and can peel easily.

In another preferable embodiment of this invention, the said attachment mechanism is a 1st attachment mechanism which adheres the said 1st masking tape to the said main surface of the said board | substrate, and the said 2nd masking tape is attached to the said main surface of the said board | substrate. And a second attaching mechanism attached to the upper surface of the first masking tape, wherein the first attaching mechanism includes a first tape supply unit for releasing the first masking tape, and the first tape of the first masking tape. A first press portion for pressing the portion released from the supply portion toward the non-coated region, wherein the second attachment mechanism includes a second tape supply portion for releasing the second masking tape, and the second masking tape; And a second pressing portion for pressing the portion released from the tape supply portion toward the first masking tape attached to the non-coating region, The first attachment portion in the first attachment mechanism and the second attachment mechanism in a moving direction parallel to the boundary of the non-coated region, with the first masking tape pressed by the first pressing portion. Relatively moving relative to, the first masking tape is sequentially attached along the boundary, and the second masking tape is pressed by the second pressing portion, and the substrate is moved in the movement direction. It is provided with the movement mechanism which attaches the said 2nd masking tape sequentially along the said boundary by moving relative to a 2nd press part.

In another preferable embodiment of this invention, the said attachment mechanism is a 1st tape supply part which releases the said 1st masking tape, the 2nd tape supply part which releases the said 2nd masking tape, and the said 1st masking tape. A tape bonding portion for attaching the portion released from the first tape supply portion to the second masking tape, and a bonded portion of the first masking tape and the second masking tape, and attaching the first masking tape to the substrate. A pressing portion that faces the non-coated region while facing the pressing portion, and the substrate is moved parallel to the boundary of the non-coated region with the first masking tape and the second masking tape pressed by the pressing portion. By moving the first masking tape and the second masking tape in a direction relative to the pressing portion. According to the system and a moving mechanism for attaching one by one.

In one aspect of the present invention, the tape applying apparatus applies a first substrate holding portion for holding a substrate, and a first lower surface edge, which is one edge of the lower surface of the first masking tape, with an uncoated region on the main surface of the substrate. A first tape applying device having a first attachment mechanism for attaching the first masking tape to the non-coated area parallel to the boundary while being positioned inside the non-coated area rather than the boundary between the areas, and holding the substrate The second substrate holding portion and the second lower surface edge, which is one edge of the lower surface of the second masking tape, are positioned outside the edges of the upper surface of the first masking tape positioned above the first lower surface edge. 2 protruding outwardly from the first masking tape by attaching a masking tape to the upper surface of the first masking tape parallel to the boundary And a second tape attachment device having a second attachment mechanism for mounting a portion of the second masking tape separated from the main surface of the substrate as a protection portion on the substrate, and attaching the substrate to the first tape attachment device. In addition to carrying out, the conveyance mechanism which carries in to a said 2nd tape attachment apparatus is provided.

The present invention also relates to an application system for applying a flowable material to a substrate, and a masking tape that adheres to an uncoated area on the main surface of the substrate and prevents adhesion of the flowable material to the non-coated area.

The above objects and other objects, features, forms, and advantages will be apparent from the detailed description of the invention to be made below with reference to the attached drawings.

FIG. 1: is a figure which shows the structure of the coating system 8 provided with the tape sticking apparatus which concerns on 1st Embodiment of this invention. The coating system 8 is a system which applies the fluid material containing a pixel formation material to the glass substrate (henceforth simply a "substrate") for flat panel display devices with a masking tape. In the present embodiment, in the coating system 8, a fluid material (hereinafter referred to as "organic EL liquid") containing an organic EL material on a substrate for an organic EL (Electro Luminescence) display device of an active matrix drive system. .) Is applied. The organic EL liquid contains, in addition to the organic EL material, an organic solvent (xylene in this embodiment) such as xylene and mesitylene.

FIG. 2: is a top view which shows the board | substrate 9 with the masking tape 1 which is a tape-shaped mask member. In FIG. 2, a parallel diagonal line is attached to a region 91 (hereinafter referred to as a “coating region”) where the organic EL liquid is applied by the coating system 8 (see FIG. 1). In this embodiment, four application | coating regions 91 are provided on the board | substrate 9, and the board | substrate for four organic electroluminescent display apparatuses is manufactured from the board | substrate 9 of one. Since the lattice-shaped region 92 around the four application regions 91 is used for incorporation of a driver circuit, sealing by an insulation film in a later step, etc., the organic EL liquid is not a region to be coated. Hereinafter, it is called "non-coating area 92." As shown in FIG. 2, the masking tape 1 adheres to (ie, adheres to) the non-coated region 92 on the main surface 90 on the (+ Z) side of the substrate 9. Adhesion of the organic EL liquid to is prevented.

As shown in FIG. 1, the coating system 8 includes a tape applying apparatus 2 and a masking tape 1 for attaching a masking tape 1 (see FIG. 2) to an uncoated region 92 on a substrate 9. Coating apparatus for applying the organic EL liquid to the area including the masking tape 1 by moving the nozzle relative to the substrate 9 while continuously discharging the organic EL liquid from the nozzle toward the substrate 9 with (3) and the tape peeling apparatus 4 which peels the masking tape 1 from the board | substrate 9 to which the organic EL liquid was apply | coated. The coating system 8 further includes a fixed transfer robot 81 between the tape applying apparatus 2 and the coating apparatus 3 and between the coating apparatus 3 and the tape peeling apparatus 4. do. In the coating system 8, two transfer robots 81 serve as substrate transfer mechanisms that sequentially transfer the substrate 9 to the tape applying apparatus 2, the application apparatus 3, and the tape peeling apparatus 4. have.

FIG. 3: cuts a part of masking tape 1 and board | substrate 9 shown in FIG. 2 perpendicularly to the longitudinal direction (namely, Y direction in FIG. 2) of masking tape 1 in the position of AA in FIG. One cross section. As shown in FIG. 3, the masking tape 1 is the 1st masking tape 11 directly attached to the board | substrate 9, and the upper surface 1111 of the 1st masking tape 11 (namely, in FIG. The 2nd masking tape 12 attached to the (+ Z) side surface of the side is provided. As the 2nd masking tape 12, it is No. made by Nitto Denko Corporation. 31B and the like are used. The 1st masking tape 11 is equipped with the tape-shaped base material 111 and the adhesive layer 112 formed in the lower surface 1112 (namely, the surface of (-Z) side) of the base material 111, and Similarly, the 2 masking tape 12 is equipped with the tape-shaped base material 121 and the adhesive layer 122 formed in the lower surface 1212 (namely, the surface of (-Z) side) of the base material 121. In the masking tape, the first masking tape 11 and the second masking tape 12 have the same shape as the cross section shown in FIG. 3 over the entire length in the longitudinal direction.

The substrates 111 and 121 are formed of a plastic film. The plastic films used as the substrates 111 and 121 are, for example, polyolefin-based films such as polyethylene and polypropylene, polyester-based films such as polyethylene terephthalate and polybutylene terephthalate, and polyamides such as nylon. It is a film, a triacetyl cellulose film, and a polyimide film, These plastic films may be any of an unstretched film and an oriented (uniaxially oriented or biaxially oriented) film. In this embodiment, T100N38 which is a polyester film made by Mitsubishi Chemical Polyester Film Co., Ltd. is used as the base material 111, and the base material 121 also becomes a polyester film.

Although the mold release process may be performed to the upper surface 1111 (namely, the upper surface of the 1st masking tape 11) of the base material 111, it is said that the adhesive force of the 2nd masking tape 12 with respect to the 1st masking tape 11 is increased. In view of the above, it is preferable that surface treatment such as reverse adhesion treatment, antistatic treatment, corona treatment, plasma treatment, photocatalyst treatment or the like is performed. In this embodiment, an antistatic treatment is performed on the upper surface 1111 of the base material 111. Moreover, although the mold release process may be similarly performed also to the upper surface 1211 (namely, the upper surface of the 2nd masking tape 12) of the base material 121, the 2nd masking at the time of peeling of the masking tape 1 mentioned later. From the viewpoint of increasing the adhesive force of the release tape 45 (see FIG. 13A) to the tape 12, it is preferable that surface treatment such as reverse adhesion treatment, antistatic treatment, corona treatment, plasma treatment, photocatalyst treatment, or the like is performed. Do.

On the lower surfaces 1112 and 1212 of the substrates 111 and 121, in order to improve adhesion between the substrates 111 and 121 and the adhesive layers 112 and 122, a reverse adhesion treatment, an antistatic treatment, a corona treatment, and a plasma are applied. It is preferable that surface treatments, such as a process and a photocatalyst process, are performed, and it is especially preferable that corona treatment is given in this embodiment.

The pressure sensitive adhesive layers 112 and 122 are formed of, for example, a polyester pressure sensitive adhesive, an acrylic pressure sensitive adhesive, a silicone pressure sensitive adhesive, a natural rubber pressure sensitive adhesive or a synthetic rubber pressure sensitive adhesive, and are formed of an acrylic pressure sensitive adhesive in the present embodiment. When the acrylic pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 112 is manufactured, 100 parts by weight of 2-ethylhexyl acrylate (2-EHA) is placed in a four-necked separable flask provided with a stirrer, a thermometer, and a reaction byproduct separation tube. And 4 parts by weight of acrylic acid (AA) are added, and an acrylic polymer having a weight average molecular weight of 600000 is produced by normal solution (ethyl acetate) polymerization. And, with respect to 100 parts by weight of the acrylic polymer, 3.5 parts by weight of the epoxy cross-linking agent (tetrad C manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 1 part by weight of isocyanate-based crosslinking agent (colonate L manufactured by Japan Polyurethane Industries, Ltd.) By adding, the acrylic adhesive which becomes the material of the adhesive layer 112 is produced.

In the tape applying apparatus 2, as shown in FIG. 2, the masking tape 1 (that is, the 2nd masking tape 12 and the 1st masking tape 11 shown in FIG. 3) of the board | substrate 9 In a state in which the non-coated region 92 on the main surface 90 and the application region 91 located on both sides of the non-coated region 92 in the X direction are parallel to the two boundaries 920 in the Y-direction. It is attached to the application area 92.

