JP2003017251A - Manufacturing method of organic electroluminescent display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a means of obtaining a high performance organic electroluminescent display device at low cost. SOLUTION: A step or a groove is provided between the luminous region and the non-luminous region on the substrate that constitutes the organic electroluminescent display device, and the organic layer of the luminous part is covered by a mask member by aligning the edge of the mask member with the step or groove, and, thereby, the organic layer of the non-luminous part that is not masked is removed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescence display device that can be used as a display device and a light source, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, Tang et al. Have an organic electroluminescent dye as an organic light emitting layer, and an organic electroluminescent layer having a two-layer structure in which the organic fluorescent dye is laminated with an organic charge transporting compound used in an electrophotographic photoreceptor or the like. A luminescence (EL) device has been proposed (JP-A-59-194393). Organic EL devices are characterized in that they can be driven at a low voltage and have high brightness and can easily emit light of many colors as compared with inorganic EL devices. Therefore, many organic EL devices have a large number of elements, organic fluorescent dyes, and organic charge transport compounds. Attempts have been reported (Jpn. J. Ap.
pl. Phys. Volume 27, L269 (1988)
Year), J. Appl. Phys. 65, 3610 (1989)).

Up to now, a low molecular weight organic fluorescent dye has been generally used as a material for the organic light emitting layer, but in the examples of WO 9013148, a soluble precursor is spin-coated on an electrode. By coating and heat treatment, a poly (p-phenylene vinylene) thin film converted into a conjugated polymer is obtained, and an EL device using the same is disclosed. In addition, an example in which a polymer light-emitting material soluble in a solvent is applied by spin coating has been published (AP
L, 58, 1982 (1991)).

As an organic EL display device using an organic EL element, a transparent electrode is formed as an anode 3 on the surface of a transparent substrate 1 made of glass or the like as shown in FIG. It is well known that the layer 5 is formed and the cathode 7 made of metal or the like is further formed on the layer 5. A protective film 9 made of an insulating material or the like is usually formed on the cathode 7 in order to prevent deterioration of the organic layer 5.

A take-out electrode 4 is formed on the substrate 1 and is electrically connected to the cathode 7. Further, the extraction electrode 4 is adhered to the FPC 11 via the anisotropic conductive film 10.

[0006]

The formation of the organic layer 5 is generally carried out by a vacuum vapor deposition method. However, if this is carried out by spin coating or dipping, an organic EL display device can be produced more easily. It is easy to increase the area.

Here, since the wiring pattern of the display is generally thin and complicated, it is difficult to use the cathode 7 formed by vapor-depositing a metal such as Al through the mask as the extraction electrode 4 directly connected to the FPC 11, and the substrate. The cathode 7 is vapor-deposited and bonded to the take-out electrode 4 which is patterned in advance.

However, in the method of applying the organic layer 5 by spin coating, the organic layer is formed on the entire surface of the substrate 1 including the patterned lead-out electrode 4, so that it is formed between the cathode 7 and the lead-out electrode 4. Since the organic layer 5 which is an insulator intervenes, the organic layer 5 at the junction needs to be removed before forming the cathode 7.

As a means for removing the organic layer 5, anisotropic dry etching such as reactive ion etching (RI
E) is effective, but there is a problem that even if a mask is put on to protect the light emitting part, some reaction gas wraps around from the gap between the organic layer and the mask and the light emitting part is damaged. There is.

As another means, a masking member such as a masking sealing material is applied and cured on the electrode patterned on the substrate to form an organic layer on the entire surface, and then the masking member is peeled off to remove the extraction electrode. There is also a method of exposing it, but if the masking member is thin, it cannot be peeled off cleanly, and if it is thick, there is a problem that the film thickness of the organic layer near the masking portion formed by spin coating becomes uneven.

The present invention has been made in view of the above problems, and an object thereof is to provide a means for obtaining a high-performance organic electroluminescence display device at low cost.

