TW200946245A - Tape attaching apparatus, liquid material applying system, and masking tape - Google Patents

Tape attaching apparatus, liquid material applying system, and masking tape Download PDF

Info

Publication number
TW200946245A
TW200946245A TW098108393A TW98108393A TW200946245A TW 200946245 A TW200946245 A TW 200946245A TW 098108393 A TW098108393 A TW 098108393A TW 98108393 A TW98108393 A TW 98108393A TW 200946245 A TW200946245 A TW 200946245A
Authority
TW
Taiwan
Prior art keywords
tape
substrate
masking
region
coating
Prior art date
Application number
TW098108393A
Other languages
Chinese (zh)
Other versions
TWI386257B (en
Inventor
Masafumi Kawagoe
Mikio Masuichi
Tsuyoshi Matsuka
Mitsushi Yamamoto
Kazuhito Okumura
Original Assignee
Dainippon Screen Mfg
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg, Nitto Denko Corp filed Critical Dainippon Screen Mfg
Publication of TW200946245A publication Critical patent/TW200946245A/en
Application granted granted Critical
Publication of TWI386257B publication Critical patent/TWI386257B/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/31Applications of adhesives in processes or use of adhesives in the form of films or foils as a masking tape for painting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)

Abstract

A second masking tape is laminated on a first masking tape. A first lower edge of the first masking tape is located on a liquid applying-inhibited area, and the first lower edge is apart from the border between the liquid applying-inhibited area and a liquid applying-required area. An eaves portion of a second masking tape, the eaves portion protruding out to the outside of the first masking tape, covers an exposed area in the liquid applying-inhibited area. With this structure, an organic EL liquid ejected onto the substrate is prevented to adhering on the exposed area of the liquid applying-inhibited area and formation of a meniscus caused by adhesion of the organic EL liquid on a side surface of the first masking tape is prevented. As a result, it is possible to prevent occurrence of meniscus on the border between the liquid applying-inhibited area and the liquid applying-required area easily.

Description

4 200946245 六、發明說明: 【發明所屬之技術領域】 本發明係關於在基板主面上之非塗佈區域黏貼為防止流 動性材料對非塗佈區域附著之遮蔽帶的帶黏貼裝置、設有該 帶黏貼裝置且對基板塗佈流動性材料的塗佈系統、及密接於 基板主面上之非塗佈區域並防止流動性材料對非塗佈區域 附著的遮蔽帶。 【先前技術】 0 習知有進行利用有機EL(Electr0 Lmninescence,電致發光) 材料的有機EL顯示裝置之開發,例如在使用高分子有機EL 材料的主動矩陣驅動式有機EL顯示裝置之製造中,係對玻 璃基板(以下簡稱「基板」),依序施行:TFT(Thin Film Transistor ’薄膜電晶體)回路的形成、陽極的IT〇(Indium Tin4 200946245 VI. Description of the Invention: [Technical Field] The present invention relates to a tape sticking device for adhering a non-coated region on a main surface of a substrate to a masking tape for preventing a fluid material from adhering to a non-coated region. The coating system with an adhesive device, which applies a fluid material to the substrate, and a masking tape which is adhered to the non-coated region on the main surface of the substrate and prevents the fluid material from adhering to the non-coated region. [Prior Art] The development of an organic EL display device using an organic EL (ElectrOl Lmninescence) material, for example, in the manufacture of an active matrix driven organic EL display device using a polymer organic EL material, The glass substrate (hereinafter referred to as "substrate") is sequentially applied: TFT (Thin Film Transistor) circuit formation, anode IT (Indium Tin)

