JP5275433B2 - Tape applicator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stick a masking tape to a non-coating area while making a particular side surface, which is one of side surfaces, coincide with a boundary between the non-coating area and a coating area even when the coating area is present on one side in a width direction. <P>SOLUTION: A tape sticking device includes a sticking mechanism (namely a scanning mechanism and tape sticking head) which sticks the masking tape 1f on a substrate 9, a moving mechanism which moves the tape sticking head in a direction perpendicular to a scanning direction, and a rotating mechanism which rotates the substrate 9 by 180&deg;. Thus, even when the coating area 91 is present on one side in the width direction, the low cost masking tape 1f where the contact angle of a fluid material on the particular side surface 103a is larger than the contact angle of the fluid material on a principal surface 90 of the substrate 9 can be attached to the non-coating area 92 while making a lower edge 124 on the particular side surface 103a side coincide with the boundary 920 of the non-coating area 92 and the coating area 91. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a technique for applying a masking tape that prevents adhesion of a flowable material to a non-application area on a main surface of a substrate.

  2. Description of the Related Art Conventionally, an organic EL display device using an organic EL (Electro Luminescence) material has been developed. For example, in the production of an active matrix drive type organic EL display device using a polymer organic EL material, a glass substrate is used. (Hereinafter simply referred to as “substrate”), formation of TFT (Thin Film Transistor) circuits, formation of ITO (Indium Tin Oxide) electrodes as anodes, formation of barrier ribs, fluid materials including hole transport materials (Hereinafter referred to as “hole transport liquid”), formation of a hole transport layer by heat treatment, flowable material containing an organic EL material (hereinafter referred to as “organic EL liquid”), heat treatment The organic EL layer, the cathode, and the insulating film are sequentially sealed.

  In the manufacture of an organic EL display device, as one of devices for applying a hole transport liquid or an organic EL liquid to a substrate, as shown in Patent Document 1 and Patent Document 2, a plurality of fluid materials are continuously discharged. 2. Description of the Related Art There is known an apparatus for applying a flowable material in a stripe shape on a substrate by moving a nozzle relative to the substrate in a main scanning direction and a sub scanning direction.

  On the surface of the substrate for the organic EL display device, there is a region where a driver circuit is incorporated around a coating region (that is, a light emitting region) where a fluid material such as a hole transport liquid or an organic EL liquid is to be applied. A region necessary for sealing with an insulating film is provided. In the production of an organic EL display device, there is a possibility that a fluid material may adhere to a region around these application regions (hereinafter referred to as “non-application region”) in the process of forming a hole transport layer or an organic EL layer. When the post-process is performed in a state where the fluid material is attached, there is a possibility that the electrode characteristic deterioration or sealing failure may occur. Therefore, it is necessary to prevent the flowable material from adhering to the non-application area on the substrate.

  Patent Document 3 discloses a technique for selectively applying a coating liquid to an element formation region by applying a masking tape to a non-application region on a substrate for an organic EL element. In the manufacturing method of the organic EL element described in Patent Document 3, the contact angle of the coating liquid on the side surface of the masking tape is made larger than the contact angle between the substrate and the coating liquid on the side surface of the masking tape. Generation of the meniscus is suppressed, and problems such as insufficient film thickness of the cathode that may occur in a subsequent process due to the protrusion of the meniscus are prevented.

JP 2004-111073 A JP 2004-89771 A JP 2006-216414 A

  By the way, in the manufacturing method of patent document 3, since one masking tape is affixed to each non-application | coating area | region between several element formation areas, it is a coating liquid with respect to several types of board | substrate from which the width | variety of a non-application | coating area differs. When coating is applied, it is necessary to prepare a plurality of types of masking tapes having different widths for each type of substrate. For this reason, the apparatus which concerns on manufacture of an organic EL element becomes complicated, and the cost concerning manufacture will increase.

  In addition, the masking tape is also applied to the non-application region where the element formation region exists only on one side in the width direction. Even if the masking tape is applied to such a non-application region, The contact angle with the coating solution is increased. That is, since the contact angle is also increased on the side surface that is not in contact with the element formation region, the cost for manufacturing the masking tape may increase.

  The present invention has been made in view of the above problems, and even in a non-application region where the application region exists on either side in the width direction, the specific side surface coincides with the boundary between the non-application region and the application region. It aims at sticking a masking tape to a non-application area | region.

  The invention according to claim 1 is a tape applicator for attaching a masking tape for preventing the flowable material from adhering to the non-application area on the non-application area on the main surface of the substrate, and holding the substrate The masking tape is moved to the non-coating region while the edge of the substrate side of the specific side that is one side of the masking tape is aligned with the boundary between the non-coating region and the coating region on the main surface of the substrate. An affixing mechanism for affixing to the substrate, a rotating mechanism for rotating the substrate 180 degrees relative to the affixing mechanism about an axis perpendicular to the main surface, and a direction perpendicular to the boundary of the non-application area. A moving mechanism that moves the substrate relative to the sticking mechanism, and the contact angle of the fluid material on the specific side surface of the masking tape is the contact of the fluid material on the main surface of the substrate Greater than.

  Invention of Claim 2 is the tape sticking apparatus of Claim 1, Comprising: The site | part which the said sticking mechanism paid out from the said tape supply part of the said tape supply part which feeds out the said masking tape, and the said masking tape And pressing the substrate against the pressing portion in a scanning direction parallel to the boundary of the non-application area in a state where the masking tape is pressed by the pressing part. A scanning mechanism that sequentially moves the masking tape along the boundary by moving relatively.

  A third aspect of the present invention is the tape applicator according to the first or second aspect, wherein the substrate is rotated together with the substrate holding portion by the rotating mechanism.

  Invention of Claim 4 is a tape sticking apparatus in any one of Claim 1 thru | or 3, Comprising: The said non-application | coating area | region is controlled by controlling the said sticking mechanism, the said rotation mechanism, and the said moving mechanism. The masking tape is affixed to the non-application area with the specific side facing the boundary, and is positioned on the other side of the non-application area opposite to the boundary and parallel to the boundary. The apparatus further includes a controller that directs a specific side surface, which is one side surface of the masking tape, and affixes the other masking tape to the non-application area with a portion opposite to the specific side surface overlapped with the masking tape.

  In the present invention, the masking tape is applied to the non-application area while the specific side surface is coincident with the boundary between the non-application area and the application area even in the non-application area where the application area exists on either side in the width direction. can do.

It is a figure which shows the structure of the coating system which concerns on related technology. It is a top view of a board | substrate. It is sectional drawing which shows a part of masking tape and a board | substrate. It is a top view of a tape sticking apparatus. It is a front view of a tape sticking apparatus. It is a left view of a tape sticking apparatus. It is a left view which expands and shows a tape sticking head. It is a left view which expands and shows a part of tape sticking head. It is a figure which shows the flow of sticking of a masking tape. It is a top view which shows the board | substrate in the process of sticking a masking tape. It is a top view which shows the board | substrate in the process of sticking a masking tape. It is a top view which shows the board | substrate in the process of sticking a masking tape. It is a top view of a coating device. It is a front view of a coating device. It is a top view of a masking tape and a board | substrate. It is sectional drawing of a masking tape and a board | substrate. It is a top view of a tape peeling apparatus. It is a left view which expands and shows a tape peeling head. It is a left view which expands and shows a part of tape peeling head. It is sectional drawing of a board | substrate. It is sectional drawing which shows a part of masking tape and board | substrate which concern on related technology. It is sectional drawing which shows a part of masking tape and a board | substrate. It is sectional drawing which shows a part of masking tape and a board | substrate. It is sectional drawing which shows a part of board | substrate. It is sectional drawing which shows a part of masking tape and board | substrate which concern on one embodiment. It is sectional drawing which shows a part of masking tape and a board | substrate. It is a top view which shows the tape sticking apparatus which concerns on related technology. It is a figure which shows the flow of sticking of a masking tape. It is a top view which shows the board | substrate in the process of sticking a masking tape. It is a top view which shows the board | substrate in the process of sticking a masking tape. It is a top view which shows the board | substrate in the process of sticking a masking tape. It is a top view which shows the board | substrate in the process of sticking a masking tape. It is a figure which shows the structure of the coating system which concerns on related technology. It is a top view which shows a tape sticking system. It is a figure which shows the structure of the tape sticking system which concerns on related technology. It is sectional drawing which shows another example of a masking tape.

  FIG. 1 is a diagram showing a configuration of a coating system 8 including a tape applying device according to a technique related to the present invention. The coating system 8 is a system that applies a fluid material including a pixel forming material to a glass substrate for a flat display device (hereinafter simply referred to as “substrate”) to which a masking tape is attached. In the coating system 8, a fluid material containing an organic EL material (hereinafter referred to as “organic EL liquid”) is applied to a substrate for an active matrix driving type organic EL (Electro Luminescence) display device. The organic EL liquid contains an organic solvent such as xylene and mesitylene (xylene in this related technology) in addition to the organic EL material.

  FIG. 2 is a plan view showing the substrate 9 on which the masking tape 1 which is a tape-like mask member is attached. In FIG. 2, a region (hereinafter referred to as “application region”) 91 to which the organic EL liquid is applied by the application system 8 (see FIG. 1) is indicated by parallel oblique lines (FIGS. 9A to 9C, and The same applies to Fig. 23.A to Fig. 23.D). In this related technology, four application regions 91 are provided on the substrate 9, and four substrates for an organic EL display device are manufactured from one substrate 9. The lattice-shaped region 92 around the four application regions 91 is a region where the organic EL liquid should not be applied because it is used for incorporating a driver circuit or sealing with an insulating film in a later process. "Non-application area 92". As shown in FIG. 2, the masking tape 1 is affixed to the non-application area 92 on the main surface 90 on the (+ Z) side of the substrate 9 (that is, in close contact), and the organic EL liquid adheres to the non-application area 92. To prevent.

  As shown in FIG. 1, the coating system 8 includes a tape applicator 2 that applies a masking tape 1 (see FIG. 2) to a non-application area 92 on the substrate 9, and an organic coating toward the substrate 9 to which the masking tape 1 is applied. The coating apparatus 3 for applying the organic EL liquid to the region including the masking tape 1 by moving the nozzle relative to the substrate 9 while continuously discharging the EL liquid from the nozzle, and the organic EL liquid was applied A tape peeling device 4 for peeling the masking tape 1 from the substrate 9 is provided. The coating system 8 further includes a fixed transfer robot 81 between the tape applying device 2 and the coating device 3 and between the coating device 3 and the tape peeling device 4.

  FIG. 3 shows a part of the masking tape 1 and the substrate 9 shown in FIG. 2 cut perpendicularly to the longitudinal direction of the masking tape 1 (that is, the Y direction in FIG. 2) at the position AA in FIG. FIG. As shown in FIG. 3, the two masking tapes 1 are respectively formed on the tape-shaped base material 11 and one surface of the base material 11 (that is, the (−Z) side surface in FIG. 3). An adhesive layer 12 is provided. In this related technology, the base material 11 is formed of, for example, a plastic film, and the pressure-sensitive adhesive layer 12 is formed of, for example, a polyester-based pressure-sensitive adhesive or an acrylic pressure-sensitive adhesive.

