JP6129938B1 - Organic device manufacturing method and organic device substrate - Google Patents

Abstract

An organic device manufacturing method and an organic device substrate capable of improving productivity are provided. A method of manufacturing an organic device includes a first electrode layer forming step S02 in which a plurality of first electrode layers 5 are formed on a support substrate 3 extending in one direction at predetermined intervals in one direction; The organic functional layer forming step S04 for forming the organic functional layer 7 on at least a part of the first electrode layer 5, and on at least a part of the first electrode layer 5 and straddling the plurality of first electrode layers 5, A masking tape applying step S03 for applying the masking tape M along one direction, a second electrode layer forming step S06 for forming the second electrode layer 9 on at least the organic functional layer 7 after the masking tape applying step S03; A peeling step S07 for peeling the masking tape M is included after the second electrode layer forming step S06. [Selection] Figure 2

Description

  The present invention relates to an organic device manufacturing method and an organic device substrate.

  As a conventional method for manufacturing an organic device, for example, a method described in Patent Document 1 is known. The manufacturing method of the organic device described in Patent Literature 1 includes a mask forming step of forming a mask by selectively applying a peelable resin to a sheet-like substrate being conveyed, and a sheet-like substrate including the mask. It includes a thin film forming process for forming a desired thin film on the entire surface, and a mask peeling process for forming a thin film pattern by selectively peeling the mask from the sheet-like substrate. In this method of manufacturing an organic device, a mask is formed by selectively applying (printing) an acrylic resin or the like on a sheet-like substrate in a mask forming step.

JP 2002-367774 A

  However, in the conventional method for manufacturing an organic device, since the mask is formed by coating (printing), it is necessary to cure the applied resin. Therefore, in the conventional method for manufacturing an organic device, it takes time to form a mask, so there is room for improvement in productivity.

  An object of this invention is to provide the manufacturing method of the organic device which can aim at the improvement of productivity, and the board | substrate for organic devices.

  The organic device manufacturing method according to one aspect of the present invention includes a first electrode layer forming step of forming a plurality of first electrode layers on a support substrate extending in one direction at a predetermined interval in one direction; An organic functional layer forming step of forming an organic functional layer on at least a part of the first electrode layer, and along one direction on at least a part of the first electrode layer and across the plurality of first electrode layers After the masking tape applying step for applying the masking tape, the second electrode layer forming step for forming the second electrode layer on at least the organic functional layer after the masking tape applying step, and the masking tape after the second electrode layer forming step And a peeling step for peeling off.

  In this method of manufacturing an organic device, a masking tape is applied along one direction on at least a part of the first electrode layer and across the plurality of first electrode layers. Therefore, a part of the plurality of first electrode layers can be covered (masked) only by an operation of applying the masking tape along one direction. Therefore, in the organic device manufacturing method, it does not take time to form the mask. As a result, the organic device manufacturing method can improve productivity.

  In one embodiment, the support substrate has flexibility, and the first electrode layer forming step, the organic functional layer forming step, the masking tape applying step, the second electrode layer forming step, and the peeling step are performed as an unwinding roll. It may be performed during the process of winding the support substrate continuously fed out from the support substrate wound on the winding roll onto the winding roll. In this case, each process is implemented by what is called a roll-to-roll system. Therefore, each process can be performed efficiently and productivity can be improved.

  In one embodiment, after forming an organic functional layer in an organic functional layer formation process, you may implement a masking tape sticking process. Thereby, since the area | region where a masking tape should be affixed in a 1st electrode layer becomes clear, a masking tape can be affixed accurately. The formation of the organic functional layer means that the whole organic functional layer, a part of the organic functional layer, or, when the organic functional layer is a plurality of layers, at least one of the plurality of layers is formed. Means.

  In one embodiment, the organic functional layer forming step may be performed after the masking tape is applied in the masking tape applying step. Thus, for example, when the organic functional layer is formed by a printing method or the like, the edge of the organic functional layer is accurately formed by peeling the masking tape even if the applied material spreads over the masking tape. Is done.

  In one embodiment, a degassing process step of degassing the masking tape and the support substrate may be included after the masking tape is applied in the masking tape applying step and before the second electrode layer forming step. . In the case where the second electrode layer is formed by a vacuum deposition method, when gas (mainly moisture) is released from the support substrate on which the masking tape is formed into the processing chamber, the degree of vacuum in the processing chamber decreases. When the second electrode layer is formed in a low vacuum, the device characteristics deteriorate. Thus, by performing degassing processing of the masking tape and the support substrate, it is possible to suppress a decrease in the degree of vacuum in the processing chamber. Therefore, it is possible to suppress deterioration of element characteristics.