[0012]

A first aspect of the present invention is to provide a light emitting portion in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed on a substrate, and to form the laminated body. A method of manufacturing an organic electroluminescence display device having a non-light emitting portion, which is not formed, wherein a light emitting portion region which forms the light emitting portion by forming the laminate as the substrate, and a non light emitting portion which becomes the non light emitting portion. What has a step between the organic layer and the organic layer is used, and when the organic layer is formed, the organic layer is formed on the entire surface of the substrate including the light emitting part region and the non-light emitting part region. And removing a portion of the organic layer that is formed in the non-light emitting portion region, using a mask member at the time of removing, and aligning an end portion of the mask member with a step portion of the substrate, The portion formed in the partial region is the mask member To keep covering, characterized by.

According to such a method, even if the influence of processing when removing the unnecessary organic layer in the non-light-emission part region wraps around from the lower part of the mask member to the inner part, it is caused by the stepped part of the substrate. It is blocked, and it becomes possible to reliably protect the organic layer in the light emitting portion near the anode.

A second aspect of the present invention is to provide a light emitting portion on a substrate in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed, and a non-light emitting portion in which the laminated body is not formed. A method of manufacturing an organic electroluminescence display device comprising: a groove formed between the light emitting portion region that forms the light emitting portion by forming the laminate as the substrate and the non-light emitting portion region that becomes the non-light emitting portion. When forming the organic layer, the organic layer is formed on the entire surface of the substrate including the light emitting part region and the non-light emitting part region, and the non-light emitting part of the organic layer is used. A portion formed in the light emitting portion region of the organic layer by removing a portion formed in the region, using a mask member at the time of removing, and aligning an end portion of the mask member with a groove portion of the substrate; Is covered with the mask member, And butterflies.

According to such a method, even if the influence of processing when removing the unnecessary organic layer in the non-light-emitting portion region wraps around from the lower part of the mask member to the inner side, it may be affected by the groove part of the substrate. It is blocked, and it becomes possible to reliably protect the organic layer in the light emitting portion near the anode.

A third aspect of the present invention is to provide, on a substrate, a light emitting portion in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed, and a non-light emitting portion in which the laminated body is not formed. A method for manufacturing an organic electroluminescence display device having, wherein, as the substrate, between the light emitting part region which forms the light emitting part by forming the laminate and the non-light emitting part region which becomes the non-light emitting part, A material having a stepped portion such that the light emitting portion region is convex is used, and when the organic layer is formed, a sealing material is formed so that the non-light emitting portion region is flush with the surface of the light emitting portion region. Is applied to form the organic layer on the entire surface of the substrate including the light emitting portion region and the sealing material, and the sealing material is removed before forming the cathode.

According to such a method, the thickness of the sealing material can be made equal to the height of the step, and the organic layer is removed from unnecessary portions without tearing or leaving residue when peeled. Can be done reliably.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION According to the first aspect of the present invention, a light emitting portion in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed on a substrate, and the laminated body is formed. A method of manufacturing an organic electroluminescence display device having a non-light emitting portion, wherein a light emitting portion region which forms the light emitting portion by forming the laminate as the substrate, and a non light emitting portion region which becomes the non light emitting portion, A layer having a step between the organic layers is formed, and when the organic layer is formed, the organic layer is formed on the entire surface of the substrate including the light emitting part region and the non-light emitting part region. Removing a portion formed in the non-light emitting region, a mask member is used for the removal, and an end portion of the mask member is aligned with a step portion of the substrate;
A portion of the organic layer formed in the light emitting portion region is covered with the mask member. Also,
It is preferable that the step is a step in which the light emitting portion region is convex, and the mask member has a concave shape.

FIG. 2 is a sectional view showing an embodiment of a method for manufacturing an organic EL display device of the present invention. Reference numeral 1 is a substrate, 3 is an anode, 4 is an extraction electrode, 5 is an organic layer formed on the entire surface of the substrate, and 6 is a mask member.

By doing so, even if the influence of the processing at the time of removing the unnecessary organic layer in the non-light-emitting region wraps around from the bottom of the mask member 6 to the inside, the stepped portion of the substrate It is possible to reliably protect the organic layer in the light emitting portion near the anode 3 by being blocked by the.

Further, it is preferable that the step forms an inclined surface with respect to the non-light emitting portion region. One preferable embodiment of this step is as shown in FIG. 1, and its angle is preferably more than 90 degrees and less than 180 degrees with respect to the substrate surface. This is because if the angle is 90 degrees or less, the cathode is likely to be broken at the step portion.
This is because the effect of the present invention cannot be obtained at 0 degree.