  In the masking tape 1, only one side surface 103 (that is, the side surface on the (+ X) side in FIG. 3) is a specific side surface (reference numeral 103a in FIG. 3) whose shape in the tape cross section is adjusted. Yes. Moreover, in the masking tape 1, the base material 11 and the adhesive layer 12 have the same shape as the cross section shown in FIG. 3 over the full length of a longitudinal direction.

  In the tape applicator 2, the edge on the substrate 9 side of the specific side surface 103 a (that is, one of the two lower surface edges 124 of the adhesive layer 12, which will be described later, on the specific side surface 103 a side) is not on the main surface 90 of the substrate 9. The masking tape 1 is affixed to the non-application area 92 of the substrate 9 while matching the boundary 920 between the application area 92 and the application area 91 (that is, the boundary extending in the Y direction in FIG. 2). Further, the portion of the two masking tapes 1 opposite to the specific side surface 103 a overlaps on the non-application region 92 of the substrate 9.

  In each masking tape 1 shown in FIG. 3, it is a main surface 112 of the base material 11 on the pressure-sensitive adhesive layer 12 side (that is, a surface on the (−Z) side in FIG. 3), and is hereinafter referred to as “base material lower surface 112”. ) And the main surface 111 opposite to the base material lower surface 112 (hereinafter referred to as “base material upper surface 111”), that is, the thickness of the base material 11 is about 37 μm. Further, the main surface 121 of the adhesive layer 12 on the substrate 11 side (hereinafter referred to as “adhesive layer upper surface 121”) and the main surface 122 on the opposite side of the substrate 11 side (hereinafter referred to as “adhesive layer lower surface”). 122 ”), that is, the thickness of the pressure-sensitive adhesive layer 12 is about 15 μm. In FIG. 3, for the sake of illustration, the thickness of the masking tape 1 is drawn thicker than the actual thickness compared to the width (the same applies to FIGS. 17 and 19).

  As shown in FIG. 3, in the masking tape 1, an edge 114 (hereinafter referred to as “lower surface edge 114”) extending in the longitudinal direction on the specific side surface 103 a side of the base material lower surface 112 is a specific side surface of the adhesive layer upper surface 121. It overlaps with an edge 123 (hereinafter referred to as “upper surface edge 123”) extending in the longitudinal direction on the 103a side. Further, an edge 124 (hereinafter referred to as “lower surface edge 124”) extending in the longitudinal direction on the specific side surface 103a side of the adhesive layer lower surface 122 is more than the upper surface edge 123 of the adhesive layer 12 in the width direction perpendicular to the longitudinal direction. Is also located inside. In other words, the lower surface edge 124 of the pressure-sensitive adhesive layer 12 is located closer to the center line in the width direction of the masking tape 1 than the upper surface edge 123 (that is, the X direction in FIG. 3).

  Here, when the lower surface edge 114 on the specific side surface 103a side of the substrate 11 and the upper surface edge 123 and the lower surface edge 124 on the specific side surface 103a side of the adhesive layer 12 are the first edge, the second edge, and the third edge. In the masking tape 1, the first edge and the second edge overlap in the width direction, and the third edge is located on the inner side of the second edge in the width direction.

  As shown in FIG. 3, the specific side surface 103 a (that is, the side surface of the base material 11 and the side surface of the pressure-sensitive adhesive layer 12) is a smooth surface that is linear in cross section and extends from the main surface 90 of the substrate 9 in the thickness direction. As the distance increases, the taper has a reverse taper shape that protrudes from the center line 90 of the substrate 9 away from the center line of the masking tape 1. In the masking tape 1, the angle θ formed by the adhesive layer lower surface 122 and the side surface of the adhesive layer 12 on the specific side surface 103 a side is about 100 °.

  The side surface 103 opposite to the specific side surface 103a of the masking tape 1 is substantially perpendicular to the main surface 90 of the substrate 9, but unlike the specific side surface 103a, the shape in the tape cross section is not particularly adjusted. Not in.

  As described above, since the cross section of the masking tape 1 has the same shape over the entire length in the longitudinal direction, the above description regarding the shape of the masking tape 1 shown in FIG. The same applies to any cross section perpendicular to the longitudinal direction of the agent layer 12).

  4 to 6 are a plan view, a front view, and a left side view, respectively, showing the configuration of the tape applicator 2. As shown in FIG. 4 to FIG. 6, the tape applicator 2 includes a substrate holding unit 21 that holds the substrate 9, and the substrate 9 together with the substrate holding unit 21 and a predetermined parallel to the main surface 90 (see FIG. 2) of the substrate 9. The scanning mechanism 22 that moves in the moving direction (that is, the Y direction in FIGS. 4 to 6 and hereinafter referred to as “scanning direction”), the non-application region 92 on the substrate 9 before the organic EL liquid is applied. A tape applying head 23 for applying the masking tape 1 (see FIG. 2), a moving mechanism 24 for moving the tape applying head 23 in a direction perpendicular to the scanning direction (that is, the X direction in FIGS. 4 to 6), and A rotation mechanism 25 that rotates the substrate 9 together with the substrate holder 21 by 180 ° about a rotation axis perpendicular to the main surface 90 of the substrate 9 is provided.

  In the tape applicator 2, the substrate holding unit 21 moves in the horizontal direction along the rail 221 by the scanning mechanism 22. In addition, the tape applying head 23 is moved in the horizontal direction along the rail 241 above the moving range of the substrate 9 by the moving mechanism 24. As shown in FIG. 4, the tape sticking device 2 includes a control unit 26 that controls the scanning mechanism 22, the tape sticking head 23, the moving mechanism 24, and the rotating mechanism 25.

  FIG. A is an enlarged left side view of the configuration of the tape applying head 23. FIG. FIG. In A, the internal structure accommodated in the housing 231 of the tape sticking head 23 is drawn. In the tape application head 23, the masking tape 1 is applied using a two-layer tape 27 in which the masking tape 1 is held on one main surface of the base tape 271. In this related technology, the specific side surface 103a (see FIG. 3) of the masking tape 1 is shown in FIG. It is located on the (+ X) side in A.

  FIG. As shown in A, the tape applying head 23 is supplied from a supply reel 232 and a supply reel 232 that are tape supply units for feeding the tape 27 (that is, the masking tape 1 and the base tape 271) while the unused tape 27 is wound thereon. The masking tape 1 is separated from the fed-out tape 27 and the separated portion (that is, the portion fed out from the supply reel 232 of the masking tape 1) is directed toward the non-application area 92 (see FIG. 2) of the substrate 9. A pressing portion 233 for pressing, a recovery reel 234 that is a tape recovery portion for winding and recovering the tape 27 (that is, the base tape 271) after the masking tape 1 is separated, and a housing 231 for housing these components are provided. Prepare.

  When the masking tape 1 is applied to the substrate 9 by the tape applying apparatus 2, first, the tape applying head 23 is moved in the X direction by the moving mechanism 24 shown in FIGS. Located in. At this time, the substrate 9 is located on the (−Y) side of the tape applying head 23. Subsequently, the substrate 9 is moved in the (+ Y) direction by the scanning mechanism 22, and FIG. It is located at the sticking start position shown in A. When the substrate 9 is located at the sticking start position, only the masking tape 1 is cut on the side facing the cutting part 235 of the tape 27 by the cutting part 235 of the pressing part 233 of the tape sticking head 23.

  The cut masking tape 1 has a supply reel 232 and a recovery reel 234 shown in FIG. By rotating counterclockwise in A, it is sent together with the base tape 271 to the leading end of the tape separating member 236 of the pressing portion 233, and at the leading end, on the opposite side to the direction in which the base tape 271 has been sent. By being guided, the masking tape 1 is peeled off from the base tape 271, and the tip thereof moves from the lower opening 237 of the housing 231 toward the substrate 9.

  In parallel with this, the air cylinder 238 causes the sticking roller 239 to move downward through the lower opening 237, and FIG. As shown in FIG. 6B, the tip of the masking tape 1 is pressed from the upper side toward the main surface 90 of the substrate 9, and the substrate 9 is attached to the substrate 9 by the scanning mechanism 22 (see FIG. 6). Start moving in the (+ Y) direction of A. Then, while the tape 27 is continuously fed from the supply reel 232 and the masking tape 1 is pressed by the affixing roller 239 of the pressing portion 233, the substrate 9 is bound to the boundary 920 (see FIG. 2), the masking tape 1 moves along the boundary 920 of the non-application area 92 on the main surface 90 of the substrate 9 as shown in FIG. 2 by moving in the scanning direction (ie, (+ Y) direction). Are attached sequentially.

  FIG. In the tape applying head 23 shown in A, only the masking tape 1 on the tape 27 is cut again by the cutting portion 235, and the masking tape 1 is attached to the substrate 9 up to the rear end portion. Close contact with the surface 90. In the tape applicator 2, the scanning mechanism 22 and the tape applicator head 23 are arranged such that the edge on the substrate 9 side of the specific side surface 103 a of the masking tape 1 (that is, the lower surface edge 124 in FIG. The masking tape 1 is applied to the non-application area 92 while matching the boundary 920.

  The masking tape 1 may be started to be applied to the substrate 9 that is moving leftward at a speed equal to the supply speed of the tape 27 while supplying the tape 27. In the tape applying head 23, the masking tape 1 needs to be pressed toward the substrate 9 by the applying roller 239 of the pressing portion 233 when the leading end portion and the rear end portion of the masking tape 1 are applied. Further, except when the rear end portion is stuck, the sticking roller 239 may be retracted into the housing 231 and the pressing of the masking tape 1 may be released. In other words, in the sticking mechanism of the tape sticking device 2, the substrate 9 is pressed by the tape sticking head 23 in a state where the masking tape 1 is pressed against the substrate 9 when sticking at least the front end portion and the rear end portion of the masking tape 1. The masking tape 1 is attached to the non-application area 92 on the substrate 9 by moving relative to the pressing portion 233 in the scanning direction.

  In the tape applicator 2, as shown in FIG. 2, among the lattice-shaped non-application areas 92 of the substrate 9, three areas extending in parallel with the scanning direction that is the moving direction of the substrate 9 by the scanning mechanism 22 (that is, 2), the masking tape 1 is applied only to the region extending in the Y direction. In the following description, the three areas to which the masking tape 1 is applied are respectively referred to as “first area 921”, “second area 922”, and “third area 923” from the (−X) side in FIG. Call. In this related technique, one masking tape 1 is applied to each of the first region 921 and the third region 923, and two masking tapes 1 are applied to the second region 922. In the non-application area 92, the masking tape 1 is not applied to an area extending perpendicularly to the scanning direction (that is, an area extending in the X direction in FIG. 2). As will be described later, in the coating system 8, the organic EL liquid is not applied to the area where the masking tape 1 is not applied.

  FIG. 8 is a diagram showing a flow of sticking of four masking tapes 1 (see FIG. 2) by the tape sticking device 2. In addition, FIG. A through FIG. C is a plan view showing the substrate 9 on the way of applying the masking tape 1. Below, FIG. 8, FIG. A through FIG. The masking tape 1 sticking by the tape sticking device 2 will be described with reference to FIG.