Oxide,氧化銦錫)電極之形成、隔間壁的形成、含電洞輸送 材料的流動性材料(以下稱「電洞輸送液」)之塗佈、利用加 ❹ 熱處理之電洞輸送層的形成、含有機EL材料的流動性材料 (以下稱「有機EL液」)之塗佈、利用加熱處理施行的有機 EL層之形成、陰極形成、及利用絕緣膜形成的密封。 在有機EL顯示裝置的製造中,將電洞輸送液或有機EL , 液塗佈於基板的裝置之一’習知有如日本專利特開 . 2004-111073號公報(文獻丨)及特開2〇〇4_89771號公報(文獻 2)所示,藉由使連續吐出流動性材料的複數喷嘴,對基板朝 098108393 4 200946245 主掃描方向與副掃描方向進行相對移動,而在基板上條紋狀 塗佈流動性材料的裝置。 在有機EL顯示裝置用之基板表面,於應塗佈電洞輸送液 或有機EL液等流動性材料的塗佈區域(即,發光區域)周 圍,設置有組人驅動電路的區域或為密封塗佈區域所必要區 -域。在有機EL顯示裝置之製造中,於電洞輸送層或有機肛 層的形成步驟,在該等塗佈區域周圍的區域(以下稱「非塗 ©佈區域」)會有附著流純材料的可祕,若在附著流動性 材料的狀態下施行後步驟’便會有發生電極特性劣化、密封 不良等之可祕。因此’必須防止流動性材料附著於基板上 之非塗佈區域。 日本專利特開2__216414號公報(文獻3)巾揭示有藉 由在有機EL元件用基板上的非塗佈區域黏貼遮蔽帶,而在 元件形成區域選擇性塗佈塗佈液的技術。文獻3所記載的有 機EL元件之製造方法中,藉由將遮蔽帶侧面中與塗佈液之 接觸角,設為大於基板與塗騎之觸肖,便可抑制遮蔽帶 側面塗佈液彎液面之發生,可防止因該f液面的突出而在後 步驟可能發生的陰極膜厚不足等之不良情況。 但是,在文獻3所記載的有機EL元件之製造方法中,因 為可使用作為遮蔽帶的材料受限制,因此遮蔽帶的成本降低 有限又因為在塗佈塗佈液前便對基板施行親水化處理(例 如溶劑洗淨、紫外線照射、電衆照射),因此有機EL元件的 098108393 200946245 el元件的生產效率提升亦有限。 製造步驟成複雜化,且有機 【發明内容】 本發明係針對在基板主面上之非塗佈區域黏貼防止流動 f生材料附㈣上述非塗佈區域的賴帶之帶黏貼裝置。帶黏 貼裝置係具備有基祕持部聽貼機構,縣㈣持部係保 持基板,該黏貼機構係使作為第i遮蔽帶下面—邊緣的第^ 下面邊緣位於較上述基板主面上之非塗钸區域與塗佈區域 間的邊界更靠上述非塗佈區域内側處,並將上述第丨遮蔽帶 與上述邊界平行地黏貼於上述非塗佈區域,使作為第2遮蔽 帶下面-邊緣的第2下面邊緣位於較位於上述第丨下面邊緣 上方的上述第1遮蔽帶上面邊緣更靠外侧處,並將上述第2 遮蔽帶與上述邊界平行地黏貼於上述第1遮蔽帶之上述上 面’藉此將從上述第β蔽帶朝上述外側突出簡時離開上 述基板之上述主面的上述第2遮蔽帶一部分作為簷部設置 在上述基板上。根據本發明,在黏貼有防止流動性材料對非 塗佈區域附著的遮蔽帶之基板中,藉由將非塗佈區域中之從 第1遮蔽帶露出的區域由離開該區域的第2遮蔽帶之簷部來 覆蓋,而可容易地防止在非塗佈區域與塗佈區域間之邊界發 生彎液面。 在本發明一較佳實施形態中’上述第2遮蔽帶之上述詹部 下面,與上述基板之上述主面大致平行。 在本發明另一較佳實施形態中’藉由將上述第1遮蔽帶黏 098108393 6 200946245 貼於上述非塗佈區域,而使上述第ι遮蔽帶之另—P下面 邊緣位於上述非塗佈區域與另—塗佈區域間較與上述邊界 平仃的3 it界更靠上述非塗佈區域内侧處,藉由將上述第 2遮蔽帶黏貼於上述第1遮蔽帶之上述上面,而使上述第2 遮蔽帶之另第2下面邊緣位於較位於上述另一第工下面邊 •緣上方的上述第1遮蔽帶之上述上面邊緣更靠外側處,將從 上述第1遮蔽帶朝上述外侧突出且同時離開上述基板之上 ❹述主面的上述第2遮蔽帶一部分作為另一篇部設置在上述 基板上。更佳係、上述第i遮蔽帶與上述第2遮蔽帶各自之中 。線大致重疊於上述非塗佈區域之中心線。更佳係上述第 2遮蔽τ之寬度係等於上述非塗佈區域之寬度。 本發明再另一較佳實施形態,上述第2遮蔽帶對上述第工 遮蔽帶的黏著力,係大於上述第1遮蔽帶對上述基板的黏著 力。藉此,便可容易地將第1遮蔽帶與第2遮蔽帶-起剝離。 ❷ |發明再另—較佳實施形態,上述黏貼機構係具備有:將 上述第1遮蔽帶黏貼於上述基板之上述主面的第i黏貼機 構’及將上述第2遮蔽帶黏貼於已黏貼在上述基板之上述主 面的上述第1遮蔽帶之上述上面之第2黏貼機構;而上述第 、1黏貼機構係具備有:捲出上述第1遮蔽帶的第1帶供給 .部;及將上述第1遮蔽帶中從上述第1帶供給部捲出的部位 朝上述非塗佈區域按押的第丨按押部;上述第2黏貼機構係 具備有.捲出上述第2遮蔽帶的第2帶供給部;及將上述第 098108393 7 200946245 2遮蔽帶中從上述第2帶供給部捲出的部位朝已黏貼在上述 非塗佈區域的上述第1遮蔽帶按押的第2按押部,·上述第! 黏貼機構與上述第2義機構係具備有移動機構,該移動機 構係在上述第i遮蔽帶由上述第i按押部按押的狀態下,藉 由使上述基板朝與上述非塗佈區域之上述邊界平行的移動 方向對上述第1按押部相對移動,而將上述第!遮蔽帶沿上 述邊界依序黏貼’同時在上述第2遮蔽帶由上述第2按押部 按押的狀態下’藉由使上述基板朝上述移動方向對上述第2 按押部相對移動,而將上述第2遮蔽帶沿上述邊界依序黏 目上。 本發明再另一較佳實施形態,上述黏貼機構係具備有:第 1帶供給部、第2帶供給部、帶貼合部、按押部、及移動機 構’該第1帶供給部係捲出上述第i遮蔽帶,該第2帶供給 部係捲出上述第2韻帶;該㈣合戰將上述第丨遮蔽帶 中從上述第1帶供給部捲出的部位㈣於上述第2遮蔽帶, 該按押部係在上述第丨遮蔽帶對向於上述基板下朝上述非 塗佈區域按押貼合有上述第i遮蔽帶與上述第⑽蔽帶㈣ 位’該移動機構係在上述第i遮蔽帶與上述第2遮蔽帶由上 述按押部按㈣狀態下,藉域上述基板朝與上述非塗佈區 域之上述邊界平行的移動方向對上述按押部相對移動,而將 上述第1遮蔽帶與上述第2遮蔽帶沿上述邊界依序黏貼。 本發明-形態的帶黏貼裝置’係具備有:第i帶黏貼敦 098108393 8 200946245 置、第2帶黏貼裝置、及搬送機構,該第j帶黏貼裝置係具 備有保持基板的第1基板保持部、使作為第i遮蔽帶下面一 邊緣的第1下面邊緣位於較上述基板主面上之非塗佈區域 與塗佈區域間的邊界更靠上述非塗佈區域内侧處,並將上述 - 第1遮蔽帶與上述邊界平行地黏貼於上述非塗佈區域的第工 - 黏貼機構,該第2帶黏貼裝置係具備有保持上述基板的第2 基板保持部、及使作為第2遮蔽帶下面一邊緣的第2下面邊 ❹緣位於較位在上述第1下面邊緣上方的上述第1遮蔽帶上面 邊緣更靠外侧處’並將上述第2遮蔽帶與上述邊界平行地黏 貼於上述第1遮蔽帶之上述上面,藉此將從上述第1遮蔽帶 朝上述外侧突出且同時離開上述基板之上述主面的上述第 2遮蔽帶一部分作為簷部設置在上述基板上的第2黏貼機 構’該搬送機構係將上述基板從上述第1帶黏貼裝置搬出且 同時搬入於上述第2帶黏貼裝置。 ❹ 纟發明φ針對在基板塗佈流動性材料㈣的钱系統、及 密接於基板主面上之非塗佈區域而防止流動性材料附著於 上述非塗佈區域的遮蔽帶。 上述目的及其他目的、特徵、態樣及優點,參照所附圖式 - 由以下本發明之詳細說明可更清楚明瞭。 • 【實施方式] 圖1所示係本發明第1實施形態設有帶黏貼裝置的塗佈系 統8之構成圖。塗佈系統8係在黏貼有遮蔽帶的平面顯示裝 098108393 9 200946245 置用玻璃基板(以下簡稱「基板」)塗佈含像素形成材料之凉 動性材料的系統。於本實施形態中,塗佈系統8係對主動矩 陣驅動式有機EL(Electro Luminescence,電致發光)顯_、_ 置用基板,塗佈含有機EL材料的流動性材料(以下稱「有機 EL液」)。有機EL液係除有機EL材料之外尚含有諸如 二曱苯、2曱苯等之有機溶劑(本實施形態則為二甲苯卜 圖2所示係黏貼有作為帶狀遮蔽構件的遮蔽帶丨之基板9 的俯視圖。圖2中,對顧塗佈线8(參_ 1}塗佈有機 EL液的區域(以下稱「塗佈區域」)91附加平行斜線。本實 施形態中,在基板9上設置4個塗佈區域91,從丨片基板9 製造4個有機EL顯示裝置用基板。4個塗佈區域91周圍的 格子狀區域92,係利用於驅動電路的組裴或後步驟中絕緣 膜岔封等,因此為不塗佈有機££液的區域,以下稱「非塗 佈區域92」。遮蔽帶1係如圖2所示,黏貼(即密接)於基板 9的(+Z)侧主面90上之非塗佈區域92 ’防止有機液附著 於非塗佈區域92。 如圖1所示,塗佈系統8係具備有:帶黏貼裝置2、塗佈 裝置3、及帶剝離裝置4,該帶黏貼裝置2係將遮蔽帶丨(參 照圖2)黏貼於基板9上之非塗佈區域92,該塗佈裝置3係 朝黏貼有遮蔽帶1的基板9從喷嘴連續吐出有機£]^液,並 使喷嘴對基板9進行相對移動,而對包含遮蔽帶1在内的區 域塗佈有機EL液,該帶剝離裝置4係從塗佈有有機液 098108393 10 200946245 的基板9將遮蔽帶1剝離。塗佈系統8在帶黏貼裝置2與塗 佈裝置3之間、及塗佈裝置3與帶剝離裝置4之間,更進一 步設置固定型搬送機器人81。於塗佈系統8中,2個搬送機 器人81為將基板9依序朝帶黏貼裝置2、塗佈裝置3及帶 剝離裝置4進行搬送的基板搬送機構。 圖3所示係將圖2所示遮蔽帶1與基板9 一部分,於圖2 中的A-A位置處朝遮蔽帶1的長邊方向(即圖2中的Y方向) ❹ 垂直切剖的剖視圖。如圖3所示,遮蔽帶1係具備有:直接 黏貼於基板9的第1遮蔽帶11、及黏貼於第1遮蔽帶11上 面1111(即圖3中(+Z)側的面)的第2遮蔽帶12。作為第2 遮蔽帶12可使用日東電工股份有限公司製No.31B等。第1 遮蔽帶11係具備有:帶狀基材Π1、及形成在基材111下 面1112(即(-Z)侧的面)之黏著劑層112,第2遮蔽帶12亦同 樣具備有:帶狀基材121、及形成在基材121下面1212(即 ® (_z)侧的面)之黏著劑層122。於遮蔽帶1中,第1遮蔽帶u 與第2遮蔽帶12係沿長邊方向全長具有與圖3所示剖面相 同之形狀。 基材111、121係由塑膠膜形成。被使用作為基材丨。、 -121的轉膜’為如:聚乙烯、聚丙烯等聚烯烴系膜;聚對 •苯二甲酸乙二醋、聚對苯二甲酸丁二自旨等聚i系膜;尼龍等 聚酿胺系膜;及三醋酸纖維素膜、聚酿亞胺膜,且該等塑膠 膜亦可為無延伸膜及延伸(單軸延伸或雙轴延伸)膜中任一 098108393 200946245 者。本實施形態中’基材111係使用三菱化學聚酯膜股份有 限公司製作為聚酯膜的T100N38,又基材121亦為聚醋膜。 亦可對基材111上面1111(即第1遮蔽帶U的上面)施行 脫離處理’但從增加第2遮蔽帶12對第1遮蔽帶11的黏著 力之觀點,最好施行諸如易黏著處理、防止帶電處理、電暈 處理、電漿處理、光觸媒處理等表面處理。本實施形態中, 對基材111的上面1111施行防止帶電處理。此外,對基材 121的上面1211(即第2遮蔽帶12的上面)亦可同樣地施行 脫離處理,但從在後述遮蔽帶i剝離時增加剝離帶45(參照 圖13A)對第2遮蔽帶12的黏著力之觀點,最好施行諸如易 黏著處理、防止帶電處理、電暈處理、電漿處理、光觸媒處 理等之表面處理。 在基材111、121的下面1112、1212,為分別提升基材lu、 121與黏著劑層112、122的黏著性,最好施行諸如易黏著 處理、防止帶電處理、電暈處理、電漿處理、光觸媒處理等 之表面處理,本實施形態中施行電暈處理尤其較佳。 黏者劑層112、122係利用例如·聚g旨系黏著劑、丙稀酸 系黏著劑、聚矽氧系黏著劑、天然橡膠系黏著劑或合成橡膠 系黏著劑形成,本實施形態中係利用丙稀酸系黏著劑而形 成。在製造形成黏著劑層112的丙烯酸系黏著劑時,於設有 擾摔機、溫度計及反應副生成物分離管的四分離式燒瓶中, 裝填入丙烯酸-2-乙基己酯(2-EHA)100重量百分比、及丙稀 098108393 12 200946245 酸(AA)4重里百分比,利用通常的溶液(醋酸乙酯)聚合而生 成重量平均分子量600000的丙烯酸系聚合物。然後,對於 該丙烯酸系聚合物100重量百分比,添加環氧系交聯劑(三 菱瓦斯化學工業股份有限公司製TETRAD c)3.5重量百分 ' 比、及異氰酸酯系交聯劑(NIPPON POLYURETHANE工業 - 股份有限公司製CORONATE L)1重量百分比,而生成作為 黏著劑層112材料的丙烯酸系黏著劑。 © 在帶黏貼裝置2巾,如圖2所示,遮蔽帶!(即第2遮蔽 帶12與圖3所示之第i遮蔽帶u),在與基板9的主面9〇 上之非塗佈區域92和位於非塗佈區域92的χ方向兩侧之 塗佈區域91 _ 2個邊界92G平行地朝向γ方向的狀態 下’黏貼於非塗佈區域92上。 如圖3所示’帛1遮蔽帶U的下面1122(即第1遮蔽帶 Π雜著劑層II2靠⑺側之面)中位於靠(+χ)側一邊緣的 ❹第1下面邊緣1123 ’係位於較非塗佈區域92與位在該非塗 佈區域92罪(+Χ)侧塗佈區域91間之邊界92〇(圖3中,基於 圖不方便而依圓點表示),靠非塗佈區域92内侧的⑼侧。 此外,位於第1遮蔽帶11下面1122靠(·Χ)側之另一第!下 -面邊緣1123,則位於較非塗佈區域%與位在該非塗佈區域 • 92靠(-X)侧的另一塗佈區域91間之邊界920(即非塗佈區域 92的另-邊界)’罪非塗佈區域%内侧的(+χ)侧。 在遮蔽帶1中,第2遮蔽帶12的下面1222(即第2遮蔽 098108393 13 200946245 帶12的黏著劑層122靠(-Z)侧之面)中位於靠(+χ)侧的一邊 緣之第2下面邊緣1223,係位於較位在靠(+χ)側第1下面 邊緣1123上方的第1遮蔽帶11上面1111(即第1遮蔽帶11 的基材111靠(+Ζ)侧之面)靠(+Χ)侧邊緣的第1上面邊緣 1113,更靠外侧的(+Χ)側。藉此,從第i遮蔽帶u朝(4〇〇 侧突出,同時離開基板9之主面90的第2遮蔽帶12 —部分, 作為簷部120而設置於基板9上。 再者’第2遮蔽帶12的下面1222中位於(_χ)側的另一第 2下面邊緣1223,係位於較位在(_Χ)側第i下面邊緣1123 上方的第1遮蔽帶11之(_χ)侧第i上面邊緣1113,更靠外 侧的(-X)侧。藉此,從第1遮蔽帶n朝(_又)側突出同時離開 基板9主面90的第2遮蔽帶12—部分,作為另一簷部120 而設置於基板9上。第2遮蔽帶12的(+又)侧與(_χ)側簷部 120下面1202 ’係平行於基板9的主面9〇。 遮蔽帶1中,第1遮蔽帶丄!兩侧的侧面11〇3、及第2遮 蔽帶12兩側的側面1203,係略垂直於基板9的主面9〇。此 外’第2遮蔽帶12的X方向寬度係等於非塗佈區域92的又 方向寬度’第2遮蔽帶12的又方向兩侧第2下面邊緣1223, 俯視下係重疊於非塗佈區域92兩側之邊界·。亦即,通 過第2遮蔽帶12之χ方向中心的線(以下稱「中心線」), 俯視下係重疊於非塗佈區域92的中心線。又第ι遮蔽帶 11之中心線俯視下亦重叠於非塗佈區域92的中心線。 098108393 200946245 在本實施形態中,第i遮蔽帶u之基材lu、與黏著劑 層112之厚度,分別為約38μηι與約15叫,第2遮蔽帶u 之基材m、及黏著劑層122之厚度,則分別為約5一與 約2_。此外,第i遮蔽帶u與第2遮蔽帶12的寬度分 別為4mm與6mm ’ f 2遮蔽帶12兩側的筹部12〇寬^分 .別為hnm。圖3中,為求圖示方便,將第】遮蔽帶^第 2遮蔽帶12的厚度對於寬度,描繪成較實際還厚(圖11A中 〇 亦同)。 遮蔽帶1中,第1遮蔽帶u與第2遮蔽帶12的基材⑴、 121厚度’較佳分別為1〇叫以上3〇〇_以下(更佳為2一 以上1〇〇μιη、最佳為25μιη以上5〇μιη以下),黏著劑層Η?、 ⑵的厚度較佳分別為1μιη以上释m以下(更佳$哗以上 6〇μιη、最佳l(^m以上4〇μιη以下)。 藉此’可在維持第1遮蔽帶Π與第2遮蔽帶12的柔軟性 #下,確保強度而容易處理。如上述,遮蔽帶1的剖面係沿長 邊方向王長成相同形狀,因此圖3所示遮蔽帶^形狀的相關 上述說明,係就與遮蔽帶Π即第1遮蔽帶η與第2遮蔽帶 12)長邊方向垂直的任意剖面均相同。 圖4至圖6所示分別係帶黏貼裝置2構成的俯視圖、前視 圖及左側視圖。如圖4至圖6所示,帶黏貼裝置2係具備有·· 基板保持# 21、基板移動機構22、第1帶黏貼頭23、第2 帶黏貼頭23a及頭移動機構24,該基板保持部21係保持基 098108393 15 200946245 板9,該基板軸機構22係使餘9與基板保持部21 一起 以平行於基板9之主面9q(參照圖2)的既定移動方向(即圖 4至圖6中的Y方向, 乂下稱知描方向」)移動,該第i 帶黏貼頭23係在塗佈有機EL液前的基板9主面9〇上之非 塗佈區域92(參照圖2),黏貼第1遮蔽帶11(參照圖3),該 第2帶黏貼頭23a係在已黏貝占在非塗佈區域92的第i遮蔽 帶11上面im ’黏貼第2遮蔽帶12(參照圖3),該頭移動 機構24係使第1帶黏貼頭23與第2帶黏貼頭23a,朝與掃 描方向垂直之方向_ 4至圖6中的χ方向)個別進行移 動。 在帶黏貼裝置2中,利用基板移動機構22,使基板保持 部21與基板9 -起沿滑執221麻平方向移動。又,利用 頭移動機構24,使第1帶黏貼頭23與第2帶黏貼頭23a在 基板9移動路徑上方沿滑軌241朝水平方向移動。 圖7A所不係第1帶勘貼頭23構成的放大左側視圖,圖 7B所不係第2帶黏貼頭23a構成的放大左側視圖。圖7A 與圖7B分別描繪出在第i帶黏貼頭23與第2帶黏貼頭23& 的忒體231中所收容之内部構成。在第丨帶黏貼頭23中, 於基底帶271(所謂「分離片」)一面,利用保持有第1遮蔽 帶11的2層構成帶27黏貼第1遮蔽帶11,在第2帶黏貼 頭23a中,於基底帶271 —面,利用保持有第2遮蔽帶12 的2層構成帶27a黏貼第2遮蔽帶12。帶27中,第1遮蔽 098108393 16 200946245 帶11之黏著劑層m下面1122(參照圖3)黏著於基底帶 271,而帶27a中’第2遮蔽帶12之黏著劑層122下面1222(參 照圖3)黏著於基底帶271。 基底帶271厚度較佳為1〇μηι以上3〇〇μιη以下更佳2〇μιη 以上ΙΟΟμηι、最佳38μιη以上75μηι以下。在本實施形態中, 基底帶271厚度為約50μιη。 基底帶271係與第1遮蔽帶U的基材m、及第2遮蔽 ❹帶12的基材121同樣地’由諸如:聚乙烯、聚丙婦等聚稀 烴系膜、或聚對苯二甲酸乙二酯、聚對苯二曱酸丁二酯等聚 酯系膜、或尼龍等聚醯胺系膜、或三醋酸纖維素膜、聚醯亞 胺膜等塑膠膜形成,本實施形態中係利用一面經電暈處理過 的聚酯膜(TORAY股份有限公司製s_1〇5)。 就基底帶271中保持第1遮蔽帶u或第2遮蔽帶12的 面,為了提高從第1遮蔽帶11或第2遮蔽帶12的剝離性’ ®視需要亦可施行諸如聚錢處理、丙雜/㈣氧處理、長 鏈烷基處理、氟處理等脫離處理’本實施形態中,對上述聚 酯膜中經電暈處理過的面塗佈聚矽氧塗液後,於14〇t:下乾 燥1分鐘,藉此施行聚矽氧處理。聚矽氧層經乾燥後的重耋 ' 為約 0.07g/cm2。 ' 上述聚魏魏鋪由在聚二?基魏烧(信越化學工業 股份有限公司製KS-36〇1)100重量百分比,添加乙快系反爲 控制劑(信越化學工業股份有限公司製CAT_PLR_1)2重量有 098108393 17 200946245 分比、乙炔系反應控制劑(信越化學工業股份有限公司製 CAT-PLR-2)1重量百分比、及溶劑(丸善股份有限公司製正 己貌、與東亞合成股份有限公司製正庚烷)而經2〇分鐘攪 拌’更添加觸媒(信越化學工業股份有限公司製 CAT-PL-50T)5重量百分比而經1〇分鐘攪拌以生成。 帶27係於在第1遮蔽帶u的基材ηι上塗佈丙烯酸系黏 著劑並於130°C下乾燥1分鐘而形成黏著劑層112後,於黏 著劑層112上黏貼基底帶271而形成。 如圖7A所示’第丨帶黏貼頭23係具備有:第1供給捲 盤232、第1按押部233、第1回收捲盤234、及殼體23卜 該第1供給捲盤232為捲繞未使用帶27,同時將帶27(即第 1遮蔽帶11及基底帶271)捲出的第1帶供給部,該第1按 押部233係從第1供給捲盤232所捲出的帶27分離第1遮 蔽帶U,同時將該分離部位(即第1遮蔽帶11中從第1供給 捲盤232捲出的部位)朝基板9的非塗佈區域92(參照圖2) 按押,該第1回收捲盤234為將經分離第1遮蔽帶u後的 帶27(即基底帶271)捲取並回收的第1帶回收部,該殼體231 係收容該等構成。 如圖7B所示,第2帶黏貼頭23a之構成係大致與圖7A 所示第1帶黏貼頭23相同,其具備有:第2供給捲盤232a、 第2按押部233a、第2回收捲盤234a、及殼體23卜該第2 供給捲盤232a為將在基底帶271 —主面保持有第2遮蔽帶 098108393 18 200946245 12的帶27a捲出之第2帶供給部,該第2按押部23%係將 第2遮蔽帶12中從第2供給捲盤232a捲出的部仅, 在非塗佈區域92之第i遮蔽帶U按押’該第2回收捲盤 234a為將基絲271捲取並回收的第2帶回收部,該殼體 231係收容該等構成。在帶黏貼裝置2中,第2帶黏貼頭u 與第1帶黏貼頭23為相對向配置。 & ❹Oxide, indium tin oxide) formation of an electrode, formation of a partition wall, application of a fluid material containing a hole transporting material (hereinafter referred to as "hole transport liquid"), formation of a hole transport layer by heat treatment by twisting The application of a fluid material (hereinafter referred to as "organic EL liquid") containing an organic EL material, formation of an organic EL layer by heat treatment, formation of a cathode, and sealing by an insulating film. In the manufacture of an organic EL display device, one of the devices for applying a hole transporting liquid or an organic EL or a liquid to a substrate is known as a Japanese Patent Laid-Open Publication No. 2004-111073 (Document No.) and a special opening. In the case of a plurality of nozzles for continuously discharging a fluid material, the substrate is moved relative to the sub-scanning direction in the main scanning direction and the sub-scanning direction, and the fluidity is applied to the substrate in a stripe shape as shown in the publication No. 4_89771 (Document 2). Material device. On the surface of the substrate for the organic EL display device, a region where the group driver circuit is provided or a seal coat is applied around the application region (ie, the light-emitting region) of the fluid material such as the hole transport liquid or the organic EL liquid. The area necessary for the cloth area - the domain. In the production of the organic EL display device, in the step of forming the hole transport layer or the organic anal layer, a region surrounding the coated regions (hereinafter referred to as "non-coated cloth region") may have a flowable pure material. It is a secret that if the step is performed in the state in which the fluid material is attached, the electrode characteristics may deteriorate, and the sealing may be poor. Therefore, it is necessary to prevent the fluid material from adhering to the non-coated region on the substrate. Japanese Laid-Open Patent Publication No. Hei. No. 2-216414 (Document 3) discloses a technique of selectively applying a coating liquid in a component forming region by adhering a masking tape to an uncoated region on a substrate for an organic EL device. In the method for producing an organic EL device according to Document 3, by making the contact angle with the coating liquid on the side surface of the masking tape larger than the contact angle between the substrate and the coating, it is possible to suppress the coating liquid on the side surface of the masking tape. When the surface is formed, it is possible to prevent the shortage of the cathode film thickness which may occur in the subsequent step due to the protrusion of the f liquid surface. However, in the method for producing an organic EL device described in Document 3, since the material that can be used as the masking tape is limited, the cost of the masking tape is limited to be limited because the substrate is hydrophilized before the coating liquid is applied. (For example, solvent cleaning, ultraviolet irradiation, and electricity irradiation), the production efficiency of the 098108393 200946245 el component of the organic EL element is also limited. The manufacturing steps are complicated and organic. [Invention] The present invention is directed to a tape sticking device for adhering a non-coating region on a main surface of a substrate to prevent the flow of the material from being attached to the uncoated region. The tape sticking device is provided with a base holding portion listening mechanism, and the county (four) holding portion holds the substrate, and the bonding mechanism is such that the lower edge of the lower edge of the i-th shielding tape is located on the main surface of the substrate. a boundary between the 钸 region and the coating region is further located at an inner side of the non-coated region, and the ninth masking tape is adhered to the uncoated region in parallel with the boundary, so as to be the lower edge of the second masking tape 2, the lower edge is located further outward than the upper edge of the first masking strip above the lower edge of the second corner, and the second masking strip is adhered to the upper surface of the first masking strip in parallel with the boundary A part of the second masking tape that is separated from the main surface of the substrate from the β-thickness tape toward the outside is provided as a crotch portion on the substrate. According to the invention, in the substrate to which the masking tape for preventing the fluid material from adhering to the non-coated region is adhered, the second masking tape leaving the region is removed from the region of the uncoated region exposed from the first masking strip. The crotch portion is covered, and the meniscus at the boundary between the non-coated region and the coated region can be easily prevented. In a preferred embodiment of the present invention, the side of the second masking tape is substantially parallel to the main surface of the substrate. In another preferred embodiment of the present invention, 'the first masking tape is 098108393 6 200946245 attached to the non-coated region, and the lower edge of the first ι mask is located in the uncoated region. And the second masking strip is adhered to the upper side of the first masking strip to the inner side of the non-coating region, and the third masking region of the other coating region is flush with the boundary of the first masking strip (2) the second lower edge of the masking tape is located further outward than the upper edge of the first masking tape located above the edge of the other lower working edge, and protrudes from the first masking tape toward the outer side and simultaneously A part of the second masking tape that is separated from the substrate and has a main surface is provided on the substrate as another portion. More preferably, each of the i-th shielding tape and the second shielding tape is included. The line substantially overlaps the centerline of the non-coated area described above. More preferably, the width of the second masking τ is equal to the width of the non-coated region. According to still another preferred embodiment of the present invention, the adhesion of the second masking tape to the first masking tape is greater than the adhesion of the first masking tape to the substrate. Thereby, the first masking tape and the second masking tape can be easily peeled off. In another preferred embodiment, the adhesive mechanism includes: an ith adhesive mechanism that adheres the first mask to the main surface of the substrate; and adheres the second mask to the second mask a second adhesive mechanism of the upper surface of the first masking tape on the main surface of the substrate; and the first adhesive bonding mechanism includes a first tape supply portion that winds up the first masking tape; a first gripping portion of the first masking tape that is taken up from the first tape supply unit toward the non-coating region; and the second bonding mechanism is provided with the second tape that is wound out of the second masking tape a tape supply unit; and a second pressing portion that is pressed from the second tape supply portion of the 098108393 7 200946245 2 masking tape to the first masking tape that has been adhered to the non-coating region, ·The above! The pasting mechanism and the second meaning mechanism are provided with a moving mechanism for causing the substrate to face the uncoated region in a state where the i-th shielding tape is pressed by the ith urging portion The moving direction in which the above-mentioned boundaries are parallel is relatively moved to the first pressing portion, and the above-mentioned first! The masking tape is sequentially adhered along the boundary, and while the second masking tape is pressed by the second pressing portion, the substrate is moved relative to the second pressing portion in the moving direction. The second masking tape is sequentially adhered to the boundary along the boundary. According to still another preferred embodiment of the present invention, the adhesion mechanism includes: a first tape supply unit, a second tape supply unit, a tape bonding unit, a gripping unit, and a moving mechanism 'the first tape supply unit roll The second i-ray mask is provided, and the second tape supply unit winds out the second rhythm band; and the (four) warfare is a portion (four) of the second masking tape that is unwound from the first tape supply unit to the second mask The urging portion is configured such that the ith shielding tape and the (10) sash (four) position are attached to the non-coated region under the substrate, and the moving mechanism is The i-th shielding tape and the second shielding tape are moved in the (4) state by the pressing portion, and the substrate is relatively moved toward the pressing portion in a moving direction parallel to the boundary of the non-coated region. 1 The masking tape and the second masking tape are sequentially adhered along the boundary. The tape-attaching device of the present invention is provided with an ith tape 098108393 8 200946245, a second tape bonding device, and a conveying mechanism, wherein the j-th tape bonding device includes a first substrate holding portion that holds the substrate And the first lower edge which is an edge of the lower surface of the i-th shielding tape is located on the inner side of the non-coating region from the boundary between the non-coating region and the coating region on the main surface of the substrate, and the above-mentioned first a mask-bonding mechanism that is adhered to the uncoated region in parallel with the boundary, the second tape bonding device includes a second substrate holding portion that holds the substrate, and an edge that serves as a lower edge of the second masking tape The second lower edge is located further outward than the upper edge of the first mask above the first lower edge, and the second mask is adhered to the first mask in parallel with the boundary In the above, the second masking tape that protrudes from the first masking strip toward the outer side and simultaneously away from the main surface of the substrate is used as a second adhesive layer provided on the substrate. Structure 'means the transfer line to the substrate 1 is unloaded from the first adhesive tape to the apparatus while carrying the second tape pasting means. The invention relates to a money system for applying a fluid material (4) to a substrate, and a masking tape for preventing a fluid material from adhering to the non-coating region by adhering to a non-coating region on the main surface of the substrate. The above and other objects, features, aspects and advantages of the present invention will become more apparent from the Detailed Description. [Embodiment] Fig. 1 is a view showing a configuration of a coating system 8 with an adhesive device according to a first embodiment of the present invention. The coating system 8 is a system in which a glass substrate (hereinafter referred to as "substrate") is used to apply a cooling material containing a pixel forming material to a flat display device 098108393 9 200946245 to which a mask tape is attached. In the present embodiment, the coating system 8 is applied to an active matrix-driven organic EL (Electro Luminescence) substrate, and a fluid material containing an EL material is applied (hereinafter referred to as "organic EL". liquid"). The organic EL liquid contains an organic solvent such as diphenylbenzene or 2-phenylene in addition to the organic EL material (in the present embodiment, xylene is shown in Fig. 2 as a masking tape as a belt-shaped shielding member). A plan view of the substrate 9. In Fig. 2, a region (hereinafter referred to as "coating region") 91 to which the organic EL liquid is applied to the coating line 8 (refer to 1) is added with parallel oblique lines. In the present embodiment, on the substrate 9. Four coating regions 91 are provided, and four substrates for an organic EL display device are produced from the ruthenium substrate 9. The lattice-like regions 92 around the four application regions 91 are used for the group of the driving circuit or the insulating film in the subsequent step. Since it is a seal or the like, it is an area where the organic liquid is not applied, hereinafter referred to as "non-coated area 92." The mask 1 is attached (+Z) to the (+Z) side of the substrate 9 as shown in FIG. The non-coating area 92' on the main surface 90 prevents the organic liquid from adhering to the non-coating area 92. As shown in Fig. 1, the coating system 8 is provided with a tape attaching device 2, a coating device 3, and a tape stripping device. 4. The tape application device 2 adheres the mask tape (refer to FIG. 2) to the non-coating region 92 on the substrate 9, and the coating The apparatus 3 continuously ejects the organic liquid from the nozzle toward the substrate 9 to which the masking tape 1 is adhered, and relatively moves the nozzle to the substrate 9, and applies an organic EL liquid to the region including the masking tape 1. The peeling device 4 peels the masking tape 1 from the substrate 9 coated with the organic liquid 098108393 10 200946245. The coating system 8 is between the tape applying device 2 and the coating device 3, and the coating device 3 and the tape peeling device 4 Further, the fixed transfer robot 81 is further provided. In the coating system 8, the two transfer robots 81 are substrate transfer mechanisms for sequentially transporting the substrate 9 toward the tape attaching device 2, the coating device 3, and the tape peeling device 4. Fig. 3 is a cross-sectional view showing a portion of the masking tape 1 and the substrate 9 shown in Fig. 2 taken at a direction AA in Fig. 2 toward the longitudinal direction of the masking tape 1 (i.e., the Y direction in Fig. 2). As shown in FIG. 3, the masking tape 1 is provided with a first masking tape 11 that is directly adhered to the substrate 9, and a first masking tape 11 that is adhered to the upper surface 1111 of the first masking tape 11 (that is, a surface on the (+Z) side in FIG. 3). The second masking tape 12. As the second masking tape 12, No. 31B manufactured by Nitto Denko Corporation can be used. The first masking tape 11 is provided with a tape substrate Π1 and an adhesive layer 112 formed on the lower surface 1112 of the substrate 111 (i.e., the surface on the (-Z) side), and the second masking tape 12 is also provided. a strip-shaped substrate 121 and an adhesive layer 122 formed on the lower surface 1212 of the substrate 121 (ie, the surface on the (_z) side). In the masking tape 1, the first masking tape u and the second masking tape 12 are along the edge The entire length in the longitudinal direction has the same shape as the cross section shown in Fig. 3. The base materials 111 and 121 are formed of a plastic film, and are used as a substrate 丨. The transfer film of -121 is, for example, polyethylene, polypropylene, or the like. Olefin film; poly-p-phthalate, polybutylene terephthalate, etc.; i-type film such as nylon; and cellulose triacetate film, polyaniline film, And the plastic film may also be any one of 098108393 200946245 without stretching film and extending (uniaxially extending or biaxially extending) film. In the present embodiment, the base material 111 is T100N38 which is produced as a polyester film by Mitsubishi Chemical Polyester Film Co., Ltd., and the base material 121 is also a polyester film. It is also possible to perform the detachment treatment on the upper surface 1111 of the base material 111 (that is, the upper surface of the first shielding tape U). However, from the viewpoint of increasing the adhesion of the second shielding tape 12 to the first shielding tape 11, it is preferable to perform, for example, easy adhesion treatment. Prevent surface treatment such as electrification treatment, corona treatment, plasma treatment, photocatalytic treatment. In the present embodiment, the upper surface 1111 of the substrate 111 is subjected to a charge-preventing treatment. Further, the upper surface 1211 of the base material 121 (that is, the upper surface of the second shielding tape 12) may be similarly subjected to the detachment treatment. However, when the masking tape i is peeled off, the peeling tape 45 (see FIG. 13A) is added to the second masking tape. From the viewpoint of adhesion of 12, it is preferable to perform surface treatment such as easy adhesion treatment, prevention of electrification treatment, corona treatment, plasma treatment, photocatalytic treatment, and the like. In the lower surfaces 1112, 1212 of the substrates 111, 121, in order to improve the adhesion of the substrates lu, 121 and the adhesive layers 112, 122, respectively, it is preferable to perform such as adhesion treatment, electrification treatment, corona treatment, plasma treatment. In the surface treatment such as photocatalytic treatment, it is particularly preferable to perform corona treatment in the present embodiment. The adhesive layers 112 and 122 are formed, for example, by a polyg-type adhesive, an acrylic adhesive, a polyoxynoxy adhesive, a natural rubber adhesive, or a synthetic rubber adhesive. It is formed using an acrylic adhesive. In the production of the acrylic adhesive forming the adhesive layer 112, a 4-separate flask equipped with a spoiler, a thermometer and a reaction by-product separation tube was charged with 2-ethylhexyl acrylate (2- EHA) 100% by weight, and propylene 098108393 12 200946245 Acid (AA) 4% by weight, polymerized by a usual solution (ethyl acetate) to produce an acrylic polymer having a weight average molecular weight of 600,000. Then, an epoxy-based crosslinking agent (TETRAD c manufactured by Mitsubishi Gas Chemical Co., Ltd.) was added in an amount of 3.5 wt%, and an isocyanate-based crosslinking agent (NIPPON POLYURETHANE Industrial Co., Ltd.) was added to 100% by weight of the acrylic polymer. Co., Ltd. made CORONATE L) 1% by weight to form an acrylic adhesive as a material for the adhesive layer 112. © 2 towels with adhesive device, as shown in Figure 2, masking tape! (i.e., the second masking strip 12 and the i-th masking strip u shown in Fig. 3) are coated on both sides of the non-coated region 92 on the main surface 9 of the substrate 9 and on the sides of the non-coated region 92. The cloth region 91 _ 2 borders 92G are adhered to the non-coating region 92 in a state of being oriented in the γ direction in parallel. As shown in Fig. 3, the lower surface 1123 of the lower surface 1122 of the 帛1 masking tape U (i.e., the surface of the first masking tape doping layer II2 on the (7) side) is located at the edge of the (+χ) side. It is located at the boundary 92 between the non-coated area 92 and the coated area 91 of the non-coated area 92 (in FIG. 3, which is represented by dots according to the inconvenience), and is not coated. The (9) side of the inner side of the cloth region 92. In addition, the other side located on the (·Χ) side of the lower surface 1122 of the first masking belt 11! The lower-face edge 1123 is located at a boundary 920 between the non-coated area % and the other coated area 91 located on the (-X) side of the uncoated area. Boundary) '(χχ) side of the inside of the non-coated area. In the masking tape 1, the lower surface 1222 of the second masking tape 12 (i.e., the surface of the second mask 098108393 13 200946245 adhesive layer 122 of the belt 12 on the (-Z) side) is located at an edge on the (+χ) side. The second lower edge 1223 is located on the upper surface 1111 of the first masking strip 11 that is positioned above the first lower edge 1123 on the (+χ) side (that is, the surface of the base material 111 of the first masking strip 11 on the (+Ζ) side. The first upper edge 1113 of the (+Χ) side edge is further on the outer (+Χ) side. As a result, the i-th shield band u is protruded toward the fourth side, and the second mask band 12 that is separated from the main surface 90 of the substrate 9 is provided on the substrate 9 as the crotch portion 120. The other second lower edge 1223 of the lower surface 1222 of the masking strip 12 on the (_χ) side is located on the (i) side of the first masking strip 11 located above the (i)th lower edge 1123. The edge 1113 is further on the outer side (-X) side. Thereby, the second masking strip 12 portion which protrudes from the first masking tape n toward the (_) side while leaving the main surface 90 of the substrate 9 serves as the other portion 120 is disposed on the substrate 9. The (+) side of the second masking strip 12 and the lower surface 1202' of the (_χ) side jaw portion 120 are parallel to the main surface 9〇 of the substrate 9. In the masking strip 1, the first masking strip The sides 11〇3 on both sides and the side faces 1203 on both sides of the second masking strip 12 are slightly perpendicular to the main surface 9〇 of the substrate 9. Further, the width of the second masking strip 12 in the X direction is equal to that of the non-coating layer. The direction width of the region 92, the second lower edge 1223 on both sides of the second masking strip 12 in the other direction, overlaps the boundary between the two sides of the non-coating region 92 in plan view. That is, after passing through the second masking strip 12 The line to the center (hereinafter referred to as "center line") is superposed on the center line of the non-coating area 92 in plan view. The center line of the ι mask 11 also overlaps the center line of the non-coated area 92 in plan view. 098108393 200946245 In the present embodiment, the thickness of the base material lu and the adhesive layer 112 of the i-th shielding tape u are about 38 μm and about 15, respectively, and the substrate m of the second masking tape u and the adhesive layer 122. The thickness of the i-shielding band u and the second masking band 12 are respectively 4 mm and 6 mm' f 2 respectively. In other words, in FIG. 3, for the convenience of illustration, the thickness of the second masking strip 12 of the first masking strip is depicted as being thicker than the actual thickness (the same is true in FIG. 11A). The thicknesses of the base material (1) and the 121 of the first masking tape u and the second masking tape 12 are preferably 1 以上 or more and 3 〇〇 _ or less (more preferably 2 or more and 1 〇〇 μιη, and most preferably 25 μm or more). 〇μιη below), the thickness of the adhesive layer 、?, (2) is preferably 1 μιηη or more and below m (better than $哗6〇μιη, optimal l(^m) In the above, the thickness of the first masking tape Π and the second masking tape 12 can be maintained, and the strength can be easily handled. As described above, the profile of the masking tape 1 is elongated along the long side. Since the shape is the same, the above description of the shape of the masking tape shown in Fig. 3 is the same as the arbitrary cross section perpendicular to the longitudinal direction of the masking tape Π, that is, the first masking tape η and the second masking tape 12). 6 is a plan view, a front view, and a left side view, respectively, of the tape attaching device 2. As shown in FIGS. 4 to 6, the tape sticking device 2 includes a substrate holding device 21, a substrate moving mechanism 22, a first tape bonding head 23, a second tape bonding head 23a, and a head moving mechanism 24, which are held by the substrate. The portion 21 is a holding base 098108393 15 200946245, and the substrate shaft mechanism 22 is such that the remainder 9 and the substrate holding portion 21 are parallel to the predetermined moving direction of the main surface 9q of the substrate 9 (see FIG. 2) (ie, FIG. 4 to FIG. In the Y direction of 6 and the movement direction of the armpit, the i-th adhesive head 23 is a non-coating region 92 on the main surface 9 of the substrate 9 before the application of the organic EL liquid (see FIG. 2). Adhering to the first masking tape 11 (see FIG. 3), the second tape bonding head 23a is attached to the i-th shielding tape 11 of the non-coating region 92, and the second masking tape 12 is attached. 3) The head moving mechanism 24 individually moves the first tape bonding head 23 and the second tape bonding head 23a in the direction _ 4 perpendicular to the scanning direction to the χ direction in FIG. 6 . In the tape attaching device 2, the substrate holding portion 21 and the substrate 9 are moved in the horizontal direction of the slide 221 by the substrate moving mechanism 22. Further, the head moving mechanism 24 moves the first tape attaching head 23 and the second tape attaching head 23a in the horizontal direction along the slide rail 241 above the moving path of the substrate 9. Fig. 7A is an enlarged left side view of the first tape applicator head 23, and Fig. 7B is an enlarged left side view of the second tape applicator head 23a. 7A and 7B respectively depict the internal configuration of the ith tape attaching head 23 and the second tape attaching head 23& In the second tape bonding head 23, the first masking tape 11 is adhered to the second tape bonding head 23a by the two-layer component tape 27 holding the first masking tape 11 on the base tape 271 (so-called "separating sheet"). The second masking tape 12 is adhered to the surface of the base tape 271 by the two-layered component tape 27a holding the second masking tape 12. In the belt 27, the first mask 098108393 16 200946245 the adhesive layer m of the belt 11 has a lower surface 1122 (see FIG. 3) adhered to the base tape 271, and in the belt 27a, the lower surface of the adhesive layer 122 of the second masking tape 12 is 1222 (refer to the figure). 3) Adhered to the base tape 271. The thickness of the base tape 271 is preferably 1 〇μηι or more and 3 〇〇μιη or less, more preferably 2 〇μιη or more ΙΟΟμηι, and preferably 38 μιη or more and 75 μηι or less. In the present embodiment, the base tape 271 has a thickness of about 50 μm. The base tape 271 is similar to the base material m of the first shielding tape U and the base material 121 of the second shielding tape 12, such as a polyethylene-based film such as polyethylene or polypropylene, or polyterephthalic acid. A polyester film such as ethylene glycol or polybutylene terephthalate or a polyamide film such as nylon or a plastic film such as a cellulose triacetate film or a polyimide film, in the present embodiment A corona-treated polyester film (s_1〇5, manufactured by TORAY Co., Ltd.) was used. In order to increase the peeling property of the first masking strip 11 or the second masking strip 12 from the surface of the base tape 271 that holds the first masking tape u or the second masking tape 12, it is also possible to perform, for example, a money collecting process, C. (4) Oxygen treatment, long-chain alkyl treatment, fluorine treatment, etc., in the present embodiment, in the present embodiment, after the corona-treated surface of the polyester film is coated with a polyfluorene-coating solution, at 14 〇t: It was dried for 1 minute to carry out a polyoxygen treatment. The heavy enthalpy of the polysiloxane layer after drying was about 0.07 g/cm2. 'The above-mentioned poly Wei Weipu is in the second? Kewei Burning (KS-36〇1, manufactured by Shin-Etsu Chemical Co., Ltd.) 100% by weight, adding B-fast system as a control agent (CAT_PLR_1 manufactured by Shin-Etsu Chemical Co., Ltd.) 2 weights 098108393 17 200946245, acetylene 1% by weight of a reaction control agent (CAT-PLR-2 manufactured by Shin-Etsu Chemical Co., Ltd.), and a solvent (manufactured by Maruzen Co., Ltd., and n-heptane manufactured by Toagosei Co., Ltd.) and stirred for 2 minutes. Further, a catalyst (CAT-PL-50T manufactured by Shin-Etsu Chemical Co., Ltd.) was added in an amount of 5 wt% and stirred for 1 minute to form. The tape 27 is formed by applying an acrylic adhesive to the substrate ηι of the first masking tape u and drying at 130 ° C for 1 minute to form the adhesive layer 112, and then adhering the base tape 271 to the adhesive layer 112. . As shown in FIG. 7A, the 'the second tape refilling head 23 is provided with a first supply reel 232, a first pressing portion 233, a first recovery reel 234, and a casing 23, and the first supply reel 232 is The first tape supply unit that winds up the unused tape 27 and winds the tape 27 (that is, the first shielding tape 11 and the base tape 271), and the first pressing portion 233 is unwound from the first supply reel 232. The belt 27 separates the first masking belt U, and simultaneously separates the separated portion (i.e., the portion of the first masking belt 11 that is unwound from the first supply reel 232) toward the non-coated region 92 of the substrate 9 (see Fig. 2). The first recovery reel 234 is a first tape collection unit that winds up and collects the tape 27 (that is, the base tape 271) after the separation of the first shielding tape u, and the casing 231 accommodates the configuration. As shown in FIG. 7B, the second tape attaching head 23a is substantially the same as the first tape attaching head 23 shown in FIG. 7A, and includes a second supply reel 232a, a second peg portion 233a, and a second recycling. The reel 234a and the casing 23, the second supply reel 232a, is a second tape supply unit that winds up the belt 27a holding the second shielding tape 098108393 18 200946245 12 on the main surface 271. The portion of the second masking strip 12 that is unwound from the second supply reel 232a is only 23% of the nip portion, and the ith i-shield belt U of the non-coated region 92 is slid by the second collecting reel 234a. The second tape collecting portion that is taken up and recovered by the base wire 271 is housed in the casing 231. In the tape application device 2, the second tape bonding head u and the first tape bonding head 23 are disposed to face each other. & ❹