A second aspect of the present invention is to provide, on a substrate, a light emitting portion in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed, and a non-light emitting portion in which the laminated body is not formed. A method of manufacturing an organic electroluminescence display device comprising: a groove formed between the light emitting portion region that forms the light emitting portion by forming the laminate as the substrate and the non-light emitting portion region that becomes the non-light emitting portion. When forming the organic layer, the organic layer is formed on the entire surface of the substrate including the light emitting part region and the non-light emitting part region, and the non-light emitting part of the organic layer is used. A portion formed in the light emitting portion region of the organic layer by removing a portion formed in the region, using a mask member at the time of removing, and aligning an end portion of the mask member with a groove portion of the substrate; Is covered with the mask member, And butterflies.

FIG. 4 is a cross-sectional view showing one embodiment of the method of manufacturing the organic EL display device of the present invention. The same reference numerals as those in FIG. 2 indicate the same members.

By doing so, even if the influence of the processing for removing the unnecessary organic layer in the non-light emitting region wraps around from the lower part of the mask member 6 to the inner side, the groove part of the substrate is formed. It is possible to reliably protect the organic layer in the light emitting portion near the anode 3 by being blocked by the.

Further, the shape of the groove is V-shaped or tapered so that the opening is wider than the deepest part so that the end of the mask member can easily fit into the groove even after the organic layer is formed thereon. It is preferable.

A third aspect of the present invention is to provide a light emitting portion on a substrate, in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed, and a non-light emitting portion in which the laminated body is not formed. A method for manufacturing an organic electroluminescence display device having, wherein, as the substrate, between the light emitting part region which forms the light emitting part by forming the laminate and the non-light emitting part region which becomes the non-light emitting part, A material having a stepped portion such that the light emitting portion region is convex is used, and when the organic layer is formed, a sealing material is formed so that the non-light emitting portion region is flush with the surface of the light emitting portion region. Is applied to form the organic layer on the entire surface of the substrate including the light emitting portion region and the sealing material, and the sealing material is removed before forming the cathode.

FIG. 5 is a sectional view showing an embodiment of a method for manufacturing an organic EL display device of the present invention. The same reference numerals as in FIG. 2 indicate the same members, and 8 is a sealing material.

That is, the sealing material 8 for masking is applied and cured in the non-light emitting area in advance, and the organic layer 5 is applied to the entire surface of the substrate 1 by, for example, spin coating, and then applied in the non-light emitting area. It is possible to remove the organic layer 5 together with some sealing material 8.

Usually, when a masking sealant is applied and an organic layer is formed by spin coating, the edge of the masking sealant serves as a wall, and the thickness of the organic layer in the vicinity is different from the central part. It is preferable that the thickness of the sealing material is thin because it causes variation in emission brightness. However, if the masking sealing material is thin, the film strength will be weak,
When peeled off, it will be torn or residue will remain.

Therefore, as in the present invention, the sealing material 8 is applied and cured in the non-light emitting area of the substrate having the stepped shape so as to have the same height as the surface of the light emitting area. The thickness of the sealing material can be taken by the height of the step without forming a wall on the inside. With this method, the organic layer in the non-light emitting region can be removed without using an expensive RIE device.

Further, the organic electroluminescence display device of the present invention includes a device characterized by being manufactured by the manufacturing method of the present invention.

Hereinafter, a method for manufacturing an organic electroluminescence (EL) display device according to the present invention and an organic EL device.
The display device will be described in detail.

The step-like substrate 1 has a light-transmitting property, and is preferably a glass substrate or a substrate made of synthetic resin, and the glass substrate is soda-lime glass, barium.
Strontium-containing glass, borosilicate glass, quartz glass, non-alkali glass, or the like is used, and as the synthetic resin substrate, polycarbonate resin, acrylic resin, polyether sulfide resin, polysulfone resin, or the like is used.