As shown in FIG. 3, on the (+ X) side of the lower surface 1122 of the 1st masking tape 11 (that is, the surface of the (-Z) side of the adhesive layer 112 of the 1st masking tape 11). The first lower surface edge 1123, which is one edge to be positioned, has a boundary 920 between the non-coated region 92 and the application region 91 positioned on the (+ X) side of the non-coated region 92 ( In FIG. 3, it is located in the (-X) side which is inner side of the non-coating area | region 92 for convenience of illustration. Moreover, the other 1st lower surface edge 1123 located in the (-X) side of the lower surface 1122 of the 1st masking tape 11, The non-coating area | region 92 and the said non-coating area | region 92 (+ X) that is inside the non-coated region 92 than the boundary 920 (that is, another boundary of the non-coated region 92) between another application region 91 positioned on the (-X) side. Located at) side.

In the masking tape 1, on the (+ X) side of the lower surface 1222 of the second masking tape 12 (that is, the (-Z) side of the pressure-sensitive adhesive layer 122 of the second masking tape 12) The upper surface 1111 (that is, the first masking) of the second lower surface edge 1223, which is one edge to be positioned, is located above the first lower surface edge 1123 on the (+ X) side. It is located in the (+ X) side which is outer side than the 1st upper surface edge 1113 which is the edge of the (+ X) side of the (+ Z) side of the base material 111 of the tape 11). For this reason, the part of the 2nd masking tape 12 which protrudes toward the (+ X) side from the 1st masking tape 11, and separates from the main surface 90 of the board | substrate 9 is used as the protection part 120. As shown in FIG. It is installed on the substrate 9.

Moreover, the other 2nd lower surface edge 1223 located in the (-X) side of the lower surface 1222 of the 2nd masking tape 12 is above the 1st lower surface edge 1123 on the (-X) side. It is located in the (-X) side which is outer side than the 1st upper surface edge 1113 of the (-X) side of the 1st masking tape 11 located in the to. For this reason, the part of the 2nd masking tape 12 which protrudes toward the (-X) side from the 1st masking tape 11, and separates from the main surface 90 of the board | substrate 9 is another protection part. It is provided on the board | substrate 9 as 120. As shown in FIG. The lower surface 1202 of the protection part 120 on the (+ X) side and the (-X) side of the second masking tape 12 is parallel to the main surface 90 of the substrate 9.

In the masking tape 1, the side surfaces 1103 of both sides of the first masking tape 11 and the side surfaces 1209 of both sides of the second masking tape 12 are approximately on the main surface 90 of the substrate 9. Become vertical. The width of the second masking tape 12 in the X direction is the same as the width of the non-coating region 92 in the X direction, and the second lower surface edge 1223 of both sides of the second masking tape 12 in the X direction. Is overlapped in plan view with the boundary 920 on both sides of the non-coated region 92. That is, a line (hereinafter referred to as a "center line") passing through the center of the second masking tape 12 in the X direction overlaps the center line of the non-coated region 92 in plan view. In addition, the centerline of the first masking tape 11 also overlaps with the centerline of the non-coated region 92 in plan view.

In this embodiment, the thickness of the base material 111 and the adhesive layer 112 of the 1st masking tape 11 is set to about 38 micrometers and about 15 micrometers, respectively, and the base material 121 of the 2nd masking tape 12 is carried out. And the pressure-sensitive adhesive layer 122 are about 50 µm and about 28 µm, respectively. The widths of the first masking tape 11 and the second masking tape 12 are 4 mm and 6 mm, respectively, and the widths of the protection parts 120 on both sides of the second masking tape 12 are 1 mm, respectively. It becomes In FIG. 3, the thickness of the 1st masking tape 11 and the 2nd masking tape 12 is thicker than it actually is compared with the width for the convenience of illustration (same also in FIG. 11A).

In the masking tape 1, it is preferable that the thickness of each of the base materials 111 and 121 of the 1st masking tape 11 and the 2nd masking tape 12 becomes 10 micrometers or more and 300 micrometers or less (more preferably, 20 micrometers or more and 100 micrometers, More preferably, they are 25 micrometers or more and 50 micrometers or less.) It is preferable that the thickness of each of the adhesive layers 112 and 122 becomes 1 micrometer or more and 100 micrometers or less (more preferably, 5 micrometers or more and 60 micrometers, More preferably, they are 10 micrometers or more and 40 micrometers or less.).

For this reason, while maintaining the flexibility of the 1st masking tape 11 and the 2nd masking tape 12, intensity | strength can be ensured and handling can be made easy. As mentioned above, since the cross section of the masking tape 1 becomes the same shape over the full length of the longitudinal direction, the said description regarding the shape of the masking tape 1 shown in FIG. The same applies to any cross section perpendicular to the longitudinal direction of the first masking tape 11 and the second masking tape 12.

4-6 is a top view, a front view, and a left side view which show the structure of the tape sticking apparatus 2, respectively. As shown in FIGS. 4 to 6, the tape attaching apparatus 2 includes the substrate holding part 21 holding the substrate 9 and the substrate 9 together with the substrate holding part 21 of the substrate 9. A substrate moving mechanism 22 moving in a predetermined movement direction parallel to the main surface 90 (see FIG. 2) (that is, Y direction in FIGS. 4 to 6, hereinafter referred to as a “scan direction”), The first tape attachment head for attaching the first masking tape 11 (see FIG. 3) to the non-coated region 92 (see FIG. 2) on the main surface 90 of the substrate 9 before the organic EL liquid is applied ( 23) a second tape attachment head 23a for attaching a second masking tape 12 (see FIG. 3) to an upper surface 1111 of the first masking tape 11 attached to the non-coated region 92, and And a head moving mechanism 24 for individually moving the first tape attaching head 23 and the second tape attaching head 23a in a direction perpendicular to the scanning direction (that is, the X direction in FIGS. 4 to 6). .

In the tape sticking apparatus 2, the board | substrate holding part 21 moves along the rail 221 along with the board | substrate 9 in the horizontal direction by the board | substrate movement mechanism 22. In addition, the head moving mechanism 24 moves the first tape attachment head 23 and the second tape attachment head 23a in the horizontal direction along the rail 241 above the movement path of the substrate 9. do.

7A is a left side view showing an enlarged configuration of the first tape attachment head 23, and FIG. 7B is a left side view enlarged and illustrating a configuration of the second tape attachment head 23a. In FIG. 7A and FIG. 7B, the internal structure which is accommodated in the housing 231 of the 1st tape attachment head 23 and the 2nd tape attachment head 23a is shown, respectively. In the first tape attachment head 23, the first masking tape is made by using a tape 27 having a two-layer structure in which the first masking tape 11 is held on one surface of the base tape 271 (so-called separator). (11) is attached, and the 2nd tape attachment head 23a uses the 2nd layer tape 27a in which the 2nd masking tape 12 was hold | maintained on one surface of the base tape 271, and is 2nd The masking tape 12 is attached. In the tape 27, the lower surface 1122 (see FIG. 3) of the pressure-sensitive adhesive layer 112 of the first masking tape 11 adheres to the base tape 271, and in the tape 27a, the second masking tape The lower surface 1222 (refer FIG. 3) of the adhesive layer 122 of (12) adheres to the base tape 271.

It is preferable that the thickness of the base tape 271 becomes 10 micrometers or more and 300 micrometers or less, More preferably, it is 20 micrometers or more and 100 micrometers, More preferably, it is 38 micrometers or more and 75 micrometers or less. In this embodiment, the thickness of the base tape 271 is about 50 micrometers.

The base tape 271 is similar to the base material 111 of the first masking tape 11 and the base material 121 of the second masking tape 12, and a polyolefin film such as polyethylene or polypropylene, polyethylene terephthalate, It is formed by polyester films, such as polybutylene terephthalate, polyamide films, such as nylon, a triacetyl cellulose film, and a plastic film, such as a polyimide film, In this embodiment, a corona treatment is made to one surface. The performed polyester film (S-105 by Toray Corporation) is used.

In order to improve the peelability from the 1st masking tape 11 or the 2nd masking tape 12 in the surface holding the 1st masking tape 11 or the 2nd masking tape 12 of the base tape 271, If necessary, release treatments such as silicone treatment, acrylic / silicone treatment, long-chain alkyl treatment, and fluorine treatment may be performed, and in the present embodiment, the conductive cone coating liquid is applied to the surface on which the corona treatment of the polyester film has been performed. After that, the silicon treatment is carried out by drying at 140C for 1 minute. The weight after drying of a silicon layer is set to about 0.07 g / cm <2>.

2 parts by weight of an acetylene-based reaction control agent (CAT-PLR-1 manufactured by Shin-Etsu Chemical Co., Ltd.) and 100 parts by weight of polydimethylsiloxane (KS-3601 manufactured by Shin-Etsu Chemical Co., Ltd.) 1 weight part of reaction control agent (CAT-PLR-2 by Shin-Etsu Chemical Co., Ltd.), and a solvent (normal hexane by Maruzen Co., Ltd. and normal heptane by Toa Synthetic Co., Ltd.) were added, and stirred for 20 minutes. 5 parts by weight of a catalyst (CAT-PL-50T manufactured by Shin-Etsu Chemical Co., Ltd.) is added, and the mixture is stirred for 10 minutes.

The tape 27 is formed by applying an acrylic pressure-sensitive adhesive on the base 111 of the first masking tape 11 and drying at 130 ° C. for 1 minute to form the pressure-sensitive adhesive layer 112, and then the base on the pressure-sensitive adhesive layer 112. It is formed by attaching the tape 271.

As shown in FIG. 7A, the first tape attachment head 23 unwinds the tape 27 (that is, the first masking tape 11 and the base tape 271) while the unused tape 27 is wound. The first masking tape 11 is separated from the first supply reel 232, which is a first tape supply part, and the tape 27 released from the first supply reel 232. 1st press part 233, 1st masking which presses the part unscrewed from the 1st supply reel 232 of the masking tape 11 toward the non-coating area | region 92 (refer FIG. 2) of the board | substrate 9 The first recovery reel 234 which is a 1st tape collection part which winds up and collect | recovers the tape 27 (namely, the base tape 271) after the tape 11 is isolate | separated, and the housing 231 which accommodates these structures Equipped.