  In the tape applicator 2 shown in FIG. 4, first, the control mechanism 26 controls the application mechanism (that is, the scanning mechanism 22 and the tape application head 23), whereby the supply reel 232 of the tape application head 23 (FIG. 7A). (See FIG. 9), the masking tape 1 is drawn out, and the drawn out portion is shown in FIG. The non-application area 92 shown in A is pressed by the pressing portion 233 (see FIG. 7.A) on the (+ Y) side portion in the first area 921. Then, with the masking tape 1 pressed by the pressing portion 233, the substrate 9 is parallel to the (+ Y) direction (that is, parallel to the boundary 920 between the non-application area 92 and the application area 91) by the scanning mechanism 22 (see FIG. 4). By moving in the scanning direction, a first masking tape (hereinafter referred to as “masking tape 1a”) is sequentially attached to the first region 921 (step S11). At this time, the masking tape 1a has the specific side surface 103a facing the boundary 920 on the (+ X) side (that is, the second region 922 side) of the first region 921, and the lower surface edge 124 (see FIG. 3) of the specific side surface 103a is concerned. Affixed to the first region 921 while matching the boundary 920.

  Subsequently, when the moving mechanism 24 is controlled by the control unit 26 shown in FIG. 4, the tape applying head 23 moves in the (+ X) direction in FIG. 4, and the second region of the non-application region 92 on the substrate 9. 922 (ie, a position overlapping the second region 922 in the X direction). In parallel with the movement of the tape applying head 23, the substrate 9 is returned to the (−Y) side of the tape applying head 23 in FIG.

  Then, the substrate 9 is moved again in the (+ Y) direction in FIG. 4 while the masking tape 1 is pressed toward the substrate 9, whereby the second masking tape (hereinafter referred to as “masking tape 1b”). ) Is affixed to the second region 922 (step S12). FIG. As shown in A, the masking tape 1b has the specific side surface 103a facing the boundary 920 on the (+ X) side (that is, the third region 923 side) of the second region 922, and the lower surface edge 124 of the specific side surface 103a (see FIG. 3). ) Is attached to the second region 922 while matching the boundary 920.

  Since the width of the masking tape 1b is smaller than the width of the second region 922 (that is, the width in the X direction), the masking tape 1b covers only the (+ X) side portion of the second region 922. At this time, the lower surface edge 124 (see FIG. 3) of the side surface 103 opposite to the specific side surface 103a of the masking tape 1b is cut from the second region 922 of the non-application region 92 (that is, from one substrate 9). It is an area that is not used as a product because it is cut when obtaining a plurality of substrates for an organic EL display device, and is located approximately in the center of the non-application area 92 located between adjacent application areas 91. To position.

  Next, when the rotation mechanism 25 is controlled by the control unit 26 shown in FIG. 4, the substrate 9 is rotated by 180 ° relative to the sticking mechanism (that is, the scanning mechanism 22 and the tape sticking head 23) (step). S13). As a result, FIG. As shown to B, the specific side surface 103a of the masking tapes 1a and 1b affixed to the 1st area | region 921 and the 2nd area | region 922 will be located in the (-X) side of each masking tape.

  When the rotation of the substrate 9 is completed, the substrate 9 is returned to the (−Y) side of the tape applying head 23 in FIG. 4, and the position of the tape applying head 23 is adjusted by the moving mechanism 24 as necessary. When the substrate 9 is moved in the (+ Y) direction in FIG. 4 while the masking tape 1 is pressed toward the substrate 9, FIG. As shown in C, a third masking tape (hereinafter referred to as “masking tape 1c”) is sequentially applied to the second region 922 (step S14).

  The masking tape 1c is shown in FIG. The specific side surface 103a faces the boundary 920 on the (−X) side (that is, the first region 921 side) of the second region 922 in C, and the lower surface edge 124 (see FIG. 3) of the specific side surface 103a coincides with the boundary 920. The second area 922 of the non-application area 92 is affixed. In the second region 922, the boundary 920 to which the specific side surface 103a of the masking tape 1c is directed is located on the opposite side of the boundary 920 to which the specific side surface 103a of the masking tape 1b is directed and is parallel to the boundary 920. There are two boundaries 920.

  Further, the portion on the opposite side to the specific side surface 103a of the masking tape 1c (that is, the portion on the (−X) side in FIG. 9.C) is the portion opposite to the specific side surface 103a of the masking tape 1b (that is, the portion on the opposite side). 9 (C) and is attached on the masking tape 1b.

  Here, of the two masking tapes 1b and 1c attached to the second region 922, the masking tape 1b attached first is the first masking tape, and the masking tape 1c attached later is the second masking tape. Then, the second masking tape has a portion on the side opposite to the second specific side which is the specific side 103a of the second masking tape, on the side opposite to the first specific side which is the specific side 103a of the first masking tape. It will be affixed on the non-application area | region 92 in piles on a site | part.

  When the application of the masking tape 1c is completed, the tape applying head 23 is moved in the (−X) direction in FIG. 4 by the moving mechanism 24, and is positioned at a position corresponding to the third region 923 of the non-application region 92. In parallel with the movement of the tape applying head 23, the substrate 9 is returned to the (−Y) side of the tape applying head 23 in FIG.

  Subsequently, the substrate 9 is moved in the (+ Y) direction in FIG. 4 in a state where the masking tape 1 is pressed toward the substrate 9, whereby the fourth masking tape (hereinafter referred to as “masking tape 1d”). ) Are sequentially attached to the third region 923 (step S15). FIG. As shown in C, the masking tape 1d has the specific side surface 103a facing the boundary 920 on the (+ X) side (that is, the second region 922 side) of the third region 923, and the lower surface edge 124 of the specific side surface 103a (see FIG. 3). ) Is attached to the third region 923 while being matched with the boundary 920.

  The substrate 9 to which the masking tapes 1a to 1d are attached is rotated 180 ° again by the rotating mechanism 25 shown in FIG. 4 and returned to the original posture, and then is carried out from the tape attaching device 2 by the transfer robot 81 shown in FIG. Then, it is carried into the coating device 3. In the following description, when it is not necessary to distinguish the masking tapes 1a to 1d, they are collectively referred to as the masking tape 1.

  Next, the coating apparatus 3 that applies the organic EL liquid to the substrate 9 will be described. 10 and 11 are a plan view and a front view showing the coating apparatus 3, respectively. As shown in FIGS. 10 and 11, the coating apparatus 3 includes a substrate holding portion 31 that holds the substrate 9 with the masking tape 1 attached to the non-application area 92 (see FIG. 2). Is provided with a heating mechanism (not shown) using a heater. 10 and 11, the illustration of the masking tape 1 attached to the main surface 90 of the substrate 9 is omitted for the sake of illustration.

  The coating apparatus 3 also horizontally moves the substrate holding unit 31 in a predetermined direction parallel to the main surface of the substrate 9 (that is, the Y direction in FIG. 10 and hereinafter referred to as “sub-scanning direction”). A substrate moving mechanism 32 that rotates about a vertical axis, a mark detection unit 33 that captures and detects a position adjustment mark (not shown) formed on the substrate 9, and a substrate 9 on the substrate holding unit 31. A coating head 34 that is a discharge mechanism that continuously discharges the organic EL liquid from the three nozzles 37, and the coating head 34 is parallel to the main surface of the substrate 9 and perpendicular to the sub-scanning direction (that is, FIG. 10, the head moving mechanism 35 that horizontally moves in the “main scanning direction”, provided on both sides of the substrate holder 31 in the main scanning direction, and the organic EL liquid from the coating head 34. Two receptions to receive Part 36, and comprises a flowable material supply unit 38 supplies the organic EL solution three nozzles 37 of the coating head 34. In the coating apparatus 3, the head moving mechanism 35 and the substrate moving mechanism 32 are a main scanning mechanism and a sub scanning mechanism that move the three nozzles 37 relative to the substrate 9 in the main scanning direction and the sub scanning direction.

  In the coating head 34, the three nozzles 37 are arranged substantially linearly with respect to the X direction in FIG. 10 (that is, the main scanning direction) and in the Y direction in FIG. 10 (that is, the sub scanning direction). The organic EL liquid that is disposed slightly shifted and is discharged from these nozzles 37 is applied to the grooves between the partition walls that extend in the main scanning direction and are formed in advance in the application region 91 (see FIG. 2) of the substrate 9. The In this related technology, the distance in the sub-scanning direction between two adjacent nozzles 37 is equal to the pitch between the partition walls (hereinafter referred to as “partition wall pitch”). In the coating head 34, three types of organic EL liquids each including three types of organic EL materials having different colors from red (R), green (G), and blue (B) are discharged from the three nozzles 37.

  When the organic EL liquid is applied by the coating device 3, first, the substrate 9 having the masking tape 1 (see FIG. 2) attached to the non-application region 92 by the tape applying device 2 is placed on the substrate holding unit 31. Then, the substrate moving mechanism 32 is driven based on the output from the mark detection unit 33, and the substrate 9 is positioned at the application start position indicated by the solid line in FIG. The coating head 34 is previously positioned at a position indicated by a solid line in FIGS. 10 and 11.

  Subsequently, the organic EL liquid is supplied from the fluid material supply unit 38 to the coating head 34, and the discharge of the organic EL liquid is started from the nozzle 37, and the head moving mechanism 35 is driven to move the coating head 34. Be started. In the coating apparatus 3, the organic EL liquid is continuously discharged from the nozzle 37 toward the substrate 9, and the nozzle 37 is moved from the (−X) side to the (+ X) side in FIG. , In the main scanning direction perpendicular to the longitudinal direction of the masking tape 1 affixed to the substrate 9), the three adjacent grooves between the partition walls of the substrate 9 and the masking tape 1 An organic EL solution is applied.

  When the coating head 34 moves to the position indicated by the two-dot chain line in FIGS. 10 and 11, the substrate moving mechanism 32 is driven, and the substrate 9 is moved to the (+ Y) side in FIG. Move in the sub-scanning direction) by a distance 3 times the partition pitch. At this time, in the coating head 34, the organic EL liquid is continuously discharged from the three nozzles 37 toward the liquid receiving unit 36.

  When the movement of the substrate 9 in the sub-scanning direction is completed, the coating head 34 moves from the (+ X) side to the left (−X) side (ie, in the main scanning direction) in FIG. 10 while discharging the organic EL liquid. Thus, after three types of organic EL liquids are applied on the substrate 9, the substrate 9 is moved again in the sub-scanning direction.

  FIG. 12 is a plan view showing the substrate 9 to which the masking tape 1 is attached, and FIG. 13 is a cross-sectional view of the masking tape 1 and the substrate 9 at the position BB in FIG. In the coating apparatus 3, the coating head 34 is moved in the main scanning direction and the coating head 34 is moved once every main scanning until the substrate 9 is positioned at the coating end position indicated by a two-dot chain line in FIG. The pitch movement of the substrate 9 in the sub-scanning direction is repeated, and as a result, as shown in FIGS. 12 and 13, the region including the masking tape 1 on the substrate 9 (that is, affixed to the non-application region 92). The organic EL liquid 93 is applied in stripes to the area on the masking tape 1 and the groove between the partition walls of the application area 91. When the substrate 9 moves to the application end position, the discharge of the organic EL liquid from the nozzle 37 is stopped and the application of the organic EL liquid to the substrate 9 is completed. In FIG. 12, for the convenience of illustration, the width and pitch of the organic EL liquid 93 applied on the substrate 9 are drawn larger than actual.