An anode 3 and a take-out electrode 4 are formed on the substrate 1. The anode 3 is preferably a metal, an alloy, an electrically conductive compound or a mixture thereof having a large work function (4 eV or more), specifically, Au, Pt, Ag, Cu, C.
Examples include uI, ITO, SnO ₂ , ZnO and the like. When the light emitted from the organic light emitting layer is taken out from the anode 3 side, the anode 3 preferably has a visible light transmittance of 10% or more. The sheet resistance of the anode 3 is preferably 500 Ω / □ or less. Further, the film thickness of the anode 3 depends on the material, but is usually selected in the range of 10 nm to 1 μm.

The extraction electrode 4 is not limited as long as it is a conductive material, and it does not need to transmit visible light. It goes without saying that the same material as that of the anode 3 can be used, and a different material, resistance, and film thickness can also be used. Also, ITO and C
There is no problem even with a laminated structure of different materials such as r. The anode 3 and the take-out electrode 4 can be formed by a method such as a vacuum vapor deposition method, a sputtering method, or a plating method. The anode 3 and the take-out electrode 4 may be formed simultaneously or sequentially.

As shown in FIG. 2, an organic layer 5 is formed on the substrate 1 and the anode 3, but the organic layer 5 is not particularly limited in terms of material type, constitution, film thickness, and dye doping form. However, the light emitting layer of an organic EL element such as a thin film made of only one or many kinds of organic light emitting materials and a thin film made of a mixture of one or many kinds of organic light emitting materials and a hole transport material and an electron injection material. A single-layer structure that functions as a single layer structure or a stacked-layer structure including two or more layers each having a hole-transporting material and an electron-injecting material other than the light-emitting layer may be used. As the constituent material of the organic layer 5, regardless of whether it is a high molecular type or a low molecular type, a hole transporting material, an organic light emitting material, and an electron injecting material which have been conventionally used in an organic EL element can be used as they are.

As the hole transport material, triazole derivatives, oxadiazole derivatives, imidazole derivatives, phenylenediamine derivatives, arylamine derivatives, pyrazoline derivatives, pyrazolone derivatives, aniline copolymers, polyarylalkane derivatives, stilbene derivatives,
Examples thereof include hydrazone derivatives, amino-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, silazane derivatives, and polysilane compounds. Examples of the organic light emitting material include benzothiazole compounds, metal chelated oxinoid compounds, stilbenzene compounds, aromatic dimethyl lysine compounds, distilpyrazine derivatives benzimidazole compounds, and benzooisazole compounds. Examples of electron injection materials include nitro-substituted fluorenone derivatives, anthraquinodimethane derivatives, heterocyclic tetracarboxylic acid anhydrides such as thiopyrandioiside derivatives, fluorenylindene methane derivatives,
Examples include oxadiazole derivatives, 8-quinolinol derivatives, carbodiimides, anthrone derivatives and the like.

The materials described above are low molecular weight organic materials, but high molecular weight organic materials such as poly (N-vinylcarbazole), polyaniline and its derivatives, polythiophene and its derivatives, and poly (P-phenylene). Vinylene) and its derivative, poly (2,5-thienylenevinylene) and its derivative, etc. can also be used, and in that case, the film forming method is not particularly limited. That is, in the case of a low molecular weight organic material, it is general to use a vacuum deposition method as the film forming method, but in the case of a high molecular weight organic material, the film forming method such as spin coating or printing method is used. In addition, a coating method such as a casting method, a dipping method, a bar coating method, or a roll coating method can be used, and of course, there is no limitation in combination with a material. In addition, here, a polymer-based organic material is a compound such as poly (p-phenylene vinylene) and its derivative, and poly (2,5-thienylene vinylene) and its derivative, which are conjugated polymers and pass through a precursor. Membranes are also possible.

Here, a means for removing the organic layer 5 in the non-light emitting portion region which is simultaneously formed when the film is formed by a coating method such as spin coating will be described. As described above, since the organic layer 5 formed on the extraction electrode 4 in the non-light emitting region functions as an insulator, the cathode 7 is vapor-deposited before being electrically joined to the extraction electrode 4. The purpose is to remove the organic layer 5.

As a means for removing the organic layer 5, wet etching causes a large damage to the organic layer 5 in the light emitting region,
In addition, dry removal is effective because mechanical removal may be incomplete or organic fine particles may be generated and adhere to the light emitting portion. Reactive ion etching (RIE), which is anisotropic etching with less side etching, is particularly preferable.