As shown in FIG. 7B, the structure of the 2nd tape attachment head 23a is substantially the same as the 1st tape attachment head 23 shown in FIG. 7A, and the 2nd masking tape is attached to one main surface of the base tape 271. FIG. A portion of the second supply reel 232a, which is the second tape supply part for releasing the tape 27a held by the (12), and the portion released from the second supply reel 232a of the second masking tape 12 may be removed. A second pressing portion 233a for pressing toward the first masking tape 11 attached to 92, a second collecting reel 234a that is a second tape collecting portion for winding and collecting the base tape 271, and these configurations It has a housing 231 for receiving it. In the tape applying apparatus 2, the 2nd tape attachment head 23a is arrange | positioned in the opposite direction to the 1st tape attachment head 23. As shown in FIG.

When the 1st masking tape 11 is affixed to the board | substrate 9 by the tape sticking apparatus 2, the head 1 with a 1st tape 23 by the head moving mechanism 24 shown to FIG. 4 thru | or 6 first. Is moved in the X direction and is located above the movement path of the substrate 9. At this time, the board | substrate 9 is located in the (-Y) side of the 1st tape attachment head 23. Subsequently, the board | substrate 9 moves to (+ Y) direction by the board | substrate movement mechanism 22, and it is located in the attachment start position shown to FIG. 7A. When the board | substrate 9 is located in a sticking start position, it is by the cut part 235 of the 1st press part 233 of the 1st tape attachment head 23 to the side which opposes the cut part 235 of the tape 27. Only the first masking tape 11 is cut.

The cut 1st masking tape 11 is the 1st press part 233 with the base tape 271 by rotating the 1st supply reel 232 and the collection reel 234 counterclockwise in FIG. 7A. Is sent to the distal end of the tape separating member 236, and at the distal end, the first masking tape 11 is drawn from the base tape 271 by being pulled toward the opposite side to the direction in which the base tape 271 is sent. It peels and the front-end part moves toward the board | substrate 9 from the lower opening 237 of the housing 231. As shown in FIG.

In parallel with this, the attachment roller 239 moves downward through the lower opening 237 by the air cylinder 238, and as shown in FIG. 7C, the front end of the first masking tape 11 is moved from above. It presses toward the main surface 90 of (9), and attaches, and the board | substrate 9 starts to move to the (+ Y) direction of FIG. 7A by the board | substrate movement mechanism 22 (refer FIG. 6). The substrate 27 is continuously fed from the first supply reel 232, and the first masking tape 11 is pressed by the attachment roller 239 of the first pressing part 233. The substrate 9 is moved by the moving mechanism 22 in the scanning direction parallel to the boundary 920 (see FIG. 2) of the non-coated region 92 (that is, the (+ Y) direction). On the main surface 90, the first masking tape 11 is sequentially attached to the non-coated region 92 along the boundary 920.

In the first tape attachment head 23 shown in FIG. 7A, only the first masking tape 11 on the tape 27 is cut again by the cutting portion 235, and the first masking tape 11 is cut to the rear end. 9, the first masking tape 11 comes into close contact with the main surface 90 of the substrate 9. In the tape applying apparatus 2, the substrate movement mechanism 22 and the first tape attachment head 23 attach the first masking tape 11 to the non-coated region 92 of the main surface 90 of the substrate 9. It is a 1st attachment mechanism to attach.

In addition, the attachment start of the 1st masking tape 11 may be performed with respect to the board | substrate 9 which is moving at the same speed as the feed rate of the tape 27, supplying the tape 27. FIG. In the first tape attachment head 23, the first masking tape 11 is attached to the attachment roller 239 of the first pressing portion 233 at the time of attachment of the front end and the rear end of the first masking tape 11. Although it is necessary to pressurize toward the board | substrate 9 by this, except in the case of attachment of a front end part and a rear end, the attachment roller 239 may retract in the housing 231, and the pressurization of the 1st masking tape 11 may be released. . In other words, in the first attaching mechanism of the tape attaching device 2, the first masking tape 11 is pressed against the substrate 9 at the time of attaching at least the front end and the rear end of the first masking tape 11. The first masking tape 11 moves the non-coated region 92 on the substrate 9 by moving the substrate 9 relative to the first pressing portion 233 of the first tape attachment head 23 in the scanning direction. ) Is attached.

When the second masking tape 12 is attached onto the first masking tape 11 by the tape attaching device 2, the first tape attaching head is performed by the head moving mechanism 24 shown in FIGS. 4 to 6. (23) moves in the (-X) direction and is retracted from above the moving path of the substrate 9, and the second tape attachment head 23a moves in the (-X) direction so that the moving path of the substrate 9 It is located above. At this time, the board | substrate 9 is located in the (+ Y) side of the 2nd tape attachment head 23a.

The attachment of the second masking tape 12 is almost the same as that of the first masking tape 11 described above, and the second masking tape is formed by the attachment roller 239 of the second pressing portion 233a shown in FIG. 7B. The tip end portion 12 is pressed against the upper surface 1111 of the first masking tape 11 and attached thereto, and the substrate 9 is moved in the (-Y) direction by the substrate movement mechanism 22 (see FIG. 6). Start the move. Subsequently, the substrate 9 is uncoated region 92 by the substrate moving mechanism 22 while the second masking tape 12 is pressed by the attachment roller 239 of the second pressing portion 233a. By moving in the scanning direction parallel to the boundary 920 (see FIG. 2) (i.e., (-Y) direction), the second masking tape 12 is bounded on the main surface 90 of the substrate 9. Along the 920, the first masking tape 11 is sequentially attached to the top surface 1111 of the first masking tape 11. This causes the masking tape 1 (see FIG. 2) to adhere to the non-coated region 92 of the substrate 9.

In the tape attaching device 2, the substrate moving mechanism 22 and the second tape attaching head 23a include a first masking tape having the second masking tape 12 attached to the main surface 90 of the substrate 9 ( It is a 2nd attachment mechanism attached to the upper surface 1111 of 11). In other words, in the tape applying apparatus 2, the 1st attachment mechanism and the 2nd attachment mechanism share the board | substrate movement mechanism 22 which moves the board | substrate 9 to a scanning direction (namely, the board | substrate movement mechanism 22). To prepare).

In addition, in the second attachment mechanism of the tape attachment device 2, similarly to the above-mentioned first attachment mechanism, the second masking tape 12 is the first mask at the time of attachment of at least the front end and the rear end of the second masking tape 12. In the state pressed against the masking tape 11, the board | substrate 9 moves relatively with respect to the 2nd press part 233a of the 2nd tape attachment head 23a in a scanning direction, and the 2nd masking tape 12 is carried out. Is attached on the first masking tape 11.

In the tape applying apparatus 2, as shown in FIG. 2, in the scanning direction which is the moving direction of the board | substrate 9 by the board | substrate movement mechanism 22 among the lattice-shaped uncoated area | regions 92 of the board | substrate 9 The masking tape 1 (ie, the first masking tape 11 and the second masking tape 12) is attached only to three regions extending in parallel (that is, the regions extending in the Y direction in FIG. 2). In the non-coated region 92, the first masking tape 11 and the second masking tape 12 are attached to a region extending vertically in the scanning direction (that is, a region extending in the X direction in FIG. 2). Not done. As described later, in the coating system 8, the coating of the organic EL liquid is not performed on the region in which the first masking tape 11 and the second masking tape 12 are omitted in the non-coated region 92. Do not.

In the coating system 8 shown in FIG. 1, the board | substrate 9 (refer FIG. 2) to which the 1st masking tape 11 and the 2nd masking tape 12 were attached is carried out by the transfer robot 81 with the tape sticking apparatus. It is carried out from (2), and is carried in to the coating device 3.

Next, the coating apparatus 3 which applies an organic EL liquid to the board | substrate 9 is demonstrated. 8 and 9 are a plan view and a front view illustrating the coating device 3. As shown in FIG. 8 and FIG. 9, in the coating device 3, the masking tape 1 (that is, the first masking tape 11 and the second masking tape 12) is a non-coated region 92 (FIG. 2) is provided with a substrate holding part 31 for holding the substrate 9 attached thereto. 8 and 9 omit the illustration of the masking tape 1 attached on the main surface 90 of the substrate 9 for convenience of illustration.

In addition, the coating device 3 also has the substrate holding part 31 in a predetermined direction parallel to the main surface 90 of the substrate 9 (that is, the Y direction in FIG. 8, hereinafter referred to as a “sub-scanning direction”). And a display detecting unit 33 which picks up and detects a substrate moving mechanism 32 which rotates around an axis facing in the vertical direction, and a position adjustment display (not shown) formed on the substrate 9. Parallel to and parallel to the application head 34 and the main surface 90 of the substrate 9, which are discharge mechanisms for continuously discharging the organic EL liquid from the three nozzles 37 toward the substrate 9 on the substrate holding portion 31. The substrate holding part with respect to the head moving mechanism 35 and the main scanning direction which horizontally move the application head 34 in the direction perpendicular to the scanning direction (that is, the X direction in FIG. 8, hereinafter referred to as the "main scanning direction"). Two fluid parts 36 which are provided on both sides of the 31 and receive the organic EL liquid from the coating head 34, and the coating heads. And the three nozzles 37 of the 34 with a liquid material supply section 38 for supplying an organic EL solution. In the coating device 3, the head moving mechanism 35 and the substrate moving mechanism 32 move the three nozzles 37 of the coating head 34 relatively to the substrate 9 in the main scanning direction. The substrate 9 is a moving mechanism which moves relative to the three nozzles 37 of the coating head 34 in the sub-scanning direction.

In the application head 34, the three nozzles 37 are arranged in a substantially straight line with respect to the X direction (i.e., main scanning direction) in FIG. 8 and slightly in the Y direction (i.e., sub-scanning direction) in FIG. The organic EL liquids which are disposed to be offset and discharged from these nozzles 37 are applied to the grooves between the partition walls extending in the main scanning direction previously formed in the application region 91 (see FIG. 2) of the substrate 9. In this embodiment, the distance with respect to the sub scanning direction between two adjacent nozzles 37 is the same as the pitch between partitions (henceforth "bump pitch"). In the application head 34, three kinds of organic EL liquids each containing three kinds of organic EL materials different in color from red (R), green (G), and blue (B) are separated from the three nozzles 37. Discharged.