  In one embodiment, a step of winding the support substrate after forming the organic functional layer may be included. Thereby, for example, by setting the thickness of the masking tape so that the position of the surface of the masking tape is higher than the position of the surface of the organic functional layer, when the support substrate is wound up, It can suppress that the back surface of a support substrate contacts. Therefore, damage to the organic functional layer due to contact with the support substrate can be suppressed. The formation of the organic functional layer means that the whole organic functional layer, a part of the organic functional layer, or, when the organic functional layer is a plurality of layers, at least one of the plurality of layers is formed. Means.

  In one embodiment, a step of winding the support substrate may be included after the second electrode layer forming step. Thereby, for example, when the thickness of the masking tape is set so that the position of the surface of the masking tape is higher than the position of the surface of the second electrode layer, the second electrode is It can suppress that a layer and the back surface of a support substrate contact. Therefore, damage to the second electrode layer due to contact with the support substrate can be suppressed.

  The organic device substrate according to one aspect of the present invention is used for manufacturing an organic device in which a first electrode layer, an organic functional layer, and a second electrode layer are laminated in this order on a support substrate. A plurality of first electrode layers disposed on a flexible support substrate extending in one direction at a predetermined interval, and one of the first electrode layers. And a masking tape affixed along one direction over the plurality of first electrode layers.

  In this organic device substrate, the masking tape is attached along one direction on a part of the first electrode layer and across the plurality of first electrode layers. As described above, the mask for the first electrode layer has a simple configuration as compared with the case where the mask is formed by applying or curing the resin because the masking tape is applied. For this reason, productivity of the organic device substrate can be improved.

  In one embodiment, the masking tape may be affixed to a region of the first electrode layer where the second electrode layer to be electrically insulated from the first electrode layer is not formed. Thereby, when the second electrode layer is formed, electrical insulation between the first electrode layer and the second electrode layer can be reliably ensured.

  According to the present invention, productivity can be improved.

It is sectional drawing of the organic EL element manufactured by the manufacturing method of the organic device which concerns on one Embodiment. It is a figure which shows typically the manufacturing method of the organic device by a roll-to-roll system. It is a figure which shows the manufacturing method of an organic device. It is a figure which shows the manufacturing method of an organic device. It is a figure which shows the manufacturing method of an organic device. It is a figure which shows the manufacturing method of an organic device. It is sectional drawing which shows the manufacturing method of the organic device which concerns on other embodiment. It is sectional drawing which shows the manufacturing method of the organic device which concerns on other embodiment. It is sectional drawing which shows the manufacturing method of the organic device which concerns on other embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.

  As shown in FIG. 1, the organic EL element 1 manufactured by the organic device manufacturing method of the present embodiment includes a support substrate 3, an anode layer (first electrode layer) 5, an organic functional layer 7, and a cathode. A layer (second electrode layer) 9 and a sealing layer 11 are provided.

[Support substrate]
The support substrate 3 is made of a resin that is transparent to visible light (light having a wavelength of 400 nm to 800 nm). The support substrate 3 is a film-like substrate (flexible substrate, flexible substrate). The thickness of the support substrate 3 is, for example, not less than 30 μm and not more than 500 μm. When the support substrate 3 is a resin, it is preferably 45 μm or more from the viewpoint of substrate twist, wrinkle, and elongation when roll-to-roll is continuous, and 125 μm or less from the viewpoint of flexibility.

  The support substrate 3 is, for example, a plastic film. The material of the support substrate 3 is, for example, polyethersulfone (PES); polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN); polyolefin resin such as polyethylene (PE), polypropylene (PP), or cyclic polyolefin; Polyamide resin; Polycarbonate resin; Polystyrene resin; Polyvinyl alcohol resin; Saponified ethylene-vinyl acetate copolymer; Polyacrylonitrile resin; Acetal resin; Polyimide resin;

  Among the above resins, the material of the support substrate 3 is preferably a polyester resin or a polyolefin resin because of its high heat resistance, low coefficient of linear expansion, and low production cost, and particularly preferably polyethylene retephthalate or polyethylene naphthalate. . Moreover, these resin may be used individually by 1 type, and may be used in combination of 2 or more type.

  A moisture barrier layer (barrier layer) may be disposed on one main surface 3 a of the support substrate 3. The other main surface 3b of the support substrate 3 is a light emitting surface. The support substrate 3 may be a thin film glass. When the support substrate 3 is thin film glass, the thickness is preferably 30 μm or more from the viewpoint of strength and 100 μm or less from the viewpoint of flexibility.