Since RIE is anisotropic etching, side etching is small, but oxygen gas is used as a reaction gas for etching the organic layer 5. Generally, the organic layer is significantly deteriorated by oxygen, and even if the mask member is directly placed on the light emitting portion to protect the organic layer in the light emitting portion, a gap is formed due to the warp of the substrate, and oxygen enters through the gap, The organic layer of the light emitting part may be deteriorated. Therefore, as in the present invention, a step or a groove is provided between the light emitting portion region and the non-light emitting portion region of the substrate, and an end portion is aligned with the step or the groove and a concave mask member is covered to form an organic layer in the light emitting portion region. By surrounding it, invasion of oxygen gas can be prevented.

The removal of the organic layer 5 is carried out by the above-mentioned third step.
The method of using a sealing material for masking as in the present invention may be used. Even when this method is used, the formation of the next cathode can be carried out in the same manner as the above method of removing the organic layer by etching.

FIG. 3 is a side view and a plan view showing a conceptual view of one embodiment of the organic EL display device of the present invention. 3 is an anode, 4 is a take-out electrode, and 7 is a cathode.

After removing the organic layer on the take-out electrode 4, a cathode 7 is formed as shown in FIG.
Is a metal, alloy, which has a small work function (4 eV or less)
An electrically conductive compound or a mixture thereof is used as an electrode material. Specific examples of such an electrode material include sodium, sodium-potassium alloy, magnesium, lithium, magnesium-silver alloy, aluminum / aluminum oxide, aluminum-lithium alloy,
Examples include indium and rare earth metals. This cathode 7
Can be formed by forming a thin film of these electrode substances by a method such as vapor deposition or sputtering.

As described above, the basic structure of the organic electroluminescence display device can be formed. A protective film 9 is formed on the cathode 7 so as to prevent the cathode 7 and the organic layer 5 from contacting oxygen and moisture in the air.

[0046]

The present invention will be described below with reference to examples.
The present invention is not limited to the following examples.

(Example 1) Hereinafter, a method for manufacturing an organic electroluminescence display device (hereinafter referred to as an organic EL display device) of the present invention will be described in detail.

FIG. 1 is a side view and a plan view showing a conceptual view of one embodiment of the organic EL display device of the present invention, and FIG. 2 is a cross section showing one embodiment of the method of manufacturing the organic EL display device of the present invention. It is a figure. 1, the same reference numerals as those in FIG. 2 indicate the same members.

FIG. 1 shows a substrate 1 used in the organic EL display device of this embodiment. FIG. 1A is a side view and FIG.
(B) is a plan view. Substrate 1 made of this glass substrate
An anode 3 made of an ITO film and an extraction electrode 4 also made of an ITO film are formed on the top. 40 on board 1
A glass plate having a size of mm □ and a thickness of 1.1 mm is used, and a step of 0.5 mm is provided with an inclination of about 45 ° by etching as shown in FIG. The anode 3 and the take-out electrode 4 are formed by forming an ITO film having a thickness of 1500Å on the substrate 1 by a sputtering method and further patterning by photoetching as shown in FIG. 1B.

MEH- is used as a light emitting material for the organic layer.
PPV dissolved in xylene at a concentration of 5 wt% was used.

The film formation of the organic layer was performed as follows. First, the substrate 1 was ultrasonically cleaned with acetone and IPA for 10 minutes each, and then dried with dry nitrogen gas, and further UV ozone cleaning was performed for 10 minutes. After that, the substrate 1 was set on a spin coater, 1 cm ^{3 of the} MEH-PPV solution was dropped on the center of the substrate 1, and the organic layer 5 was formed on the substrate by rotating at a rotation speed of 1500 rpm for 1 minute. After that, the substrate 1 was taken out and placed in a vacuum oven, and dried in an atmosphere of 80 ° C. and 1.3 × 10 ² Pa for 30 minutes.