When the application of the organic EL liquid is performed by the coating device 3, first, the masking tape 1 (see FIG. 2) is applied to the non-coated region 92 by the tape applying device 2 (see FIGS. 4 to 6). The substrate 9 with) is placed and held on the substrate holding portion 31, and the substrate moving mechanism 32 is driven based on the output from the display detecting portion 33 so that the substrate 9 is moved to the solid line in FIG. It is located in the coating start position shown. The application head 34 is previously located at the position shown by a solid line in FIGS. 8 and 9.

Subsequently, organic EL liquid is supplied from the fluid material supply part 38 to the coating head 34, discharge of organic EL liquid is started from the nozzle 37, the head movement mechanism 35 is driven, and the coating head 34 is driven. The movement of starts. In the coating device 3, the nozzle 37 is discharged from the (-X) side in FIG. 8 with respect to the substrate 9 while continuously discharging the organic EL liquid from the nozzle 37 toward the substrate 9. Three adjacent grooves between the partition walls of the substrate 9 by moving relatively to the side (i.e., in the main scanning direction perpendicular to the longitudinal direction of the first masking tape and the second masking tape attached to the substrate 9), And the organic EL liquid on the second masking tape 12 of the masking tape 1.

When the application head 34 moves to the position indicated by the dashed-dotted line in Figs. 8 and 9, the substrate moving mechanism 32 is driven, and the substrate 9 together with the substrate holding part 31 is (+ Y in Fig. 8. 3) the distance to the side wall (i.e., in the sub-scanning direction) by a distance of three times the bulkhead pitch. At this time, in the coating head 34, the organic EL liquid is continuously discharged from the three nozzles 37 toward the fluid receiving portion 36.

When the movement of the substrate 9 in the sub-scanning direction ends, the coating head 34 discharges the organic EL liquid from the (+ X) side to the (-X) side (that is, in the main scanning direction) in FIG. 8. By moving, after three types of organic EL liquids are apply | coated on the board | substrate 9, the movement of the board | substrate 9 in a subscanning direction is performed again.

10 is a plan view of the substrate 9 with the masking tape 1 attached thereto. In the coating device 3, the movement of the coating head 34 in the main scanning direction and one time of the coating head 34 are performed until the substrate 9 is positioned at the coating end position indicated by the dashed-dotted line in FIG. 8. Whenever the movement in the main scanning direction is performed, the pitch movement in the sub-scanning direction of the substrate 9 is repeated, and as a result, as shown in FIG. 10, the first masking tape 11 on the substrate 9 ( 3 and organic EL in the region including the second masking tape 12 (that is, the region on the masking tape 1 attached to the non-coated region 92, and the groove between the partition walls of the application region 91). The liquid 93 is applied in a stripe shape. In addition, in FIG. 10, the width | variety and the pitch of the organic EL liquid 93 apply | coated on the board | substrate 9 are drawn larger than actual for convenience of illustration.

In the coating device 3, while the application of the organic EL liquid 93 is performed, the organic EL liquid 93 is continuously discharged from the nozzle 37 (see FIGS. 8 and 9) of the coating head 34. have. In the coating device 3, it is an area | region which extends perpendicular | vertical to the moving direction of the board | substrate 9 among the uncoated area | region 92 (namely, it is an area | region extending in the X direction in FIG. 10, and adhesion of the masking tape 1 With respect to the region omitted, the substrate 9 is held by the same distance as the width of the region (ie, the width in the Y direction in FIG. 10) with the application head 34 standing on the infusion portion 36. By moving in the sub-scanning direction, the application of the organic EL liquid 93 to the region is avoided.

FIG. 11: A is sectional drawing which cut | disconnects and shows a part of masking tape 1 and board | substrate 9 with which the organic EL liquid was apply | coated at the position of B-B in FIG. 10, and respond | corresponds to FIG. 11B shows that the organic EL liquid 793 is applied to the substrate 79 of the comparative example in which only one masking tape 71 equal to the width of the non-coated region 792 is attached to the non-coated region 792. It is a figure which shows the cross section in the case. As shown in FIG. 11B, in the substrate 79 of the comparative example, organic matters are formed on the side surface 713 of the masking tape 71 positioned on the boundary 7720 between the non-coated region 792 and the coating region 791. In the film 795 of the organic EL material that the EL liquid 793 adheres to form the meniscus 794, and remains on the substrate 79 after peeling off the masking tape 71, as shown in FIG. 11C. The portion 796 corresponding to the meniscus 794 (see FIG. 11B) protrudes from the boundary 7720 between the non-coated region 792 and the application region 791. As a result, there exists a possibility that the thickness of the other film | membrane (for example, the film | membrane of a cathode) formed on the film | membrane of organic electroluminescent material in a later process may become short in the said protrusion part.

On the other hand, in the masking tape 1 attached on the board | substrate 9 by the tape sticking apparatus 2 (refer FIG. 4 thru | or 6) of the coating system 8 which concerns on this embodiment, in FIG. As shown, the first lower surface edge 1123 on the (-X) side of the first masking tape 11 attached to the non-coated region 92 is the non-coated region 92 and the non-coated region 92. It is located on the (+ X) side than the boundary 920 between the application areas 91 on the (-X) side of the. Moreover, the protection part 120 which protrudes toward the (-X) side from the 1st masking tape 11 of the 2nd masking tape 12 is (-X) of the 1st masking tape 11 among the non-coating areas 92. FIG. The exposure area 921 is covered while being spaced apart from the area 921 (hereinafter referred to as "exposure area 921") exposed from the first masking tape 11 on the side.

For this reason, the organic EL liquid 93 discharged on the board | substrate 9 from the nozzle 37 (refer FIG. 8 and FIG. 9) of the coating device 3 is the exposed area | region 921 of the non-coating area | region 92 It can be prevented from adhering to the surface, and can also be prevented from adhering to the side surface 1103 on the (-X) side of the first masking tape 11 attached to the non-coated region 92. As a result, generation | occurrence | production of the meniscus in the boundary 920 between the non-coating area | region 92 and the application | coating area | region 91 of the (-X) side can be easily prevented, and organic electroluminescent in a post process Defects such as lack of thickness of other films formed on the film of material are prevented.

Moreover, in the masking tape 1, the 1st lower surface edge 1123 of the (+ X) side of the 1st masking tape 11 is between the non-coating area 92 and the application area 91 of the (+ X) side. The protection part 120 which is located in the (-X) side rather than the boundary 920 of this, and protrudes from the 1st masking tape 11 of the 2nd masking tape 12 to (+ X) side is the non-coating area | region 92 The exposed area 921 is covered while being separated from the exposed area 921 on the (+ X) side of the first masking tape 11. For this reason, the organic EL liquid 93 adheres to the exposed region 921 on the (+ X) side of the non-coated region 92 and the side surface 1103 on the (+ X) side of the first masking tape 11. The adhesion of the organic EL liquid 93 to the above is prevented. As a result, the generation of meniscus can also be easily prevented at the boundary 920 between the non-coated region 92 and the application region 91 on the (+ X) side.

In addition, in the coating device 3, in order to discharge the organic EL liquid while the nozzle 37 moves at a high speed, the first masking is performed when the application of the organic EL liquid is performed while the nozzle 37 moves in the (+ X) direction. In the exposure area 921 on the (-X) side of the tape 11 (that is, upstream in the movement direction of the nozzle 37), the organic EL liquid 93 adheres slightly to the boundary 920. Although the amount of adhesion may be small to such an extent that there is no fear of influence on the post-process, the adhesion of the organic EL liquid 93 to the non-coated region 92 is performed by the first masking tape 11 and the second masking tape. You may think that it is substantially prevented by (12). In addition, when the application of the organic EL liquid is performed while the nozzle 37 moves in the (-X) direction, the organic EL liquid is organically placed near the boundary 920 of the exposed area 921 on the (+ X) side of the first masking tape 11. Although the EL liquid may adhere slightly, in this case as well, the first EL masking tape 11 and the second masking tape 12 may be used for the organic EL liquid 93 to the non-coated region 92. You may think that adhesion is substantially prevented.

On the other hand, when the application of the organic EL liquid is performed while the nozzle 37 moves in the (+ X) direction, the masking tape 1 is positioned on the (+ X) side (that is, downstream of the moving direction of the nozzle 37). In the coating area 91, the coating start position with respect to the coating area 91 of the organic EL liquid 93 may be spaced apart from the boundary 920 by a slight distance. However, the region near the boundary 920 of the coating region 91 is not used as the pixel region of the organic EL display device, and the organic EL liquid 93 is placed near the boundary 920 of the coating region 91. Since the distance that is not applied is smaller than the width of the area that is not used as the pixel region, a slight separation between the application start position and the boundary 920 does not affect the performance of the organic EL display device. In addition, when the application of the organic EL liquid is performed while the nozzle 37 moves in the (-X) direction, the organic EL liquid (in the application region 91 located on the (-X) side of the masking tape 1) Although the application start position with respect to the application | coating area | region 91 of 93 may be spaced apart by a some distance from the boundary 920, as mentioned above, this separation does not affect the performance of an organic electroluminescence display.

In the tape applying apparatus 2, as mentioned above, the 1st masking tape 11 and the 2nd masking tape 12 are attached so that each centerline may overlap with the centerline of the non-coating area 92, and 1st The masking tape 11 and the second masking tape 12 are line symmetrical with respect to the centerline of the non-coated region 92. For this reason, in the coating device 3, when the nozzle 37 moves in the (+ X) direction and the application of the organic EL liquid is performed, the nozzle 37 moves in the (-X) direction and the organic EL In the case where the liquid is applied, a slight adhesion of the organic EL liquid to the non-coated region 92 and the application start position of the organic EL liquid in the application region 91 and a slight separation between the boundary 920 The shape can be the same. As a result, the quality of application of the organic EL liquid to the two application regions 91 on both sides of the non-coated region 92 can be made uniform.

In the tape applying apparatus 2, the width of the second masking tape 12 is equal to the width of the non-coated region 92, and the edges in the width direction of the second masking tape 12 are viewed in plan view. Overlaps 920 on both sides of the non-coated region 92. As a result, adhesion of the organic EL liquid to the non-coated region 92 is more reliably prevented.

In the masking tape 1, the lower surface 1202 of the protective part 120 of the second masking tape 12 is parallel to the main surface 90 of the substrate 9, whereby the side surface of the second masking tape 12 is formed. The organic EL liquid 93 adhering to 1203 is prevented from flowing to the side surface 1103 of the first masking tape 11 along the lower surface 1202 of the protective part 120 and adhering to the side surface 1103. Can be. As a result, the organic EL liquid 93 adhering to the side surface 1203 of the second masking tape 12 causes the lower surface 1202 of the protective part 120 and the side surface 1103 of the first masking tape 11 to be removed. It is prevented from adhering to the non-coated area 92 via the light.