當利用帶黏貼裝置2在基板9黏貼第1遮蔽帶u時首 先,利用圖4至圖6所示之頭移動機構24,使第i帶黏貼 頭23朝X方向移動’使其位於基板9移動路徑上方。此時, 基板9係位於第i帶黏貼頭23之⑼侧。黏著,利用基板 移動機構22使基板9朝(+Y)方向移動,使其位於圖^所 示之開始黏貼位置。當基板9位於開始黏貼位置,則 1帶黏貼頭23的第1按押部233之切斷部235只在與帶27 之切斷部235對向側切斷第i遮蔽帶u。 ^刀斷的第1遮蔽帶U係藉由第!供給捲盤232與回收 捲盤234朝圖7A中的逆時針方向旋轉,而與基底帶271- 起送入第1按押部233之帶分離 - ^ , ^ b 饵件236前端,在該前端 處,藉由被導入於與饋送基底帶) ^ 一 71方向大致相反侧,第1 遮蔽帶11便從基底帶271上剝齄 離’該前端部從殼體231之 下部開口 237朝基板9移動。 與此並行,利用氣缸238使黏㈣加經由下部開口爪 朝下方移動,如圖7C所示,將坌 聊弟1遮蔽帶11之前端部從 098108393 19 200946245 22(參照圖6)使基:9:按押黏貼,同時利用基板移動機構 11由第1按二::27 ’同時在第1遮蔽帶 板移動機構22使基板9 239按押的狀態下,利用基 使基板9朝與非塗佈區域 照圖2)平行的掃描方向(即㈣㈣移動,(參 面90上將第!遮蔽帶丨 土板主 %。 邊界依序黏貼於非塗佈區域 二二:所示之第1帶黏貼頭Μ中,利用切斷部235只 黏:於A板Γ上之第1遮蔽帶U ’藉由將第1遮蔽帶11 =;9至後端部為止,而使第丨遮蔽帶^密接於基 板9之主面9〇。在帶點貼裝置2中,基板移動機㈣與第 1帶黏貼頭23為將第1遮蔽帶Π黏貼於基板9主面90之 非塗佈區域%的第1黏貼機構。 另外,第1遮蔽帶η之開始黏貼,亦可在供給帶27下對 以與帶27之供給速度相同的速度移動之基板9進行。此外, 在第1帶㈣頭23巾,於第1麵帶11之前端部及後端部 的黏貼時,必須將第1遮蔽㈣利用第!按押部233之黏 貼輥239朝基板9按押,但亦可在前端部與後端部之黏貼時 以外’使黏貼輥239退離於殼體231内而解除第】遮蔽帶 之按押換。之I帶黏貼裝置2之第^黏貼機構中, 在第I遮蔽帶η之至少前端部及後端部的黏貼時於第】遮 098108393 ❹ 20 200946245 蔽帶U對基板9按押之狀態下,藉由使基板9對第!帶點 貼頭23之第1按押部233於掃插方向相對性移動,而將第 1遮蔽帶U黏貼於基板9上之非塗佈區域92。 ❹ 田利用帶獅裝置2在第〗韻帶u上黏貼第2遮蔽帶 I2時,利用圖4至圖6所示之頭移動機構24,使第i帶黏 貼頭Μ朝(-X)方向移動而從基板9之移動路徑上方退離, 並使第2帶黏貼頭23a朝⑼方向移動而位於 路徑上方。此時,純9位於第2__23a之(+=動 ❿ 第2遮蔽帶12之黏貼係大致與上述第1遮蔽帶11之勸貼 相同寿J用圖7B所不第2按押部233a之黏貼棍挪 2遮蔽帶12之前端部朝第1遮蔽帶u之上面按押黏 貼,同時利用基板移動機構22(參照圖6)使基板9朝 向開始移動。然後,在第2遮蔽帶12由第2按押部233 之黏貼輕239按押的狀態下,利用基板移動機構2 a 板9朝與非塗佈區域92之邊界(參照圖2)平行二 方向(即⑼方向)移動,藉此在基板9主面9〇上,田 遮蔽帶12沿邊界920依序黏貼於第i遮蔽帶U之上面mi 上。藉此’在基板9之转佈區域92上獅鑛When the first masking tape u is adhered to the substrate 9 by the tape bonding apparatus 2, first, the i-th tape bonding head 23 is moved in the X direction by the head moving mechanism 24 shown in FIGS. 4 to 6 to move it on the substrate 9. Above the path. At this time, the substrate 9 is located on the (9) side of the i-th tape bonding head 23. Adhesively, the substrate moving mechanism 22 is used to move the substrate 9 in the (+Y) direction so as to be at the beginning of the pasting position shown in Fig. When the substrate 9 is at the position where the bonding is started, the cutting portion 235 of the first pressing portion 233 of the tape bonding head 23 cuts the i-th shielding tape u only on the side opposite to the cutting portion 235 of the tape 27. ^The first masking tape U of the knife is broken by the first! The supply reel 232 and the recovery reel 234 are rotated counterclockwise in FIG. 7A, and are separated from the tape of the base tape 271 which is fed into the first pressing portion 233 - ^ , ^ b front end of the bait member 236 at the front end Wherein, the first masking strip 11 is peeled off from the base strip 271 by being introduced on the side substantially opposite to the feeding substrate strip), and the front end portion is moved from the lower opening 237 of the housing 231 toward the substrate 9. . In parallel with this, the air cylinder 238 is used to move the adhesive (4) downward through the lower opening claw, as shown in Fig. 7C, the front end of the masking belt 11 is 098108393 19 200946245 22 (refer to Fig. 6). : Pressing and pasting, while the substrate moving mechanism 11 is used to press the substrate 9 239 while the first masking plate moving mechanism 22 is pressed by the first pressing unit: 27', and the base substrate 9 is used for non-coating. Area 2) Parallel scanning direction (ie (4) (4) movement, (Part 90 will be the first! Masking 丨 主 主 。 依 依 边界 边界 边界 边界 边界 边界 边界 边界 边界 边界 边界 边界 二 二 二 二 二 二 : : : : : : : : : : : : In the crucible, the first masking strip U' on the A-plate is adhered to the first masking strip U' by the first masking strip 11=;9 to the rear end portion, and the third masking strip is adhered to the substrate. In the tape placement device 2, the substrate moving machine (4) and the first tape bonding head 23 are the first bonding tape which adheres the first mask tape to the non-coating area % of the main surface 90 of the substrate 9 In addition, the first masking tape η is pasted and adhered to the substrate 9 which is moved at the same speed as the feeding speed of the belt 27 under the supply belt 27. In addition, in the first belt (four) head 23, when the end portion and the rear end portion of the first surface belt 11 are pasted, the first mask (four) must be pressed toward the substrate 9 by the bonding roller 239 of the second pressing portion 233. However, when the front end portion and the rear end portion are pasted, the adhesive tape 239 may be retracted from the casing 231 to release the masking tape. The first tape bonding mechanism of the I tape bonding device 2 In the case where at least the front end portion and the rear end portion of the first masking strip η are pasted, the mask 9 is attached to the substrate 9 in a state where the mask U is pressed against the substrate 9 by the substrate 9 The first pressing portion 233 of the head 23 is relatively moved in the sweeping direction, and the first masking tape U is adhered to the non-coating region 92 on the substrate 9. ❹田 uses the lion device 2 on the first rhyme band u When the second masking tape I2 is pasted, the head moving mechanism 24 shown in FIGS. 4 to 6 is used to move the i-th adhesive head Μ in the (-X) direction and retreat from the moving path of the substrate 9, and the first 2 The adhesive head 23a moves in the (9) direction and is located above the path. At this time, the pure 9 is located at the 2nd__23a (+= the second adhesive tape 12 is adhered to the upper and lower sides) The first masking tape 11 is the same as that of the first masking tape 233a. The front end portion of the masking tape 12 is pressed against the upper surface of the first masking tape u while using the substrate moving mechanism. 22 (refer to Fig. 6), the substrate 9 is moved toward the beginning. Then, in a state where the second masking tape 12 is pressed by the bonding light 239 of the second pressing portion 233, the substrate moving mechanism 2a is used to face the non-coating. The boundary of the cloth region 92 (refer to FIG. 2) is moved in the parallel two directions (ie, the (9) direction), whereby the field mask 12 is sequentially adhered to the upper surface of the ith mask U along the boundary 920 on the main surface 9 of the substrate 9. on. By this, the lion mine on the transfer area 92 of the substrate 9