  In the coating device 3, the organic EL liquid 93 is continuously discharged from the nozzle 37 (see FIGS. 10 and 11) of the coating head 34 while the organic EL liquid 93 is being applied. In the coating device 3, the non-coating region 92 extends in a direction perpendicular to the moving direction of the substrate 9 (that is, a region extending in the X direction in FIG. 12 and the masking tape 1 is not attached). The substrate 9 is moved in the sub-scanning direction by a distance equal to the width of the region (that is, the width in the Y direction in FIG. 12) while the coating head 34 is kept on the liquid receiving unit 36. Application of the organic EL liquid 93 to the region is avoided.

  In the coating apparatus 3, since the solvent component of the organic EL liquid applied on the substrate 9 is evaporated by the heating mechanism of the substrate holding unit 31 (see FIG. 9), the masking tape 1 and the organic EL liquid are in a dry state. It adheres on the application area 91. In the coating system 8 shown in FIG. 1, the substrate 9 coated with the organic EL liquid is unloaded from the coating device 3 by the transport robot 81 and loaded into the tape peeling device 4.

  Next, the tape peeling apparatus 4 which peels the masking tape 1 from the board | substrate 9 with which organic EL liquid was apply | coated is demonstrated. FIG. 14 is a plan view showing the tape peeling device 4. As shown in FIG. 14, the tape peeling apparatus 4 includes a tape peeling head 43 instead of the tape sticking head 23 of the tape sticking apparatus 2 shown in FIGS. 4 to 6. Other configurations of the tape peeling device 4 are substantially the same as those of the tape applying device 2.

  The tape peeling device 4 holds a substrate holding unit 41 that holds the substrate 9, a substrate moving mechanism 42 that moves the substrate 9 together with the substrate holding unit 41 in the Y direction in FIG. 14, and the masking tape 1 (see FIG. 2). A tape peeling head 43 for peeling, and a head moving mechanism 44 for moving the tape peeling head 43 in a direction perpendicular to the moving direction of the substrate 9 (that is, the X direction in FIG. 14) are provided. In the tape peeling device 4, the substrate moving mechanism 42 causes the substrate 9 to move in the horizontal direction along the rails 421 together with the substrate holding portion 41 and to rotate about a rotation axis that faces the vertical direction. Further, the tape moving head 43 is moved horizontally along the rail 441 above the moving range of the substrate 9 by the head moving mechanism 44.

  FIG. A is an enlarged left side view of the configuration of the tape peeling head 43. FIG. FIG. Even in A, FIG. Similarly to A, the internal configuration of the housing 431 of the tape peeling head 43 is depicted. FIG. As shown to A, the tape peeling head 43 adheres to the masking tape 1, the peeling tape 45 holding at least a part of the masking tape 1, and the peeling tape 45 with the adhesive surface of the peeling tape 45 facing the masking tape 1 An adhesive mechanism 433 that is a peeling tape guide portion that guides 45 to sequentially adhere to the masking tape 1 on the substrate 9, a supply reel 432 that is a peeling tape supply portion that supplies the unused peeling tape 45 to the adhesive mechanism 433, A recovery reel 434, which is a peeling tape recovery unit for collecting the tape 45 from the substrate 9 together with the masking tape 1 adhered to the release tape 45, and a housing 431 for housing these components are provided. The adhesion mechanism 433 includes an air cylinder 436 and a pressing roller 437. Further, the width of the peeling tape 45 is larger than the width of the masking tape 1.

  As shown in FIG. 14, when the masking tape 1 is peeled from the substrate 9 by the tape peeling device 4, first, the substrate 9 and the tape peeling head 43 are moved by the substrate moving mechanism 42 and the head moving mechanism 44. Located at the start position. At this time, FIG. As shown to A, the front-end | tip of the masking tape 1 which is peeling object is located under the lower opening 435 of the housing 431 of the tape peeling head 43. FIG.

  Subsequently, the pressure roller 437 is moved downward through the lower opening 435 by the air cylinder 436, and the peeling tape 45 is pressed against the tip of the masking tape 1 from the upper side (that is, the side opposite to the adhesive surface of the peeling tape 45). And stick. Next, the substrate 9 is moved by the substrate moving mechanism 42 as shown in FIG. Start moving in the (+ Y) direction in A. At the same time, the supply reel 432 and the recovery reel 434 shown in FIG. When the clockwise rotation in A is started and the peeling tape 45 wound around the supply reel 432 is sent out, the pressing roller 437 moves upward and returns to the original position, so that FIG. As shown in B, the tip of the masking tape 1 adhered to the peeling tape 45 peels from the substrate 9. Then, the peeling tape 45 is continuously fed from the supply reel 432 and the substrate 9 continues to move, whereby the masking tape 1 on the substrate 9 is peeled off from the substrate 9 while being adhered to the peeling tape 45, and the recovery reel 434. Is wound up and collected.

  FIG. 16 is a cross-sectional view of the substrate 9 corresponding to FIG. In the tape peeling device 4, the masking tape 1 is peeled from the substrate 9 on which the organic EL liquid 93 is applied, so that the organic EL liquid 93 is left only on the application region 91 of the substrate 9 as shown in FIG. The As described above, in the tape peeling device 4 shown in FIG. 14, the substrate 9 is moved along the direction in which the masking tape 1 is applied by the substrate moving mechanism 42 while the masking tape 1 is held and lifted by the tape peeling head 43. The masking tape 1 is peeled from the substrate 9 by moving.

  As described above, in the masking tape 1, as shown in FIG. 3, the lower surface edge 114 of the base material 11 is formed on the side of the specific side surface 103 a where the lower surface edge 124 coincides with the boundary 920 between the non-application region 92 and the application region 91. The upper surface edge 123 of the pressure-sensitive adhesive layer 12 is overlapped, and the lower surface edge 124 of the pressure-sensitive adhesive layer 12 is positioned more inside than the upper surface edge 123 in the width direction. For this reason, when the masking tape 1 is peeled from the substrate 9, the portion near the lower surface edge 124 on the specific side surface 103 a side of the adhesive layer 12 is firmly supported by the base material 11 and is stably pulled upward. Thereby, it is possible to prevent a part of the pressure-sensitive adhesive layer 12 from remaining on the substrate 9 as a residue on the specific side surface 103a side (that is, in the vicinity of the boundary 920). As a result, it is possible to easily obtain the substrate 9 in which the organic EL liquid is applied only to the application region 91 and the organic EL liquid and the residue of the masking tape 1 are not attached in the vicinity of the boundary 920 of the non-application region 92. it can.

  In addition, since the lower surface edge 124 of the side surface 103 opposite to the specific side surface 103a of the masking tape 1b is located in a cut region (that is, a region not used as a product) on the non-application region 92 as described above, the adhesive surface Even if a portion of the agent layer 12 in the vicinity of the lower surface edge 124 remains as a residue on the non-application region 92, the quality of the organic EL display device is not affected.

  In the tape peeling device 4, the upper surface of the masking tape 1 to which the organic EL liquid is adhered is covered with the peeling tape 45 and the masking tape 1 is peeled off from the substrate 9, so that the organic EL liquid adhered on the masking tape 1 drops on the substrate 9. The masking tape 1 can be recovered without causing it. Note that the start of adhesion of the release tape 45 to the masking tape 1 may be performed on the substrate 9 that is moving at a speed equal to the supply speed of the release tape 45 while supplying the release tape 45.

  In the coating system 8 shown in FIG. 1, when the peeling of the masking tape 1 from the substrate 9 is finished, the substrate 9 is unloaded from the tape peeling device 4 to the outside of the coating system 8 and the coating of the organic EL liquid on the substrate 9 is finished. . Note that in the coating system 8, the masking tape 1 is actually applied, the organic EL liquid is applied, and the masking tape 1 is peeled continuously from the plurality of substrates.

  As described above, the tape applying device 2 of the coating system 8 includes the application mechanism (that is, the scanning mechanism 22 and the tape application head 23) for applying the masking tape 1 on the substrate 9, and the tape application head 23 in the scanning direction. A moving mechanism 24 that moves in a vertical direction and a rotating mechanism 25 that rotates the substrate 9 by 180 ° are provided. Thereby, even if the application region 91 exists on either side in the width direction, the masking tape 1 that is the specific side surface 103a having a cross-sectional shape that prevents residues at the time of peeling is removed. The lower surface edge 124 on the specific side surface 103a side can be adhered to the non-application area 92 while the boundary surface 920 between the application area 92 and the application area 91 is matched.

  Further, by using the masking tape 1 which is the specific side surface 103a in which only one side surface 103 is adjusted in cross-sectional shape, compared to the case of using an expensive masking tape in which the cross-sectional shape of both side surfaces is adjusted, The mask required for the non-application area 92 and the cost required for application of the flowable material can be reduced. Furthermore, since the specific side surface 103a of the masking tape 1 is a smooth surface that is linear in cross section, the masking tape 1 can be easily manufactured and the cost required for manufacturing the masking tape 1 can be reduced.

  In the sticking mechanism of the tape sticking device 2, the substrate 9 is moved by the scanning mechanism 22 in a state where the masking tape 1 fed from the supply reel 232 of the tape sticking head 23 is pressed against the substrate 9 by the pressing portion 233. Thus, the masking tape 1 can be applied to the non-application area 92 with high positional accuracy and quickly.

  In the tape applicator 2, when masking a region where the application region 91 exists on both sides in the width direction (that is, the second region 922) in the non-application region 92, two masking tapes are provided on the boundary 920 on both sides. Masking tapes 1b and 1c are affixed to the second region 922 while matching the lower surface edges 124 of the specific side surfaces 103a of 1b and 1c, respectively. In this way, by masking the second area 922 with the plurality of masking tapes 1 while making the different masking tapes 1 correspond to the boundaries 920 on both sides in the width direction, the width of the second area 922 can be changed by changing the substrate type or the like. Even if the change is made, the second region 922 can be easily masked without newly preparing masking tapes having different widths. In addition, the second region 922 can be reliably masked by overlapping the portion of the masking tape 1b, 1c opposite to the specific side surface 103a.

  Next, a tape applicator according to another technique related to the present invention will be described. In the tape applicator according to the related art, a masking tape different from the masking tape 1 shown in FIG. Other configurations are shown in FIGS. It is the same as the tape applicator 2 shown in B, and the same reference numerals are given in the following description.

  FIG. 17 is a cross-sectional view of the masking tape 1e applied to the non-application area 92 of the substrate 9 by the tape applying apparatus according to the related art and a part of the substrate 9 cut perpendicularly to the longitudinal direction of the masking tape 1e. is there. As shown in FIG. 17, the side surfaces on both sides of the masking tape 1 e are substantially perpendicular to the main surface 90 of the substrate 9. The masking tape 1e is formed in the tape-shaped base material 11, the pressure-sensitive adhesive layer 12 formed on the base material lower surface 112, and the specific side surface 103a that is the side surface on the (+ X) side of the masking tape 1e (specifically, In the specific side surface 103a side, an absorbent member 13 provided in a longitudinally extending groove formed on the side of the base material 11 and the pressure-sensitive adhesive layer 12 is provided.