In the masking tape 1, the width of each protective part 120 (that is, the first upper surface edge 1113 of the first masking tape 11 shown in FIG. 3 and the second lower surface edge of the second masking tape 12). The distance in the X direction between the 1223) is preferably 0.5 mm or more and 3 mm or less, respectively. By the width | variety of each protection part 120 being 0.5 mm or more, the certainty of the prevention of adhesion of the organic EL liquid with respect to the side surface 1103 of the 1st masking tape 11 can be improved more. Moreover, when the width | variety of each protection part 120 becomes 3 mm or less, the intensity | strength of the protection part 120 can be ensured enough, and the protection part 120 falls down toward the main surface 90 of the board | substrate 9 Can be prevented.

In the coating system 8 shown in FIG. 1, the board | substrate 9 by which the organic EL liquid was apply | coated by the coating device 3 is carried out from the coating device 3 by the transfer robot 81, and the tape peeling apparatus 4 is carried out. Imported into). 12 is a plan view of the tape peeling apparatus 4. As shown in FIG. 12, the tape peeling apparatus 4 is one instead of the 1st tape attachment head 23 and the 2nd tape attachment head 23a of the tape attachment apparatus 2 shown in FIGS. 4-6. The tape peeling head 43 is provided. The other structure of the tape peeling apparatus 4 is substantially the same as that of the tape sticking apparatus 2.

The tape peeling apparatus 4 includes the substrate holding part 41 which holds the board | substrate 9, the board | substrate movement mechanism 42 which moves the board | substrate 9 to the Y direction in FIG. 12 with the board | substrate holding part 41, The tape peeling head 43 which hold | maintains and peels the masking tape 1 (namely, the 1st masking tape 11 and the 2nd masking tape 12 shown in FIG. 3), and the tape peeling head 43 are board | substrates. The head moving mechanism 44 which moves in the direction perpendicular to the moving direction of (9) (namely, X direction in FIG. 12) is provided. In the tape peeling apparatus 4, the board | substrate 9 moves along the rail 421 along with the board | substrate holding part 41 in the horizontal direction by the board | substrate movement mechanism 42, and centers on the rotation axis which faces in a vertical direction. Rotate to Moreover, the tape peeling head 43 moves in the horizontal direction along the rail 441 above the movement range of the board | substrate 9 by the head movement mechanism 44. As shown in FIG.

FIG. 13: A is a left side view which expands and shows the structure of the tape peeling head 43. FIG. Also in FIG. 13A, the internal structure of the housing 431 of the tape peeling head 43 is shown like FIG. 7A. As shown to FIG. 13A, the tape peeling head 43 adheres to the 2nd masking tape 12 of the masking tape 1, The peeling tape 45 which hold | maintains at least one part of the masking tape 1, and peeling tape The peeling tape which guides the peeling tape 45 and opposes the adhesive surface of 45 to the 2nd masking tape 12 of the masking tape 1 on the board | substrate 9, facing the 2nd masking tape 12 in order. Masking tape in which the adhesive receptacle 433 which is a guide part, the supply reel 432 which is a peeling tape supply part which supplies the unused peeling tape 45 to the adhesive mechanism 433, and the peeling tape 45 adhered to the peeling tape 45 (1) (i.e., the first masking tape 11 and the second masking tape 12) together with the recovery reel 434 which is a peeling tape recovery part which is pulled up and recovered from the substrate 9, and a housing accommodating these configurations 431 is provided. The adhesion mechanism 433 includes an air cylinder 436 and a pressure roller 437. In addition, the width of the peeling tape 45 is larger than the width of the second masking tape 12 of the masking tape 1.

When the masking tape 1 is peeled off from the board | substrate 9 by the tape peeling apparatus 4, first, the board | substrate 9 and the head movement mechanism 44 shown in FIG. The tape peeling head 43 is moved and located in a peeling start position. At this time, as shown to FIG. 13A, the front end of the masking tape 1 which is a peeling object is located under the lower opening 435 of the housing 431 of the tape peeling head 43. As shown in FIG.

Subsequently, the pressure roller 437 moves downward through the lower opening 435 by the air cylinder 436, and the peeling tape 45 is moved upward (that is, the opposite side to the adhesive surface of the peeling tape 45). Is pressed against the tip of the second masking tape 12 of the masking tape 1 and adhered thereto. Next, the substrate 9 starts to move in the (+ Y) direction in FIG. 13A by the substrate moving mechanism 42 (see FIG. 12). At the same time, clockwise rotation of the supply reel 432 and the recovery reel 434 in FIG. 13A is started to release the peeling tape 45 wound around the supply reel 432, and as shown in FIG. 13B. Similarly, the pressure roller 437 moves upward to return to its original position, whereby the tip of the second masking tape 12 adhered to the release tape 45 is joined with the first masking tape 11 (+ Z). It lifts to the side, and the front-end | tip part of the 1st masking tape 11 peels from the board | substrate 9. And the peeling tape 45 is continuously sent from the supply reel 432 shown in FIG. 13A, and the board | substrate 9 continues to move, and the 1st masking tape 11 and the 2nd masking tape on the board | substrate 9 are continued. While 12 sticks to the peeling tape 45, it peels from the board | substrate 9, it is wound up by the collection reel 434, and is collect | recovered.

In the tape peeling apparatus 4, only the 1st masking tape 11 and the 2nd masking tape 12 peel from the board | substrate 9 to which the organic EL liquid was apply | coated, and only on the application | coating area | region 91 of the board | substrate 9 The organic EL liquid is left. Thus, in the tape peeling apparatus 4 shown in FIG. 12, the masking tape 1 is masked by the board | substrate movement mechanism 42 in the state which hold | maintained and raised the masking tape 1 by the tape peeling head 43. As shown in FIG. The peeling of the masking tape 1 from the board | substrate 9 is performed by moving along the direction in which (1) is affixed.

In the coating system 8, in the masking tape 1 attached to the substrate 9 by the tape applying apparatus 2, the adhesive force of the second masking tape 12 to the first masking tape 11 is, It becomes larger than the adhesive force with respect to the non-coating area 92 of the board | substrate 9 of the 1st masking tape 11. FIG. In this embodiment, the adhesive force with respect to the non-coating area | region 92 of the 1st masking tape 11 becomes 0.01N / 20mm or more and 1.2N / 20mm or less, Preferably, it is 0.02N / 20mm or more 0.8N / 20mm or less (more preferably, 0.03N / 20mm or more and 0.4N / 20mm or less).

The adhesive force is attached to the non-coated area 92 by attaching a first masking tape having a width of 20 mm in a laminator with an adhesion speed of 0.3 m / min and a linear pressure of 78.4 N / cm under conditions of a temperature of 23 ° C. and a relative humidity of 50%, After 30 minutes have elapsed, the tensile tester used the peeling angle of 180 ° and the peeling speed of 0.3 m / min (that is, the tip of the first masking tape was removed from the rest of the first masking tape 11). Force when peeling while pulling at a speed of 0.3 m / min in the direction overlapping with the site. Moreover, the adhesive force with respect to the 1st masking tape 11 of the 2nd masking tape 12 becomes 0.1N / 20 mm or more larger than the adhesive force with respect to the non-coating area 92 of the 1st masking tape 11.

Thus, as the adhesive force of the 2nd masking tape 12 with respect to the 1st masking tape 11 becomes larger than the adhesive force with respect to the board | substrate 9 of the 1st masking tape 11, the tape peeling apparatus 4 In this case, when the second masking tape 12 is lifted by the release tape 45, the first masking tape 11 is peeled off from the second masking tape 12 to prevent it from remaining on the substrate 9. The 1st masking tape 11 and the 2nd masking tape 12 can be tied together (that is, by one peeling operation), and can peel easily.

Moreover, in the tape peeling apparatus 4, since the upper surface of the 2nd masking tape 12 with organic EL liquid adhered is covered with the peeling tape 45, the masking tape 1 is peeled from the board | substrate 9, The masking tape 1 can be collect | recovered without dropping the organic EL liquid adhering on the 2 masking tape 12 to the board | substrate 9. In addition, the adhesion start to the masking tape 1 of the peeling tape 45 may be performed with respect to the board | substrate 9 which is moving at the same speed as the feed rate of the peeling tape 45, supplying the peeling tape 45. FIG. .

In the coating system 8 shown in FIG. 1, when peeling from the board | substrate 9 of the masking tape 1 is complete | finished, the board | substrate 9 is carried out from the tape peeling apparatus 4 to the outside of the coating system 8, and the board | substrate ( Application of the organic EL solution to 9 is completed. In addition, in the coating system 8, in practice, the masking tape 1 is applied, the organic EL liquid is applied, and the masking tape 1 is peeled off continuously on a plurality of substrates.

As explained above, in the coating system 8 shown in FIG. 1, the non-coating area | region 92 and the coating | coating area | region 91 by the tape applying apparatus 2, the coating apparatus 3, and the tape peeling apparatus 4 are performed. It is possible to easily obtain the substrate 9 to which the organic EL liquid is applied substantially to the application region 91 while preventing the occurrence of meniscus at the boundary 920 between the layers.

By the way, the film thickness of the organic EL layer (that is, the thickness of the film of the organic EL material formed by drying the organic EL liquid) formed on the substrate for the organic EL display device greatly influences the display performance of the flat panel display device and the like. Because of this, it needs to be controlled with high precision. Therefore, the coating system 8 which can prevent the occurrence of meniscus and improve the uniformity of the film thickness of the organic EL layer is particularly suitable for the application of the organic EL liquid to the substrate for the organic EL display device. Can be. In addition, in the other flat display devices other than the organic EL display device, as in the organic EL display device, since the film thickness of the pixel forming material formed on the substrate needs to be controlled with high precision, the coating system 8 is flat It can be said that it is suitable also for application | coating of the fluid material containing the pixel formation material for display devices.