Next, the organic layer 5 formed in a region other than the light emitting region
Was removed by reactive ion etching (RIE).
First, the mask member 6 was covered on the light emitting portion region on the substrate 1 on which the organic layer 5 was formed on the entire surface by spin coating. Mask member 6
Is 20 mm □ and the outer peripheral portion of the glass plate having a thickness of 1.1 mm is 0.
What was etched into a concave shape having a depth of 0.7 mm while leaving 5 mm was used. The step on the substrate 1 is provided at a position where the inner edge of the mask member 6 is applied to the inclined surface portion. After that, the substrate 1 on which the mask member 6 is set is RI
It was set in the chamber of the E apparatus, the pressure was reduced to 3 × 10 ⁻³ Pa, oxygen gas was caused to flow for 2 minutes at a flow rate of 10 cm ³ / min, and the organic layer 5 except the portion covered with the mask was removed.

After that, the substrate 1 was set in a vapor deposition apparatus, and as the cathode 7, Al was vapor deposited to a thickness of 1500 Å as shown in FIG.

Then, after taking out the substrate from the vapor deposition apparatus,
When a direct current voltage was applied between the anode 3 and the extraction electrode 4, orange light emission of 3000 cd / m ² was obtained at 10 V, and uniform light emission was observed over the entire surface and no deterioration of pixels was observed.

(Embodiment 2) An embodiment of the form shown in FIG. 4 will be described. ITO is formed on the substrate 1 made of this glass substrate.
An anode 3 made of a film and an extraction electrode 4 also made of an ITO film are formed.

A glass plate having a size of 40 mm and a thickness of 1.1 mm is used as the substrate 1, and a V-shaped groove having a width of 1 mm and a depth of 0.5 mm is provided by etching as shown in FIG. The anode 3 and the take-out electrode 4 have a thickness of 1 on the substrate 1.
An ITO film of 500 Å is formed by the sputtering method,
Further, it is patterned by photoetching as shown in FIG.

As a light emitting material used for the organic layer, MEH-
PPV dissolved in xylene at a concentration of 5 wt% was used.

The film formation of the organic layer was performed as follows. First, the substrate 1 was ultrasonically cleaned with acetone and IPA for 10 minutes each, and then dried with dry nitrogen gas, and further UV ozone cleaning was performed for 10 minutes. After that, the substrate 1 was set on a spin coater, 1 cm ^{3 of the} MEH-PPV solution was dropped on the center of the substrate 1, and the organic layer 5 was formed on the substrate by rotating at a rotation speed of 1500 rpm for 1 minute. After that, the substrate 1 was taken out and put in a vacuum oven, and dried in an atmosphere of 80 ° C. and 1.3 × 10 ² for 30 minutes.

Next, the organic layer 5 formed in a region other than the light emitting region
Was removed by reactive ion etching (RIE).
First, the mask member 6 was covered on the light emitting region on the substrate 1 on which the organic layer 5 was formed by spin coating. As the mask member 6, a glass plate of 20 mm square and 1.1 mm in thickness was used, which was etched into a concave shape of 0.7 mm in depth, leaving 0.5 mm of the outer peripheral portion. The V-shaped groove on the substrate 1 is provided at a position where the edge of the mask member 6 sinks inside the groove. After that, the substrate 1 on which the mask member 6 is set is RI
E Set in the chamber of the apparatus, depressurize to 3 × 10 ⁻³ Pa, and let oxygen gas flow at a flow rate of 10 cm ³ / min for 2 minutes to remove the organic layer 5 except the masked portion, and then take out from the chamber. It was After that, the substrate 1 is set in a vapor deposition apparatus, and as shown in FIG.
It was vapor-deposited to a thickness of 0Å and joined to the extraction electrode 4.

Then, after taking out the substrate from the vapor deposition apparatus,
When a direct current voltage was applied between the anode 3 and the extraction electrode 4, orange light emission of 3000 cd / m ² was obtained at 10 V, and uniform light emission was observed over the entire surface and no deterioration of pixels was observed.

(Embodiment 3) An embodiment of the form shown in FIG. 5 will be described. An anode 3 made of an ITO film and an extraction electrode 4 also made of an ITO film are formed on a substrate 1 made of a glass substrate.

As the substrate 1, a glass plate having a size of 40 mm square and a thickness of 1.1 mm is used, and a step of 0.5 mm is provided with an inclination of about 45 ° by etching as shown in FIG. The anode 3 and the take-out electrode 4 are formed by forming an ITO film having a thickness of 1500Å on the substrate 1 by a sputtering method and further patterning by photoetching as shown in FIG. 1B.