[Anode layer]
The anode layer 5 is disposed on one main surface 3 a of the support substrate 3. For the anode layer 5, an electrode layer showing optical transparency is used. As the electrode exhibiting light transmittance, a thin film of metal oxide, metal sulfide, metal or the like having high electrical conductivity can be used, and a thin film having high light transmittance is preferably used. For example, a thin film made of indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO), indium zinc oxide (abbreviated as IZO), gold, platinum, silver, copper, or the like is used. Among these, a thin film made of ITO, IZO, or tin oxide is preferably used.

  As the anode layer 5, an organic transparent conductive film such as polyaniline and derivatives thereof, polythiophene and derivatives thereof may be used. Further, as the anode layer 5, an electrode obtained by patterning a metal or a metal alloy or the like into a mesh shape, or an electrode in which nanowires containing silver are formed in a network shape may be used.

  The thickness of the anode layer 5 can be determined in consideration of light transmittance, electrical conductivity, and the like. The thickness of the anode layer 5 is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

  Examples of the method for forming the anode layer 5 include a vacuum deposition method, a sputtering method, an ion plating method, a plating method, and a coating method.

[Organic functional layer]
The organic functional layer 7 is disposed on one main surface 3 a of the anode layer 5 and the support substrate 3. The organic functional layer 7 includes a light emitting layer. The organic functional layer 7 usually contains an organic substance that mainly emits fluorescence and / or phosphorescence, or a light emitting layer dopant material that assists the organic substance. The dopant material for the light emitting layer is added, for example, in order to improve the light emission efficiency or change the light emission wavelength. The organic substance may be a low molecular compound or a high molecular compound. Examples of the light emitting material constituting the organic functional layer 7 include the following dye materials, metal complex materials, polymer materials, and light emitting layer dopant materials.

(Dye material)
Examples of the dye material include cyclopentamine and derivatives thereof, tetraphenylbutadiene and derivatives thereof, triphenylamine and derivatives thereof, oxadiazole and derivatives thereof, pyrazoloquinoline and derivatives thereof, distyrylbenzene and derivatives thereof, and distyryl. Arylene and derivatives thereof, pyrrole and derivatives thereof, thiophene compounds, pyridine compounds, perinone and derivatives thereof, perylene and derivatives thereof, oligothiophene and derivatives thereof, oxadiazole dimer, pyrazoline dimer, quinacridone and derivatives thereof, coumarin and derivatives thereof Etc.

(Metal complex materials)
Examples of metal complex materials include rare earth metals such as Tb, Eu, and Dy, or Al, Zn, Be, Pt, Ir, and the like as a central metal, and an oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, and quinoline structure. And the like. Examples of metal complexes include metal complexes having light emission from triplet excited states such as iridium complexes and platinum complexes, aluminum quinolinol complexes, benzoquinolinol beryllium complexes, benzoxazolyl zinc complexes, benzothiazole zinc complexes, azomethyl zinc complexes, A porphyrin zinc complex, a phenanthroline europium complex, etc. can be mentioned.

(Polymer material)
Examples of the polymer material include polyparaphenylene vinylene and derivatives thereof, polythiophene and derivatives thereof, polyparaphenylene and derivatives thereof, polysilane and derivatives thereof, polyacetylene and derivatives thereof, polyfluorene and derivatives thereof, polyvinylcarbazole and derivatives thereof, Examples thereof include materials obtained by polymerizing dye materials and metal complex materials.

(Dopant material for light emitting layer)
Examples of the dopant material for the light emitting layer include perylene and derivatives thereof, coumarin and derivatives thereof, rubrene and derivatives thereof, quinacridone and derivatives thereof, squalium and derivatives thereof, porphyrin and derivatives thereof, styryl dyes, tetracene and derivatives thereof, pyrazolone and derivatives thereof. Derivatives, decacyclene and its derivatives, phenoxazone and its derivatives, and the like.

  The thickness of the organic functional layer 7 is usually about 2 nm to 200 nm. The organic functional layer 7 is formed by, for example, a coating method using a coating liquid (for example, ink) containing the light emitting material as described above. The solvent of the coating solution containing the light emitting material is not limited as long as it dissolves the light emitting material. The light emitting material as described above may be formed by vacuum deposition.