Next, the tape applying apparatus of the coating system which concerns on 2nd Embodiment of this invention is demonstrated. FIG. 14: is a top view which shows the tape sticking apparatus 2a which concerns on 2nd Embodiment. In the tape sticking device 2a, one tape sticking head 23b is provided in place of the first tape sticking head 23 and the second tape sticking head 23a of the tape sticking device 2 shown in FIG. . The other structure of the tape sticking apparatus 2a is the same as that of the tape sticking apparatus 2 shown to FIGS. 4-6, and attaches | subjects the same code | symbol to the corresponding structure in the following description.

FIG. 15A is a left side view showing an enlarged configuration of the tape attachment head 23b. In FIG. 15A, an internal configuration is accommodated in the housing 231 of the tape attachment head 23b as shown in FIGS. 7A and 7B. have. As shown in FIG. 15A, in addition to the configuration of the first tape attaching head 23 shown in FIG. 7A, the tape attaching head 23b includes a second masking tape 12 formed on one main surface of the base tape 271. A second supply reel 232a, which is a second tape supply part for releasing the held tape 27a, a second recovery reel 234a, a second tape recovery part that winds and recovers the base tape 271 of the tape 27a; And a tape bonding part 230 for attaching the second masking tape 12 to the first masking tape 11. The other structure of the tape attachment head 23b is the same as that of the 1st tape attachment head 23 shown to FIG. 7A, and attaches | subjects the same code | symbol to a corresponding structure in the following description. In addition, the tape attachment head 23b is arrange | positioned in the same direction as the 1st tape attachment head 23 shown to FIG. 7A.

When the 1st masking tape 11 and the 2nd masking tape 12 are affixed to the board | substrate 9 by the tape sticking apparatus 2a shown in FIG. 14, first, to the head movement mechanism 24 shown in FIG. As a result, the tape attachment head 23b is moved in the X direction, positioned above the movement path of the substrate 9, and the substrate 9 is moved in the (+ Y) direction by the substrate movement mechanism 22, as shown in FIG. 15A. It is located at the attachment start position.

In the tape attachment head 23b, the portion which is released from the second supply reel 232a of the second masking tape 12 and peeled from the base tape 271 is separated from the first supply reel 232 which is the first tape supply part. The rollers 2301 and 2302 of the tape joint 230 together with the released tape 27 (ie, the base tape 271 and the first masking tape 11 held on one main surface of the base tape 271). The lower surface 1222 of the pressure-sensitive adhesive layer 122 of the second masking tape 12 is attached to the upper surface 1111 (see FIG. 3) of the base material 111 of the first masking tape 11 by inserting in the. Are attached).

Subsequently, the first masking tape 11 and the second masking tape 12 are cut off from the second masking tape 12 side by the cutting portion 235 of the pressing portion 233, and the tape separating member 236. At the distal end of the first masking tape 11 and the second masking tape 12 are peeled from the base tape 271, the distal end of which moves toward the substrate 9 from the lower opening 237 of the housing 231. do. In addition, in parallel with this, the attachment roller 239 moves downward through the lower opening 237 by the air cylinder 238 of the pressurizing portion 233, and as shown in FIG. 15B, the first masking tape ( 11) and the second masking tape 12 while the distal end portions of the bonded portions of the second masking tape 12 face the substrate 9 with the pressure-sensitive adhesive layer 112 (see FIG. 3) of the first masking tape 11. ) Is pressed against the main surface 90 of the substrate 9 from the substrate 121 (see FIG. 3) side, and the substrate 9 starts to move in the direction (+ Y) of FIG. 15A.

Then, the tape 27 and the tape 27a are continuously sent out from the first supply reel 232 and the second supply reel 232a, respectively, and the first masking tape 11 and the second masking tape 12 are provided. In the state where the pressing part 233 was pressed by the attachment roller 239, the board | substrate 9 is the boundary 920 of the non-coating area | region 92 by the board | substrate movement mechanism 22 shown in FIG. By moving in a scanning direction parallel to the scanning surface (i.e., (+ Y) direction), the first masking tape 11 and the second masking tape 12 (i.e., on the main surface 90 of the substrate 9) Masking tape 1 is sequentially attached to non-coated region 92 along boundary 920.

In the tape attachment head 23b shown in FIG. 15A, the first masking tape 11 and the second masking tape 12 on the base tape 271 are cut again by the cutting portion 235, and the first masking tape 11 is provided. ) And the second masking tape 12 are attached to the substrate 9 to the rear end thereof so that the first masking tape 11 of the masking tape 1 comes into close contact with the main surface 90 of the substrate 9. In the tape applying apparatus 2a shown in FIG. 14, the board | substrate movement mechanism 22 and the tape attachment head 23b make the 1st masking tape 11 and the 2nd masking tape 12 the main surface of the board | substrate 9 An attachment mechanism is attached to the non-coated region 92 of 90.

In addition, the attachment start of the 1st masking tape 11 and the 2nd masking tape 12 shown to FIG. 15A is moving at the same speed as the feed rate of these tapes, supplying the tape 27 and the tape 27a. It may be performed on the substrate 9. In addition, in the tape attachment head 23b, the first masking tape 11 and the second masking tape 12 are different from when the front and rear ends of the first masking tape 11 and the second masking tape 12 are attached. May be released. In other words, in the attaching mechanism of the tape applying apparatus 2a, at least the front end part and the rear end part of the first masking tape 11 and the second masking tape 12 are attached at the time of attaching the first masking tape 11 and the second masking tape. The first masking tape 11 and the substrate 9 are moved relative to the pressing portion 233 of the tape attaching head 23b in the scanning direction while the 12 is pressed against the substrate 9. A second masking tape 12 is attached to the non-coated region 92 on the substrate 9.

In the board | substrate 9 with the 1st masking tape 11 and the 2nd masking tape 12 attached by the tape sticking apparatus 2a, like 1st Embodiment (refer FIG. 3), 1st masking tape The boundary 920 between the non-coated region 92 and the application | coating area | region 91 of the 1st lower surface edge 1123 of both sides (namely, (+ X) side and (-X) side) of the width direction of (11) ) And the second lower surface edge 1223 on both sides of the second masking tape 12 is positioned outside the first upper surface edge 1113 of the first masking tape 11. Located. For this reason, a part of the 2nd masking tape 12 which protrudes outward from the 1st masking tape 11 in the both sides of the width direction turns into the protection part 120. FIG.

In the tape applying apparatus 2a which concerns on 2nd Embodiment, since the 1st masking tape 11 and the 2nd masking tape 12 are bonded by the tape attachment head 23b, the board | substrate movement mechanism 22 The first masking tape 11 and the second masking tape 12 can be attached to the non-coated region 92 of the substrate 9 at the same time by one movement in the Y direction. As a result, the rapid attachment of the masking tape 1 to the substrate 9 can be realized.

On the other hand, in the tape attachment device 2 which concerns on 1st Embodiment, the structure of the 1st tape attachment head 23 and the 2nd tape attachment head 23a is made simple, and both tape attachment heads By making the structure of common, the device structure of the tape applying apparatus 2 is simplified.

In the application system according to the second embodiment, the masking tape 1 (that is, the first masking tape 11 and the second masking tape 12) having the protection part 120 (see FIG. 11A). The substrate 9 attached to the temporary uncoated region 92 is carried out from the tape applying apparatus 2a and carried in the coating apparatus 3. And after application | coating of organic EL liquid is performed like 1st Embodiment, it carries in to the tape peeling apparatus 4, and peeling of the masking tape 1 is performed.

In the coating system which concerns on 2nd Embodiment, the mask 37 of the coating device 3 is similar to the 1st Embodiment with the masking tape 1 affixed by the tape sticking apparatus 2a. The organic EL liquid discharged from the substrate 9 (see FIGS. 8 and 9) can be prevented from adhering to the exposed region 921 (see FIG. 11A) of the non-coated region 92. It can also be prevented from adhering to the side surfaces 1103 (see FIG. 11A) on both sides of the first masking tape 11 attached to the non-coated region 92. As a result, the generation of the meniscus at the boundary 920 between the non-coated region 92 and the coating regions 91 on both sides can be easily prevented, and on the film of the organic EL material in a later step. Defects such as insufficient thickness of other films to be formed are prevented.

In the tape applying apparatus 2a, like the 1st Embodiment, the 1st masking tape 11 and the 2nd masking tape 12 are attached so that each centerline may overlap with the centerline of the non-coating area | region 92. FIG. Thereby, the form of the slight adhesion of the organic EL liquid to the non-coated region 92 and the application start position of the organic EL liquid in the application region 91 and the form of a slight separation of the boundary 920 can be made the same. . As a result, the quality of application of the organic EL liquid to the two application regions 91 on both sides of the non-coated region 92 can be made uniform. In addition, the width of the second masking tape 12 is equal to the width of the non-coated region 92, and the edges of the second masking tape 12 are bordered on both sides of the non-coated region 92 in plan view. By attaching the second masking tape 12 so as to overlap with the 920, the adhesion of the organic EL liquid to the non-coated region 92 is more reliably prevented.

In the masking tape 1, as in the first embodiment, the lower surface 1202 of the protective part 120 of the second masking tape 12 is made parallel to the main surface 90 of the substrate 9. The organic EL liquid adhering to the side surface 1203 (see FIG. 11A) of the 2 masking tape 12 is prevented from adhering to the side surface 1103 and the non-coating region 92 of the first masking tape 11.

Moreover, in the coating system which concerns on 2nd Embodiment, the masking tape 1 adhering to the board | substrate 9 by the tape sticking apparatus 2a WHEREIN: Like 2nd Embodiment, 2nd masking The adhesive force of the tape 12 to the first masking tape 11 is larger than the adhesive force of the first masking tape 11 to the substrate 9. For this reason, in the tape peeling apparatus, the 1st masking tape 11 and the 2nd masking tape 12 can be bundled together (that is, by one peeling operation), and it can peel easily.

Next, the tape applying apparatus of the coating system which concerns on 3rd Embodiment of this invention is demonstrated. FIG. 16: is a top view which shows the tape sticking apparatus 2b which concerns on 3rd Embodiment. As shown in FIG. 16, the tape attaching apparatus 2b is the 1st tape attaching apparatus 201a, the 2nd tape attaching apparatus 201b, and the 1st tape attaching apparatus 201a and the 2nd tape attaching apparatus 201b. ) And a conveying mechanism 202 which carries out the board | substrate 9 from the 1st tape attachment apparatus 201a, and carries in to the 2nd tape attachment apparatus 201b. The first tape attachment device 201a has the same configuration as the tape attachment device 2 shown in FIGS. 4 to 6 except that the second tape attachment head 23a is not provided. The second tape attachment device 201b has the same configuration as the tape attachment device 2 shown in FIGS. 4 to 6 except that the first tape attachment head 23 is not provided.