  The absorptive member 13 is formed of a material having higher absorbability with respect to the organic EL liquid than the base material 11 and the pressure-sensitive adhesive layer 12. In the masking tape 1e, the substrate 11 and the pressure-sensitive adhesive layer 12 are formed of a material that is substantially non-absorbable with respect to the organic EL liquid. Here, the substantial non-absorbability of the base material 11 and the pressure-sensitive adhesive layer 12 with respect to the organic EL liquid means that a small amount of the organic EL liquid applied to the masking tape 1 by the coating device 3 of the coating system 8 (see FIG. 1). Means that the organic EL liquid is hardly (or not) absorbed by the base material 11 and the pressure-sensitive adhesive layer 12 during drying in a short time (for example, several seconds).

  In the masking tape 1e, the base material 11 is formed of, for example, a plastic film, and the pressure-sensitive adhesive layer 12 is formed of, for example, a polyester-based pressure-sensitive adhesive or an acrylic pressure-sensitive adhesive. As the absorbent member 13, for example, a porous polymer used for a membrane filter or the like is used. In this case, in order to prevent generation of particles from the absorbent member 13, it is preferable that the porous polymer is provided with a particle prevention measure.

  As shown in FIG. 17, at the specific side surface 103a of the masking tape 1e, the side end surface of the adhesive layer 12 extending along the edge of the surface of the substrate 9 of the masking tape 1e (that is, the lower surface edge 124 of the adhesive layer 12). 1031 becomes a region that is non-absorbable with respect to the organic EL liquid applied to the substrate 9, and the exposed region 1032 on the specific side surface 103 a of the absorbent member 13 is organic on the upper side of the side end surface 1031 of the adhesive layer 12. It becomes an area | region which has an absorptivity with respect to EL liquid. Hereinafter, the side end face 1031 of the pressure-sensitive adhesive layer 12 is referred to as “non-absorbing region 1031”, and the exposed region 1032 of the absorbent member 13 is referred to as “absorbing region 1032”.

  In other words, the specific side surface 103a of the masking tape 1e is in contact with the lower surface edge 124 of the adhesive layer 12 of the masking tape 1e and exists along the lower surface edge 124, and above the non-absorbing region 1031 ( In other words, an absorption region 1032 disposed apart from the lower surface edge 124 is provided between the base material upper surface 111 and the non-absorption region 1031, which is the surface opposite to the substrate 9 side of the masking tape 1 e. That is, the specific side surface 103a is a surface whose surface state is adjusted in the surface of the masking tape 1e.

  The flow of applying the masking tape 1e by the tape applying apparatus according to the related art is the same as the flow of applying the masking tape 1 described above. First, the lower surface edge 124 on the specific side surface 103a side of the masking tape 1e is applied to the non-application region 92. The masking tape 1e is sequentially applied to the first region 921 and the second region 922 (see FIG. 2) of the non-application region 92 while matching the boundary 920 between the coating region 91 and the application region 91 (FIG. 8: Step S11, S12). Next, after the substrate 9 is rotated by 180 °, the masking tape 1e is sequentially applied to the second region 922 and the third region 923 (see FIG. 2) (steps S13 to S15).

  When the masking tape 1e is pasted, the substrate 9 is unloaded from the tape sticking device and loaded into the coating device 3 (see FIG. 1). In the coating device 3, the organic EL liquid is applied to the substrate 9 to which the masking tape 1e is attached. FIG. A and FIG. B is a cross-sectional view showing a part of the substrate 9 coated with the organic EL solution 93 together with a part on the specific side surface 103a side of the masking tape 1e. FIG. A shows a state immediately after the organic EL liquid 93 is applied to the substrate 9, and FIG. B shows a state after a short time (for example, several seconds) has elapsed since the application of the organic EL liquid 93. FIG. A and FIG. In B, for the convenience of illustration, the thickness of the organic EL liquid 93 is drawn larger than the actual thickness (the same applies to FIG. 18C described later).

  FIG. As shown in A, the organic EL liquid 93 immediately after coating has a substantially uniform thickness on the main surface 90 of the substrate 9 and the base material upper surface 111 of the masking tape 1e, and on the specific side surface 103a of the masking tape 1e, gravity is applied. Due to this, the lower edge 124 side is thicker. In the masking tape 1e, since the absorption region 1032 by the absorbent member 13 is provided in the specific side surface 103a, FIG. As shown in B, the organic EL liquid 93 adhering to the specific side surface 103a is quickly absorbed by the absorbent member 13 immediately after application. Thereby, the height of the meniscus 94 (that is, the height from the main surface 90 of the substrate 9) formed on the specific side surface 103a of the masking tape 1e can be reduced to the same level as the height of the non-absorbing region 1031. .

  Further, in the masking tape 1e, the non-absorbing region 1031 is provided between the absorbing region 1032 and the lower surface edge 124 on the specific side surface 103a, and the absorbent member 13 is formed by the non-absorbing adhesive layer 12 on the substrate 9. Therefore, the organic EL liquid 93 once absorbed by the absorbent member 13 oozes out from the lower side of the masking tape 1e and adheres to the non-application area 92 of the substrate 9. Can be prevented. Furthermore, it is possible to prevent a part of the absorbent member 13 that has become brittle due to absorption of the organic EL liquid from falling off the masking tape 1e and remaining as a residue on the main surface 90 of the substrate 9.

  When the application of the organic EL liquid is completed, the substrate 9 is unloaded from the coating device 3 and loaded into the tape peeling device 4 (see FIG. 1). In the tape peeling device 4, the masking tape 1 e is peeled from the non-application area 92 of the substrate 9. FIG. C is a cross-sectional view showing a part of the substrate 9 from which the masking tape 1e has been peeled off.

  As described above, since the organic EL liquid 93 is absorbed by the absorbent member 13 (see FIG. 18B) on the specific side surface 103a of the masking tape 1e, FIG. As shown in C, after the masking tape 1e is peeled off, the meniscus 94 of the organic EL liquid 93 remaining in the vicinity of the boundary 920 between the non-application area 92 and the application area 91 (that is, in the vicinity of the non-application area 92 of the application area 91). The height can be reduced. That is, in the coating system 8 provided with the tape applicator according to the related art, the organic EL liquid can be applied onto the substrate 9 while improving the uniformity of the film thickness of the organic EL liquid.

  Moreover, in the tape applicator according to the related art, the low-cost masking tape 1e, which is the specific side surface 103a whose surface state is adjusted so that only one side surface reduces the meniscus height of the organic EL liquid, Similar to the tape applicator 2, the lower edge 124 on the specific side surface 103 a side coincides with the boundary 920 between the non-application area 92 and the application area 91 even when the application area 91 exists on either side in the width direction. The masking tape 1e can be affixed to the non-application area 92.

  Next, a tape applicator according to an embodiment of the present invention will be described. In the tape applicator according to the present embodiment, a masking tape different from the masking tape 1 shown in FIG. Other configurations are shown in FIGS. It is the same as the tape applicator 2 shown in B, and the same reference numerals are given in the following description. The flow of applying the masking tape by the tape applying apparatus according to the present embodiment is the same as the flow of applying the masking tape 1 described above.

  FIG. 19 shows a cross section of the masking tape 1f applied to the non-application area 92 of the substrate 9 by the tape applying apparatus according to the present embodiment and a part of the substrate 9 cut perpendicularly to the longitudinal direction of the masking tape 1f. FIG. As shown in FIG. 19, the side surfaces on both sides of the masking tape 1 f are substantially perpendicular to the main surface 90 of the substrate 9. Further, the side surface on the (+ X) side of the masking tape 1 f is a specific side surface 103 a in which the contact angle of the organic EL liquid is larger than the contact angle of the organic EL liquid on the main surface 90 of the substrate 9. In the masking tape 1f, the water repellent treatment is performed only on the specific side surface 103a of the surface of the masking tape 1f.

  Therefore, when the organic EL liquid is applied by the coating apparatus 3 to the substrate 9 to which the masking tape 1f is applied by the tape applying apparatus, the organic EL liquid 93 is formed on the specific side surface 103a as shown in FIG. 9 is attracted to the main surface 90 side, and as a result, generation of meniscus on the specific side surface 103a can be prevented (or suppressed).

  In the tape applicator according to the present embodiment, as shown in FIG. 19, a specific property in which the property with respect to the organic EL liquid (or the substrate 9) is adjusted so that only one side surface suppresses the generation of the meniscus of the organic EL liquid. Using the low-cost masking tape 1f that is the side surface 103a, the non-application area 92, the application area 91, and the application area 91 are present even if the application area 91 exists on either side in the width direction, as in the tape applicator 2. The masking tape 1 f can be applied to the non-application area 92 while the lower surface edge 124 on the specific side surface 103 a side is aligned with the boundary 920.

  Next, a tape applicator according to still another technique related to the present invention will be described. FIG. 21 is a plan view showing a tape applicator 2a according to the related art. As shown in FIG. 21, the tape sticking apparatus 2a includes another tape sticking head in addition to the configuration of the tape sticking apparatus 2 shown in FIG. In the following description, the (−X) side tape application head in FIG. 21 is referred to as “first tape application head 23a”, and the (+ X) side tape application head is referred to as “second tape application head 23b”. Moreover, in the tape sticking apparatus 2a, a rotation mechanism for rotating the substrate 9 together with the substrate holding unit 21 is not provided. Other configurations are shown in FIGS. It is the same as the tape applicator 2 shown in B, and the same reference numerals are given in the following description.

  In the tape applicator 2a shown in FIG. 21, the masking tape 1 shown in FIG. 3 is applied to the non-application area 92 of the substrate 9 shown in FIG. 2 by the first tape application head 23a and the second tape application head 23b. The structure of the first tape application head 23a and the second tape application head 23b shown in FIG. It is the same as the tape applying head 23 of the tape applying apparatus 2 shown in A, and includes a supply reel 232, a pressing part 233, a collection reel 234 and a housing 231. In the following description, the supply reel and the pressing portion of the first tape applying head 23a are referred to as “first supply reel (ie, first tape supplying portion)” and “first pressing portion”, respectively. The supply reel and the pressing portion 23b are referred to as “second supply reel (ie, second tape supply portion)” and “second pressing portion”, respectively.

  The direction of the first tape applying head 23a is shown in FIG. It is the same as the tape applying head 23 of the tape applying apparatus 2 shown in A. In the first tape applying head 23a, the masking tape 1 has the specific side surface 103a (see FIG. 3) facing the (+ X) side in FIG. So that it is held. The second tape application head 23b is disposed in the opposite direction to the first tape application head 23a. In the second tape application head 23b, the masking tape 1 has the specific side surface 103a on the (−X) side. It is held to face.

  FIG. 22 is a diagram showing a flow of applying the masking tape 1 by the tape applying apparatus 2a. FIG. A to FIG. D is a plan view showing the substrate 9 on the way of applying the masking tape 1. In the following, FIG. 22, FIG. A to FIG. D and the attachment of the masking tape 1 by the tape applying apparatus 2a will be described with reference to other drawings.