[Cathode layer]
The cathode layer 9 is disposed on one main surface 3 a of the organic functional layer 7 and the support substrate 3. The cathode layer 9 is electrically connected to the extraction electrode 9a. The extraction electrode 9 a is disposed on one main surface 3 a of the support substrate 3. The extraction electrode 9a is arranged at a predetermined interval from the anode layer 5. The thickness of the extraction electrode 9 a is equal to the thickness of the anode layer 5. The material of the extraction electrode 9 a is the same as that of the anode layer 5. In addition, a lead wire or a connector is electrically connected to the extraction electrode 9a, and current is supplied from an external power source. Further, the extraction electrode 9 a may be omitted, and in this case, the cathode layer 9 is extended outside outside the end portion of the sealing layer 11.

  As a material of the cathode layer 9, for example, alkali metal, alkaline earth metal, transition metal, periodic table group 13 metal, or the like can be used. Specific examples of the material for the cathode layer 9 include lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, aluminum, scandium, vanadium, zinc, yttrium, indium, cerium, samarium, Metals such as europium, terbium, ytterbium, alloys of two or more of the metals, one or more of the metals, gold, silver, platinum, copper, manganese, titanium, cobalt, nickel, tungsten, tin An alloy with one or more of them, graphite, a graphite intercalation compound, or the like is used. Examples of alloys include magnesium-silver alloys, magnesium-indium alloys, magnesium-aluminum alloys, indium-silver alloys, lithium-aluminum alloys, lithium-magnesium alloys, lithium-indium alloys, calcium-aluminum alloys, and the like. it can.

  Further, as the cathode layer 9, for example, a transparent conductive electrode made of a conductive metal oxide, a conductive organic substance, or the like can be used. Specific examples of the conductive metal oxide include indium oxide, zinc oxide, tin oxide, ITO, and IZO. Examples of the conductive organic substance include polyaniline and derivatives thereof, polythiophene and derivatives thereof, and the like. it can. In addition, the cathode layer 9 may be comprised by the laminated body which laminated | stacked two or more layers. An electron injection layer may be used as the cathode layer 9 in some cases.

  The thickness of the cathode layer 9 is set in consideration of electric conductivity and durability. The thickness of the cathode layer 9 is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

  Examples of the method for forming the cathode layer 9 include a vacuum deposition method, a sputtering method, and a laminating method and a coating method in which a metal thin film is thermocompression bonded.

[Sealing layer]
The sealing layer 11 is disposed at the top of the organic EL element 1. The sealing layer 11 is joined by an adhesive layer (not shown). The sealing layer 11 is a metal foil, a barrier film in which a barrier functional layer is formed on the front surface or back surface of a transparent plastic film, or both surfaces thereof, a thin film glass having flexibility, or a metal layer having barrier properties on a plastic film. It consists of a film etc. and has a gas barrier function, especially a moisture barrier function. As the metal foil, copper, aluminum, and stainless steel are preferable from the viewpoint of barrier properties. The thickness of the metal foil is preferably as thick as possible from the viewpoint of suppressing pinholes, but is preferably 15 μm to 50 μm in view of flexibility.

[Method of manufacturing organic EL element]
Then, the manufacturing method of the organic EL element 1 which has the said structure is demonstrated.

  In the form in which the support substrate 3 is a flexible substrate, a roll-to-roll system can be adopted as conceptually shown in FIG. When the organic EL element 1 is manufactured by the roll-to-roll method, the long flexible support substrate 3 stretched between the unwinding roll 30A and the winding roll 30B is continuously transported by the transport roller 31. However, each layer is formed in order from the support substrate 3 side.

  When manufacturing the organic EL element 1, first, the support substrate 3 is heated and dried (substrate drying process S01). Next, the anode layer 5 and the extraction electrode 9a are formed on the dried support substrate 3 (one main surface 3a) (anode layer forming step (first electrode layer forming step) S02). The anode layer 5 (extraction electrode 9a) can be formed by the formation method exemplified in the description of the anode layer 5. As shown in FIG. 3, the anode layer 5 and the extraction electrode 9 a are formed at a predetermined interval in the width direction (X direction) of the support substrate 3. On the support substrate 3, a plurality of sets (patterns) of the anode layer 5 and the extraction electrode 9 a are formed at predetermined intervals in the longitudinal direction (Y direction) of the support substrate 3 and the width of the support substrate 3. A plurality (two in this embodiment) are formed at predetermined intervals in the direction.