As with the tape applying apparatus 2 shown in FIG. 4, the 1st tape applying apparatus 201a carries out the board | substrate holding part 21 which hold | maintains the board | substrate 9, and the board | substrate 9 in a scanning direction (namely, in FIG. 16). A substrate moving mechanism 22 moving in the Y direction, a first tape attaching head 23 attaching the first masking tape 11 (see FIG. 3) to the non-coated region 92 on the substrate 9, and The head moving mechanism 24 which moves the 1st tape attachment head 23 to the direction perpendicular | vertical to a scanning direction (namely, X direction in FIG. 16) is provided. In the 1st tape attachment apparatus 201a, the board | substrate movement mechanism 22 and the 1st tape attachment head 23 make the 1st masking tape 11 the non-coating area | region 92 of the main surface 90 of the board | substrate 9 It is a 1st attachment mechanism to attach to).

Like the 1st tape attachment apparatus 201a, the 2nd tape attachment apparatus 201b also has the board | substrate holding part 21 which hold | maintains the board | substrate 9, and the board | substrate movement mechanism 22 which moves the board | substrate 9 to a scanning direction. ), A second tape attachment head 23a for attaching the second masking tape 12 (see FIG. 3) to the top surface 1111 of the first masking tape 11 attached on the substrate 9, and the second The head moving mechanism 24 which moves the tape attachment head 23a in the direction perpendicular | vertical to a scanning direction is provided. In the 2nd tape attachment apparatus 201b, the 1st mask which the board | substrate movement mechanism 22 and the 2nd tape attachment head 23a attached the 2nd masking tape 12 to the main surface 90 of the board | substrate 9 was carried out. A second attachment mechanism is attached to the upper surface 1111 of the king tape 11.

In the tape attaching apparatus 2b which concerns on 3rd embodiment, the 1st tape attaching apparatus 201a carries out the 1st masking tape 11 similarly to 1st embodiment (refer FIG. 3). The first lower surface edge 1123 on both sides in the width direction (that is, the (+ X) side and the (-X) side) is not coated than the boundary 920 between the non-coated region 92 and the coating region 91. Positioned inside the region 92, the first masking tape 11 is attached to the non-coated region 92 parallel to the boundary 920. The board | substrate 9 with the 1st masking tape 11 is carried out from the 1st tape attachment apparatus 201a by the conveyance mechanism 202, and is carried in to the 2nd tape attachment apparatus 201b.

And the 2nd lower surface edge 1223 of the 2nd masking tape 12 is made into the 1st upper surface edge 1113 of the 1st masking tape 11 by the 2nd tape attachment apparatus 201b on both sides of the width direction. The second masking tape 12 is attached to the top surface 1111 of the first masking tape 11 in parallel with the boundary 920, while being located outside the. For this reason, the protection part 120 becomes a part of the 2nd masking tape 12 which protrudes outward from the 1st masking tape 11 in the both sides of the width direction.

As a result, in the coating system which concerns on 3rd Embodiment, it is carried out on the board | substrate 9 from the nozzle 37 (refer FIG. 8 and FIG. 9) of the coating device 3 like 1st Embodiment. The discharged organic EL liquid can be prevented from adhering to the exposed region 921 (see FIG. 11A) of the non-coated region 92, and the first masking tape 11 attached to the non-coated region 92. It can also be prevented from adhering to the side surfaces 1103 (see Fig. 11A) on both sides of the &quot; For this reason, generation | occurrence | production of the meniscus at the boundary 920 between the non-coating area | region 92 and the application | coating area | region 91 of both sides is easily prevented.

Next, the tape applying apparatus of the coating system which concerns on 4th Embodiment of this invention is demonstrated. The tape sticking apparatus which concerns on 4th Embodiment is a tape sticking apparatus 2 and the point except that the 2nd tape sticking head 23a is omitted from the tape sticking apparatus 2 shown to FIGS. The same structure is provided and the same code | symbol is attached | subjected to the corresponding structure in the following description.

In the tape applying apparatus which concerns on 4th Embodiment, the masking tape 1 (refer FIG. 3) to which the 2nd masking tape 12 was previously attached to the upper surface 1111 of the 1st masking tape 11, In a state held on one surface of the base tape 271, the base tape 271 is wound around the first supply reel 232 in the first tape attachment head 23 shown in FIG. 7A. And the 2nd surface attached to the 1st masking tape 11 and the 1st masking tape 11 in parallel, opposing the lower surface 1122 (refer FIG. 3) of the 1st masking tape 11 to the board | substrate 9. The substrate 9 is moved in the scanning direction by the substrate moving mechanism 22 while the masking tape 12 is pressed against the main surface 90 of the substrate 9, whereby the non-coated region 92 of the substrate 9 is provided. ), The masking tape 1 (that is, the first masking tape 11 and the second masking tape 12) is attached.

In the masking tape 1, the 1st masking tape 11 and the 2nd masking tape 12 are attached to the board | substrate 9 one by one by the tape sticking apparatus 2 which concerns on 1st Embodiment, and is formed. As is the case, the second lower surface edge 1223 of the second masking tape 12 is located outward of the first upper surface edge 1113 of the first masking tape 11 on both sides in the width direction. do. For this reason, the protection part 120 which is the site | part which protrudes outward of the width direction from the 1st masking tape 11 of the 2nd masking tape 12 is the main surface 90 of the board | substrate 9 (namely, 1st masking). It is located above the lower surface 1122 of the tape 11). As a result, as in the first embodiment, generation of meniscus at the boundary 920 between the non-coated region 92 and the coating regions 91 on both sides is easily prevented.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible.

For example, in the masking tape 1 attached to the non-coated region 92 of the substrate 9, the side surfaces 1103 of both sides of the first masking tape 11 always have the main surface 90 of the substrate 9. ) Need not be approximately perpendicular (ie, approximately perpendicular to the bottom surface 1122 of the first masking tape 11), and the first top edge 1113 of the first masking tape 11 is the second masking tape 12. The second lower surface edge 1223 may be inclined to face the inner side or the outer side in the width direction as it is located away from the main surface 90 of the substrate 9.

Similarly with respect to the second masking tape 12, the side surfaces 1203 on both sides of the second masking tape 12 must be substantially perpendicular to the main surface 90 of the substrate 9 (that is, the second masking tape 12). It is not necessary to be substantially perpendicular to the lower surface 1222 of), and may be inclined to face inward or outward in the width direction as it moves away from the main surface 90 of the substrate 9. However, the maximum width of the second masking tape 12 is equal to the width of the non-coated region 92, and the edges in the width direction of the second masking tape 12 of the non-coated region 92 are viewed in plan view. By overlapping the boundary 920 on both sides, adhesion of the organic EL liquid to the non-coated region 92 is more reliably prevented.

In the masking tape 1, the lower surface 1202 of the protective part 120 does not necessarily need to be parallel to the main surface 90 of the substrate 9, but the lower surface 1202 of the protective part 120 is formed of a substrate ( By being substantially parallel to the main surface 90 of 9), the organic EL liquid is prevented from adhering to the side surface 1103 or the non-coated region 92 of the first masking tape 11 as described above. In addition, although the centerline of each of the 1st masking tape 11 and the 2nd masking tape 12 does not necessarily need to overlap with the centerline of the non-coating area | region 92, the 1st masking tape 11 and the 2nd masking do not necessarily overlap. By attaching the first masking tape 11 and the second masking tape 12 to the non-coating area 92 almost overlapping the center line of the tape 12 with the center line of the non-coating area 92, respectively, as described above, The quality of the application of the organic EL liquid to the two application regions 91 on both sides of the application region 92 can be made uniform.

In the tape applying apparatus 2 which concerns on 1st Embodiment, instead of the movement to the scanning direction of the board | substrate 9 by the board | substrate movement mechanism 22, the 1st tape attachment head 23 and the 2nd tape As the attachment head 23a is moved in the scanning direction, respectively, the relative movement with respect to the 1st press part 233 of the board | substrate 9 in a scanning direction, and the 2nd press part 233a of the board | substrate 9 with respect to Relative movement may be realized. Moreover, instead of the movement of the 1st tape attachment head 23 and the 2nd tape attachment head 23a by the head movement mechanism 24, the board | substrate 9 is perpendicular to a scanning direction with the board | substrate holding part 21. It may move in the direction.

In the tape applying apparatus 2, the 1st tape attachment head 23 and the 2nd tape attachment head 23a are arrange | positioned in the same direction, and the board | substrate 9 is a (-Y) direction (or (+ Y) direction). In parallel with the attachment of the first masking tape 11 by the first tape attaching head 23, the film is placed on another first masking tape 11 already attached to the non-coated region 92. The second masking tape 12 may be attached by the second tape attachment head 23a. Moreover, in the tape sticking apparatus 2, each structure of the 1st tape attachment head 23 and the 2nd tape attachment head 23a is accommodated in one housing, and is integrated by the head movement mechanism 24 integrally. It may be moved in the direction perpendicular to the scanning direction.

In the tape applying apparatus 2a which concerns on 2nd Embodiment, the tape attachment head 23b is moved to a scanning direction instead of the movement to the scanning direction of the board | substrate 9 by the board | substrate movement mechanism 22. Relative movement with respect to the press part 233 of the board | substrate 9 may be implement | achieved. In addition, instead of the movement of the tape attachment head 23b by the head moving mechanism 24, the substrate 9 may be moved together with the substrate holding part 21 in a direction perpendicular to the scanning direction.

In the state before the 1st masking tape 11 is affixed to the board | substrate 9, it is not necessary to necessarily hold | maintain on the base tape 271, and is hold | maintained in the tape sticking apparatus by the 1st masking tape 11 single body. It may be sufficient (the same applies to the second masking tape 12).