As a light emitting material used for the organic layer, MEH-
PPV dissolved in xylene at a concentration of 5 wt% was used.

The film formation of the organic layer was performed as follows. First
Substrate 1 is ultrasonically cleaned with acetone and IPA for 10 minutes each.
After that, dry with dry nitrogen gas, and further UV ozone cleaning
Was carried out for 10 minutes. Next, a silicone seal is used as the sealing material 8.
Material (X-31-1293 manufactured by Shin-Etsu Chemical Co., Ltd.
-W) as shown in FIG.
Apply to a thickness of 0.5 mm, and the top surface of the sealing material
It was made to be almost flat with the light area region surface. And 20
It was cured at 55 ° C. and 55% RH for 1 hour. Then substrate 1
Is set on a spin coater and MEH is used as the light emitting material.
-PPV solution 1 cm ³Is dropped on the center of the substrate 1, and 150
The organic layer 5 is rotated on the substrate for 1 minute at a rotation speed of 0 rpm.
Was deposited. After that, take out the substrate 1 and put it in a vacuum oven.
Put 80 ℃, 1.3 × 10²Dry in Pa atmosphere for 30 minutes
Let it dry.

Then, the sealing material 8 is peeled off and the electrode 4 is taken out.
After exposing the substrate, the substrate 1 is set in the vapor deposition apparatus, and the substrate shown in FIG.
As shown in (1), Al was vapor-deposited to a thickness of 1500 Å as the cathode 7 and joined to the extraction electrode 4.

After removing the substrate from the vapor deposition apparatus, the anode 3
When a DC voltage is applied between the extraction electrode 4 and the extraction electrode 4, 10V
At this time, an orange emission of 3000 cd / m ² was obtained, and uniform emission was observed over the entire surface, and no deterioration of pixels was observed.

[0067]

According to the present invention, the organic layer on the non-light emitting region can be removed without damaging the organic layer of the light emitting unit. Therefore, the organic layer can be formed easily by spin coating, casting, dipping or the like. It is possible to manufacture an organic EL display device at low cost and with high reliability by performing such a film formation method, which is also useful for increasing the size of the organic EL display device.

[Brief description of drawings]

FIG. 1 is a side view and a plan view showing a conceptual view of an embodiment of an organic EL display device of the present invention.

FIG. 2 is a cross-sectional view showing one embodiment of a method for manufacturing an organic EL display device of the present invention.

FIG. 3 is a plan view showing a conceptual diagram of one embodiment of the organic EL display device of the present invention.

FIG. 4 is a cross-sectional view showing one embodiment of a method for manufacturing an organic EL display device of the present invention.

FIG. 5 is a cross-sectional view showing one embodiment of a method for manufacturing an organic EL display device of the present invention.

FIG. 6 is a cross-sectional view showing an example of the structure of a conventional organic EL display device.

[Explanation of symbols]

1 substrate 3 anode 4 Extraction electrode 5 organic layers 6 Mask member 7 cathode 8 Seal material 9 Protective layer 10 Anisotropic conductive film 11 FPC

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05B 33/14 H05B 33/14 AF term (reference) 3K007 AB11 AB18 BA06 CA01 CB01 DA01 DB03 EB00 FA01 5C094 AA14 AA32 AA43 AA44 AA48 BA27 CA19 DA13 DB01 DB04 EA04 EA05 EB02 FA01 FA03 FA04 FB01 FB12 FB15 FB20 GB10 JA09 5G435 AA14 AA17 BB05 CC09 HH12 HH14 KK05 KK10

Claims (18)