  When the masking tape 1 is affixed by the tape affixing device 2a shown in FIG. 21, first, the masking tape 1 is fed out from the first supply reel of the first tape affixing head 23a. The first pressing portion presses the (+ Y) side portion in the first region 921 of the non-application region 92 shown in A. Then, in a state where the masking tape 1 is pressed by the first pressing portion, the substrate 9 is parallel to the boundary 920 between the non-application area 92 and the application area 91 by the scanning mechanism 22 (see FIG. 21). The first masking tape 1 is sequentially attached to the first region 921 by moving to one side in the scanning direction (step S21). At this time, the masking tape 1 has the specific side surface 103a facing the boundary 920 on the (+ X) side (that is, the second region 922 side) of the first region 921, and the lower surface edge 124 (see FIG. 3) of the specific side surface 103a is concerned. Affixed to the first region 921 while matching the boundary 920.

  Subsequently, in a state where the substrate 9 is positioned on the (+ Y) side of the first tape application head 23a and the second tape application head 23b shown in FIG. 21, the position of the second tape application head 23b in the X direction is moved by the moving mechanism 24. Adjusted as needed, FIG. It is located at a position corresponding to the second region 922 of the non-application region 92 shown in FIG.

  Then, in a state where the masking tape 1 fed from the second supply reel of the second tape applying head 23b is pressed against the substrate 9 by the second pressing portion, the substrate 9 is moved in the (−Y) direction ( That is, the second masking tape 1 is sequentially applied to the second region 922 by moving to the other side in the scanning direction opposite to the time of applying the first masking tape 1 (step S22). At this time, the masking tape 1 has the specific side surface 103a facing the boundary 920 on the (−X) side (that is, the first region 921 side) of the second region 922, and the lower surface edge 124 (see FIG. 3) of the specific side surface 103a. Affixed to the (−X) side portion of the second region 922 while matching the boundary 920.

  When the second masking tape 1 is affixed, the second tape affixing head 23b is in a state where the substrate 9 is positioned on the (−Y) side of the first tape affixing head 23a and the second tape affixing head 23b shown in FIG. Is retracted from the position corresponding to the second region 922 in the (+ X) direction, the position of the first tape application head 23a in the X direction is adjusted by the moving mechanism 24, and FIG. It is located at a position corresponding to the second region 922 of the non-application region 92 shown in FIG.

  Next, the substrate 9 is moved again in the (+ Y) direction in a state where the masking tape 1 fed from the first supply reel of the first tape applying head 23a is pressed toward the substrate 9 by the first pressing portion. Thus, the third masking tape 1 is sequentially attached to the second region 922 (step S23). The third masking tape 1 is shown in FIG. The specific side surface 103a is directed to the boundary 920 on the (+ X) side (that is, the third region 923 side) of the second region 922 in C, and the lower surface edge 124 (see FIG. 3) of the specific side surface 103a is aligned with the boundary 920. The second region 922 is attached to the (+ X) side portion. Further, the lower surface edge 124 (see FIG. 3) of the side surface 103 opposite to the specific side surface 103 a of the masking tape 1 is located in a cutting region on the second region 922 of the non-application region 92.

  In the second region 922, the boundary 920 to which the specific side surface 103a of the third masking tape 1 is directed is located on the opposite side of the boundary 920 to which the specific side surface 103a of the second masking tape 1 is directed, and the boundary Another boundary 920 is parallel to 920. Further, the portion on the opposite side to the specific side surface 103a of the third masking tape 1 (that is, the portion on the (−X) side in FIG. 23C) is opposite to the specific side surface 103a of the second masking tape 1. Affixed on the side portion (that is, the (+ X) side portion in FIG. 23C).

  When the third masking tape 1 is affixed, the first tape affixing head 23a is in a state where the substrate 9 is positioned on the (+ Y) side of the first tape affixing head 23a and the second tape affixing head 23b shown in FIG. After retracted in the (−X) direction from the position corresponding to the second region 922, the position of the second tape applying head 23b in the X direction is adjusted by the moving mechanism 24, and FIG. It is located at a position corresponding to the third region 923 of the non-application region 92 shown in D.

  Next, the substrate 9 is moved in the (−Y) direction in a state where the masking tape 1 fed from the second supply reel of the second tape application head 23b is pressed toward the substrate 9 by the second pressing portion. Thus, the fourth masking tape 1 is sequentially attached to the third region 923 (step S24). The fourth masking tape 1 is shown in FIG. The specific side surface 103a is directed to the boundary 920 on the (−X) side (that is, the second region 922 side) of the third region 923 in D, and the lower surface edge 124 (see FIG. 3) of the specific side surface 103a coincides with the boundary 920. It is stuck on the 3rd field 923, making it go.

  Here, the masking tape 1 applied by the first tape application head 23a and the specific side surface 103a thereof are defined as “first masking tape” and “first specific side surface”, and the masking tape applied by the second tape application head 23b. 1 and its specific side surface 103a are “second masking tape” and “second specific side surface”, in the tape applicator 2a, the first tape application head 23a and the scanning mechanism 22 are the first specification of the first masking tape. A first pasting mechanism for pasting the first masking tape to the non-application area 92 while aligning the edge on the side of the substrate 9 (that is, the lower surface edge 124) with the boundary 920 between the non-application area 92 and the application area 91. Yes. In addition, the second tape applying head 23b and the scanning mechanism 22 cause the edge of the second specific side surface of the second masking tape on the substrate 9 side (that is, the lower surface edge 124) to be parallel to the boundary 920 of the non-application area 92. This is a second pasting mechanism for pasting the second masking tape to the non-application area 92 while matching the two boundaries 920.

  Further, in applying the masking tape to the second region 922 of the non-application region 92 of the substrate 9, the first masking mechanism and the second bonding mechanism are controlled by the control unit 26 shown in FIG. In a state where the tape is overlapped with a portion on the opposite side to the first specific side which is the specific side surface 103a of the first masking tape, a portion on the opposite side to the second specific side which is the specific side surface 103a of the second masking tape. Affixed to the non-application area 92.

  As described above, the tape sticking device 2a includes the first sticking mechanism and the second sticking mechanism (that is, the first tape sticking head 23a, the second tape sticking head 23b, and the scanning mechanism 22). And, by these configurations, similarly to the tape applicator 2, using the low-cost masking tape 1 that is the specific side surface 103a whose cross-sectional shape is adjusted so that only one side surface prevents residue at the time of peeling, Even if the application region 91 exists on either side in the width direction, the masking tape 1 is not applied while the lower surface edge 124 on the specific side surface 103a side is aligned with the boundary 920 between the non-application region 92 and the application region 91. It can be affixed to region 92.

  In each of the first sticking mechanism and the second sticking mechanism, the substrate 9 is moved by the scanning mechanism 22 while the masking tape 1 fed from the supply reel 232 is pressed against the substrate 9 by the pressing portion 233. The masking tape 1 can be applied to the non-application area 92 with high positional accuracy and quickly.

  In the tape applicator 2a, it is not necessary to rotate the substrate 9 when the masking tape 1 is applied, so that the masking tape 1 can be applied more quickly. The moving direction of the substrate 9 when the masking tape 1 is applied by the first tape applying head 23a and when the masking tape 1 is applied by the second tape applying head 23b is set to one side and the other side of the scanning direction, respectively. Thus, the masking tape 1 can be applied more quickly than the tape applying apparatus that returns the substrate 9 to one side of the tape applying head 23 each time one masking tape 1 is applied. In the above description, the masking tape 1 is applied in order from the (−X) side of the substrate 9, but the application order of the masking tape 1 may be changed as appropriate.

  In the tape applicator 2a, when masking the second region 922 of the non-application region 92, by masking with a plurality of masking tapes 1 while corresponding different masking tapes 1 to the boundaries 920 on both sides in the width direction, Even when the width of the second region 922 is changed due to a change in the substrate type or the like, the second region 922 can be easily masked without newly preparing a masking tape having a different width. Further, the second region 922 can be reliably masked by overlapping the portions of the two masking tapes 1 opposite to the specific side surface 103a.

  As described above, the masking tape 1 has the lower surface edge 114 of the substrate 11 on the side of the specific side surface 103a where the lower surface edge 124 coincides with the boundary 920 between the non-application region 92 and the application region 91, as shown in FIG. The upper surface edge 123 of the pressure-sensitive adhesive layer 12 is overlapped, and the lower surface edge 124 of the pressure-sensitive adhesive layer 12 is located further inside than the upper surface edge 123 in the width direction. For this reason, when the masking tape 1 is peeled from the substrate 9, it is possible to prevent a part of the adhesive layer 12 from remaining on the substrate 9 as a residue on the specific side surface 103a side (that is, in the vicinity of the boundary 920).

  In the tape applying apparatus 2a, instead of the masking tape 1, a masking tape 1e (see FIG. 17) may be applied to the non-application area 92 of the substrate 9 by the first application mechanism and the second application mechanism. In this case, as shown in FIG. 17, the specific side surface 103a of the masking tape 1e is in contact with the lower surface edge 124 of the pressure-sensitive adhesive layer 12 and exists along the lower surface edge 124, and the base material upper surface 111 and As described above, the meniscus 94 formed on the specific side surface 103a of the masking tape 1e by providing the absorption region 1032 disposed away from the lower surface edge 124 between the non-absorption region 1031 (see FIG. 18B). Can be made as small as the height of the non-absorbing region 1031.

  Moreover, in the tape sticking apparatus 2a, it replaces with the masking tape 1, and the masking tape 1f (refer FIG. 19) may be stuck to the non-application area | region 92 of the board | substrate 9 with a 1st sticking mechanism and a 2nd sticking mechanism. In this case, as shown in FIG. 19, the contact angle of the organic EL liquid on the specific side surface 103a of the masking tape 1f is made larger than the contact angle of the organic EL liquid on the main surface 90 of the substrate 9, as described above. Furthermore, the generation of meniscus on the specific side surface 103a can be prevented (or suppressed).

  Next, a tape application system according to still another technique related to the present invention will be described. FIG. 24 is a diagram illustrating a configuration of a coating system 8a including a tape applying system 20 according to related technology. As shown in FIG. 24, the coating system 8a includes a tape application system 20 instead of the tape application device 2 shown in FIG. Other configurations are the same as those of the coating system 8 shown in FIG. 1, and the same reference numerals are given in the following description.

  Similar to the tape application device 2 shown in FIG. 1, the tape application system 20 is a masking tape 1 that prevents the organic EL liquid from adhering to the non-application area 92 (see FIG. 2) on the main surface 90 of the substrate 9 (FIG. 2). This is a system for affixing to the non-application area 92. In the masking tape 1, as shown in FIG. 3, only one side surface is the specific side surface 103a.

  FIG. 25 is a plan view showing the tape application system 20. As shown in FIG. 25, the tape application system 20 is shown in FIGS. B. Two tape applicators having the same structure as the tape applicator 2 shown in B (in the following description, the tape applicator on the (−X) side in FIG. 25 is referred to as “first tape applicator 201a”; + X) side tape applicator is referred to as “second tape applicator 201b”), and the substrate 9 is disposed between the first tape applicator 201a and the second tape applicator 201b. A transport mechanism 202 for transporting from the device 201a to the second tape sticking device 201b is provided.

  The first tape sticking device 201a moves the first substrate holding portion 21a for holding the substrate 9 and the substrate 9 in the scanning direction (that is, the Y direction in FIG. 25), similarly to the tape sticking device 2 shown in FIG. The first scanning mechanism 22a, the first tape application head 23c for applying the masking tape 1 to the non-application area 92 on the substrate 9, and the first tape application head 23c in the direction perpendicular to the scanning direction (that is, the X direction in FIG. 25). ) Is provided.