The masking tape 1 may be comprised by laminating | stacking three or more masking tapes. For example, when the masking tape 1 is constituted by three layers of masking tape, when the width of the masking tape of the intermediate layer is smaller than the width of the masking tape of the uppermost layer, the masking tape of the intermediate layer is described together with the masking tape of the lowest layer. Is considered the first masking tape. Moreover, when the width | variety of the masking tape of an intermediate | middle layer is larger than the width of the masking tape of a lowermost layer, the masking tape of an intermediate | middle layer is considered to be the 2nd masking tape mentioned above with the masking tape of an uppermost layer.

In the coating apparatus 3 of the coating system which concerns on the said embodiment, the number of nozzles provided in the coating head 34 is not limited to three, and it is necessarily required to apply three types of organic EL liquids simultaneously. There is no. For example, the same kind of organic EL liquid may be simultaneously discharged from three or more nozzles and applied to the substrate 9. In this case, the distance in the sub-scan direction between two adjacent nozzles is equal to three times the partition pitch. In addition, a partition wall does not necessarily need to be formed in the application | coating area | region 91 of the board | substrate 9, In the application | coating device 3, the organic EL liquid is predetermined | prescribed with respect to the application | coating area | region 91 in which the partition is not provided. You may apply | coat with a pitch.

In addition, in the coating system, instead of the two fixed transfer robots 81 (see FIG. 1), a self-propelled one (or plural) transfer robot is the tape applying apparatus 2 and the coating apparatus. You may be provided as a board | substrate conveyance mechanism which conveys the board | substrate 9 in order to (3) and the tape peeling apparatus 4 in order.

When the said coating system apply | coats the fluid material containing a hole transport material (henceforth "hole transport liquid") to the board | substrate 9 for organic electroluminescent display apparatuses in addition to application | coating of organic electroluminescent liquid, It may be used for preventing the adhesion of the hole transport liquid to the application region 92. Here, the "hole transporting material" is a material for forming the hole transporting layer of the organic EL display device, and the "hole transporting layer" is only a narrow hole transporting layer for transporting holes to the organic EL layer formed of the organic EL material. It does not mean, but also includes the hole injection layer which injects holes.

In addition, the coating system is not necessarily used only at the time of coating of the fluid material which contains the organic EL material or hole transport material for organic electroluminescent display as a pixel formation material, For example, a liquid crystal display device, a plasma display device, etc. The substrate for a flat panel display device may be used when applying a fluid material containing other kinds of pixel forming materials such as a coloring material or a fluorescent material or when applying other fluid materials. Moreover, you may use at the time of apply | coating a fluid material to various board | substrates, such as an organic thin film solar cell board | substrate, a semiconductor wafer, and an optical disk board | substrate.

While the invention has been described and described in detail, the description thereof is intended to be illustrative and not restrictive. Accordingly, many modifications and forms are possible without departing from the scope of the present invention.

FIG. 1: is a figure which shows the structure of the coating system which concerns on 1st Embodiment.

2 is a plan view of the substrate.

3 is a cross-sectional view showing part of a masking tape and a substrate.

4 is a plan view of the tape applying apparatus.

5 is a front view of the tape applying apparatus.

6 is a left side view of the tape applying device.

FIG. 7A is an enlarged left side view of the head with the first tape. FIG.

7B is an enlarged left side view of the head with the second tape.

7C is an enlarged left side view of a part of the first tape attachment head.

8 is a plan view of the coating apparatus.

9 is a front view of the coating device.

10 is a plan view of a masking tape and a substrate.

11A is a cross-sectional view showing part of a masking tape and a substrate.

It is sectional drawing which shows a part of masking tape and a board | substrate of a comparative example.

11C is a cross-sectional view showing a part of the substrate of the comparative example.

12 is a plan view of the tape peeling apparatus.

It is a left side view which expands and shows a tape peeling head.

It is a left side view which expands and shows a part of tape peeling head.

It is a top view of the tape sticking apparatus which concerns on 2nd Embodiment.

15A is an enlarged left side view of the head with tape.

It is a left side view which expands and shows a part of head with a tape.

It is a top view of the tape sticking apparatus which concerns on 3rd Embodiment.

Claims (14)

A tape applying apparatus for attaching a masking tape to an uncoated area on a main surface of a substrate to prevent adhesion of a flowable material to the uncoated area, A substrate holding part for holding a substrate, The first masking tape is positioned at the inner side of the non-coated region rather than the boundary between the non-coated region and the application region on the main surface of the substrate, the first lower surface edge being one edge of the lower surface of the first masking tape. Attaching to the non-coated area in parallel, and positioning the second lower surface edge, which is one edge of the lower surface of the second masking tape, outward from the edge of the upper surface of the first masking tape located above the first lower surface edge. Attaching the second masking tape to the upper surface of the first masking tape in parallel with the boundary so that the second masking tape protrudes outward from the first masking tape and is spaced apart from the main surface of the substrate. Tape attachment apparatus provided with the attachment mechanism which installs a part of on a said board | substrate as a protection part. The method according to claim 1, The tape attaching apparatus of which the lower surface of the said protection part of the said 2nd masking tape is parallel to the said main surface of the said board | substrate. The method according to claim 1, By attaching the first masking tape to the non-coated area, the other first lower surface edge of the first masking tape is parallel to the boundary between the non-coated area and another application area. Located inside the non-coated area more than one boundary, The second masking tape is attached to the upper surface of the first masking tape, so that the second lower surface edge of the other side of the second masking tape is located above the other first lower surface edge of the first masking tape. A portion of the second masking tape positioned outside the edge of the upper surface of the tape and protruding from the first masking tape toward the outside and spaced apart from the main surface of the substrate is another substrate as the protection portion. Tape attachment device installed on the. The method of claim 3, The tape sticking device of which the centerline of each of the said 1st masking tape and the said 2nd masking tape overlaps the centerline of the said non-coating area | region. The method according to claim 4, A tape applying apparatus, wherein the width of the second masking tape is the same as that of the non-coated area. The method according to any one of claims 1 to 5, The adhesive force of the said 2nd masking tape with respect to the said 1st masking tape is larger than the adhesive force of the said 1st masking tape with respect to the said board | substrate. The method according to any one of claims 1 to 5, The attachment mechanism, A first attachment mechanism for attaching the first masking tape to the main surface of the substrate; A second attachment mechanism for attaching the second masking tape to the upper surface of the first masking tape attached to the main surface of the substrate, The first attachment mechanism, A first tape supply part for unwinding the first masking tape; A first pressing portion for pressing the portion released from the first tape supply portion of the first masking tape toward the non-coating region, The second attachment mechanism, A second tape supply part for releasing the second masking tape; And a second pressing portion for pressing the portion released from the second tape supply portion of the second masking tape toward the first masking tape attached to the non-coated area, The first attachment mechanism and the second attachment mechanism, The first masking tape by moving the substrate relative to the first pressing portion in a moving direction parallel to the boundary of the non-coated region with the first masking tape pressed by the first pressing portion By attaching the tape sequentially along the boundary, while moving the substrate relative to the second pressing portion in the moving direction while the second masking tape is pressed by the second pressing portion, And a moving mechanism for sequentially attaching the second masking tape along the boundary. The method according to any one of claims 1 to 5, The attachment mechanism, A first tape supply part for unwinding the first masking tape; A second tape supply part for releasing the second masking tape; A tape joining portion for attaching a portion released from the first tape supply portion of the first masking tape to the second masking tape; A pressing portion for pressing the bonded portions of the first masking tape and the second masking tape toward the non-coated area while facing the first masking tape with the substrate; The first masking tape and the second masking tape are pressed by the pressing portion, and the substrate is moved relative to the pressing portion in a moving direction parallel to the boundary of the non-coated region, thereby making the And a moving mechanism for sequentially attaching the first masking tape and the second masking tape along the boundary. A tape applying apparatus for attaching a masking tape to an uncoated area on a main surface of a substrate to prevent adhesion of a flowable material to the uncoated area, A first substrate holding portion for holding a substrate and a first lower surface edge, which is one edge of the lower surface of the first masking tape, are located inside the non-coating region than a boundary between an uncoated region and an application region on the main surface of the substrate. A first tape attachment device having a first attachment mechanism that attaches the first masking tape to the non-coated area parallel to the boundary while positioning; A second substrate holding portion for holding the substrate, and a second lower surface edge, which is one edge of the lower surface of the second masking tape, on an outer side of an edge of the upper surface of the first masking tape located above the first lower surface edge. Attaching the second masking tape to the upper surface of the first masking tape in parallel with the boundary while positioning so that the second masking tape protrudes outward from the first masking tape and is spaced apart from the main surface of the substrate. A second tape applying device having a second attaching mechanism for providing a portion of the masking tape as a protecting portion on the substrate; Tape carrying apparatus which carries out the said board | substrate from the said 1st tape attachment apparatus, and carries in to the said 2nd tape attachment apparatus. An application system for applying a flowable material to a substrate, The tape sticking apparatus of any one of Claims 1-5, An applicator for applying a flowable material to a region comprising said second masking tape on a substrate having a first masking tape and a second masking tape attached thereto; A tape peeling apparatus for peeling the first masking tape and the second masking tape from a substrate coated with a fluid material; It is provided with the board | substrate conveyance mechanism which conveys a board | substrate in order to the said tape sticking apparatus, the said coating device, and the said tape peeling apparatus, The coating device, A discharge mechanism for continuously discharging the fluid material toward the substrate; The discharge mechanism is moved relative to the substrate in the main scanning direction parallel to the main surface of the substrate and intersects with the second masking tape, and the substrate is transferred to the discharge mechanism every time the movement in the main scanning direction is performed. And a moving mechanism moving relatively in the sub-scan direction perpendicular to the main scan direction. The method according to claim 10, And the flowable material comprises a pixel forming material for a flat panel display device. The method of claim 11, A coating system, wherein the pixel forming material is an organic EL material or a hole transporting material for an organic EL display device. A masking tape which adheres to an uncoated area on a main surface of a substrate to prevent adhesion of a flowable material to the uncoated area, A first masking tape having a lower surface facing the substrate, A second masking tape attached to an upper surface of the first masking tape in parallel to the first masking tape, In one side portion of the first masking tape and the second masking tape, an edge of the bottom surface of the second masking tape is located outside the edge of the top surface of the first masking tape, whereby A masking tape, wherein a portion projecting outward from the first masking tape is located above a plane including the bottom surface of the first masking tape. 14. The method of claim 13, A masking tape, wherein the adhesive force of the second masking tape to the first masking tape is greater than the adhesive force of the first masking tape to the substrate.

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