圖2)。 、令W 在帶黏貼裝置2中,基板移動機構22與第2帶黏貼 23a,為將第2遮蔽帶12黏貼於基板9之主面9()獻 第1遮蔽帶11之上面1111的第2黏貼機構。換言之,在帶 098108393 21 200946245 黏貼裝置2中’第丨黏貼機構與第2黏貼機構共用使基板9 朝掃描方向移動的基板移動機構22(即設置基板移動機構 22)。 另外,在帶黏貼裝置2之第2黏貼機構中,與上述第i 黏貼機構同樣地,在第2遮蔽帶12之至少前端部及後蠕部 的黏貼時’於第2遮蔽帶12對第1遮蔽帶U按押之狀態下, 藉由使基板9對第2帶黏貼頭23a之第2按押部233&朝掃 描方向相對移動,而將第2賴帶12黏貼於第】遮蔽帶“ 上。 ® 在帶黏貼裝置2中,如圖2所示,基板9的格子狀非塗佈 區域92中,只在平行於作為基板移動機構22使基板$移動 之方向的掃描方向延伸之3個區域(即朝圖2中之γ方向延 伸的區域)黏貼遮蔽帶i(即第i频帶U與第2遮蔽帶12)。 另外在非塗佈區域92中’不對朝掃描方向垂直延伸的區 域(即朝圖2中X方向延伸的區域)黏貼第i遮蔽帶u與帛❹ 2遮蔽帶12。如後述,塗佈純8中,對非塗佈區域^中 省略第1遮蔽帶11與第2遮蔽帶12黏貼的區域’不塗佈有 機EL液。 在圖1所示之塗佈系統8中,黏貼有第丨遮蔽帶u與第 2遮蔽帶12的基板9(參照圖2),利用搬送機器人“從帶黏 貼装置2搬出並搬入於塗佈裝置3中。 、 斜對在基板9塗佈有機EL液的塗佈裝置3進行說 098108393 22 200946245 明。圖8與圖9所示係塗佈裝置3的俯視圖與前視圖。如圓 8與圖9所示’塗佈|置3係具備有基板保持部Μ,該基板 保持部31係保持已將遮蔽帶〗(即第丨遮蔽帶”與第 蔽帶I2)黏貼於非塗佈區域%參照圖幻的基板9。在圖^ 與圖9中為求圖示方便,省略在基板9之主面⑽上所勘貼 遮蔽帶1之圖示。 e 塗佈裝置3又具備心基板移動機構32、記號檢測部33、 塗佈頭34、頭移動機構35、2個受液部%、及流動性材料 供給部38 ’該基板移動機構32制吏基板保持部31朝與基 板9之主面90平行的既定方向(即圖8中的以向以下: 「副掃描方向」)水平移動,同時以垂直方向軸為中心進行 旋轉,該記號檢測部33係拍攝基板9上所形成之位置調整 用記號(省略圖示)並進行檢測,該塗佈頭34為朝基板保持 部31上之基板9從3個喷嘴37連續吐出有機扯液的吐出 機構’頭移動機構35係朝與基板9之主面9G平行且與副掃 描方向垂直之方向(即圖8中的X方向,以下稱「主掃描方 向」)使塗佈頭34水平移動,該等受液部%係相對於主掃 描方向3又置在基板保持部31兩侧,同時承接來自塗佈頭料 的有機EL液,該流動性材料供給部38係對塗佈頭34之3 個喷嘴37供給有機扯液。於塗佈裝置3巾頭移動機構 35與基板移動機構32為使塗佈頭34之3個喷嘴37對基板 9朝主掃描方向相對移動,同時使基板9對塗佈頭34之3 098108393 23 200946245 個嘴嘴37朝副掃描方向相對移動的移動機構。 在塗饰頭34中,3個喷嘴37係就圖8中之χ 掃描方向)以略直線狀相隔開排列,同時 向(即主 放朝圖8中之Υ 万同(即副掃描方向)偏移配置,從該等噴嘴37 機EL液,塗佈於在基板9之塗佈區域 出的有 , 荃照圖2)所預奏 形成朝主掃描方向延伸的隔間壁間之溝 九 jr^ 能 中’相鄰2個噴嘴37間在副掃描方向之_,= 壁間之間距(以下稱「隔間壁間距」)。在塗佈頭Μ中,月曰 分別含有紅色(R)、綠色(G)、藍色⑻等顏色互異之3種將 機EL材料的3種有機EL液從3個喷嘴37吐出 當利用塗佈裝置3塗佈有機E L液時,首先,利用帶黏貼 農置2(參照圖4至圖6)’將已在非塗佈區域%黏貼有遮蔽 帶!(參照圖2)的基板9載置於基板保持部31而保持,根據 來自記號檢測部33之輸出’驅動基板移動機構32使基板9 位於圖8中實線所示之開始塗佈位置。塗佈頭34縣位於 圖8與圖9中實線所示之位置處。 接著,從流動性材料供給部38朝塗佈頭34供給有機虹 液’並開始從喷嘴37吐出有機肛液,驅動頭移動機構乃 而開始移動塗佈頭34。在塗佈裝置3中,在從喷嘴37朝基 板9連續吐出有機EL液下使噴嘴37對基板9從圖8中(·χ) 側朝㈣側(即與黏貼在基板9的第i遮蔽帶及第2遮蔽帶 之長邊方向垂直交叉的主掃描方向)相對移動,而將有機虹 098108393 24 200946245 液塗佈於基板9之隔間壁間3個鄰接溝、及遮蔽帶1之第2 遮蔽帶12上。 當塗佈頭34移動至圖8與圖9中二點鏈線所示之位置 處,則驅動基板移動機構32,使基板9與基板保持部31 — 起朝圖8中(+Y)侧(即副掃描方向)僅移動隔間壁間距之3件 距離。此時,在塗佈頭34中,從3個喷嘴37朝受液部% 連續吐出有機EL液。 © 當結束基板9於副掃描方向移動後,塗佈頭34 —邊吐出 有機EL液一邊在圖8 <中從(+x)侧朝(_x)侧(即主掃描方向) 移動,藉此當在基板9上塗佈有3種有機EL液後,再度使 基板9於副掃描方向移動。 圖10所不係黏貼有遮蔽帶1之基板9的俯視圖。於塗佈 裝置3中,至基板9位於圖8中二點鏈線所示之結束塗佈位 置處為止前,重複進行塗佈頭34朝主掃描方向的移動、及 ® 當塗佈頭34每1次朝主掃描方向移動所進行基板9朝副掃 描方向之間距移動,藉此如圖1〇所示,在基板9上包含第 1遮蔽帶11(參照圖3)與第2遮蔽帶12的區域(即黏貼在非 塗佈區域92之遮蔽帶1上的區域、及塗佈區域91的隔間壁 - 間之溝),條紋狀塗佈有機EL液93。另外,圖10中,為求 • 圖示方便’將基板9上所塗佈有機EL液93之寬度與間距 描繪為較實際還大。 在塗佈裝置3中,當塗佈有機EL液93之期間,從塗佈 098108393 25 200946245 頭34之喷嘴37(參照圖8與圖9)連續吐出有機EL液93。 在塗佈裝置3中’對非塗佈區域92中朝基板9之移動方向 垂直延伸的區域(即圖10中朝X方向延伸的區域,省略黏貼 遮蔽帶1的區域),於使塗佈頭34在受液部36上待機之狀 態下’使基板9朝副掃描方向僅移動與該區域寬度(即圖1〇 中Y方向寬度)相等之距離,藉此可避免對該區域塗佈有機 EL 液 93。 圖11A所示係塗佈有有機EL液的遮蔽帶1及基板9 一部 分在圖10中之B-B位置切剖的剖視阖,其對應於圖3。此 外’圖11B所示係對僅將等於非塗佈區域792寬度的1片 遮蔽帶71黏貼於非塗佈區域792的比較例基板79,塗佈有 機EL液793時的剖視圖。如圖11B所示,在比較例之基板 79中,在位於非塗佈區域792與塗佈區域791間邊界7920 上的遮蔽帶71之侧面713,附著有機EL液793而形成彎液 面794,如圖11C所示,在遮蔽帶71剝離後基板79上所殘 留之有機EL材料膜795中,於非塗佈區域792與塗佈區域 791間的邊界7920處,與該彎液面794(參照圖11B)對應的 部分796呈現突出。結果,在後步驟中,有機££材料膜上 所形成其他膜(例如陰極膜)之厚度,會有在該突出部不足的 可能性。figure 2). In the tape attaching device 2, the substrate moving mechanism 22 and the second tape attaching 23a are the second covering tape 12 adhered to the main surface 9 of the substrate 9 (the second surface 1111 of the first masking tape 11) Adhesive mechanism. In other words, in the tape 098108393 21 200946245, the second bonding means and the second bonding means share the substrate moving mechanism 22 (i.e., the substrate moving mechanism 22) for moving the substrate 9 in the scanning direction. Further, in the second bonding mechanism with the bonding device 2, in the same manner as the above-described i-th bonding mechanism, at least the front end portion of the second shielding tape 12 and the rear creeping portion are attached to the second shielding tape 12 When the masking tape U is pressed, the second tape 12 is adhered to the first masking tape by moving the substrate 9 to the second pressing portion 233& of the second tape applying head 23a in the scanning direction. In the tape-attaching device 2, as shown in FIG. 2, in the lattice-shaped uncoated region 92 of the substrate 9, only three regions extending in the scanning direction parallel to the direction in which the substrate $ is moved by the substrate moving mechanism 22 are shown. (i.e., the region extending in the γ direction in Fig. 2) is adhered to the masking tape i (i.e., the i-th band U and the second masking band 12). Further, in the non-coated region 92, 'the region extending perpendicularly to the scanning direction is not That is, the i-th shielding band u and the 帛❹ 2 shielding tape 12 are adhered to the region extending in the X direction in FIG. 2. As will be described later, in the case of coating pure 8, the first masking band 11 and the second layer are omitted from the uncoated region. The area where the masking tape 12 is adhered 'does not apply the organic EL liquid. In the coating system 8 shown in Fig. 1, the third masking tape u and the second layer are adhered. The substrate 9 (see Fig. 2) of the masking tape 12 is carried out from the tape-attaching device 2 by the transfer robot and carried into the coating device 3. The coating apparatus 3 which coats the organic EL liquid on the substrate 9 is 098108393 22 200946245. 8 and 9 are plan and front views of the coating apparatus 3. As shown in FIG. 9, the 'coating|setting 3 system is provided with the substrate holding portion Μ, and the substrate holding portion 31 holds the masking tape (ie, the second masking tape) and the masking tape I2). The coating area % refers to the substrate 9 of the drawing. In the drawings and FIG. 9, for convenience of illustration, the illustration of the masking tape 1 on the main surface (10) of the substrate 9 is omitted. The core substrate moving mechanism 32, the mark detecting unit 33, the coating head 34, the head moving mechanism 35, the two liquid receiving portions %, and the fluid material supply portion 38'. The substrate moving mechanism 32 makes the substrate holding portion 31 toward the substrate. The predetermined direction parallel to the main surface 90 of 9 (i.e., in the following direction: "sub-scanning direction" in FIG. 8) is horizontally moved while rotating about the vertical axis, and the mark detecting portion 33 is formed on the photographing substrate 9. The position adjustment flag (not shown) is detected, and the application head 34 is a discharge mechanism that continuously ejects the organic liquid from the three nozzles 37 toward the substrate 9 on the substrate holding portion 31. The main surface 9G of the substrate 9 is parallel and perpendicular to the sub-scanning direction (ie, X in FIG. 8) The coating head 34 is horizontally moved, hereinafter referred to as "main scanning direction", and the liquid receiving portions are placed on both sides of the substrate holding portion 31 with respect to the main scanning direction 3, and at the same time, the organic material from the coating head is received. In the EL liquid, the fluid material supply unit 38 supplies the organic liquid to the three nozzles 37 of the coating head 34. In the coating device 3, the towel moving mechanism 35 and the substrate moving mechanism 32 are configured to move the three nozzles 37 of the coating head 34 relative to the substrate 9 in the main scanning direction while the substrate 9 is applied to the coating head 34. 3 098108393 23 200946245 A moving mechanism in which the nozzles 37 are relatively moved in the sub-scanning direction. In the finishing head 34, the three nozzles 37 are arranged in a slightly linear relationship with respect to the scanning direction in Fig. 8 at the same time, and the direction (i.e., the main projection is shifted toward the same direction in Fig. 8 (i.e., the sub-scanning direction). The arrangement is carried out, and the EL liquid from the nozzles 37 is applied to the coating area of the substrate 9, and the groove between the partition walls extending in the main scanning direction is formed by the prelude of FIG. 2). In the middle of the 'two adjacent nozzles 37' in the sub-scanning direction, = the distance between the walls (hereinafter referred to as "the partition wall spacing"). In the coating head ,, the three types of organic EL liquids of the EL materials, which are different in color, such as red (R), green (G), and blue (8), are discharged from the three nozzles 37. When the cloth device 3 is coated with the organic EL liquid, first, the tape is adhered to the non-coated region by the adhesive tape 2 (see FIGS. 4 to 6). The substrate 9 (see Fig. 2) is placed on the substrate holding portion 31 and held, and the substrate moving mechanism 32 is driven by the output from the mark detecting portion 33 so that the substrate 9 is positioned at the start application position indicated by the solid line in Fig. 8. The coating head 34 is located at the position shown by the solid line in Figs. 8 and 9. Then, the organic liquid liquid is supplied from the fluid material supply unit 38 to the coating head 34, and the organic anal liquid is discharged from the nozzle 37, and the head moving mechanism is driven to start moving the coating head 34. In the coating device 3, the organic EL liquid is continuously discharged from the nozzle 37 toward the substrate 9, and the nozzle 37 is applied to the substrate 9 from the (·) side of FIG. 8 toward the (four) side (that is, the i-th shielding tape adhered to the substrate 9). And the second scanning zone has a relative movement in the main scanning direction in which the longitudinal direction intersects vertically, and the organic rainbow 098108393 24 200946245 is applied to the three adjacent grooves between the partition walls of the substrate 9 and the second shielding of the shielding tape 1 Belt 12 on. When the coating head 34 is moved to the position shown by the two-dot chain line in FIGS. 8 and 9, the substrate moving mechanism 32 is driven to bring the substrate 9 and the substrate holding portion 31 toward the (+Y) side in FIG. 8 ( That is, the sub-scanning direction) only moves 3 pieces of the distance between the partition walls. At this time, in the coating head 34, the organic EL liquid is continuously discharged from the three nozzles 37 toward the liquid receiving portion. © When the end substrate 9 is moved in the sub-scanning direction, the coating head 34 ejects the organic EL liquid while moving from the (+x) side to the (_x) side (ie, the main scanning direction) in FIG. 8 <RTIgt; After three kinds of organic EL liquids are applied onto the substrate 9, the substrate 9 is again moved in the sub-scanning direction. Figure 10 is a plan view of the substrate 9 to which the masking tape 1 is attached. In the coating device 3, the movement of the coating head 34 in the main scanning direction and the application of the coating head 34 are repeated until the substrate 9 is positioned at the end of the coating position indicated by the two-dot chain line in FIG. When the substrate 9 is moved in the main scanning direction once, the substrate 9 is moved in the sub-scanning direction, and as shown in FIG. 1A, the first shielding tape 11 (see FIG. 3) and the second shielding tape 12 are included on the substrate 9. The region (i.e., the region adhered to the masking tape 1 of the non-coating region 92 and the partition wall between the coating regions 91) is strip-coated with the organic EL liquid 93. Further, in Fig. 10, in order to facilitate the illustration, the width and pitch of the organic EL liquid 93 applied on the substrate 9 are drawn to be larger than actual. In the coating device 3, during the application of the organic EL liquid 93, the organic EL liquid 93 is continuously discharged from the nozzle 37 (see Figs. 8 and 9) of the head 34 of 098108393 25 200946245. In the coating device 3, 'the region extending perpendicularly to the moving direction of the substrate 9 in the non-coating region 92 (that is, the region extending in the X direction in FIG. 10, omitting the region where the masking tape 1 is adhered) is used to make the coating head In the state in which the liquid receiving portion 36 stands by, the substrate 9 is moved only in the sub-scanning direction by a distance equal to the width of the region (that is, the width in the Y direction in FIG. 1A), whereby the application of the organic EL to the region can be avoided. Liquid 93. Fig. 11A shows a cross-sectional view of a masking tape 1 coated with an organic EL liquid and a portion of the substrate 9 taken along the line B-B in Fig. 10, which corresponds to Fig. 3. Further, Fig. 11B is a cross-sectional view showing a case where only one masking tape 71 equal to the width of the non-coating region 792 is adhered to the non-coated region 792, and the organic EL liquid 793 is applied. As shown in FIG. 11B, in the substrate 79 of the comparative example, the organic EL liquid 793 is attached to the side surface 713 of the masking tape 71 located on the boundary 7920 between the non-coating region 792 and the coating region 791 to form a meniscus 794. As shown in FIG. 11C, in the organic EL material film 795 remaining on the substrate 79 after the masking tape 71 is peeled off, at the boundary 7920 between the non-coating region 792 and the coating region 791, and the meniscus 794 (refer to Figure 11B) The corresponding portion 796 is highlighted. As a result, in the latter step, the thickness of the other film (e.g., the cathode film) formed on the film of the organic material may be insufficient in the protrusion.

相對於此’利用本實施形態塗佈系統8之帶黏貼裝置2(參 照圖4至圖6)在基板9上所黏貼的遮蔽帶i中,如圖UA 098108393 26 200946245 所示’黏貼在非塗絲域92的第i輕帶 下面邊緣1123,較非涂德卩a n 較非塗佈Q域92、與該非塗佈區域92 =區域91間之邊界920更靠(+X)側。此外,第2遮 從第1遮蔽帶11朝⑼側突出的簷部120,係離 開非塗佈區域92中在箆1说社, 、In contrast to the masking tape i adhered to the substrate 9 by the tape applying device 2 (see FIGS. 4 to 6) of the coating system 8 of the present embodiment, as shown in FIG. UA 098108393 26 200946245, the film is adhered to the non-coated film. The lower edge 1123 of the i-th light belt of the silk field 92 is closer to the (+X) side than the boundary 920 between the non-coated Q domain 92 and the non-coated region 92 = region 91. Further, the second portion 120 that protrudes from the first masking belt 11 toward the (9) side is separated from the non-coated region 92.

遮蔽帶ll(-X)側從第1遮蔽帶U 所露出的區域921 (以下稱「霞山旧u b 、 (下稱露出區域921」),並覆蓋該露 出區域921。 ®藉此,可防正從塗佈裝置3之噴嘴參照圖8與圖9)吐 出於基板9上的有機扯液93附著在非塗佈區域%之露出 區域921,同時亦可防止附著於非塗佈區域%上所黏貼第^ 遮蔽帶π之(_x)側側面1103。結果,可容易防止在非塗佈 區域92與(-X)侧塗佈區域91間之邊界畑處發生彎液面, 可防止在後步驟中於有機肛材料膜上所形成其他膜之厚度 不足等不良情況。 參再者,於遮蔽帶1中,第1遮蔽帶U的㈣侧W下面 邊緣1123’位於較非塗佈區域92、與(+χ)侧塗佈區域91間 的邊界920更靠(·Χ)侧,第2遮蔽帶12中從第i遮蔽帶u 朝(+X)側突出的筹部U0,離開非塗佈區域%中第1遮蔽 帶11的(+X)側露出區域921,並覆蓋該露出區域92卜藉此, 可防止有機EL液93附著於非塗佈區域92之(+χ)側露出區 域92卜及有機EL液93附著於第i遮蔽帶u之(+乂)侧側 面1103。結果’亦可容易地防止彎㈣亦發生在非塗佈區 098108393 27 200946245 域92與(+X)側塗佈區域91間之邊界920。 另外’於塗佈裝置3中,因為噴嘴37高速移動並吐出有 機此液’因此在嘴嘴37朝(+X)方向移動並塗佈有機EL液 時,第1遮蔽帶11的(_x)侧(即喷嘴37移動方向之上游侧) 露出區域921 +,在邊界92〇附近會有些微有機EL液% 附著,但附著量為不會有對後步驟造成影響可能的微量程 度,因此認為有機EL液93對非塗佈區域92的附著可利用 第1遮蔽帶11與第2遮蔽帶12而實質防止。此外,在噴嘴 37朝(-X)方向移動下塗佈有機EL液,時,在第i遮蔽帶u 的(+X)側露出區域921之邊界920附近,會有些微有機扯 液附著,但此情況亦與上述相同,認為利用第1遮蔽帶u 與第2遮蔽帶12可實質地防止有機虹液93附著於非塗佈 區域92。 另一方面’在嘴嘴π朝(+x)方向移動下塗佈有機el液 時,在位於遮蔽帶1(+x)侧(即噴嘴37移動方向之下游側) 之塗佈區域91中,有機肛液93對塗佈區域%的開始塗 佈位置,係離開邊界920些微距離。然而,塗佈區域“之 邊界920附近的區域並未被利用作為有機顯示裝置之像 素區域,且在塗佈區域91之邊界92〇附近未塗佈有機证 液93的距離,係較小於未被利用作為像素區域的區域寬 度,因此上述開始塗佈位置與邊界920之些微離開並不會對 有機EL顯示裝置的性能造成影響。此外,在喷嘴37朝(_又) 098108393 28 200946245A region 921 (hereinafter referred to as "Xiashan Old ub" (hereinafter referred to as an exposed region 921)) which is exposed from the first shielding tape U on the side of the masking tape ll (-X) covers the exposed region 921. Referring to FIG. 8 and FIG. 9) from the nozzle of the coating device 3, the organic liquid 93 discharged from the substrate 9 adheres to the exposed region 921 of the non-coated region %, and also prevents adhesion to the non-coated region. Adhering to the (_x) side side 1103 of the masking zone π. As a result, it is possible to easily prevent the meniscus from occurring at the boundary between the non-coated region 92 and the (-X)-side coated region 91, and it is possible to prevent the thickness of other films formed on the organic anal material film from being insufficient in the subsequent step. And other bad conditions. Further, in the masking tape 1, the (four) side W lower edge 1123' of the first masking tape U is located closer to the boundary 920 between the non-coated region 92 and the (+χ) side coating region 91 (·Χ On the side, the portion U0 of the second masking tape 12 that protrudes from the (i)th side of the i-th shield band u is separated from the (+X) side exposed region 921 of the first masking band 11 in the non-coated region %, and By covering the exposed region 92, the organic EL liquid 93 can be prevented from adhering to the (+χ) side exposed region 92 of the non-coating region 92, and the organic EL liquid 93 is attached to the (+乂) side of the i-th shielding band u. Side 1103. As a result, it is also easy to prevent the bend (4) from also occurring at the boundary 920 between the non-coating zone 098108393 27 200946245 domain 92 and the (+X) side coating zone 91. Further, in the coating device 3, since the nozzle 37 moves at a high speed and the organic liquid is discharged, the (_x) side of the first masking belt 11 is moved when the nozzle 37 moves in the (+X) direction and the organic EL liquid is applied. (ie, the upstream side of the direction in which the nozzle 37 moves) The exposed area 921 +, some micro organic EL liquid adheres to the vicinity of the boundary 92 ,, but the amount of adhesion does not have a slight degree of influence on the subsequent steps, so the organic EL is considered The adhesion of the liquid 93 to the non-coated region 92 can be substantially prevented by the first shielding tape 11 and the second shielding tape 12 . Further, when the organic EL liquid is applied while the nozzle 37 is moved in the (-X) direction, some micro organic liquid adheres to the vicinity of the boundary 920 of the (+X) side exposed region 921 of the i-th shielding band u, but In this case as well, it is considered that the first masking tape u and the second masking tape 12 can substantially prevent the organic rainbow 93 from adhering to the non-coating region 92. On the other hand, when the organic EL liquid is applied while the nozzle π is moving in the (+x) direction, in the coating region 91 on the masking belt 1 (+x) side (i.e., the downstream side in the moving direction of the nozzle 37), The initial application position of the organic anal fluid 93 to the coated area % is a slight distance from the boundary 920. However, the region near the boundary 920 of the coating region is not utilized as the pixel region of the organic display device, and the distance of the organic liquid crystal 93 is not applied near the boundary 92 of the coating region 91, which is smaller than that. It is utilized as the width of the region of the pixel region, so that the slight departure of the above-described starting coating position from the boundary 920 does not affect the performance of the organic EL display device. Further, at the nozzle 37 toward (_) 098108393 28 200946245

方向移動下塗佈有機EL液時,於# 士 A 寻於位在遮蔽帶1(-X)侧的塗 佈區域91中’有機EL液μ掷浴从 3對塗佈區域91的開始塗佈位 置會離開邊界920些微距離,相伽L丄 距離但與上朗樣地,該離開並不 會對有機EL顯示裝置之性能造成影響。 在帶黏貼裝置2中,如上沭,筮,袖 上江第1遮蔽帶11與第2遮蔽 帶12分別以各自中^線重疊於非塗佈區域92之中心線方式 ❹When the organic EL liquid is applied in the direction of the movement, the organic EL liquid is thrown from the coating area 91 of the pair of coating regions 91 in the coating region 91 on the masking belt 1 (-X) side. The position will leave the boundary 920 a few micro-distances, and the distance between the gamma and the L-square is not affected by the performance of the organic EL display device. In the tape attaching device 2, as described above, the 第, the upper sleeve 1 and the second mask 12 are overlapped with the center line of the non-coated region 92, respectively.