  Subsequently, as shown in FIG. 3, a masking tape M is pasted (masking tape pasting step S03). The masking tape M has a predetermined width and extends in one direction. The width and thickness of the masking tape M may be appropriately selected. As the thickness of the masking tape M, for example, a thickness larger than the total thickness of the organic functional layer 7 is selected. The masking tape M has adhesiveness and can be peeled off. The adhesive strength of the masking tape M is set such that the anode layer 5 does not peel from the support substrate 3 when the masking tape M is peeled off. The material of the base material constituting the masking tape M is ± 10 ppm / ° C. with respect to the linear expansion coefficient of the support substrate 3 so as not to cause peeling or wrinkles due to the temperature in the cathode layer forming step S06 (described later). Can be selected. Here, the linear expansion coefficient can be measured by, for example, a method defined in JIS K7197. Specifically, examples of the material for the base material of the masking tape M include PEN and PET.

  The masking tape M is attached so as to cover a part of the anode layer 5 (on a part of the anode layer 5). Specifically, the masking tape M is attached so as to cover one end of the anode layer 5 (the end opposite to the other end facing the extraction electrode 9a). The masking tape M is attached along the longitudinal direction of the support substrate 3 across the plurality of anode layers 5. Moreover, the masking tape M is affixed so that a part of extraction electrode 9a may be covered. Specifically, the masking tape M is attached so as to cover one end of the extraction electrode 9a (the end opposite to the other end facing the anode layer 5). The masking tape M is affixed along the longitudinal direction of the support substrate 3 across the plurality of extraction electrodes 9a. Thereby, the substrate for organic devices is produced.

  Subsequently, as shown in FIG. 4, an organic functional layer 7 is formed on the anode layer 5 (organic functional layer forming step S04). The organic functional layer 7 is formed on the anode layer 5 in a portion other than the region where the masking tape M is applied, for example, by an ink jet printing method, a spray coating method, or a vacuum deposition method. Specifically, the organic functional layer 7 is formed such that no gap is formed between the organic functional layer 7 and the masking tape M. The organic functional layer 7 is also formed in a part between the anode layer 5 and the extraction electrode 9a. The thickness of the organic functional layer 7 is thinner than the thickness of the masking tape M, for example. The organic functional layer 7 can be formed by the formation method exemplified in the description of the organic functional layer 7. The organic functional layer 7 may be formed on the masking tape M or a part of the masking tape M.

  Subsequently, the support substrate 3 on which the masking tape M is formed is degassed (water) (degas process step S05). As degassing (water) gas treatment, in a vacuum, an inert atmosphere, or in dry air, using a heat source such as an IR heater, an IR lamp, or a ceramic heater, radiation, heat transfer, convection, etc., masking tape M A method of heating the support substrate 3 on which is formed is used. Further, in an inert atmosphere or in dry air, hot air using these gases can be brought into contact with the support substrate 3 on which the masking tape M is formed.

  Subsequently, as shown in FIG. 5, a cathode layer 9 is formed on the organic functional layer 7 (cathode layer forming step (second electrode layer forming step) S06). The cathode layer 9 is formed so as to cover the organic functional layer 7. Specifically, the cathode layer 9 is formed on the entire surface of the support substrate 3 or a part thereof by, for example, a vacuum deposition method. Thereby, the cathode layer 9 is formed so as to cover the masking tape M while covering the other end of the extraction electrode 9a (a region where the masking tape M is not attached). The cathode layer 9 can be formed by the formation method exemplified in the description of the cathode layer 9.

  Subsequently, as shown in FIG. 6, the masking tape M is peeled off (masking tape peeling step S07). The peeled masking tape M is wound, for example, on a roll. When peeling off the masking tape M, it is preferable to place the cathode layer 9 below the support substrate 3 and peel off the masking tape M. Thereby, the dust generated when the masking tape M is peeled can be dropped downward. When the masking tape M is peeled off, a part (one end) of the anode layer 5 and a part (one end) of the extraction electrode 9a are exposed. And the sealing layer 11 is bonded together and the organic functional layer 7 and the cathode layer 9 are sealed (sealing process S08). Thus, the organic EL element 1 is formed.

  As described above, in the method for manufacturing the organic EL element 1 according to this embodiment, the masking tape is formed along at least a part of the anode layer 5 and across the plurality of anode layers 5 along the longitudinal direction of the support substrate 3. Affix M. Therefore, a part of the plurality of anode layers 5 can be covered only by the operation of applying the masking tape M along the longitudinal direction. Therefore, in the method for manufacturing the organic EL element 1, it takes no time to form the mask. As a result, in the method for manufacturing the organic EL element 1, productivity can be improved.