  Similarly to the tape applicator 2 shown in FIG. 4, the second tape applicator 201b also has a second substrate holding portion 21b that holds the substrate 9, a second scanning mechanism 22b that moves the substrate 9 in the scanning direction, and the substrate 9 A second tape application head 23d for applying the masking tape 1 to the non-application area 92 and a second moving mechanism 24b for moving the second tape application head 23d in a direction perpendicular to the scanning direction are provided. In addition, in the 1st tape sticking apparatus 201a and the 2nd tape sticking apparatus 201b, the rotation mechanism which rotates the board | substrate 9 is not provided.

  In each of the first tape applying head 23c and the second tape applying head 23d, the masking tape 1 is held such that the specific side surface 103a (see FIG. 3) faces the (+ X) side. Moreover, in the 1st tape sticking apparatus 201a, the board | substrate 9 moves from the (-Y) side of the 1st tape sticking head 23c to the (+ Y) side in the state in which the masking tape 1 was pressed toward the board | substrate 9. Thus, the masking tape 1 is attached to the substrate 9. Similarly, in the second tape applying apparatus 201b, the substrate 9 is moved from the (−Y) side to the (+ Y) side of the second tape applying head 23d while the masking tape 1 is pressed toward the substrate 9. Thus, the masking tape 1 is attached to the substrate 9.

  Here, the masking tape 1 applied by the first tape application head 23c and the specific side surface 103a thereof are referred to as “first masking tape” and “first specific side surface”, and the masking tape applied by the second tape application head 23d. 1 and its specific side surface 103a are “second masking tape” and “second specific side surface”, the side surface of the first masking tape on the same side as the first specific side surface is the second specific side surface. It has become.

  Further, in the first tape sticking apparatus 201a, the first tape sticking head 23c and the first scanning mechanism 22a are arranged so that the edge on the substrate 9 side of the first specific side surface of the first masking tape (that is, the lower face edge 124 (see FIG. 3)). ) Is matched with the boundary 920 (see FIG. 2) between the non-application area 92 and the application area 91, and the first masking tape is applied to the non-application area 92. In the second tape application device 201b, the second tape application head 23d and the second scanning mechanism 22b use the second specific side surface of the second masking tape as the substrate 9 side edge (that is, the lower surface edge 124) as a non-application region. The second masking mechanism is configured to apply the second masking tape to the non-application area 92 while being matched with another boundary 920 parallel to the above-described boundary 920.

  In the tape applying system 20, one masking tape 1 is applied to the first region 921 and the second region 922 in the non-application region 92 of the substrate 9 shown in FIG. 2 by the first tape applying device 201a. At this time, the specific side surface 103a of the masking tape 1 affixed to the first region 921 is directed to the boundary 920 on the second region 922 side, and the specific side surface 103a of the masking tape 1 affixed to the second region 922 is It is directed to the boundary 920 on the 3 area 923 side.

  Subsequently, the substrate 9 is unloaded from the first tape applying device 201a by the transport mechanism 202, and the second tape is applied while being rotated by 180 ° about an axis perpendicular to the main surface 90 of the substrate 9 (see FIG. 2). It is carried into the apparatus 201b. Specifically, the arm 2021 of the transport mechanism 202 slides in the (−X) direction to receive the substrate 9 from the first substrate holding part 21a of the first tape applying device 201a, and the arm 2021 slides in the (+ X) direction. While rotating around the rotation axis 2022, it is rotated 180 °. Thereafter, the arm 2021 slides in the (+ X) direction to place the substrate 9 on the second substrate holding portion 21b of the second tape applying apparatus 201b.

  Next, one masking tape 1 is applied to each of the second region 922 and the third region 923 in the non-application region 92 of the substrate 9 by the second tape applying device 201b. At this time, the specific side surface 103a of the masking tape 1 to be affixed to the second region 922 is directed to the boundary 920 on the first region 921 side, and the portion of the masking tape 1 opposite to the specific side surface 103a is On the cutting area, the first tape sticking device 201a is overlaid on the part opposite to the specific side 103a of the masking tape 1 that has been stuck first. Further, the specific side surface 103a of the masking tape 1 attached to the third region 923 is directed to the boundary 920 on the second region 922 side.

  In the tape applying system 20, as in the tape applying apparatus 2, the low-cost masking tape 1 having only one side surface of the specific side surface 103a is used, and the application region 91 exists on either side in the width direction. Even in this case, the masking tape 1 can be applied to the non-application area 92 while the lower surface edge 124 on the specific side surface 103a side coincides with the boundary 920 between the non-application area 92 and the application area 91.

  In the coating system 8 a, as in the coating system 8, the masking tape 1 is applied, the organic EL liquid is applied, and the masking tape 1 is continuously peeled from a plurality of substrates. The masking tape 1 is applied to the two substrates in parallel by the first tape applying device 201a and the second tape applying device 201b. Thereby, in the tape sticking system 20, the masking tape 1 can be stuck quickly.

  In the tape application system 20, the masking tape 1e (see FIG. 17) may be applied to the non-application area 92 of the substrate 9, and the masking tape 1f (see FIG. 19) may be applied to the non-application area 92. .

  Next, a tape application system according to still another technique related to the present invention will be described. FIG. 26 is a plan view showing a tape attaching system 20a according to the related art. The tape sticking system 20a has substantially the same configuration as the tape sticking system 20 shown in FIG. 25, and the same reference numerals are given in the following description.

  Similar to the tape application system 20 shown in FIG. 25, the tape application system 20a includes a first tape application device 201a, a second tape application device 201b, and a transport mechanism 202a. The second tape application head 23d of the second tape application device 201b is arranged in the opposite direction to the first tape application head 23c of the first tape application device 201a. In the first tape applying head 23c, the masking tape 1 is held so that the specific side surface 103a (see FIG. 3) faces the (+ X) side, and in the second tape applying head 23d, the masking tape 1 is specified. The side surface 103a is held so as to face the (−X) side.

  Moreover, in the 1st tape sticking apparatus 201a, the board | substrate 9 moves from the (-Y) side of the 1st tape sticking head 23c to the (+ Y) side in the state in which the masking tape 1 was pressed toward the board | substrate 9. Thus, the masking tape 1 is attached to the substrate 9. In the second tape applying device 201b, the masking tape 1 is pressed toward the substrate 9, and the masking is performed by moving the substrate 9 from the (+ Y) side to the (−Y) side of the second tape applying head 23d. Tape 1 is affixed to substrate 9.

  Here, the masking tape 1 applied by the first tape application head 23c and the specific side surface 103a thereof are referred to as “first masking tape” and “first specific side surface”, and the masking tape applied by the second tape application head 23d. Assuming that 1 and its specific side surface 103a are “second masking tape” and “second specific side surface”, in the second masking tape, the side surface opposite to the first specific side surface of the first masking tape is the second specific side surface. It has become.

  In the tape affixing system 20a, as in the tape affixing system 20 shown in FIG. 25, the first tape affixing device 201a masks each of the first area 921 and the second area 922 in the non-application area 92 shown in FIG. Tape 1 is affixed. At this time, the specific side surface 103a of the masking tape 1 affixed to the first region 921 is directed to the boundary 920 on the second region 922 side, and the specific side surface 103a of the masking tape 1 affixed to the second region 922 is It is directed to the boundary 920 on the 3 area 923 side.

  Then, the board | substrate 9 is carried out from the 1st tape sticking apparatus 201a by the conveyance mechanism 202a, and is carried in into the 2nd tape sticking apparatus 201b. Specifically, the arm 2021 of the transport mechanism 202a slides in the (−X) direction to receive the substrate 9 from the first substrate holding portion 21a of the first tape applying apparatus 201a, and the slider 2023 that holds the substrate 9 has the arm 2021. And the arm 2021 also slides in the (+ X) direction. Then, the substrate 9 is placed on the second substrate holding portion 21b of the second tape applying apparatus 201b by the slider 2023 that has moved to the end of the arm 2021 on the (+ X) side. In the tape application system 20a, unlike the tape application system 20 (see FIG. 25), when the substrate 9 is conveyed from the first tape application device 201a to the second tape application device 201b by the conveyance mechanism 202a, the substrate 9 It will not be rotated.

  Next, one masking tape 1 is applied to each of the second region 922 and the third region 923 in the non-application region 92 of the substrate 9 by the second tape applying device 201b. At this time, the specific side surface 103a of the masking tape 1 to be affixed to the second region 922 is directed to the boundary 920 on the first region 921 side, and the portion of the masking tape 1 opposite to the specific side surface 103a is On the cutting area, the first tape sticking device 201a is overlaid on the part opposite to the specific side 103a of the masking tape 1 that has been stuck first. Further, the specific side surface 103a of the masking tape 1 attached to the third region 923 is directed to the boundary 920 on the second region 922 side.

  In the tape applying system 20a, similarly to the tape applying apparatus 2, the low-cost masking tape 1 whose only one side surface is the specific side surface 103a is used, and the application region 91 exists on either side in the width direction. Even in this case, the masking tape 1 can be applied to the non-application area 92 while the lower surface edge 124 on the specific side surface 103a side coincides with the boundary 920 between the non-application area 92 and the application area 91.

  In the tape application system 20a, the masking tape 1 is applied to two substrates in parallel by the first tape application device 201a and the second tape application device 201b, as in the tape application system 20. Thus, the masking tape 1 can be quickly applied.

  In the tape applying system 20a, it is not necessary to rotate the substrate 9 when the substrate 9 is transferred from the first tape applying device 201a to the second tape applying device 201b. Therefore, the structure of the transfer mechanism 202a can be simplified. . On the other hand, in the tape application system 20 shown in FIG. 25, the structure of the first tape application device 201a and the second tape application device 201b is the same until the direction of the specific side surface 103a of the masking tape 1 in the tape application head. Therefore, the structure of the tape application system 20 can be simplified.

  In the tape application system 20a, the masking tape 1e (see FIG. 17) may be applied to the non-application area 92 of the substrate 9, or the masking tape 1f (see FIG. 19) may be applied to the non-application area 92. .

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible.

  In the tape applicator 2 according to the related art, instead of the scanning mechanism 22 moving the substrate 9 in the scanning direction, the tape applying head 23 of the attaching mechanism is moved in the scanning direction, so that the pressing portion 233 of the substrate 9 is pressed. Relative movement may be realized. The movement mechanism 24 moves the tape application head 23 in the direction perpendicular to the scanning direction (that is, the direction perpendicular to the boundary 920 of the first region 921, the second region 922, and the third region 923 of the non-application region 92). Instead, relative movement of the substrate 9 with respect to the pasting mechanism may be realized by moving the substrate 9 together with the substrate holding unit 21.

  Furthermore, instead of rotating the substrate 9 by the rotating mechanism 25, the tape applying head 23 rotates about an axis perpendicular to the main surface 90 of the substrate 9, thereby realizing a relative rotation of the substrate 9 with respect to the attaching mechanism. May be. However, the structure of rotating the substrate 9 together with the substrate holding portion 21 by the rotation mechanism 25 as in the tape applying apparatus 2 makes it possible to use the tape applying apparatus 2 as compared to the structure of rotating the tape applying head 23. The structure can be simplified. In the tape applicator 2, instead of the rotation mechanism 25, another rotation mechanism may be provided in which the substrate 9 is once lifted from the substrate holding unit 21 and rotated 180 ° and then returned to the substrate holding unit 21.