黏貼’第1遮蔽帶U與第2遮蔽帶12對於非塗钸區域% 之中心線成線對稱。藉此,在塗佈裝置3中,在嘴嘴37朝 ⑽方向移動下塗佈有機乱液時、及在喷嘴37朝⑼方向 移動下塗佈有機EL液時,可將有機EL液對雜佈區域92 的二微附著、及塗佈區域91中有機EL液之開始塗佈位置 ”邊界92G的些微離開之態樣設為相同。結果,可使有機 EL液對非塗佈區域92兩侧之2個塗佈區域%㈣佈品質 均勻化。 再者’在帶黏貼裝置2中’ f 2遮蔽帶12的寬度等於非 塗佈區域92 $寬度’第2遮蔽帶12的寬度方向邊緣俯視下 係重疊於非塗佈區域92兩側之邊界920。藉此 ,可更確實 妨止有機EL液對非塗佈區域92之附著。 在遮蔽帶1中,藉由使第2遮蔽帶12之簷部120下面1202 平行於基板9之主面9〇,可防止附著在第2遮蔽帶12侧面 ^03的有機EL液93沿簷部120之下面1202流至第1遮蔽 帶11之侧面1103而附著於側面1103。結果,可防止附著 098108393 29 200946245 在第2遮蔽帶12侧面1203的有機EL液93經由簷部ι2〇 之下面1202及第1遮蔽帶11之侧面1103而附著於非塗佈 區域92。 在遮蔽帶1中,各簷部120之寬度(即圖3所示第i遮蔽 帶11之第1上面邊緣1113與第2遮蔽帶12之第2下面邊 緣1223間之X方向距離)較佳分別為〇.5mm以上3mm以 下。藉由將各簷部12〇之寬度設定在0.5mm以上,可更加 提升防止有機EL液對第1遮蔽帶11側面1103附著的確實 性。此外,藉由將各簷部12〇的寬度設為3mm以下,可充 分確保簷部120之強度,可防止簷部120朝基板9之主面 90下垂。 在圖1所示塗佈系統8中,經塗佈裝置3塗佈有機EL液 的基板9,由搬送機器人81從塗佈裝置3搬出並搬入於帶 剝離裝置4。圖12所示係帶剝離裝置4的俯視圖。如圖12 所示,帶剝離裝置4係具備有取代圖4至圖6所示帶黏貼裝 置2之第1帶黏貼頭23與第2帶黏貼頭23a的1個帶剝離 頭43。帶剝離裝置4其他構成與帶黏貼裝置2大致相同。 帶剝離裝置4係具備有:基板㈣部41、基板移動機構 42、帶剥離頭43、及頭移動機構44,該41係保持基板9, 該基板移動機構42係使基板9與基板保持部41 一起朝圖 12中Y方向移動,該帶剝離頭43係保持並剝離遮蔽帶丨(即 圖3所示之第1 ϋ蔽帶U與第2遮蔽帶12) ’該頭移動機 098108393 30 200946245 構44係使帶剝離頭43朝與基板9移動方向垂直之方向(即 圖12中X方向)移動。在帶剝離裝置4中,利用基板移動機 構42,使基板9與基板保持部41 一起沿滑執421朝水平方 向移動,同時以垂直方向旋轉軸為中心旋轉。此外,利用頭 移動機構44,使帶剝離頭43於基板9之移動範圍上方沿滑 執441朝水平方向移動。The adhesion 'the first masking tape U and the second masking tape 12 are line-symmetric with respect to the center line of the non-coated area %. Thereby, in the coating device 3, when the organic liquid liquid is applied while the nozzle 37 is moved in the (10) direction, and the organic EL liquid is applied while the nozzle 37 is moved in the (9) direction, the organic EL liquid can be mixed. The two micro-adhesion of the region 92 and the initial application position of the organic EL liquid in the application region 91 are slightly the same as the boundary 92G. As a result, the organic EL liquid can be applied to both sides of the non-coating region 92. The coating area % (four) cloth quality is uniformized. Further, 'in the tape application device 2', the width of the f 2 masking tape 12 is equal to the non-coated region 92, and the width is the width of the second shielding tape 12. The boundary 920 on both sides of the non-coating region 92 is overlapped. Thereby, the adhesion of the organic EL liquid to the non-coating region 92 can be more reliably prevented. In the masking tape 1, by the crotch portion of the second masking tape 12 The lower surface 1202 of the 120 is parallel to the main surface 9 of the substrate 9, and the organic EL liquid 93 adhering to the side surface 03 of the second masking strip 12 is prevented from flowing along the lower surface 1202 of the crotch portion 120 to the side surface 1103 of the first masking strip 11 and attached thereto. Side surface 1103. As a result, adhesion of 098108393 29 200946245 to the organic EL liquid 9 on the side 1203 of the second masking strip 12 can be prevented. 3 is attached to the non-coated region 92 via the lower surface 1202 of the crotch portion ι2 and the side surface 1103 of the first shielding tape 11. In the masking tape 1, the width of each crotch portion 120 (i.e., the i-th shielding band 11 shown in FIG. 3) Preferably, the distance between the first upper edge 1113 and the second lower edge 1223 of the second mask 12 is 〇5 mm or more and 3 mm or less. By setting the width of each ridge 12〇 to 0.5 mm or more Further, the accuracy of preventing the adhesion of the organic EL liquid to the side surface 1103 of the first masking strip 11 can be further improved. Further, by setting the width of each of the flange portions 12 to 3 mm or less, the strength of the flange portion 120 can be sufficiently ensured, and the flaw can be prevented. The portion 120 is suspended toward the main surface 90 of the substrate 9. In the coating system 8 shown in Fig. 1, the substrate 9 of the organic EL liquid is applied by the coating device 3, and the transfer robot 81 is carried out from the coating device 3 and carried into the belt. Peeling device 4. Fig. 12 is a plan view of the tape peeling device 4. As shown in Fig. 12, the tape peeling device 4 is provided with a first adhesive tape 23 and a third adhesive tape device 2 instead of the adhesive tape device 2 shown in Figs. 2 one tape peeling head 43 with a bonding head 23a. The other structure of the tape peeling device 4 is substantially the same as that of the tape bonding device 2. The off device 4 includes a substrate (four) portion 41, a substrate moving mechanism 42, a tape peeling head 43, and a head moving mechanism 44 that holds the substrate 9 and the substrate moving mechanism 42 that causes the substrate 9 together with the substrate holding portion 41. Moving in the Y direction in Fig. 12, the tape peeling head 43 holds and peels off the mask tape (i.e., the first tape U and the second mask tape 12 shown in Fig. 3). The head moving machine 098108393 30 200946245 The tape peeling head 43 is moved in a direction perpendicular to the moving direction of the substrate 9 (i.e., the X direction in Fig. 12). In the tape peeling device 4, the substrate moving mechanism 42 is used to move the substrate 9 together with the substrate holding portion 41 in the horizontal direction along the slide 421 while rotating in the vertical direction. Further, by the head moving mechanism 44, the tape peeling head 43 is moved in the horizontal direction along the slide 441 over the moving range of the substrate 9.

圖13A所示係帶剝離頭43構成的放大左侧視圖。圖 中亦與圖7A同樣地,描繪出帶剝離頭43之殼體‘Μ内部 構成。如圖13A所示,帶剝離頭43係具備有:剝離帶β 15 黏著機構433、供給捲盤432、回收捲盤434、 入故體431, 該剝離帶45係藉由黏著於遮蔽帶】之第2遮蔽帶q 遮蔽帶1之至少-部份,該黏著機構433為使剥離2而保持 黏著面對向於第2遮蔽帶12並導弓丨剝離帶45而依=之An enlarged left side view of the tether stripping head 43 shown in Fig. 13A is shown. Similarly to Fig. 7A, the inside of the casing with the peeling head 43 is shown in Fig. 7A. As shown in FIG. 13A, the tape peeling head 43 is provided with a peeling tape β 15 adhesive mechanism 433, a supply reel 432, a take-up reel 434, and a body 431 which is adhered to the mask tape. The second masking tape q shields at least a portion of the tape 1 , and the adhesive mechanism 433 is held to adhere to the second masking tape 12 and to guide the peeling tape 45 to the peeling 2

基板9上遮蔽帶1之第2遮蔽帶12的剝離帶導弓卜黏著於 捲盤432為將未使用之剝離帶45供給至黏著機構:供給 離帶供給冑,該回收捲盤434 $將剝離帶45與已^的制 離帶45的遮蔽帶丨(即第i遮蔽帶u及第2遮蔽帶έ著至韌 從基板9拉起而回收的剝離帶回收部,該殼體2)〜起 等構成。黏著機構433係具備有氣缸與按押^收容讀 外’剝離帶45寬度係大於遮蔽帶!之第2遮蔽帶12 437。此 當利用帶剝離裝置4從基板9 _遮蔽帶i時,^寬度。 用圖12所示之基板移動㈣42與頭移動機構,’利 __ 基板9 31 200946245 與帶剝離頭43移動而位於剝離開始位置。此時,如圖Μ 所示,作為剥離對象的遮蔽帶1之前端,係位於帶剝離頭 43的殼體431下部開口 43 5下方。 接著,利用氣缸436使按押輥437經由下部開口 435移動 至下方,將剝離帶45從上側(即與剝離帶45之黏著面相反 側)朝遮蔽帶1之第2遮蔽帶12前端部按押而黏著。接著, 利用基板移動機構42(參照圖12),使基板9朝圖13A中(+γ) 方向開始移動。與此同時,供給捲盤432及回收捲盤434 開始進行圖13Α中的順時針旋轉,而饋送出供給捲盤432 上所捲繞的剝離帶45,同時如圖ηΒ所示,藉由使按押輥 437移動至上方而返回至原本位置,以使黏著於剝離帶45 的第2遮蔽帶12之前端部與第i遮蔽帶u 一起朝(+ζ)側持 起,將第1遮蔽帶11之前端部從基板9剝離。然後,藉由 從圖13Α所示之供給捲盤432持續饋送出剝離帶45同時使 基板9持續移動,而使基板9上之第丨遮蔽帶u及第2遮 蔽帶12黏著於剝離帶45並從基板9剝離,而由回收捲盤 434捲取且回收。 在帶剝離裝置4中,藉由從塗佈有有機EL液的基板9剝 離第i遮蔽帶11與第2遮蔽帶12,而僅在基板9之塗佈區 域91上殘留有機EL液。如此,在圖12所示之帶剝離裝置 4中,在由帶剝離頭43保持遮蔽帶丨並持起的狀態下,利 用基板移動機構42將基板9沿黏貼遮蔽帶丨之方向移動, 098108393 32 200946245 藉此從基板9剝離遮蔽帶1。 在塗佈系統8中,於由帶黏貼裝置2黏貼於基板9的遮蔽 帶1中,第2遮蔽帶12對第1遮蔽帶u的黏著力,係大於 第1遮蔽帶11對基板9之非塗佈區域92的黏著力。於本實 施形態中’第1遮蔽帶11對非塗佈區域92的黏著力為 0_01N/20mm 以上 1.2N/20mm 以下’較佳為 〇.〇2N/20mm 以 上 0.8N/20mm 以下(更佳 〇.〇3N/20mm 以上 0.4N/20mm 以 參下)。 上述黏著力為在溫度23°C、相對濕度50%之條件下,利 用黏貼速度0.3m/min且線壓78.4N/cm之貼合機將寬20mm 之第1遮蔽帶黏貼於非塗佈區域92,在黏貼後經30分鐘後 利用拉伸試驗機以剝離角度180。且拉伸速度a3m/min剝離 時(亦即將第1遮蔽帶之前端朝重疊於第1遮蔽帶11之殘留 部位的方向以速度〇.3m/min拉伸並剝離時)的力。又,第2 ❹遮蔽帶12對第1遮蔽帶U的黏著力,係較第1遮蔽帶11 對非塗佈區域92的黏著力大〇.lN/2〇mm以上。 如此’藉由使第2遮蔽帶12對第}遮蔽帶11的黏著力大 於第1遮蔽帶11對基板9的黏著力,而在帶剝離裝置4中, - 富由剝離帶45持起第2遮蔽帶12時,可防土第1遮蔽帶 . 11從第2遮蔽帶12剝落而殘留於基板9上,可容易地將第 1遮蔽帶11與第2遮蔽帶12—起(即由單次剝離動作)剝離。 再者’在帶剝離裝置4中,將附著有有機EL液的第2遮 098108393 33 200946245 蔽帶12上面由剝離帶45覆蓋並從基板9剝離遮蔽帶1,因 此不會使附著在第2遮蔽帶12上的有機el液落至基板9 而可回收遮蔽帶1。另外,剝離帶45對遮蔽帶1的開始黏 著,亦可在供給剝離帶45下對以等於剝離帶45之供給速度 的速度移動的基板9來進行。 在圖1所示之塗佈系統8中,當結束從基板9剝離遮蔽帶 1 ’基板9從帶剝離裝置4搬出至塗佈系統8外而結束對基 板9塗佈有機EL液。另外,在塗佈系統8中,實際上,遮 蔽帶1之黏貼、有機EL液之塗佈、及遮蔽帶i之剝離係對 複數基板連續進行。 如以上所說明,在圖1所示之塗佈系統8中,利用帶黏貼 裝置2、塗佈裝置3及帶剝離裝置4,可防止在非塗佈區域 92與塗佈區域91間之邊界92〇發生彎液面並可容易獲得 實質只在塗佈區域91塗佈有有機EL液的基板9。 但疋’有機EL顯示裝置用之基板上所形成有機EL層的 膜厚(即由有機EL液之乾燥所形成有機EL材料的膜厚)對 平面顯示裝置之顯示性能等具有大幅影響,因此必須以高精 度進行控制。因此,可謂防止彎液面之發生並提升有機EL 層膜厚之均勻性的塗佈系統8特別適用於有機el液對有機 EL顯示裝置用基板的塗佈。此外,即使在有機虹顯示裝 置以外的其他平面顯示裝置中,亦與有機EL顯示裝置同樣 地’必須以高精度㈣基板上所形成像素形成材料之膜厚, 098108393 34 200946245 因此可謂塗佈系統8亦適用在塗佈包含平面顯示裝置用之 像素形成材料的流動性材料。 接者,針對本發明第2實施形態塗佈系統之帶黏貼裝置進 行說明。® 14所示係第2實施形態帶黏%裝置之俯視 圖。於帶㈣裝置2a中,其具備有取代_ 4所示帶黏貼裝 置2之第1帶黏貼頭23與第2帶黏貼頭^的i個帶黏貼 頭23b。帶黏貼裝置2a之其他構成與圖4至圖^所示之帶 ©黏貼裝置2相同’社下說财就所對應之構成舒相同之 元件符號。 圖15A所示係帶黏貼頭2儿構成之放大左侧視圖,在圖 15A中,與圖7A與圖7B同樣地,描繪出帶黏貼頭23b之 殼體231所收容的内部構成。如圖15A所示,帶黏貼頭23b 除圖7A所示第1帶黏貼頭23之構成外更具備有:第2供 給捲盤232a、第2回收捲盤234a、及帶貼合部23〇,該第2 參供給捲盤232a為將在基底帶271 —主面保持有第2遮蔽帶 12的帶27a捲出的第2帶供給部,該第2回收捲盤23如為 捲取帶27a之基底帶271而回收的第2帶回收部,該帶貼合 部230係將第2遮蔽帶12黏貼於第1遮蔽帶11。帶黏貼頭 ' 2孙之其他構成與圖7A所示第1帶黏貼頭23相同,在以下 • 說明中就對應之構成賦予相同之元件符號。另外,帶黏貼頭 23b以與圖7A所示之第i帶黏貼頭23相同的方向而配置。 當利用圖14所示之帶黏貼裝置2a在基板9黏貼第丨遮蔽 098108393 35 200946245 帶11及第2遮蔽帶12時,首先,利用圖14所示之頭移動 機構24使帶黏貼頭2_χ方向移動而位於基板9移動路 徑上方,並利用基板移動機構22使基板9朝(+γ)方向移動, 而位於圖15Α所示之開始黏貼位置。 在帶黏貼頭23b中,第2遮蔽帶12中從第2供給捲盤咖 捲出並從基底帶271剝離的部位,係與從作為第丨帶供給部 之第1供給捲盤232所捲出的帶27(即基底帶271、及保持 在基底帶271 —主面的第〗遮蔽帶11} 一起被夾持在帶貼合 部230之輥2301、2302,藉此在第丨遮蔽帶u之基材lu 上面1111(參照圖3),黏貼第2遮蔽帶12之黏著劑層122 下面1222(參照圖3)。 接著,藉由按押部233之切斷部235 ’將第1遮蔽帶η 與第2遮蔽帶12從第2遮蔽帶12側切斷,而在帶分離構件 236之前端從基底帶271剝離第1遮蔽帶η與第2遮蔽帶 12 ’其前端部從殼體231之下部開口 237朝基板9移動。此 外’與此並行’利用按押部233之氣缸238使黏貼輥239 經由下部開口 237朝下方移動,如圖15Β所示,貼合有第1 遮蔽帶11及第2遮蔽帶12部位之前端部,使第1遮蔽帶 11之黏著劑層112(參照圖3)對向於基板9並從第2遮蔽帶 12之基材121(參照圖3)侧朝基板9之主面90按押而黏貼, 同時基板9朝圖15Α(+Υ)方向開始移動。 然後’分別從第1供給捲盤232及第2供給捲盤232a持 098108393 36 200946245 續饋送出帶27及帶27a’同時在第丨遮蔽帶丨丨及第2遮蔽 帶12由按押部233之黏貼輥239按押的狀態下,利用圖14 所示基板移動機構22使基板9额錄佈區域%之邊界 92〇(參關2)平行物财向(即(+γ)方向)移動藉此在基 板9主面90上將篦!、由#嫌^& 遮蔽帶11及第2遮蔽帶ΐ2(即遮蔽帶 1)沿邊界92G依辆貼於非塗佈區域%。 ❹The peeling tape of the second masking tape 12 on the substrate 9 is adhered to the reel 432 to supply the unused peeling tape 45 to the adhesive mechanism: the supply tape is supplied, and the take-up reel 434 $ will be peeled off. The mask tape 45 of the tape 45 and the tape strip 45 (ie, the io tape mask u and the second mask tape are pulled up to the peeling tape recovery portion recovered from the substrate 9 and recovered, the casing 2) And so on. The adhesive mechanism 433 is provided with a cylinder and a pusher. The width of the peeling tape 45 is larger than the masking tape! The second shielding tape 12 437. When the tape stripping device 4 is used from the substrate 9 to the masking tape i, the width is . The substrate moving (four) 42 and the head moving mechanism shown in Fig. 12 are moved to the peeling start position by moving the tape peeling head 43 with the tape peeling head 43. At this time, as shown in Fig. ,, the front end of the masking tape 1 as the object to be peeled is located below the lower opening 43 5 of the casing 431 with the peeling head 43. Next, the pressing roller 437 is moved downward by the lower opening 435 by the air cylinder 436, and the peeling tape 45 is pressed from the upper side (that is, the side opposite to the adhesive surface of the peeling tape 45) toward the front end portion of the second shielding tape 12 of the masking tape 1. And sticking. Next, the substrate 9 is moved in the (+γ) direction in FIG. 13A by the substrate moving mechanism 42 (see FIG. 12). At the same time, the supply reel 432 and the recovery reel 434 start the clockwise rotation in FIG. 13A, and feed the peeling tape 45 wound on the supply reel 432, as shown in FIG. The pressing roller 437 is moved to the upper position and returned to the original position so that the front end portion of the second masking tape 12 adhered to the peeling tape 45 is held toward the (+ζ) side together with the i-th shielding tape u, and the first masking tape 11 is held. The front end is peeled off from the substrate 9. Then, by continuously feeding the peeling tape 45 from the supply reel 432 shown in FIG. 13A while continuously moving the substrate 9, the second masking tape u and the second masking tape 12 on the substrate 9 are adhered to the peeling tape 45. It is peeled off from the substrate 9 and taken up by the take-up reel 434 and recovered. In the tape peeling device 4, the i-th shielding tape 11 and the second masking tape 12 are peeled off from the substrate 9 coated with the organic EL liquid, and only the organic EL liquid remains on the coating region 91 of the substrate 9. As described above, in the tape peeling device 4 shown in FIG. 12, the substrate 9 is moved in the direction in which the substrate 9 is adhered by the substrate moving mechanism 42 while the mask tape is held by the tape peeling head 43 and held up, 098108393 32 200946245 Thereby, the masking tape 1 is peeled off from the substrate 9. In the coating system 8, in the masking tape 1 adhered to the substrate 9 by the tape bonding apparatus 2, the adhesion of the second masking tape 12 to the first masking tape u is larger than that of the first masking tape 11 to the substrate 9. The adhesion of the coating area 92. In the present embodiment, the adhesive force of the first masking tape 11 to the non-coating region 92 is 0_01N/20 mm or more and 1.2 N/20 mm or less. Preferably, it is preferably 〇2N/20 mm or more and 0.8 N/20 mm or less (more preferably 〇 .〇3N/20mm or more 0.4N/20mm to participate in the next). The adhesion is such that the first masking tape having a width of 20 mm is adhered to the non-coated region by a laminator having a bonding speed of 0.3 m/min and a linear pressure of 78.4 N/cm under the conditions of a temperature of 23 ° C and a relative humidity of 50%. 92. After 30 minutes from the pasting, the tensile tester was used to peel the angle 180. Further, when the stretching speed is a3 m/min, the force is released when the front end of the first masking tape is stretched at a speed of 〇3 m/min and peeled off in a direction overlapping the remaining portion of the first masking belt 11. Further, the adhesion of the second ❹ masking tape 12 to the first masking tape U is greater than or equal to 1 N/2 〇 mm or more than the adhesion of the first masking tape 11 to the non-coated region 92. Thus, by making the adhesion of the second masking strip 12 to the masking strip 11 larger than the adhesion of the first masking strip 11 to the substrate 9, the stripping device 4 is held by the peeling strip 45. When the masking tape 12 is shielded, the first shielding tape can be prevented from being soiled. 11 is peeled off from the second shielding tape 12 and remains on the substrate 9, so that the first shielding tape 11 and the second shielding tape 12 can be easily picked up (i.e., by a single time) Peeling action) peeling. Further, in the tape peeling device 4, the second cover 098108393 33 200946245 on which the organic EL liquid adheres is covered with the peeling tape 45 and the mask tape 1 is peeled off from the substrate 9, so that the second mask is not attached. The organic EL liquid on the belt 12 falls onto the substrate 9 to recover the masking tape 1. Further, the peeling tape 45 is adhered to the beginning of the masking tape 1, and may be performed on the substrate 9 which is moved at a speed equal to the supply speed of the peeling tape 45 under the supply peeling tape 45. In the coating system 8 shown in Fig. 1, when the masking tape 1' is peeled off from the substrate 9, the substrate 9 is carried out from the tape peeling device 4 to the outside of the coating system 8, and the application of the organic EL liquid to the substrate 9 is completed. Further, in the coating system 8, actually, the adhesion of the masking tape 1, the application of the organic EL liquid, and the peeling of the masking tape i are continuously performed on the plurality of substrates. As described above, in the coating system 8 shown in Fig. 1, the boundary between the uncoated region 92 and the coating region 91 can be prevented by the tape bonding device 2, the coating device 3, and the tape peeling device 4. The meniscus is generated and the substrate 9 coated with the organic EL liquid only in the coating region 91 can be easily obtained. However, the film thickness of the organic EL layer formed on the substrate for the organic EL display device (that is, the film thickness of the organic EL material formed by drying the organic EL liquid) has a large influence on the display performance of the flat display device, and the like. Control with high precision. Therefore, the coating system 8 which prevents the occurrence of the meniscus and improves the uniformity of the film thickness of the organic EL layer is particularly suitable for application of the organic EL liquid to the substrate for an organic EL display device. Further, even in a flat display device other than the organic rainbow display device, as in the case of the organic EL display device, the film thickness of the pixel formation material formed on the substrate must be high-precision (iv), 098108393 34 200946245, so that the coating system 8 can be said It is also suitable for applying a fluid material comprising a pixel forming material for a flat display device. The tape applicator of the coating system according to the second embodiment of the present invention will be described. ® 14 is a plan view of the second embodiment with a slim % device. In the belt (4) device 2a, the first tape bonding head 23 with the first tape bonding head 23 and the second tape bonding head 23 shown in Fig. 4 are provided. The other configuration of the tape-attaching device 2a is the same as that of the tape-attaching device 2 shown in Figs. 4 to 2, which means that the components corresponding to the same components are the same. Fig. 15A is an enlarged left side view showing the structure of the tape attaching head 2, and in Fig. 15A, the internal configuration of the case 231 with the adhesive head 23b is depicted in the same manner as Fig. 7A and Fig. 7B. As shown in FIG. 15A, the tape attaching head 23b further includes a second supply reel 232a, a second recovery reel 234a, and a tape bonding portion 23, in addition to the configuration of the first tape attaching head 23 shown in FIG. 7A. The second supply supply reel 232a is a second tape supply unit that winds up the tape 27a holding the second shielding tape 12 on the main surface of the base tape 271, and the second recovery reel 23 is a take-up tape 27a. The second tape collecting portion that is collected by the base tape 271 adheres the second masking tape 12 to the first masking tape 11 . The other components of the adhesive tape are the same as those of the first tape bonding head 23 shown in Fig. 7A, and the same components are denoted by the corresponding components in the following description. Further, the tape attaching head 23b is disposed in the same direction as the i-th tape attaching head 23 shown in Fig. 7A. When the second cover 098108393 35 200946245 band 11 and the second mask band 12 are adhered to the substrate 9 by the tape attaching device 2a shown in FIG. 14, first, the head moving mechanism 24 shown in FIG. 14 is used to move the tape sticking head 2_χ direction. On the other hand, the substrate 9 is positioned above the moving path, and the substrate 9 is moved in the (+γ) direction by the substrate moving mechanism 22, and is located at the beginning of the pasting position shown in FIG. In the tape bonding head 23b, a portion of the second masking tape 12 that is unwound from the second supply reel and peeled off from the base tape 271 is unwound from the first supply reel 232 as the second tape supply unit. The belt 27 (i.e., the base tape 271 and the first masking tape 11 held on the main surface of the base tape 271) are clamped together with the rollers 2301 and 2302 of the tape fitting portion 230, whereby the second tape is disposed at the second tape. The substrate 11111 (see FIG. 3) is adhered to the lower layer 1222 of the adhesive layer 122 of the second masking tape 12 (see FIG. 3). Next, the first masking tape η is cut by the cutting portion 235' of the pressing portion 233. The second shielding tape 12 is cut from the second shielding tape 12 side, and the first shielding tape η and the second shielding tape 12 ′ are separated from the base tape 271 at the front end of the tape separating member 236, and the front end portion thereof is from the lower portion of the casing 231. The opening 237 is moved toward the substrate 9. Further, 'in parallel with this, the adhesive roller 239 is moved downward by the lower opening 237 by the air cylinder 238 of the pressing portion 233, and the first shielding tape 11 and the second surface are bonded as shown in Fig. 15A. The front end portion of the masking tape 12 is placed such that the adhesive layer 112 (see FIG. 3) of the first masking tape 11 faces the substrate 9 and is formed from the substrate 121 of the second masking strip 12 ( Referring to Fig. 3), the main surface 90 of the substrate 9 is pressed and adhered, and the substrate 9 starts moving in the direction of Fig. 15 (+Υ). Then, 'from the first supply reel 232 and the second supply reel 232a, respectively, 098108393 36 200946245 The feeding belt 27 and the belt 27a' are continuously fed, and the second moving belt 12 and the second shielding belt 12 are pressed by the bonding roller 239 of the pressing portion 233, and the substrate moving mechanism 22 shown in Fig. 14 is used. The boundary of the substrate 9 is recorded at the boundary of the recording area % (〇2), and the parallel object is moved (ie, (+γ) direction), thereby causing the 主!, by the #嫌^& masking tape on the main surface 90 of the substrate 9. 11 and the second masking tape ΐ 2 (i.e., the masking tape 1) are attached to the uncoated region % along the boundary 92G.