  In the present embodiment, the support substrate 3 has flexibility. The anode layer forming step S02, the masking tape attaching step S03, the organic functional layer forming step S04, the degassing step S05, the cathode layer forming step S06, and the masking tape peeling step S07 are carried out by the support substrate 3 wound around the unwinding roll 30A. It is performed during the process of winding the support substrate 3 continuously fed out from the winding roll 30B. In this case, each process is implemented by what is called a roll-to-roll system. Therefore, each process can be performed efficiently and productivity can be improved.

  In this embodiment, organic functional layer formation process S04 is implemented after masking tape sticking process S03. Thereby, for example, when the organic functional layer 7 is formed by a printing method or the like, even if the applied material or the deposited material spreads over the masking tape M, by peeling the masking tape M, The edge of the organic functional layer 7 is formed with high accuracy. Further, by forming a part of the organic functional layer 7 so as to be formed on the masking tape M, the formation of a gap between the organic functional layer 7 and the masking tape M can be suppressed. Thereby, electrical insulation between the anode layer 5 and the cathode layer 9 can be reliably ensured.

  In this embodiment, the degassing process step S05 is performed after the masking tape M is applied in the masking tape applying step S03 and before the cathode layer forming step S06. When the cathode layer 9 is formed by a vacuum deposition method, if gas (mainly moisture) is released from the support substrate 3 on which the masking tape M is formed to the vacuum chamber (processing chamber), the vacuum degree of the vacuum chamber decreases. To do. When the cathode layer 9 is formed in a low vacuum, the device characteristics are deteriorated. Therefore, in this embodiment, before introducing the support substrate 3 on which the masking tape M is formed into the vacuum chamber in which the cathode layer 9 is formed, a degassing (water) treatment is performed, and the support substrate 3 and the masking tape M in the masking tape M are removed. Remove gas (moisture). Thereby, it can suppress that a vacuum chamber becomes a low vacuum. As a result, the characteristic deterioration of the organic EL element 1 can be suppressed.

The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, in the said embodiment, the organic EL element 1 with which the organic functional layer 7 containing a light emitting layer was arrange | positioned between the anode layer 5 and the cathode layer 9 was illustrated. However, the structure of the organic functional layer 7 is not limited to this. The organic functional layer 7 may have the following configuration.
(A) (Anode layer) / Light emitting layer / (Cathode layer)
(B) (Anode layer) / Hole injection layer / Light emitting layer / (Cathode layer)
(C) (anode layer) / hole injection layer / light emitting layer / electron injection layer / (cathode layer)
(D) (anode layer) / hole injection layer / light emitting layer / electron transport layer / electron injection layer / (cathode layer)
(E) (Anode layer) / Hole injection layer / Hole transport layer / Light emitting layer / (Cathode layer)
(F) (anode layer) / hole injection layer / hole transport layer / light emitting layer / electron injection layer / (cathode layer)
(G) (anode layer) / hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / (cathode layer)
(H) (anode layer) / light emitting layer / electron injection layer / (cathode layer)
(I) (anode layer) / light emitting layer / electron transport layer / electron injection layer / (cathode layer)
Here, the symbol “/” indicates that the layers sandwiching the symbol “/” are adjacently stacked. The configuration shown in (a) above shows the configuration of the organic EL element 1 in the above embodiment.

  As materials for the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer, known materials can be used. Each of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer can be formed by, for example, a coating method in the same manner as the organic functional layer 7.

  Here, the electron injection layer may contain an alkali metal or alkaline earth metal, or an oxide or fluoride of an alkali metal or alkaline earth metal. Examples of the method for forming the electron injection layer include a coating method and a vacuum deposition method. In the case of oxides and fluorides, the thickness of the electron injection layer is preferably 0.5 nm to 20 nm. The electron injection layer is preferably a thin film, for example, a thickness of 0.5 nm to 10 nm from the viewpoint of suppressing an increase in driving voltage of the organic EL element 1, particularly when the insulating property is strong. From the viewpoint of properties, the thickness is preferably 2 nm to 7 nm. The electron injection layer may be formed on the masking tape M in the same manner as the cathode layer 9 before the cathode layer 9 is formed in the step of forming the cathode layer 9. Therefore, for example, an electron injection layer may be formed between the extraction electrode 9 a and the cathode layer 9.

The organic EL element 1 may have a single organic functional layer 7 or may have two or more organic functional layers 7. In any one of the layer configurations (a) to (i) above, when the laminated structure disposed between the anode layer 5 and the cathode layer 9 is “structural unit A”, the organic function of two layers As a structure of the organic EL element which has the layer 7, the layer structure shown to the following (j) can be mentioned, for example. The two (structural unit A) layer configurations may be the same or different.
(J) Anode layer / (structural unit A) / charge generation layer / (structural unit A) / cathode layer

  Here, the charge generation layer is a layer that generates holes and electrons by applying an electric field. Examples of the charge generation layer include a thin film made of vanadium oxide, ITO, molybdenum oxide, or the like.