  In the masking tape 1 according to the related art, the lower surface edge 114 on the specific side surface 103a side of the base material 11 overlaps the upper surface edge 123 on the specific side surface 103a side of the adhesive layer 12 over the entire length of the masking tape. The top edge 123 of the pressure-sensitive adhesive layer 12 in a very small part in the longitudinal direction of the masking tape 1 due to a small part of the pressure-sensitive adhesive falling off the pressure-sensitive adhesive layer 12 or a slight manufacturing error during the production of the masking tape 1. May slightly deviate from the lower surface edge 114 of the substrate 11. In other words, the lower surface edge 114 on the specific side surface 103 a side of the base material 11 overlaps the upper surface edge 123 on the specific side surface 103 a side of the adhesive layer 12 over almost the entire length of the masking tape 1. Even in this case, as in the related art, when the masking tape 1 is peeled from the substrate 9, it is possible to prevent a part of the adhesive layer 12 from remaining on the substrate 9 as a residue.

  The cross-sectional shape of the masking tape 1 according to the related art is not necessarily limited to that shown in FIG. 3. For example, the specific side surface 103 a becomes a smooth surface perpendicular to the substrate 9, as in the masking tape 1 g shown in FIG. Thus, the cross-sectional shape may be adjusted. In this case, on the specific side 103a side of the masking tape 1g, the lower surface edge 114 of the base material 11 overlaps with the upper surface edge 123 of the adhesive layer 12, and the lower surface edge 124 of the adhesive layer 12 and the upper surface edge 123 in the width direction. Located in the same position. The side surface 103 opposite to the specific side surface 103a of the masking tape 1g is approximately perpendicular to the main surface 90 of the substrate 9, but unlike the specific side surface 103a, the shape in the tape cross section is particularly adjusted. Not.

  When the masking tape 1g is peeled off, similarly to the masking tape 1 (see FIG. 3), the portion in the vicinity of the lower surface edge 124 on the specific side surface 103a side of the adhesive layer 12 is firmly supported by the base material 11 and stably faces upward. By being pulled, it is possible to prevent a part of the pressure-sensitive adhesive layer 12 from remaining on the substrate 9 as a residue on the specific side surface 103a side.

  In the masking tape 1 and the masking tape 1g, the angles θ formed by the specific side surface 103a and the adhesive layer lower surface 122 are 100 ° and 90 °, respectively, but the angle θ is not limited to 100 ° or 90 °. . However, the angle θ is preferably 90 ° to 160 ° (more preferably 90 ° to 150 °). By setting the angle θ to 90 ° or more, the pressure-sensitive adhesive can be continuously present up to the substrate lower surface 112 directly above the lower surface edge 124 of the pressure-sensitive adhesive layer 12. As a result, when the masking tape is peeled off, the portion in the vicinity of the lower surface edge 124 of the pressure-sensitive adhesive layer 12 is firmly supported by the base material 11 and peeled off from the substrate 9. 9 can be prevented more reliably. Further, by setting the angle θ to 160 ° or less, the organic EL liquid is prevented from entering between the masking tape and the substrate 9, and the organic EL liquid adheres to the non-application area 92 (that is, masking failure). Can be prevented.

  In the masking tape 1e shown in FIG. 17, the upper side of the absorbent member 13 is covered with a part of the base material 11, but the upper surface of the absorbent member 13 coincides with the upper surface 111 of the base material (see FIG. 17). In other words, the upper surface of the absorbent member 13 may be provided so as to be exposed on the upper surface of the masking tape 1.

  In the tape applying apparatus 2a shown in FIG. 21, instead of moving the substrate 9 in the scanning direction by the scanning mechanism 22, the first tape applying head 23a and the second tape applying head 23b are moved in the scanning direction, whereby the substrate The relative movement with respect to the 9th first pressing part and the second pressing part may be realized. Further, instead of moving the first tape applying head 23 a and the second tape applying head 23 b in the direction perpendicular to the scanning direction by the moving mechanism 24, the substrate 9 is moved together with the substrate holding unit 21, thereby A relative movement with respect to the first sticking mechanism and the second sticking mechanism may be realized.

  In the tape applicator 2a, the first tape applicator head 23a and the second tape applicator head 23b are arranged in the same direction, and when the substrate 9 moves in the (−Y) direction (or (+ Y) direction) The masking tape 1 may be stuck by a tape sticking head. Also in this case, the specific side surface 103a of the masking tape 1 in the second tape applying head 23b is located on the (−X) side of the masking tape 1.

  When only one application region 91 is provided on the substrate 9 (that is, when only one substrate for an organic EL display device is obtained from the substrate 9), the tape applying device 2a includes the first tape applying head 23a and the first tape applying head 23a. If the two-tape application head 23b can be disposed at positions corresponding to the non-application area 92 on both sides of the application area 91, the first tape application head 23a and the second tape application head 23b are perpendicular to the scanning direction. The moving mechanism 24 that moves in the direction may be omitted.

  In the tape applicator 2a, each configuration of the first tape applicator head 23a and the second tape applicator head 23b may be accommodated in one housing and integrally moved in a direction perpendicular to the scanning direction by the moving mechanism 24. .

  In the tape applying apparatus and the tape applying system described above, in the second region 922 of the non-application region 92 of the substrate 9, the portions opposite to the specific side surface 103 a of the two masking tapes are respectively on the cutting region of the substrate 9. If located, the site | part on the opposite side to the specific side surface 103a of the said 2 masking tapes does not necessarily need to overlap. For example, there may be a gap between two masking tapes attached to the second region 922. When the width of the second region 922 is relatively large with respect to the width of the masking tape, the second region 922 may be masked by three or more masking tapes (the first region 921 and the third region 923). The same in).

  The specific side surface 103a of the masking tape to be applied by the tape applying apparatus and the tape applying system according to the related technology is not necessarily the same as the masking tape 1 shown in FIG. It is not necessary to be prepared, and it is not necessary that the surface state is adjusted for the purpose of reducing the meniscus formed on the specific side surface 103a as in the masking tape 1e shown in FIG. . Furthermore, as with the masking tape 1f shown in FIG. 19, the property with respect to the organic EL liquid (or the substrate 9) is adjusted for the purpose of preventing (or suppressing) the generation of meniscus on the specific side surface 103a. There is no need. The specific side surface 103a of the masking tape may be a side surface in which the cross-sectional shape and surface state suitable for various requirements in the application of the organic EL liquid, or the properties of the organic EL liquid and the substrate are adjusted.

  The above tape applying device and tape applying system are not applied when applying a fluid material containing a hole transport material to the substrate 9 for an organic EL display device in addition to the application of the organic EL liquid described above. It may be used for attaching a masking tape to 92. Here, the “hole transport material” is a material that forms a hole transport layer of an organic EL display device, and the “hole transport layer” is a positive electrode that is formed into an organic EL layer formed of an organic EL material. It means not only a narrowly defined hole transport layer that transports holes, but also includes a hole injection layer that injects holes.

  Further, the tape applicator and the tape applicator system are not necessarily used only for applying a masking tape at the time of applying a fluid material containing an organic EL material or a hole transport material for an organic EL display device as a pixel forming material. For example, when applying a fluid material containing other types of pixel forming materials such as a coloring material and a fluorescent material to a substrate for a flat display device such as a liquid crystal display device or a plasma display device, or other fluidity You may utilize for the masking tape sticking at the time of apply | coating material. Further, it may be used for applying a masking tape when applying a fluid material to various substrates such as an organic thin film solar cell substrate, a semiconductor wafer, and an optical disk substrate.

  In the above embodiment, the method of continuously discharging and applying the flowable material from the nozzle toward the substrate has been described. However, the tape applicator and the tape applicator system may be applied by other application methods (for example, the ink jet method, It may also be used to apply a masking tape when a fluid material is applied to a substrate by a spin coating method.

  In addition, the masking tape is not necessarily applied to the substrate by the tape applying apparatus or the tape applying system described above, for example, a tape holding unit that holds the masking tape stretched along the boundary of the non-application area, The first masking tape is affixed by pressing the masking tape over the entire length against the non-coating area on the substrate, and the substrate is held after the substrate is rotated 180 ° about the axis perpendicular to the main surface. The second masking tape held in the part may be pressed and pasted over the entire length of the non-application area.

DESCRIPTION OF SYMBOLS 1,1a-1g Masking tape 2,2a Tape sticking apparatus 9 Board | substrate 11 Base material 12 Adhesive layer 20, 20a Tape sticking system 21 Board | substrate holding part 21a 1st board | substrate holding part 21b 2nd board | substrate holding part 22 Scanning mechanism 22a 1st Scanning mechanism 22b Second scanning mechanism 23 Tape application head 23a, 23c First tape application head 23b, 23d Second tape application head 24 Moving mechanism 25 Rotating mechanism 26 Control unit 90 Main surface 91 Application area 92 Non-application area 93 Organic EL liquid 103a Specific side surface 114 Lower surface edge 123 Upper surface edge 124 Lower surface edge 201a 1st tape sticking apparatus 201b 2nd tape sticking apparatus 202,202a Conveying mechanism 232 Supply reel 233 Press part 920 Boundary 1031 Non-absorption area 1032 Absorption area S11-S15, S21- S2 Step

Claims (4)

A tape applicator for applying a masking tape to prevent the flowable material from adhering to the non-application area on the non-application area on the main surface of the substrate,
A substrate holder for holding the substrate;
The masking tape is affixed to the non-application area while the edge on the substrate side of the specific side surface, which is one side surface of the masking tape, coincides with the boundary between the non-application area and the application area on the main surface of the substrate. A pasting mechanism;
A rotation mechanism that rotates the substrate 180 degrees relative to the pasting mechanism about an axis perpendicular to the main surface;
A moving mechanism for moving the substrate relative to the pasting mechanism in a direction perpendicular to the boundary of the non-application area;
With
The tape sticking device, wherein a contact angle of the fluid material on the specific side of the masking tape is larger than a contact angle of the fluid material on the main surface of the substrate. The tape applicator according to claim 1, wherein
The sticking mechanism is
A tape supply unit for feeding out the masking tape;
A pressing portion that presses a portion of the masking tape fed from the tape supply portion toward the non-application region;
In a state where the masking tape is pressed by the pressing portion, the substrate is moved relative to the pressing portion in a scanning direction parallel to the boundary of the non-application area, thereby moving the masking tape to the boundary. A scanning mechanism for sequentially pasting along,
A tape applicator characterized by comprising: The tape applicator according to claim 1 or 2,
The tape applying apparatus, wherein the substrate is rotated together with the substrate holder by the rotating mechanism. The tape applicator according to any one of claims 1 to 3,
The masking tape is applied to the non-application area with the specific side facing the boundary of the non-application area by controlling the application mechanism, the rotation mechanism, and the moving mechanism, and the boundary of the non-application area A specific side surface, which is one side surface of another masking tape, is directed to another boundary parallel to the boundary and the portion opposite to the specific side surface is directed to the masking tape. A tape applicator, further comprising a control unit that overlaps and applies the another masking tape to the non-application area.

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