在圖15Α所示之帶黏貼頭挪+,藉由切斷部故再度 切斷基底帶271上之第丨遮蔽帶u及第2遮蔽帶η,藉由 將第1遮蔽帶11及第2遮蔽帶12黏貼於基板9至後端部為 止’而將遮蔽帶1之第1遮蔽帶11密接於基板9之主面90。 在圖14所示之帶黏貼裝置2&中,基板移動機構22及帶黏 貼頭別成為將第丨遮蔽帶u及第2遮蔽帶u黏貼於基板 9之主面90的非塗佈區域92之黏貼機構。 另外,圖15A所示第i遮蔽帶u與第2遮蔽帶12之開 始黏貼’亦可在供給帶27與帶27a下對以等於該等帶之供 給速度的速度移動的基板9來進行。此外,在帶黏貼頭说 中’亦可在黏貼第i遮蔽帶U與第2遮蔽帶12之前端部與 後端部時以外’解除按壓第!遮蔽帶u與第2遮蔽帶12。 換言之’在帶黏貼裝置2a之黏貼機構中,#黏貼第!遮蔽 帶11與第2遮蔽帶12之至少前端部與後端部時保持第i 遮蔽帶Π與第2遮㈣!2對基板9按押之狀態下,使基板 9對帶黏貼頭23b之按押部233朝掃插方向相對移動,藉此 098108393 37 200946245 使第1遮蔽帶11與第2遮蔽帶12黏貼於基板9上之非塗佈 區域92。 在經帶黏貼裝置2a黏貼有第!遮蔽帶u與第2遮蔽帶 12的基板9中,與第丨實施形態相同地(參照圖3),第i遮 蔽帶11寬度方向兩側(即(+χ)侧與(_χ)侧)之第i下面邊緣 1123係位於較非塗佈區域92與塗佈區域91間之邊界92〇 更靠非塗佈區域92内侧,第2遮蔽帶12兩侧之第2下面邊 緣1223係位於較第1遮蔽帶Π之第1上面邊緣1113更靠 外侧。藉此,在寬度方向兩側,從第1遮蔽帶U朝外侧突 出的第2遮蔽帶12 —部分成為簷部12〇。 在第2實施形態之帶黏貼裝置2a中,由於帶黏貼頭23b 使第1遮蔽帶11與第2遮蔽帶12相貼合,因此經由基板移 動機構22朝Y方向每1次之移動’可將第1遮蔽帶u與 第2遮蔽帶12同時黏貼於基板9之非塗饰區域92。結果, 可實現遮蔽帶1對基板9的迅速黏貼。 另一方面,在第1實施形態之帶黏貼裝置2中,藉由使第 1帶黏貼頭23與第2帶黏貼頭23a之構造簡單,更進—步 使二帶黏貼頭之構造共通,而可使帶黏貼裝置2之襄置構造 簡單化。 在第2實施形態之塗佈系統中,於非塗佈區域92黏貼有 具有簷部120(參照圖11A)之遮蔽帶1(即第1遮蔽帶u與第 2遮蔽帶12)的基板9,係從帶黏貼裝置2a搬出而搬入於塗 098108393 38 200946245 佈裝置3中。然後,與第i實施形態同樣地,在塗佈有機 EL液後,搬入至帶剝離裝置4而剝離遮蔽帶i。 在第2實施形態之塗佈系統中,藉由經帶黏貼裝置2&黏 貼的遮蔽帶1 ’與第1實施形態同樣地可防止從塗佈裝置3 之喷嘴37(參照圖8與圖9)吐出至基板9上的有機EL液附 著於非塗佈區域92之露出區域921(參照圖11A),同時亦可 防止附著在非塗佈區域92上所黏貼第1遮蔽帶11之兩侧侧 ❹面u〇3(參照圖11A)。結果,可容易地防止在非塗佈區域 92與兩侧塗佈區域91間之邊界92〇發生彎液面,可防止在 後步驟中於有機EL材料之膜上所形成其他膜之厚度不足等 不良情形。 在帶黏貼裝置2a中,與第1實施形態同樣地,藉由將第 1遮蔽帶11與第2遮蔽帶12以各自中心線重疊於非塗佈區 域92之中心線方式黏貼,而可使有機el液對非塗佈區域 參 92之些微附著、和塗佈區域91中有機EL液之開始塗佈位 置與邊界920之些微離開的態樣相同。結果,可使有機EL 液對非塗佈區域92兩側之2個塗佈區域91的塗佈品質均句 化。此外,藉由使第2遮蔽帶12之寬度等於非塗佈區域92 •之寬度,俯視下第2遮蔽帶12之邊緣重疊於非塗佈區域92 兩側邊界920方式黏貼第2遮蔽帶12,而可更加確實防止 有機EL液附著至非塗佈區域92。 在遮蔽帶1中,與第1實施形態同樣地’藉由使第2遮蔽 098108393 39 200946245 帶12之簷部120下面1202平行於基板9之主面90,而可 防止附著在第2遮蔽帶12侧面1203(參照圖11A)的有機EL 液附著於第1遮蔽帶11之側面1103與非塗佈區域92。 再者,在第2實施形態之塗佈系統中,於藉由帶黏貼裝置 2a黏貼於基板9的遮蔽帶1中,與第1實施形態同樣地, 第2遮蔽帶12對第1遮蔽帶11的黏著力為大於第1遮蔽帶 11對基板9的黏著力。藉此,在帶剝離裝置中,可容易地 將第1遮蔽帶11與第2遮蔽帶12 —起(即由單次剝離動作) 剝離。 接著’針對本發明第3實施形態塗佈系統之帶黏貼裝置進 行說明。圖16所示係第3實施形態帶黏貼裝置2b之俯視 圖。如圖16所示,帶黏貼裝置2b係具備有:第1帶黏貼裝 置201a、第2帶黏貼裝置201b、及搬送機構202,該搬送 機構202被配置於第!帶黏貼裝置2〇la與第2帶黏貼裝置 201b間而將基板9從第1帶黏貼裝置201a搬出,同時搬入 於第2帶黏貼裝置2〇lb。第1帶黏貼裝置201a除未設置第 2帶黏貼頭23a之處外,其餘具備有與圖4至圖6所示帶黏 貼裝置2相同的構成。又,第2帶黏貼裝置2〇lb除未設置 第1帶黏貼頭23之處外,其餘具備有與圖4至圖6所示帶 黏貼裝置2相同的構成。 第1帶黏貼裝置2〇ia與圖4所示帶黏貼裝置2同樣地, 具備有:基板保持部21、基板移動機構22、第丨帶黏貼頭 098108393 200946245 23、及頭移動㈣24,該基板保持部2i係保持基板g,該 基板移動機構22係使基板9朝掃插方向(即圖16中¥方向) 移動,該第1帶黏貼頭23係在基板9上之非塗佈區域92 黏貼著第1遮蔽帶11(參照圖3),該頭移動機構24係使第 1帶黏貼頭23朝與掃描方向垂直之方向(即圖16fx方⑷ 移動。在第1帶黏貼裝置2〇la令,基板移動機構22與第1 帶黏貼頭23成為將第i遮蔽帶u黏貼於基板9之主面% ❹的非塗佈區域92之第1黏貼機構。 第2帶黏貼裝置201b亦與第i帶黏貼裝置2〇1&同樣地, 具備有:保持基板9的基板保持部21、使基板9朝掃描方 向移動的基板移動機構22、於已黏貼在基板9上的第工遮 蔽帶11之上面1111黏貼第2遮蔽帶12(參照圖3)的第2帶 黏貼頭23a、及使第2帶黏貼頭23&朝與掃描方向垂直之方 向移動的頭移動機構24。於第2帶黏貼裝置2〇lb中,基板 ⑩移動機構22與第2帶黏貼頭23a成為將第2遮蔽帶12黏貼 於已黏貼在基板9之主面90的第1遮蔽帶η之上面llu 的第2黏貼機構。 在第3實施形態之帶黏貼裝置2b中,藉由第1帶點貼裝 ' 置2〇la,與第1實施形態同樣地(參照圖3)使第1遮蔽帶u 之寬度方向兩側(即(+X)側與(-X)侧)的第1下面邊緣1123位 於較非塗佈區域92與塗佈區域91間之邊界920更靠非塗佈 區域92内側,並將第1遮蔽帶11與邊界920平行地點貼在 098108393 41 200946245 非塗佈區域92。黏貼有第1遮蔽帶11的基板9,由搬送機 構202從第1帶黏貼裝置201a搬出而搬入於第2帶黏貼裝 置 201b 。 然後,藉由第2帶黏貼裝置201b,在寬度方向兩側,使 第2遮蔽帶12之第2下面邊緣1223位於較第1遮蔽帶u 之第1上面邊緣1113更靠外侧,並將第2遮蔽帶12與邊界 920平行地黏貼在第1遮蔽帶11之上面1111。藉此,在寬 度方向兩侧中,從第i遮蔽帶11朝外侧突出的第2遮蔽帶 12 —部分成為簷部120。 結果,在第3實施形態的塗佈系統中,與第〗實施形態同 樣地,可防止從塗佈裝置3之喷嘴37(參照圖8與圖9)吐出 至基板9上的有機El液附著於非塗佈區域92之露出區域 921(參照圖liA),同時亦可防止附著於非塗佈區域%上所 黏貼第1遮蔽帶11之兩側侧面1103(參照圖11A)。藉此, 可容易地防止在非塗佈區域92與兩側塗佈區域91間之邊界 920發生彎液面。 接著,針對本發明第4實施形態塗佈系統之帶黏貼裝置進 行說明。第4實施形態之帶黏貼裝置,除從圖4至圖6所示 之帶黏貼裝置2中省略第2帶黏貼頭23a之處外,其餘具備 有與帶黏貼裝置2相同之構成,在以下說明中,就對應之構 成賦予相同之元件符號。 在第4實施形態之帶黏貼裝置中,在第丨遮蔽帶u上面 098108393 42 200946245 1111預先黏貼有第2遮蔽帶12的遮蔽帶1(參照圖3),在已 保持於基底帶271 —面的狀態下與基底帶271 —起捲繞於圖 7A所示第1帶黏貼頭23内之第1供給捲盤232。然後,使 第1遮蔽帶11之下面1122(參照圖3)對向於基板9,並在將 第1遮蔽帶11與平行黏貼於第1遮蔽帶11的第2遮蔽帶 12按壓至基板9之主面90的狀態下,利用基板移動機構22 使基板9朝掃描方向移動,藉此在基板9之非塗佈區域92 ® 黏貼遮蔽帶1(即第1遮蔽帶11與第2遮蔽帶12)。 在遮蔽帶1中,與由第1實施形態之帶黏貼裝置2在基板 9上依序黏貼而形成第1遮蔽帶11與第2遮蔽帶12的情況 同樣地,在寬度方向兩侧之侧部,第2遮蔽帶12之第2下 面邊緣1223位於較第1遮蔽帶11之第1上面邊緣m3更 靠外侧。藉此,第2遮蔽帶12中從第1遮蔽帶11朝寬度方 向外侧突出之部位、即簷部120,係位於較基板9之主面 ® 90(即包含第1遮蔽帶η下面U22的平面)更靠上方。結果, 與第1實施形態同樣地,可容易防止在非塗佈區域92與兩 側塗佈區域91間之邊界920發生彎液面。 以上,針對本發明實施形態進行說明,惟本發明不受限於 - 上述實施形態,可有各種之變更。 例如在黏貼於基板9之非塗佈區域92的遮蔽帶1中,第 1遮蔽帶11之兩侧侧面1103未必要略垂直於基板9之主面 90(即略垂直於第1遮蔽帶11之下面1122),只要第1遮蔽 098108393 43 200946245 帶11之第1上面邊緣1113位於較第2遮蔽帶12之第2下 面邊緣1223,更靠寬度方向内側,則亦可伴隨離開基板9 之主面90而朝寬度方向之内侧或外侧傾斜。 關於第2遮蔽帶12亦同樣地’第2遮蔽帶12之兩側侧面 ❹ 1203,未必要略垂直於基板9之主面9〇(即略垂直於第2遮 蔽帶12之下面1222) ’亦可伴隨離開基板9之主面9〇而朝 寬度方向之内侧或外側傾斜。然而,藉由使第2遮蔽帶12 之最大寬度等於非塗佈區域92之寬度,並使第2遮蔽帶12 之寬度方向邊緣俯視下重疊於非塗佈區域92兩侧之邊界 920,而可更確實地防止有機EL液附著於非塗佈區域%。丨 在遮蔽帶!中,詹部120之下心〇2未必要平行於基相 9之主面90,但藉由使詹部120之下面12〇2大致平行於基 板9之主面90,而如上述可防止有機虹液附著於第工遮蔽 帶11之侧面聰和非塗佈區域92。此外,第i遮蔽帶^In the tape sticking head shown in FIG. 15A, the second masking tape u and the second masking tape η on the base tape 271 are again cut by the cutting portion, and the first masking tape 11 and the second masking layer are shielded. The tape 12 is adhered to the substrate 9 to the rear end portion, and the first masking tape 11 of the masking tape 1 is adhered to the main surface 90 of the substrate 9. In the tape bonding apparatus 2 & shown in FIG. 14, the substrate moving mechanism 22 and the tape bonding head are attached to the non-coating region 92 of the main surface 90 of the substrate 9 by the second masking tape u and the second masking tape u. Adhesive mechanism. Further, the opening of the i-th shield band u and the second mask band 12 shown in Fig. 15A can also be performed on the substrate 9 which is moved at a speed equal to the feed speed of the tapes under the supply belt 27 and the belt 27a. Further, in the case of the adhesive head, it is also possible to cancel the pressing of the first and second rear ends of the second masking tape U and the second masking tape 12; The shielding tape u and the second shielding tape 12 are provided. In other words, 'In the pasting mechanism with the adhesive device 2a, #贴贴第! When the shielding tape 11 and the second shielding tape 12 are at least the front end portion and the rear end portion, the i-th shielding tape and the second shielding (four) are held! When the pair of substrates 9 are pressed, the substrate 9 is relatively moved toward the sweeping direction by the pressing portion 233 of the adhesive head 23b, whereby the first masking strip 11 and the second masking strip 12 are adhered to the substrate by 098108393 37 200946245. 9 non-coated area 92. Adhesively attached to the tape-attaching device 2a! In the substrate 9 of the masking tape u and the second masking tape 12, similarly to the second embodiment (see FIG. 3), the i-th shielding tape 11 is on both sides in the width direction (ie, the (+χ) side and the (_χ) side). The i-th lower edge 1123 is located on the inner side of the non-coated region 92 between the non-coated region 92 and the coating region 91, and the second lower edge 1223 on both sides of the second shielding tape 12 is located at the first The first upper edge 1113 of the masking tape is further outside. Thereby, the second shielding tape 12 protruding from the first shielding tape U toward the outside in the width direction is partially formed as the crotch portion 12A. In the tape sticking device 2a of the second embodiment, since the first masking tape 11 and the second masking tape 12 are bonded to each other by the tape bonding head 23b, the substrate moving mechanism 22 moves in the Y direction every time. The first masking tape u and the second masking tape 12 are simultaneously adhered to the uncoated region 92 of the substrate 9 . As a result, rapid adhesion of the masking tape 1 to the substrate 9 can be achieved. On the other hand, in the tape sticking device 2 of the first embodiment, the structure of the first tape bonding head 23 and the second tape bonding head 23a is made simple, and the structure of the two tape bonding heads is further advanced. The structure of the tape-attaching device 2 can be simplified. In the coating system of the second embodiment, the substrate 9 having the masking tape 1 (that is, the first shielding tape u and the second shielding tape 12) having the crotch portion 120 (see FIG. 11A) is adhered to the non-coating region 92, It is carried out from the tape-attaching device 2a and carried into the cloth device 3 of 098108393 38 200946245. Then, in the same manner as in the i-th embodiment, after the organic EL liquid is applied, it is carried into the tape stripping device 4 to peel off the masking tape i. In the coating system of the second embodiment, the mask 37 from the coating device 3 can be prevented by the masking tape 1' adhered by the tape bonding device 2 & in the same manner as in the first embodiment (see Figs. 8 and 9). The organic EL liquid discharged onto the substrate 9 adheres to the exposed region 921 of the non-coating region 92 (see FIG. 11A), and also prevents the two sides of the first masking tape 11 from adhering to the non-coating region 92. Face u〇3 (refer to Fig. 11A). As a result, it is possible to easily prevent the meniscus from occurring at the boundary 92 between the non-coating region 92 and the both-side coating regions 91, and it is possible to prevent the thickness of other films formed on the film of the organic EL material from being insufficient in the subsequent step, and the like. Bad situation. In the tape attaching device 2a, as in the first embodiment, the first masking tape 11 and the second masking tape 12 are adhered so as to overlap the center line of the non-coating region 92 with the respective center lines. The slight adhesion of the el liquid to the non-coated region reference 92 and the initial application position of the organic EL liquid in the coated region 91 are the same as those of the boundary 920. As a result, the coating quality of the organic EL liquid to the two coating regions 91 on both sides of the non-coating region 92 can be made uniform. Further, by making the width of the second masking strip 12 equal to the width of the non-coating region 92, the second masking strip 12 is adhered to the edge 920 of the non-coated region 92 in a plan view, and the edge of the second masking strip 12 is overlapped. Further, it is possible to more surely prevent the organic EL liquid from adhering to the non-coating region 92. In the masking belt 1, as in the first embodiment, the second masking belt 12 can be prevented from adhering to the second masking belt 12 by making the lower surface 1202 of the second portion 098108393 39 200946245 belt 12 parallel to the main surface 90 of the substrate 9. The organic EL liquid on the side surface 1203 (see FIG. 11A) adheres to the side surface 1103 of the first masking strip 11 and the non-coating region 92. Furthermore, in the coating system of the second embodiment, the second masking tape 12 is applied to the first masking tape 11 in the masking tape 1 which is adhered to the substrate 9 by the tape bonding apparatus 2a, similarly to the first embodiment. The adhesion is greater than the adhesion of the first masking strip 11 to the substrate 9. Thereby, in the tape peeling apparatus, the first masking tape 11 and the second masking tape 12 can be easily peeled off (i.e., by a single peeling operation). Next, the tape application device of the coating system according to the third embodiment of the present invention will be described. Fig. 16 is a plan view showing the tape-attaching device 2b of the third embodiment. As shown in Fig. 16, the tape attaching device 2b is provided with a first tape attaching device 201a, a second tape attaching device 201b, and a transport mechanism 202, and the transport mechanism 202 is disposed in the first! The substrate 9 is carried out from the first tape bonding device 201a and the second tape bonding device 2〇1b is carried out between the tape bonding device 2〇1a and the second tape bonding device 201b. The first tape attaching device 201a has the same configuration as that of the tape attaching device 2 shown in Figs. 4 to 6 except that the second tape attaching head 23a is not provided. Further, the second tape attaching device 2 〇 lb has the same configuration as that of the tape attaching device 2 shown in Figs. 4 to 6 except that the first tape attaching head 23 is not provided. Similarly to the tape-attaching device 2 shown in FIG. 4, the first tape attaching device 2A includes a substrate holding portion 21, a substrate moving mechanism 22, a third tape bonding head 098108393 200946245 23, and a head moving (four) 24, which holds the substrate. The portion 2i holds the substrate g, and the substrate moving mechanism 22 moves the substrate 9 in the sweeping direction (that is, in the direction of ¥ in FIG. 16), and the first tape bonding head 23 is adhered to the non-coating region 92 on the substrate 9. In the first masking belt 11 (see FIG. 3), the head moving mechanism 24 moves the first tape bonding head 23 in a direction perpendicular to the scanning direction (that is, in the direction of FIG. 16fx (4). In the first tape bonding device 2, The substrate moving mechanism 22 and the first tape bonding head 23 are the first bonding means for adhering the i-th shielding tape u to the non-coating region 92 of the main surface of the substrate 9. The second tape bonding device 201b is also the i-th tape. Similarly, the bonding apparatus 2 〇 1 & is provided with the substrate holding part 21 which hold|maintains the board|substrate 9, and the board|substrate movement mechanism 22 which moves the board|substrate 9 in the scanning direction, and the upper surface 1111 of the masking tape 11 adhered on the board|substrate 9 Adhering to the second tape bonding head 23a of the second masking tape 12 (see FIG. 3) and bonding the second tape The head 23 & a head moving mechanism 24 that moves in a direction perpendicular to the scanning direction. In the second tape attaching device 2 〇 lb, the substrate 10 moving mechanism 22 and the second tape applying head 23a adhere the second masking tape 12 to the second masking tape 12 a second bonding mechanism that is adhered to the upper surface 11u of the first masking tape η of the main surface 90 of the substrate 9. In the tape attaching device 2b of the third embodiment, the first tape mounting device 2b is placed on the first tape. In the same manner as in the first embodiment (see FIG. 3), the first lower edge 1123 on both sides in the width direction of the first masking tape u (ie, the (+X) side and the (-X) side) is located in the non-coated region 92 and The boundary 920 between the coating regions 91 is further inside the non-coated region 92, and the first masking strip 11 and the boundary 920 are placed in parallel with each other at 098108393 41 200946245 uncoated region 92. The substrate 9 to which the first masking tape 11 is adhered The conveyance mechanism 202 is carried out from the first tape application device 201a and carried into the second tape attachment device 201b. Then, the second tape attachment device 201b is used to make the second tape mask 12 on the both sides in the width direction. The edge 1223 is located outside the first upper edge 1113 of the first masking band u, and the second masking band 12 is bordered 920 is adhered to the upper surface 1111 of the first masking strip 11 in parallel. Thereby, the second masking strip 12 protruding outward from the i-th shielding strip 11 is partially formed as the crotch portion 120 on both sides in the width direction. In the coating system of the embodiment, as in the first embodiment, the organic EL liquid discharged from the nozzle 37 (see FIGS. 8 and 9) of the coating device 3 to the substrate 9 can be prevented from adhering to the non-coated region. The exposed area 921 of 92 (see FIG. LiA) can also prevent the side surfaces 1103 of the first masking strip 11 from adhering to the non-coated area % (see FIG. 11A). Thereby, it is possible to easily prevent the meniscus from occurring at the boundary 920 between the non-coating region 92 and the both-side coating regions 91. Next, a tape applying device of a coating system according to a fourth embodiment of the present invention will be described. The tape sticking device of the fourth embodiment has the same configuration as that of the tape attaching device 2 except that the second tape attaching head 23a is omitted from the tape sticking device 2 shown in Figs. 4 to 6, and the following description will be given. In the meantime, the corresponding component symbols are assigned to the corresponding components. In the tape sticking apparatus of the fourth embodiment, the mask tape 1 (see FIG. 3) in which the second masking tape 12 is adhered to the top surface of the second masking tape u 098108393 42 200946245 1111 is held on the surface of the base tape 271. In the state, the first supply reel 232 is wound around the base tape 271 in the first tape attaching head 23 shown in Fig. 7A. Then, the lower surface 1122 (see FIG. 3) of the first masking strip 11 is opposed to the substrate 9, and the first masking strip 11 and the second masking strip 12 adhered in parallel to the first masking strip 11 are pressed against the substrate 9. In the state of the main surface 90, the substrate 9 is moved in the scanning direction by the substrate moving mechanism 22, whereby the masking tape 1 is adhered to the non-coating region 92 of the substrate 9 (that is, the first masking strip 11 and the second masking strip 12). . In the masking tape 1 as in the case where the first masking tape 11 and the second masking tape 12 are formed by sequentially adhering to the substrate 9 by the tape sticking device 2 of the first embodiment, the side portions on both sides in the width direction are formed. The second lower edge 1223 of the second masking strip 12 is located outside the first upper edge m3 of the first masking strip 11. Thereby, the portion of the second masking belt 12 that protrudes outward from the first masking belt 11 in the width direction, that is, the dam portion 120 is located on the main surface of the substrate 9® 90 (that is, the plane including the U22 below the first masking tape η). ) More on top. As a result, similarly to the first embodiment, it is possible to easily prevent the meniscus from occurring at the boundary 920 between the non-coating region 92 and the both side application regions 91. The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, and various modifications are possible. For example, in the masking tape 1 adhered to the non-coated region 92 of the substrate 9, the side surfaces 1103 of the first masking strip 11 are not necessarily perpendicular to the main surface 90 of the substrate 9 (ie, slightly perpendicular to the first masking strip 11). In the following 1122), as long as the first upper edge 1113 of the first shielding 098108393 43 200946245 belt 11 is located on the second lower edge 1223 of the second shielding tape 12, and further inward in the width direction, the main surface 90 of the substrate 9 may be accompanied. It is inclined toward the inside or outside of the width direction. Similarly, in the second masking strip 12, the side surfaces 1202 of the second masking strip 12 are not necessarily perpendicular to the main surface 9 of the substrate 9 (i.e., slightly perpendicular to the lower surface 1222 of the second masking strip 12). It may be inclined toward the inner side or the outer side in the width direction with the main surface 9〇 of the substrate 9 being separated. However, by making the maximum width of the second masking strip 12 equal to the width of the non-coated region 92, and overlapping the widthwise edges of the second masking strip 12 in a plan view and overlapping the boundary 920 on both sides of the non-coated region 92, It is more sure to prevent the organic EL liquid from adhering to the non-coated area %.丨 In the masking belt! In the middle, the heart 2 of the Zhan section 120 is not necessarily parallel to the main surface 90 of the base phase 9, but by making the lower surface 12 of the Zhan section 120 substantially parallel to the main surface 90 of the substrate 9, the organic rainbow can be prevented as described above. The liquid adheres to the side and uncoated regions 92 of the work mask 11 . In addition, the i-th shield tape ^