Further, assuming that “(structural unit A) / charge generation layer” is “structural unit B”, the configuration of an organic EL element having three or more organic functional layers 7 is, for example, the layer configuration shown in the following (k) Can be mentioned.
(K) Anode layer / (structural unit B) x / (structural unit A) / cathode layer

  The symbol “x” represents an integer of 2 or more, and “(structural unit B) x” represents a stacked body in which (structural unit B) is stacked in x stages. A plurality of (structural units B) may have the same or different layer structure.

  The organic EL element may be configured by directly laminating a plurality of organic functional layers 7 without providing the charge generation layer.

  In the said embodiment, after sticking the masking tape M, the form which forms the organic functional layer 7 was demonstrated to an example. However, after the organic functional layer 7 is formed, the masking tape M may be applied, and then the cathode layer 9 may be formed. The formation of the organic functional layer 7 means that the entire organic functional layer 7, a part of the organic functional layer 7, or at least one of the plurality of layers is formed when the organic functional layer 7 is a plurality of layers. Means that. The organic functional layer 7 may be formed on the anode layer 5 in a portion other than the region where the masking tape M is attached. In this case, the masking tape M is attached so that no gap is formed between the masking tape M and the organic functional layer 7. Thereby, since the area | region where the masking tape M should be affixed in the anode layer 5 becomes clear, the masking tape M can be affixed accurately. In addition, electrical insulation between the anode layer 5 and the cathode layer 9 can be reliably ensured.

  Further, as shown in FIG. 7, the masking tape M may be stuck so that the masking tape M overlaps the organic functional layer 7. In this case, since the gap is surely eliminated, insulation can be further ensured. When the masking tape M is applied after the organic functional layer 7 is formed, the organic functional layer 7 is not formed in the area functioning as a terminal in the anode layer 5 or the organic functional layer 7 is formed on the anode layer 5. Later, a part of the organic functional layer 7 is removed. As a method for removing the organic functional layer 7 formed on the anode layer 5, for example, peeling using a solvent, physical peeling using a blade or the like, or ablation with a laser or the like can be used. .

  As a method for removing the organic functional layer 7 formed on the anode layer 5, a masking tape M can be used. Since the masking tape M has an adhesive part (adhesive layer), the organic functional layer 7 can be peeled from the anode layer 5 by the adhesive force of the adhesive part. Therefore, the organic functional layer 7 is formed so as to cover the whole of the anode layer 5, the masking tape M is pasted on the organic functional layer 7, and the masking tape M is peeled off, so that the organic film closely contacting the masking tape M is adhered. The functional layer 7 is removed together with the masking tape M. Thereby, an area functioning as a terminal in the anode layer 5 is formed. In this method, the process can be simplified.

  In addition to the above embodiment, an insulating layer 15 may be formed as shown in FIG. In this case, for example, after the anode layer 5 is formed, the insulating layer 15 is formed, and after the masking tape M is applied including part of the anode layer 5 and part of the insulating layer 15, the organic functional layer 7 and the cathode layer 9 may be formed. In this case, even when a gap is formed between the masking tape M and the organic functional layer 7, electrical insulation between the anode layer 5 and the cathode layer 9 can be ensured.

  Moreover, the insulating layer 15 has a function of a partition wall. For example, when the organic functional layer 7 is formed by a coating process, the coating liquid is blocked by the insulating layer 15 to control the formation area of the organic functional layer 7. Can do.

  Further, as shown in FIG. 9, after forming the insulating layer 15, the organic functional layer 7 is formed including a part on the insulating layer 15, and masking is performed across the insulating layer 15 and a part of the organic functional layer 7. Tape M may be affixed. The masking tape M may be attached only to the insulating layer 15.

  In the said embodiment, the form implemented continuously from board | substrate drying process S01 to sealing process S08 was demonstrated to the example. However, in the organic device manufacturing method, the support substrate 3 may be wound up after the organic functional layer 7 is formed. In this case, for example, when the thickness of the masking tape M is set so that the position of the surface of the masking tape M is higher than the position of the surface of the organic functional layer 7, It can suppress that the organic functional layer 7 and the back surface (other main surface 3b) of the support substrate 3 contact. Therefore, damage to the organic functional layer 7 due to contact with the support substrate 3 can be suppressed. In addition, winding of the support substrate 3 can be performed at arbitrary timings (in the middle of each process).