[Claims] 1. A light emitting section in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed on a substrate,
A method for manufacturing an organic electroluminescent display device having a non-light-emitting part in which the laminate is not formed,
As the substrate, a substrate having a step between the light emitting portion region which forms the laminated body and serves as a light emitting portion and the non-light emitting portion region which serves as the non-light emitting portion is used, and when the organic layer is formed, Forming the organic layer on the entire surface of the substrate including the light emitting part region and the non-light emitting part region, and removing a part of the organic layer formed in the non-light emitting part region; Is a mask member, an end of the mask member is aligned with a stepped portion of the substrate, and a portion of the organic layer formed in the light emitting region is covered with the mask member. Manufacturing method of electroluminescent display device. 2. The method of manufacturing an organic electroluminescence display device according to claim 1, wherein the step is a step in which the light emitting portion region is convex, and the mask member has a concave shape. . 3. The method for manufacturing an organic electroluminescence display device according to claim 2, wherein the step forms a slope with respect to the non-light emitting region. 4. The method of manufacturing an organic electroluminescence display device according to claim 3, wherein an angle formed by the non-light emitting region and the slope is greater than 90 degrees and less than 180 degrees. 5. The organic electroluminescence display according to claim 1, wherein the organic layer formed in the non-light emitting region is removed by a dry etching process. Device manufacturing method. 6. The method of manufacturing an organic electroluminescence display device according to claim 5, wherein the dry etching process is a reactive ion etching process. 7. A light emitting section having a laminated body formed of an anode, an organic layer including an organic light emitting layer, and a cathode on a substrate,
A method for manufacturing an organic electroluminescent display device having a non-light-emitting part in which the laminate is not formed,
As the substrate, a substrate having a groove between a light emitting portion region which forms the laminated body and serves as a light emitting portion and a non-light emitting portion region which serves as the non-light emitting portion is used, and when the organic layer is formed, Forming the organic layer on the entire surface of the substrate including the light emitting part region and the non-light emitting part region, and removing a part of the organic layer formed in the non-light emitting part region; Using a mask member, aligning the end of the mask member with the groove of the substrate, and covering the portion of the organic layer formed in the light emitting region with the mask member,
A method for manufacturing an organic electroluminescence display device, comprising: 8. The method of manufacturing an organic electroluminescence display device according to claim 7, wherein the groove has a V-shape or a taper shape in which an opening is wider than the deepest part. 9. The method for manufacturing an organic electroluminescent display device according to claim 7, wherein the organic layer formed in the non-light emitting region is removed by dry etching. 10. The dry etching process is a reactive ion etching process.
A method for manufacturing the organic electroluminescence display device according to 1. 11. An organic electroluminescent device having, on a substrate, a light emitting portion in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed, and a non-light emitting portion in which the laminated body is not formed. A method of manufacturing a luminescence display device, wherein the substrate has the light emitting portion region between a light emitting portion region which forms the light emitting portion by forming the laminate and a non-light emitting portion region which becomes the non-light emitting portion. Using a material having a convex step, when forming the organic layer, a sealing material is applied to the non-light emitting area so that the height is the same as the surface of the light emitting area. Manufacturing the organic electroluminescent display device, characterized in that the organic layer is formed on the entire surface of the substrate including the light emitting portion region and the sealing material, and the sealing material is removed before forming the cathode. Method. 12. An organic electroluminescent device having a light emitting portion on a substrate, in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed, and a non-light emitting portion in which the laminated body is not formed. In the luminescence display device, the substrate has a step between a light emitting portion region which forms the laminate and serves as a light emitting portion and a non-light emitting portion region which serves as the non-light emitting portion. Electroluminescence display device. 13. The organic electroluminescence display device according to claim 12, wherein the step is a step in which the light emitting portion region is convex. 14. The organic electroluminescence display device according to claim 13, wherein the step forms a slope with respect to the non-light emitting region. 15. The organic electroluminescence display device according to claim 14, wherein an angle formed by the non-light emitting region and the slope is greater than 90 degrees and less than 180 degrees. 16. An organic electroluminescent device having a light emitting portion on a substrate, in which a laminated body including an anode, an organic layer including an organic light emitting layer, and a cathode is formed, and a non-light emitting portion in which the laminated body is not formed. In the luminescence display device, the substrate has a groove between a light emitting portion region which forms the laminate and serves as a light emitting portion and a non-light emitting portion region which serves as the non-light emitting portion. Electroluminescence display device. 17. The organic electroluminescence display device according to claim 16, wherein the groove has a V-shape or a taper shape in which the opening is wider than the deepest part. 18. The organic electroluminescence display device according to claim 12, wherein the non-light emitting portion has an extraction electrode.