與第2遮蔽帶12的各中心線未必要重疊於非塗佈區域% 之中心線’但藉诚第1遮蔽帶U與第2遮蔽帶12之中心 線分別大致重纽麵魅域92之中心線而將第i遮蔽帶 U與第2遮蔽帶12黏貼於非塗佈區域92,而如上述可使有 機EL液對非塗佈區域^ 質均句化。—兩侧之2個塗佈區域㈣塗佈品 在第1實施形態之帶激日μ w f貼裝置2中,亦可取代利用基板移 動機構22使基板9朝播杆士人1 乃輙描方向的移動,改為使第1帶黏貼 098108393 44 200946245 =與二2帶黏貼頭23a分別朝掃摇方向移動,藉此實現 基於掃描方向對第:按押部233之相對移〜實現 =押部"a之相對移動。此外,亦可取代:頭移 =使第i帶黏貼頭23與第2帶黏貼頭23&移動: 移動=9與基板保持部21 —起朝與掃描方向垂直之方向 e ❹ =黏貼裝置2中’亦可使第1帶黏貼_與第2帶黏 移動時^方向配置’當基板9朝(A方向(或(+Υ)方向) 移動時’與利用第1帶黏貼頭 Π) 利用第2帶黏貼頭23a黏貼第二:遽蔽帶11並行地, 佈區域92的其他第心帶第JH:至已黏貼於非塗 .雄 帶11上。此外,於帶黏貼裝置2 於^帶黏貼頭23與第2帶黏貼頭仏之各構 :毅體’由頭移動機構―與掃描方向垂直: 在第2實施形態之帶黏貼裝置&中,亦可取代利用 =構22使基板9朝掃描方向移動,改為使帶黏貼頭;3b 朝知描方向移動’藉此實現基板9斜按押部233之 =,亦可取代利用頭移動機構24使帶黏貼頭 動’改為使基板9與基板保持部21_起朝與掃描方向垂直 之方向移動。 =遮蔽帶η在黏貼於基板9前⑽態下未必要保持於 基⑽1’亦可使第1遮蔽帶11單體保持於帶黏貼裳置(第 098108393 45 200946245 2遮蔽帶12亦同)。 遮蔽帶1亦可藉由叠層3片以上遮蔽帶而構成。例如在由 3層遮蔽帶構成遮蔽帶丨之情況下,當中間層遮蔽帶之寬度 小於最上層遮蔽帶之寬度時,中間層之遮蔽帶可與最下層之 遮蔽帶一起被視作上述第1遮蔽帶。此外,當中間層之遮蔽 帶的寬度較大於最下層之遮蔽帶的寬度時,中間層之遮蔽帶 可與最上層之遮蔽帶一起被視作上述第2遮蔽帶。 在上述實施形態塗佈系統之塗佈裝置3中,設在塗佈頭 〇 34的喷嘴個數並不限於3個,又3種有機el液未必要同時 塗佈。例如亦可從3個以上喷嘴同時吐出同-種有機EL液 而塗佈至基板9。在此情況下,相鄰2個喷嘴間在副掃描方 向的距離,係等於隔間壁間距的3倍。另外,在基板9之塗 佈區域未必要形成關壁,亦可錢似置3中對未設 置有隔間壁的塗佈區域9卜以既定間距塗佈有機此液。 再者’於塗佈系統中,亦可取代2個固定型之搬送機器人❹ 81(參照圖1)’改為將自走式之!個(或複數)搬送機器人設 為依序搬送基板9至帶黏貼裝置2、塗佈裝置3及帶剝離裝 置4的基板搬送機構。 上述塗佈系統除有機EL液之塗佈外,亦可利用在當對有 機EL顯示裝置用基板9塗佈含有電洞輸送材料的流動性材 料(以下稱「電洞輸送液」)塗伟防止電洞輸送液附著於非塗 佈區域92之情況。此處,所謂「電洞輪送材料」係指形成 098108393 46 200946245 有機£L·顯示裝晉少It is not necessary to overlap the center line of the non-coated area % with the center line of the second masking band 12, but the center lines of the first masking strip U and the second masking strip 12 are substantially centered on the center of the charm area 92, respectively. The i-th shielding tape U and the second masking tape 12 are adhered to the non-coating region 92 by the wire, and as described above, the organic EL liquid can be made uniform for the non-coating region. - Two coated areas on the both sides (four) coated article In the first embodiment of the first embodiment, the substrate moving mechanism 22 may be used to make the substrate 9 toward the broadcaster 1 The movement is changed so that the first tape is pasted 098108393 44 200946245 = the second tape bonding head 23a is moved toward the sweeping direction, thereby achieving the relative shift based on the scanning direction to the first: the pressing portion 233 ;a relative movement. In addition, it is also possible to replace: head shift = make the i-th adhesive head 23 and the second adhesive head 23 & move: movement = 9 with the substrate holding portion 21 in the direction perpendicular to the scanning direction e ❹ = in the pasting device 2 'When the first tape is attached _ and the second tape is moved in the direction of the ^ direction, when the substrate 9 is moved in the (A direction (or (+) direction), and the first tape is used, the second tape is used. Adhesive head 23a is adhered to the second: the masking strip 11 is in parallel, and the other center strips of the cloth region 92 are JH: to be adhered to the non-coated male belt 11. Further, in the tape-attaching device 2, the tape-attachment head 23 and the second tape-adhesive head 仏 are configured to be perpendicular to the scanning direction: in the tape-attaching device of the second embodiment, Alternatively, instead of using the head moving mechanism 24, the substrate 9 may be moved in the scanning direction by the use of the structure 22, and the tape bonding head may be moved; 3b is moved toward the direction of the drawing. The tape-adhesive head movement is changed so that the substrate 9 and the substrate holding portion 21_ move in a direction perpendicular to the scanning direction. = The masking tape η is not necessarily held by the base (10) 1' before being adhered to the substrate 9 (10), and the first masking strip 11 can be held by the adhesive tape (the same applies to the masking tape 12 of 098108393 45 200946245 2). The masking tape 1 can also be constructed by laminating three or more masking tapes. For example, in the case where the masking tape is constituted by three layers of masking tapes, when the width of the intermediate layer masking tape is smaller than the width of the uppermost masking tape, the masking tape of the intermediate layer can be regarded as the first one together with the masking tape of the lowermost layer. Masking tape. Further, when the width of the masking layer of the intermediate layer is larger than the width of the masking tape of the lowermost layer, the masking tape of the intermediate layer can be regarded as the second masking tape together with the masking tape of the uppermost layer. In the coating apparatus 3 of the coating system of the above embodiment, the number of nozzles provided in the coating head 〇 34 is not limited to three, and the three kinds of organic EL liquids are not necessarily coated at the same time. For example, the same type of organic EL liquid may be simultaneously discharged from three or more nozzles and applied to the substrate 9. In this case, the distance between the adjacent two nozzles in the sub-scanning direction is equal to three times the spacing of the partition walls. Further, it is not necessary to form a closed wall in the coating region of the substrate 9, and the organic coating liquid may be applied to the coating region 9 where no partition wall is provided, at a predetermined interval. Furthermore, in the coating system, it is also possible to replace the two fixed type transfer robots ❹ 81 (see Fig. 1) to be self-propelled! The (or plural) transport robots are configured to sequentially transport the substrate 9 to the tape-attaching device 2, the coating device 3, and the substrate transfer mechanism with the peeling device 4. In addition to the application of the organic EL liquid, the above-mentioned coating system can also be used to apply a fluid material (hereinafter referred to as "hole transport liquid") containing a hole transporting material to the substrate 9 for an organic EL display device. The case where the hole transporting liquid adheres to the non-coating region 92. Here, the term "hole-wheeling material" means the formation of 098108393 46 200946245 organic £L· display

係並非僅指將電洞輪輸适層的材料’所謂「電洞輸送層」 層的狹義電洞輪 有機EL材料所形成之有機EL 再者,塗佈李續去’亦涵蓋進行電詞注入的電洞注入層。 有機亂材料或電t僅利用於含有有機扯顯示裝置用之 料之塗佈時’例如亦可形成材料的流動性材 置等之平面顯示裝 、SB‘和裝置或電漿顯示裝It is not only the organic EL formed by the narrow-shaped electric wheel organic EL material of the material of the so-called "hole transport layer" of the hole-conveying layer. The coating is continued to cover the word injection. The hole is injected into the layer. The organic disorder material or electricity t is used only for coating containing a material for an organic display device, for example, a flat display device such as a fluid material for forming a material, SB', and a device or a plasma display device.

等其他種類像fD _+有著色材料或螢光材料 電池用基板、半導俨曰π 村利用在對有機膜太陽 性材料之情況晶圓、光碟用基板等各種基板塗佈流動 雖已就本發明詳細描述,惟前述說明僅為例示而並非限 定。因此’可謂只要不脫離本發明之範圍,可有多數變化與 態樣。Other types of substrates such as fD _+, which have a coloring material or a fluorescent material battery, and semi-conducting π mura are used for coating various substrates such as wafers and optical disk substrates for organic film solar materials. The detailed description is merely illustrative and not limiting. Therefore, many variations and aspects may be made without departing from the scope of the invention.

【圖式簡單說明】 圖1為第1實施形態塗佈系統構成圖。 圖2為基板之俯視圖。 圖3為遮蔽帶與基板一部分之剖視圖。 圖4為帶黏貼裝置之俯視圖。 圖5為帶黏貼裝置之前視圖。 圖6為帶黏貼裝置之左侧視圖。 圖7Α為第1帶黏貼頭之放大左側視圓。 098108393 47 200946245 圖7B為第2帶黏貼頭之放大左侧視圖。 圖7C為第1帶黏貼頭一部分之放大左側視圖。 圖8為塗佈裝置之俯視圖。 圖9為塗佈裝置之前視圖。 圖10為遮蔽帶及基板之俯視圖。 圖11A為遮蔽帶與基板一部分之剖視圖。 圖11B為比較例的遮蔽帶與基板一部分之剖視圖。 圖11C為比較例的基板一部分之剖視圖。 圖12為帶剝離裝置之俯視圖。 圖13A為帶剝離頭之放大左側視圖。 圖13B為帶剝離頭一部分之放大左侧視圖。 圖14為第2實施形態帶黏貼裝置之俯視圖。 圖15A為帶黏貼頭之放大左侧視圖。 圖15B為帶黏貼頭一部分之放大左側視圖。 圖16為第3實施形態帶黏貼裝置之俯視圖。 【主要元件符號說明】 1 ' 71 遮蔽帶 2、2a、2b 帶黏貼裝置 3 塗佈裝置 4 帶剝離裝置 8 塗佈系統 9 基板 098108393 48 200946245 11 第1遮蔽帶 12 第2遮蔽帶 21、31、41 基板保持部 22 ' 32 ' 42 基板移動機構 23 第1帶黏貼頭 23a 第2帶黏貼頭 23b 帶黏貼頭 φ 24、35、44 頭移動機構 27、27a 帶 33 記號檢測部 34 塗佈頭 36 受液部 37 喷嘴 38 流動性材料供給部 © 43 帶剝離頭 45 剝離帶 79 比較例基板 81 搬送機器人 90 基板主面 91 塗佈區域 92 、 792 非塗佈區域 93 > 793 有機EL液 098108393 49 200946245 111 、 121 基材 112 、 122 黏著劑層 120 簷部 201a 第1帶黏貼裝置 201b 第2帶黏貼裝置 202 搬送機構 221 、 241 滑軌 230 帶貼合部 231 ' 431 殼體 232 第1供給捲盤 232a 第2供給捲盤 233 第1按押部 233a 第2按押部 234 第1回收捲盤 234a 第2回收捲盤 235 切斷部 236 帶分離構件 237 、 435 下部開口 238 、 436 氣缸 239 黏貼輥 271 基底帶 432 供給捲盤 098108393 50 200946245 433 黏著機構 434 回收捲盤 437 713 794 796 920 、 7920 © 921 1103 1111 1113 1122 1123 1202 ® 1203 按押輥 遮蔽帶侧面 彎液面 對應彎液面的部分 邊界 露出區域 第1遮蔽帶兩側的側面 第1遮蔽帶的上面 第1上面邊緣 第1遮蔽帶的下面 第1下面邊緣 簷部下面 第2遮蔽帶兩側的側面 1212 下面 1222 黏著劑層下面 1223 第2下面邊緣 2301 ' 2302 帶貼合部的輥 098108393 51BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a configuration diagram of a coating system according to a first embodiment. 2 is a plan view of a substrate. Figure 3 is a cross-sectional view of a portion of the masking tape and the substrate. Figure 4 is a plan view of the tape-attaching device. Figure 5 is a front view of the tape applicator. Figure 6 is a left side view of the tape applicator. Fig. 7 is an enlarged left side view circle of the first tape bonding head. 098108393 47 200946245 Figure 7B is an enlarged left side view of the second tape-adhesive head. Fig. 7C is an enlarged left side view of a portion of the first tape sticking head. Figure 8 is a plan view of the coating apparatus. Figure 9 is a front view of the coating apparatus. Figure 10 is a plan view of the masking tape and the substrate. Figure 11A is a cross-sectional view of a portion of the masking tape and the substrate. Fig. 11B is a cross-sectional view showing a portion of the mask tape and the substrate of the comparative example. Fig. 11C is a cross-sectional view showing a part of the substrate of the comparative example. Figure 12 is a plan view of the tape stripping device. Figure 13A is an enlarged left side view of the stripping head. Figure 13B is an enlarged left side view of a portion with a peeling head. Fig. 14 is a plan view showing the tape applicator of the second embodiment. Figure 15A is an enlarged left side view of the adhesive head. Figure 15B is an enlarged left side view of a portion of the adhesive head. Fig. 16 is a plan view showing the tape applicator of the third embodiment. [Description of main component symbols] 1 ' 71 masking tape 2, 2a, 2b with adhesive device 3 coating device 4 stripping device 8 coating system 9 substrate 098108393 48 200946245 11 first masking strip 12 second masking strip 21, 31, 41 substrate holding portion 22 ' 32 ' 42 substrate moving mechanism 23 first tape bonding head 23a second tape bonding head 23b tape bonding head φ 24, 35, 44 head moving mechanism 27, 27a belt 33 mark detecting portion 34 coating head 36 Liquid receiving portion 37 Nozzle 38 Fluid material supply portion © 43 Stripping head 45 Peeling strip 79 Comparative example substrate 81 Transfer robot 90 Substrate main surface 91 Application area 92, 792 Uncoated area 93 > 793 Organic EL liquid 098108393 49 200946245 111 , 121 Substrate 112 , 122 Adhesive layer 120 檐 201a 1st tape attaching device 201b 2nd tape attaching device 202 Transporting mechanism 221 , 241 Slide rail 230 with bonding portion 231 ' 431 Housing 232 1st supply roll Disk 232a second supply reel 233 first pressing portion 233a second pressing portion 234 first recovery reel 234a second recovery reel 235 cutting portion 236 with separation members 237, 435 Lower opening 238, 436 cylinder 239 Adhesive roller 271 Substrate tape 432 Supply reel 098108393 50 200946245 433 Adhesive mechanism 434 Reel reel 437 713 794 796 920 , 7920 © 921 1103 1111 1113 1122 1123 1202 ® 1203 Press roll cover side bend Part of the boundary of the liquid surface corresponding to the meniscus exposed area, the side of the first masking strip, the upper side of the first masking strip, the first upper edge, the lower side of the first masking strip, the first lower edge, the side of the second masking strip below the second masking strip 1212 Lower 1222 Adhesive layer underside 1223 Second lower edge 2301 ' 2302 Roller with 098108393 51