  Further, the support substrate 3 may be wound up after the cathode layer 9 is formed. In this case, for example, when the thickness of the masking tape M is set so that the position of the surface of the masking tape M is higher than the position of the surface of the cathode layer 9, It can suppress that the layer 9 and the back surface (other main surface 3b) of the support substrate 3 contact. Therefore, damage to the cathode layer 9 due to contact with the support substrate 3 can be suppressed. Note that the formation of the organic functional layer 7 mentioned here means that the entire organic functional layer 7, a part of the organic functional layer 7, or, when the organic functional layer 7 is a plurality of layers, at least of the plurality of layers. It means that one layer of is formed.

  In the above-described embodiment, an example in which the masking tape M is pasted so as to cover a part of the extraction electrode 9a in the masking tape pasting step S03 has been described. However, in the masking tape attaching step S03, the masking tape M may not be attached to the extraction electrode 9a. In this case, the organic functional layer 7 may be formed so that a part of the extraction electrode 9a is exposed. In this configuration, the cathode layer 9 is formed so as to cover the extraction electrode 9a.

  In the above-described embodiment, the form including the extraction electrode 9a has been described as an example, but the extraction electrode 9a may not be provided. In this case, the cathode layer 9 functions as an extraction electrode.

  In the above embodiment, the embodiment for performing the substrate drying step S01 has been described as an example, but the substrate drying step S01 may not be performed. Moreover, in the said embodiment, the anode layer formation process S02 demonstrated as an example the form which forms the group of the anode layer 5 and the extraction electrode 9a at predetermined intervals in the width direction of the support substrate 3 as an example. However, in the anode layer forming step S02, the set of the anode layer 5 and the extraction electrode 9a may be one set in the width direction of the support substrate 3.

  In the said embodiment, the degassing process S05 was continuously demonstrated with the other process in the roll to roll system as an example. However, the degassing process may be performed independently. Further, the degassing process step S05 may not be performed.

  In the said embodiment, the organic EL element was demonstrated to an example as an organic device. The organic device may be an organic thin film transistor, an organic photodetector, an organic thin film solar cell, or the like.

  DESCRIPTION OF SYMBOLS 1 ... Organic EL element, 3 ... Support substrate, 5 ... Anode layer (1st electrode layer), 7 ... Organic functional layer, 9 ... Cathode layer (2nd electrode layer), S02 ... Anode layer formation process (1st electrode layer) Forming step), S03 ... masking tape attaching step, S04 ... organic functional layer forming step, S05 ... degassing treatment step, S06 ... cathode layer forming step (second electrode layer forming step), S07 ... masking tape peeling step.

Claims (7)

A first electrode layer forming step of forming a plurality of first electrode layers on the support substrate extending in one direction at a predetermined interval in the one direction;
An organic functional layer forming step of forming an organic functional layer on at least a part of the first electrode layer;
A masking tape applying step of applying a masking tape along at least one part of the first electrode layer and across the plurality of first electrode layers along the one direction;
A second electrode layer forming step of forming a second electrode layer on at least the organic functional layer after the masking tape attaching step;
After the second electrode layer forming step, a peeling step for peeling the masking tape;
A degassing process step of degassing the masking tape and the support substrate after applying the masking tape in the masking tape applying step and before the second electrode layer forming step. Manufacturing method. The support substrate has flexibility,
The first electrode layer forming step, the organic functional layer forming step, the masking tape sticking step, the second electrode layer forming step, and the peeling step are continuously sent out from the support substrate wound on a winding roll. The manufacturing method of the organic device of Claim 1 performed during the process which winds the said said support substrate wound on the winding roll.   The manufacturing method of the organic device of Claim 1 or 2 which implements the said masking tape sticking process after forming the said organic functional layer in the said organic functional layer formation process.   The manufacturing method of the organic device of Claim 1 or 2 which implements the said organic functional layer formation process after sticking the said masking tape in the said masking tape sticking process. The manufacturing method of the organic device as described in any one of Claims 1-4 including the winding-up process which winds up the said support substrate after the said organic functional layer formation process. The manufacturing method of the organic device as described in any one of Claims 1-5 including the winding-up process which winds up the said support substrate after the said 2nd electrode layer formation process. In the said 2nd electrode layer formation process, the said 2nd electrode layer is formed by the vacuum evaporation method, The manufacturing method of the organic device as described in any one of Claims 1-6.

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