Claims (1)

200946245 七、申請專利範圍: 1,-種帶黏貼裝置’係在基板主面上之非塗佈區域黏貼防 止流動性材料附著於上述非塗佈區域的遮蔽帶(_king tape);其具備有: 基板保持部,保持基板;及 黏貼機構’使作為第1遮蔽帶下面一邊緣的第1下面邊緣 位於較上述基板主面上之非塗佈區域與塗佈區域間的邊界 更靠上述非塗佈區域内侧處,並將上述第丨遮蔽帶與上述邊 ❹ 界平行地黏貼於上述非塗佈區域,使作為第2遮蔽帶下面一 邊緣的第2下面邊緣位於較位於上述第i下面邊緣上方的上 述第1遮蔽帶上面邊緣更靠外侧處,並將上述第2遮蔽帶與 上述邊界平行地黏貼於上述第丨遮蔽帶之上述上面藉此將 從上述第1遮蔽帶朝上料侧突纽_離訂述基板之 上述主面的上述第2遮蔽帶一部分作為詹部設置在上述基 板上。 ❹ 2.如申請專利範圍第!項之帶黏貼裝置,其中,上述第2 遮蔽帶之上述廣部下面’係與上述基板之上述主面大致平 行。 ^如申請專利範圍第!項之帶黏貼裝置,其中,藉由將上 述幻遮蔽帶黏貼於上述非塗佈區域,而使上述第〗遮㈣ 第1下面邊緣位於上述非塗佈區域與另一塗体區域 B ”上述邊界平行的另一邊界更靠上述非塗佈區域内側 098108393 52 200946245 藉將由上述第2遮蔽帶黏貼於上述第丨遮蔽帶之上述上 面’而使上述第2遮蔽帶之另—第2下面邊緣位於較位於上 述另一第1下面邊緣上方的上述第㈤蔽帶之上述上面邊緣 更靠外侧處’將從上述第i遮蔽帶朝上述外侧突出且同時離 開上述基板之上述主面的上述第2遮蔽帶一部分作為另一 簷部設置在上述基板上。 β 4.如中請專利範圍第3項之帶黏貼裝置其中,上述第夏 遮蔽帶與上述第2遮蔽帶各自之中讀,敍致重疊於上述 非塗佈區域之中心線。 5. 如申請專利翻第4項之帶黏貼裝置,其中,上述第2 遮蔽帶之寬度係等於上述非塗佈區域之寬度。 6. 如申請專利範圍第1至5項中任-項之帶黏貼裝置,其 中,上述第2遮蔽帶對上述第丨賴帶的黏著力,係大於上 述第1遮蔽帶對上述基板的黏著力。 7. 如申請專利範圍第項中任一項之帶黏貼裝置,其 中,上述黏貼機構係具備有: 第1黏貼機構’將上述第1遮蔽帶黏貼於上述基板之上述 主面;及 第2黏貼機構’將上述第2遮蔽帶黏貼於已黏貼在上述基 板之上述主面的上述第1遮蔽帶之上述上面; 而上述第1黏貼機構係具備有·· 098108393 53 200946245 第1帶供給部,捲出上述第1遮蔽帶;及 第1按押部,將上述第i遮蔽帶中從上述第丨帶供給部捲 出的部位朝上述非塗佈區域按押; 上述第2黏貼機構係具備有: 第2帶供給部,捲出上述第2遮蔽帶;及 第2按押部,將上述第2遮蔽帶中從上述第2帶供給部捲 出的部位朝已黏貼在上述非塗佈區域的上述第1遮蔽帶按 押; 上述第1黏貼機構與上述第2黏貼機構係具備有移動機 構/移動機構在上述第i遮蔽帶由上述第i按押部按押的 狀態下’藉由使上述基板朝與上述非塗佈區域之上述邊界平 行的移動方向對上述第丄按押部相對移動,而將上述第1 遮蔽帶沿上述邊界依序黏貼,同時在上述第2遮蔽帶由上述 第2按押部按押的狀態下,藉由使上述基板朝上述移動方向 對上述第2按押部相對移動,而將上述第2遮蔽帶沿上述邊 ❹ 界依序黏貼。 8.如申δ月專利範圍第i至5項中任一項之帶黏貼裝置,其 中,上述黏貼機構係具備有: 第1帶供給部,捲出上述第丨賴帶; 帶供給部’捲出上述第2遮蔽帶; ㈣° °卩’將上述第1遮蔽帶中從上述第1帶供給部捲出 的部位黏貼於上述第2遮蔽帶; 098108393 54 200946245 帶對向於上述基板下朝上述非塗 1遮蔽帶與上述第2遮蔽帶的部 按押部,在上述第1遮蔽 佈區域按押貼合有上述第 位;及 柿構’在上述第1遮蔽帶與上述第2遮蔽帶由上述按 :甲的狀態下’藉由使上述基板朝與上述非塗饰區域之 述邊界平行的移動方向對上述按押部相對移動,而將上述 蔽帶與±述第2遮蔽帶沿上述邊界依序黏貼。200946245 VII. Patent application scope: 1. The type of adhesive tape device is attached to the non-coated area on the main surface of the substrate to prevent the fluid material from adhering to the uncoated area (_king tape); The substrate holding portion holds the substrate; and the bonding mechanism ′ is such that the first lower edge which is an edge of the lower surface of the first mask is located on the boundary between the uncoated region and the coating region on the main surface of the substrate. The inner side of the region is adhered to the uncoated region in parallel with the edge boundary, so that the second lower edge which is an edge of the lower surface of the second mask is located above the lower edge of the ith. The upper surface of the first shielding tape is further outward, and the second shielding tape is adhered to the upper surface of the second shielding tape in parallel with the boundary, thereby moving the first shielding tape toward the loading side. A part of the second masking tape from the main surface of the prescription substrate is provided on the substrate as a portion. ❹ 2. If you apply for the patent scope! The tape attaching device of the present invention, wherein the lower portion of the wide portion of the second masking tape is substantially parallel to the main surface of the substrate. ^ If you apply for a patent range! The tape sticking device, wherein the first shadow edge of the first mask is located at the boundary between the uncoated region and the other body region B by adhering the mask layer to the non-coated region. The other parallel boundary is further located on the inner side of the uncoated region 098108393 52 200946245 by the second masking tape being adhered to the upper surface of the second masking strip, so that the second lower edge of the second masking strip is located a second masking strip that protrudes from the i-th shielding strip toward the outer side and simultaneously leaves the main surface of the substrate while the outer edge of the fifth (5) strip above the other first lower edge is further outside A part of the tape-attaching device of the third aspect of the invention, wherein the first summer shielding tape and the second shielding tape are read in each of the above-mentioned substrates. The center line of the uncoated region. The adhesive tape device of claim 4, wherein the width of the second masking tape is equal to the width of the non-coated region. 6. The tape-adhesive device according to any one of claims 1 to 5, wherein the adhesion of the second masking tape to the first tape is greater than the adhesion of the first masking tape to the substrate. 7. The tape sticking device according to any one of the preceding claims, wherein the tape sticking mechanism includes: a first bonding mechanism affixes the first masking tape to the main surface of the substrate; and a second The adhesion mechanism affixes the second masking tape to the upper surface of the first masking tape that has been adhered to the main surface of the substrate; and the first bonding mechanism includes a first tape supply unit, 098108393 53 200946245, Rolling out the first shielding tape; and the first pressing portion, and pressing the portion of the i-th shielding tape that is unwound from the third tape supply portion toward the non-coating region; the second bonding mechanism is provided with : the second tape supply unit winds up the second masking tape; and the second pressing portion, the portion of the second masking tape that is unwound from the second tape supply unit is adhered to the non-coated region The first masking belt is pressed The first bonding mechanism and the second bonding mechanism are provided with a moving mechanism/moving mechanism in a state where the i-th shielding tape is pressed by the ith urging portion, by causing the substrate to face the non-coating The moving direction parallel to the boundary of the region is relatively moved to the first pressing portion, and the first shielding tape is sequentially adhered along the boundary, and the second shielding tape is pressed by the second pressing portion. Then, the second shielding tape is sequentially attached to the second pressing portion by moving the substrate toward the moving direction, and the second shielding tape is sequentially adhered along the edge boundary. The tape sticking device according to any one of the preceding claims, wherein the tape attaching mechanism includes: a first tape supply unit that winds up the first tape; and a tape supply unit that winds out the second mask tape; (4) °°卩a portion of the first masking tape that is unwound from the first tape supply portion is adhered to the second masking tape; 098108393 54 200946245 with a portion facing the non-coating masking tape and the second masking tape on the substrate Pressed, in The first masking area is affixed to the first position; and the persimmon structure 'in the first masking strip and the second masking strip are in the state of the armor", by causing the substrate to face the non-coating The movement direction parallel to the boundary of the decorative region is relatively moved to the above-mentioned grip portion, and the cover tape and the second masking tape are sequentially adhered along the boundary. 9. 一種帶點貼裝置’係在基板主面上之非塗佈區域黏貼防 止流動:材料附著於上述非塗佈區域的遮蔽帶;其具備有: 第π黏贴裝置,具傷有保持基板的第】基板保持部、及 使作為第1遮蔽帶下面—邊緣的第1下面邊緣位於較上述基 板主面上之非塗佈區域與塗佈區域間的邊界更靠上述非塗 佈區域内侧處,並將上述第1遮蔽帶與上述邊界平行地黏貼 於上述非塗佈區域的第1黏貼機構; 第2帶黏貼裝置,具備有保持上述基板的第2基板保持 部、及使作為第2遮蔽帶下面-邊緣的第2下面邊緣位於較 位在上述第1下面邊緣上方的上述第〗遮蔽帶上面邊緣更靠 外侧處,並將上述第2遮蔽帶與上述邊界平行地黏贴於上述 第1遮蔽帶之上述上面,藉此將從上述第1遮蔽帶朝上述外 侧突出且同時離開上述基板之上述主面的上述第2遮蔽帶 一部分作為簷部設置在上述基板上的第2黏貼機構;及 搬送機構,將上述基板從上述第1帶黏貼裝置搬出且同時 098108393 55 200946245 搬入於上述第2帶黏貼裝置。 10. —種塗佈系統,係對基板塗佈流動性材料;其具備有: 申請專利範圍第1至5項中任一項之帶黏貼裝置; 塗佈裝置,對黏貼有第1遮蔽帶與第2遮蔽帶的基板上之 包3上述第2遮蔽帶的區域塗佈流動性材料; 帶剝離裝置,從塗佈有流動性材料的基板剝離上述第i 遮蔽帶與上述第2遮蔽帶;及 基板搬送機構,依序搬送基板至上述帶黏貼裝置、上述塗 ❹ 佈裝置及上述帶剝離裝置,· 而上述塗佈裝置係具備有: 吐出機構’朝上述基板連續吐出流動性材料丨及 時母當朝上述主掃描方向移動時使上述基板對上述 構朝與上述主掃描方向垂直之副掃描方向相對移動。 移動機構’使上述吐出機構沿與上述基板之主面平行且與 ^述第2遮蔽帶交叉的主掃描方向對上述基板相對移動,同 述吐出機 11.如申請專利菔图篦 1 Π话夕ί V丄<9. A tape-attaching device is attached to a non-coated region on a main surface of a substrate to prevent flow: a masking tape to which the material adheres to the non-coated region; and the device includes: a π-adhesive device having a holding substrate The first substrate holding portion and the first lower edge which is the lower surface of the first masking tape are located on the inner side of the non-coating region at a boundary between the non-coating region and the coating region on the main surface of the substrate And attaching the first masking tape to the first bonding mechanism of the non-coating region in parallel with the boundary; the second tape bonding device includes the second substrate holding portion for holding the substrate, and the second shielding layer a second lower edge of the lower edge of the belt is located further outward than an upper edge of the first masking tape positioned above the first lower edge, and the second masking tape is adhered to the first layer in parallel with the boundary The upper surface of the masking tape, wherein the second shielding tape that protrudes from the first shielding tape toward the outer side and simultaneously away from the main surface of the substrate serves as a second adhesive layer provided on the substrate And a transfer mechanism that carries the substrate from the first tape attaching device and simultaneously moves the 098108393 55 200946245 into the second tape attaching device. 10. A coating system for coating a substrate with a fluid material; the device comprising: the adhesive tape device of any one of claims 1 to 5; the coating device, the first mask tape is adhered to a layer of the second masking tape on the substrate of the second masking tape is coated with a fluid material; and a tape peeling device is used to peel off the i-th masking tape and the second masking tape from the substrate coated with the fluid material; The substrate transfer mechanism sequentially transports the substrate to the tape attaching device, the coating device, and the tape peeling device, and the coating device includes a discharge mechanism that continuously discharges a fluid material toward the substrate. When moving in the main scanning direction, the substrate is relatively moved in the sub-scanning direction perpendicular to the main scanning direction. The moving mechanism moves the discharge mechanism to the substrate in a main scanning direction that is parallel to the main surface of the substrate and intersects with the second shielding strip, and the discharge machine 11 is as described in the patent application.丄 V丄< 13·—種遮蔽帶,係密接於基板主13·—the kind of shielding tape, which is closely connected to the main substrate 面上之非塗佈區域而防 佈區域;其具備有: 200946245 第1遮蔽帶,具有與基板相對向的下面;及 第2遮蔽帶’與上述第i遮蔽帶平行_ 遮蔽帶之上© ’· 1 在上述第1遮蔽帶與上述第2韻帶—侧部,藉由使上述 二:蔽帶:下面邊緣位於較上述第i遮蔽帶之上 緣更罪外側處’而使上述第2遮蔽㈣從上述“遮 上述外側突出的部位位於較包含上述第1遮蔽帶之4 ®面的平面更靠上方處。 卞 14·如申請專利範圍第13項之遮蔽帶,其中,上述第2、 蔽帶對上述第!遮蔽帶的黏著力,係大於上述第i遮蔽帶: 上述基板的黏著力。 子 ❹ 098108393 57a non-coated area on the surface and a rubbing-proof area; the first masking strip having a lower surface facing the substrate; and the second masking strip 'parallel to the i-th masking strip _ on the masking tape © ' 1 in the first masking zone and the second rhyme-side portion, the second masking is performed by making the lower edge of the second tape smaller than the upper edge of the i-th shielding tape (4) The portion protruding from the outer side of the above-mentioned outer surface is located above the plane including the 4 ® surface of the first masking strip. 卞14. The masking strip of claim 13 of the patent application, wherein the second section The adhesive force to the above-mentioned first masking tape is greater than the above-mentioned i-th shielding tape: the adhesion of the substrate. ❹ 098108393 57
TW098108393A 2008-04-30 2009-03-16 Tape attaching apparatus, liquid material applying system, and masking tape TWI386257B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008118229A JP5226379B2 (en) 2008-04-30 2008-04-30 Tape sticking device, coating system and masking tape

Publications (2)

Publication Number Publication Date
TW200946245A true TW200946245A (en) 2009-11-16
TWI386257B TWI386257B (en) 2013-02-21

Family

ID=41392312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098108393A TWI386257B (en) 2008-04-30 2009-03-16 Tape attaching apparatus, liquid material applying system, and masking tape

Country Status (3)

Country Link
JP (1) JP5226379B2 (en)
KR (1) KR101046861B1 (en)
TW (1) TWI386257B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5381414B2 (en) * 2009-07-01 2014-01-08 カシオ計算機株式会社 Light emitting panel manufacturing method and light emitting panel manufacturing apparatus
JP6439114B2 (en) 2014-03-07 2018-12-19 株式会社Joled Display device and electronic device
KR102112619B1 (en) * 2019-11-18 2020-05-19 제너셈(주) Emi shielding method and protection tape sticking apparatus applied for the same
KR102160183B1 (en) * 2020-06-09 2020-09-25 제룡전기 주식회사 Amorphous outdoor transformer and manufacturing method thereof
JP2023048932A (en) 2021-09-28 2023-04-07 トヨタ自動車株式会社 Forming method of parting line

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0433979Y2 (en) * 1985-10-30 1992-08-13
JPH06238209A (en) * 1993-02-18 1994-08-30 Yamaha Motor Co Ltd Masking tape and use thereof
JP3157990B2 (en) * 1994-08-26 2001-04-23 日本ペイント株式会社 Masking method and spray coating method in spray coating
JP2003249354A (en) * 2002-02-26 2003-09-05 Toyota Industries Corp Method of manufacturing organic el display panel
JP4190835B2 (en) * 2002-08-29 2008-12-03 大日本スクリーン製造株式会社 Coating apparatus and coating method
JP2004111073A (en) * 2002-09-13 2004-04-08 Dainippon Screen Mfg Co Ltd Thin film forming device
JP2005347609A (en) * 2004-06-04 2005-12-15 Sony Corp Manufacturing method for semiconductor layer and for semiconductor light emitting element
JP2006216414A (en) * 2005-02-04 2006-08-17 Dainippon Screen Mfg Co Ltd Organic el element manufacturing method
JP2008000678A (en) * 2006-06-22 2008-01-10 Dainippon Screen Mfg Co Ltd Mask member, coating apparatus, coating system and coating method

Also Published As

Publication number Publication date
JP2009266766A (en) 2009-11-12
JP5226379B2 (en) 2013-07-03
TWI386257B (en) 2013-02-21
KR101046861B1 (en) 2011-07-06
KR20090115049A (en) 2009-11-04

Similar Documents

Publication Publication Date Title
TW200946245A (en) Tape attaching apparatus, liquid material applying system, and masking tape
US8641851B2 (en) Apparatus and method for manufacturing a flexible display device
US9902130B2 (en) Methods of processing a glass substrate and glass apparatus
TWI321973B (en)
JP6792366B2 (en) Optical film set and its manufacturing method
JP4587449B2 (en) Anisotropic conductive film carrying tape
JP4878228B2 (en) Tape peeling apparatus, coating system, and tape peeling method
TW201620068A (en) Leader member, substrate, substrate cartridge, substrate process device, leader connection method, display element manufacturing method, and display element manufacturing device
JP2008000678A (en) Mask member, coating apparatus, coating system and coating method
JP2009272208A (en) Mask member pasting apparatus, and coating system
JP2008297027A (en) Photosensitive web joining structure and its joining tape member
JP6384328B2 (en) Method for manufacturing organic electroluminescence panel
JP2008277212A (en) Tape adhering device, tape adhering system, and tape adhering method
JP5153834B2 (en) Mounting method using anisotropic conductive film carrying tape
TW201805701A (en) Method for manufacturing optical display panels and system for manufacturing optical display panels
JP5821853B2 (en) Method for manufacturing organic electroluminescence element
JP2007095378A (en) Painting system
CN102856346B (en) The method manufacturing organic light-emitting display device
JP5275433B2 (en) Tape applicator
JPH10268777A (en) Manufacture of linerless label
JP5811660B2 (en) Glass film laminate and method for producing the same
JP5189671B2 (en) Tape sticking device, tape sticking system and tape sticking method
JP2001347715A (en) Printer of linerless print sheet
KR101532328B1 (en) Cleaning apparatus of encapsulation film for FPD manufacturing
JP6269674B2 (en) Manufacturing method and manufacturing apparatus of organic electroluminescence element

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees