KR101035167B1 - Rubber pick-up frame equiped with guiding block - Google Patents

Rubber pick-up frame equiped with guiding block Download PDF

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Publication number
KR101035167B1
KR101035167B1 KR1020090052282A KR20090052282A KR101035167B1 KR 101035167 B1 KR101035167 B1 KR 101035167B1 KR 1020090052282 A KR1020090052282 A KR 1020090052282A KR 20090052282 A KR20090052282 A KR 20090052282A KR 101035167 B1 KR101035167 B1 KR 101035167B1
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South Korea
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rubber
guide block
tool
guide
tool body
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KR1020090052282A
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Korean (ko)
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KR20100133632A (en
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이정구
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이정구
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Abstract

본 발명은 반도체 패키지의 제조에 있어 웨이퍼(Wafer) 상의 다이(Die)를 픽업(Pick-up)하여 운반하기 위한 러버 픽업 툴(Rubber Pick-up Tool)에 관한 것으로, 더욱 상세하게는 샹크를 갖고 있는 툴몸체의 양측에 하단이 대향 절곡된 가이드판을 고정 형성하고, 픽업러버의 상부에는 금속재로 된 가이드블록을 결합 형성하며, 상기 가이드블록의 저면에는 가이드판과 슬립되게 한 탄성체를 돌출 형성하여, 상기 픽업러버와 가이드블록이 결합된 상태에서 이들을 툴몸체에 결합 고정할 수 있도록 구성함으로써,BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rubber pick-up tool for picking up and transporting a die on a wafer in the manufacture of a semiconductor package. More specifically, the present invention relates to a rubber pick-up tool. On both sides of the tool body there is fixedly formed guide plate bent oppositely, the upper portion of the pick-up rubber to form a guide block made of a metal, the bottom surface of the guide block protruding to form an elastic body made to slip with the guide plate By configuring the pickup rubber and the guide block in a coupled state, they can be fixed to the tool body,

웨이퍼 상의 다이를 흡착 이송하기 위한 픽업러버가 툴몸체로부터 안정적인 수평도를 갖고 고정되어 있으므로 다이의 이송작업이 더욱 원활해짐은 물론 다이의 파손을 방지할 수 있어 매우 합리적이면서도 경제적인 것이고, 마모된 상태의 픽업러버를 교체하고자 하는 경우에도 미리 준비된 가이드블록을 슬라이딩 결합하는 과정만으로도 수평도의 변화없이 안정적인 교체 결합이 이루어질 수 있어 매우 효과적인 것이다.The pick-up rubber for adsorption and transfer of the die on the wafer is fixed and stable from the tool body, so that the die transfer operation can be made smoother and the die can be prevented from being damaged. Even if you want to replace the pick-up rubber is a very effective replacement can be made without a change in the horizontal level only by sliding the guide block prepared in advance prepared.

웨이퍼, 다이, 러버 픽업 툴, 툴몸체, 가이드판, 픽업러버, 가이드블록 Wafer, Die, Rubber Pickup Tool, Tool Body, Guide Plate, Pickup Rubber, Guide Block

Description

가이드블록을 구비한 러버 픽업 툴 {Rubber pick-up frame equiped with guiding block}Rubber pick-up frame equiped with guiding block

본 발명은 반도체 패키지의 제조에 있어 웨이퍼(Wafer) 상의 다이(Die)를 픽업(Pick-up)하여 운반하기 위한 러버 픽업 툴(Rubber Pick-up Tool)에 관한 것으로, 더욱 상세하게는 툴몸체의 양측에 가이드판을 형성하고, 픽업러버의 상부에는 가이드블록을 결합 형성하며, 상기 가이드블록의 저면 양측에는 탄성체를 고정 형성함에 따라, 픽업러버와 가이드블록이 결합된 상태에서 상기의 가이드블록을 툴몸체의 하부에 슬라이딩 결합함에 따라 우수한 픽업러버의 수평도를 유지할 수 있게 하여 다이의 안정적인 운반은 물론 다이의 파손을 최소화한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rubber pick-up tool for picking up and transporting a die on a wafer in the manufacture of a semiconductor package. Guide plates are formed on both sides, and guide blocks are formed on the upper side of the pickup rubber, and elastic bodies are fixed on both sides of the bottom of the guide block, so that the guide block is coupled to the pickup rubber and the guide block. Sliding coupled to the lower part of the body to maintain the excellent level of the pick-up rubber to minimize the breakage of the die as well as stable transport of the die.

일반적으로 반도체 패키지의 제조과정에 있어서 평판 형태의 웨이퍼 상에는 많은 칩을 포함하고 있으며 쏘잉(Sawing)이라는 공정을 통하여 웨이퍼로부터 각각의 칩을 분리하며 이와 같이 분리된 상태의 칩은 다이(Die)라고 한다.In general, a semiconductor package includes many chips on a flat wafer, and each chip is separated from the wafer by a sawing process. The separated chips are called dies. .

상기와 같이 분리된 각각의 다이를 픽업(Pick-up)하고 이송하여 리드 프레임 상에 안착시켜 접착하게 되는데 이때 다이를 진공 흡착하여 이송하는 툴을 러버 콜렛 또는 러버 픽업 툴이라는 용어로 불리어 진다(이하, 본 발명에서는 러버 픽업 툴이라 칭한다).Each die separated as described above is picked up and transported to be seated on the lead frame to be bonded to each other. In this case, a tool for vacuum-suctioning and transporting the die is called a rubber collet or a rubber pickup tool (hereinafter, referred to as a die). Is referred to as a rubber pickup tool in the present invention).

이와 같은 러버 픽업 툴은 도 1 및 도 2의 도시와 같이 이송수단의 작동축 하단에 결합되는 샹크(101;Shank)를 갖고 있는 툴몸체(100)와 상기 툴몸체(100)의 저면에 결합되는 픽업러버(110;Pick-up Rubber)로 이루어져 있는 것으로서, 상기의 이송수단의 구동에 따라 툴몸체(100)가 웨이퍼(120) 상으로 이동하는 것이고, 툴몸체(100)와 픽업러버(110)가 동시에 하강하여 웨이퍼(120) 상의 다이와 맞닿게 된다.Such a rubber pick-up tool is coupled to the tool body 100 and the bottom surface of the tool body 100 having a shank 101 coupled to the lower end of the operating shaft of the conveying means as shown in FIGS. 1 and 2. Pick-up rubber (110; Pick-up Rubber), the tool body 100 is moved on the wafer 120 according to the driving of the transfer means, the tool body 100 and the pickup rubber 110 Are simultaneously lowered to abut the die on wafer 120.

이에 상기의 툴몸체(100) 및 픽업러버(110) 상에 관통 형성되어 있는 흡착구멍(102)을 통해 진공압력을 생성시키면 픽업러버(110)의 저면에 밀착되어 있는 상태의 다이가 상기의 러버 픽업 툴과 함께 상승하여 이송할 수 있게 된다.Accordingly, when the vacuum pressure is generated through the suction holes 102 formed through the tool body 100 and the pickup rubber 110, the die in close contact with the bottom surface of the pickup rubber 110 is placed in the rubber. With the pick-up tool it can be raised and transported.

그러나, 상기와 같은 종래의 러버 픽업 툴은 다이와 접촉하는 픽업러버가 고무 재질인 관계로 픽업러버의 제조시 바닥면과 흡착면의 수평도 유지가 곤란한 문제점을 갖고 있다.However, the conventional rubber pickup tool as described above has a problem that it is difficult to maintain the horizontality of the bottom surface and the adsorption surface when manufacturing the pickup rubber because the pickup rubber in contact with the die is made of rubber.

또한, 상기와 같은 픽업러버의 제조과정에서 러버 픽업 툴에 대한 수평도가 유지되더라도 사용자가 장비에 설치된 툴몸체에 픽업러버를 삽입하는 과정에서 재차 변형되어 수평도가 흐트러지는 문제점이 발생하게 된다.In addition, even when the level of the rubber pickup tool is maintained in the manufacturing process of the pickup rubber as described above, the user is deformed again during the process of inserting the pickup rubber into the tool body installed in the equipment, causing a problem that the level is disturbed.

이에 따라 상기의 픽업러버가 툴몸체와의 수평도가 안정적으로 확보되지 못 한 경우 웨이퍼 상의 다이를 흡착하는데 어려움이 뒤따르게 되는 것이고, 수평도가 심하게 불안정할 경우에는 두께가 매우 얇은 상태인 다이를 파손시키는 등의 폐단을 갖고 있는 것이다.As a result, when the pick-up rubber does not have a stable level with the tool body, it is difficult to adsorb the die on the wafer, and when the level is extremely unstable, a die having a very thin thickness is used. It has a closed end such as damage.

본 발명은 전기한 바와 같은 문제점을 개선한 것으로서, 샹크를 갖고 있는 툴몸체의 양측에 하단이 대향 절곡된 가이드판을 고정 형성하고, 픽업러버의 상부에는 금속재로 된 가이드블록을 결합 형성하며, 상기 가이드블록의 저면에는 가이드판과 슬립되게 한 탄성체를 돌출 형성하여, 상기 픽업러버와 가이드블록이 결합된 상태에서 이들을 툴몸체에 결합 고정할 수 있도록 구성함으로써,The present invention is to solve the problems as described above, and fixedly formed on both sides of the tool body having the shank, the lower end of the guide plate is bent, the upper portion of the pickup rubber to form a combined guide block made of metal, By forming a guide plate and an elastic body made to slip on the bottom of the guide block, and configured to be coupled to the tool body in a state where the pickup rubber and the guide block are coupled,

금속재로 된 가이드블록과 툴몸체 간의 결합방식으로 인해 수평도의 안정적인 유지가 가능하면서도 픽업러버의 교체 과정에서도 균일한 수평도의 확보가 가능하므로 종래의 러버 픽업 툴이 갖고 있던 제반의 문제점을 합리적으로 극복한 특징의 가이드블록을 구비한 러버 픽업 툴을 제공함에 본 발명의 목적이 있는 것이다.The combination between the guide block made of metal and the tool body enables stable horizontal level and ensures even level even during the replacement of the pickup rubber, thus reasonably solving the problems of the conventional rubber pickup tool. It is an object of the present invention to provide a rubber pickup tool having a guide block of the features overcome.

상기한 바와 같은 목적을 달성하기 위한 본 발명은, 상부에 샹크가 돌출된 툴몸체와, 상기 툴몸체의 하측에 결합되는 픽업러버로 이루어지고, 상기 툴몸체와 픽업러버에는 수직 관통의 흡입공이 형성된 공지의 러버 픽업 툴에 있어서,The present invention for achieving the above object is composed of a tool body with a shank protruding from the top, and a pickup rubber coupled to the lower side of the tool body, the tool body and the pickup rubber is formed with a suction hole of the vertical through In a known rubber pickup tool,

상기 툴몸체의 양측에는 하단이 서로 대향되게 절곡된 안내부를 갖는 가이드판을 고정하고, 상기 픽업러버의 상부에는 툴몸체의 저면과 안내부의 사이로 끼워지는 삽입부를 갖는 가이드블록을 결합 형성하되, 상기 가이드블록의 삽입부 저면에는 탄성체를 돌출 형성하여 이루어지는 것이다.Both sides of the tool body is fixed to the guide plate having a guide portion bent opposite to each other, the upper portion of the pickup rubber coupled to the guide block having an insertion portion fitted between the bottom of the tool body and the guide portion, the guide The bottom of the insertion portion of the block is formed by projecting an elastic body.

본 발명은, 웨이퍼 상의 다이를 흡착 이송하기 위한 픽업러버가 툴몸체로부터 안정적인 수평도를 갖고 고정되어 있으므로 다이의 이송작업이 더욱 원활해짐은 물론 다이의 파손을 방지할 수 있어 매우 합리적이면서도 경제적인 것이고, 마모된 상태의 픽업러버를 교체하고자 하는 경우에도 미리 준비된 가이드블록을 슬라이딩 결합하는 과정만으로도 수평도의 변화없이 안정적인 교체 결합이 이루어질 수 있어 매우 효과적인 것이다.The present invention is very reasonable and economical because the pick-up rubber for adsorption and transfer of the die on the wafer is fixed with a stable horizontal level from the tool body, thereby making the transfer of the die more smooth and preventing the die from being broken. In addition, even when the pickup rubber is to be replaced in a worn state, a stable replacement coupling can be made without changing the horizontal level by only sliding the previously prepared guide block, which is very effective.

본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor may properly define the concept of the term to describe its invention in the best possible way And should be construed in accordance with the principles and meanings and concepts consistent with the technical idea of the present invention.

이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 러버 픽업 툴에 대한 분리 사시도이고, 도 4는 본 발명에 따른 러버 픽업 툴에 대한 장방향 결합 단면도이며, 도 5는 본 발명에 따른 러버 픽업 툴에 대한 단방향 분리 단면도이다.Figure 3 is an exploded perspective view of the rubber pickup tool according to the present invention, Figure 4 is a longitudinal coupling cross-sectional view of the rubber pickup tool according to the present invention, Figure 5 is a unidirectional separation cross-sectional view of the rubber pickup tool according to the present invention. .

도시와 같이 본 발명에 따른 러버 픽업 툴은, 상부면으로 돌출 형성된 원기둥 형태의 샹크(11)를 갖는 툴몸체(10)와; 상기 툴몸체(10)의 양측에 고정되는 가이드판(30)(30') 및 상기 툴몸체(10)의 측부로부터 저면을 향하여 슬라이딩 삽입되는 가이드블록(40)과; 가이드블록(40)의 저면에 결합되는 고무재의 픽업러버(20)로 이루어지는 것이다.Rubber pick-up tool according to the invention as shown, the tool body having a cylindrical shank 11 protruding toward the upper surface; Guide plates (30) (30 ') fixed to both sides of the tool body (10) and a guide block (40) slidingly inserted toward the bottom from the side of the tool body (10); It is made of a rubber pickup pickup rubber 20 is coupled to the bottom of the guide block 40.

상기의 툴몸체(10)는 웨치퍼 상의 다이를 이송하기 위한 이송수단(도면에는 미도시함)에 장착되는 것으로서, 상부에 돌출 형성된 샹크(11)를 이송수단에 장착하여 사용된다.The tool body 10 is mounted on a conveying means (not shown in the figure) for conveying the die on the wechper, and is used by mounting the shank 11 protruding thereon.

또한, 상기의 픽업러버(20)는 연질의 고무재로 이루어져 있는 것으로서, 웨이퍼 상의 다이 상부면에 밀착된 상태에서 툴몸체(10)와 픽업러버(20)를 수직으로 관통하여 형성된 흡입공(12) 내에 진공력이 발생되게 하면 상기의 다이는 픽업러버(20)의 저면에 밀착되므로 이와 같은 흡입 진공력을 통해 상기의 다이를 안전하게 이송시킬 수 있게 된다.In addition, the pickup rubber 20 is made of a soft rubber material, the suction hole 12 formed by vertically penetrating the tool body 10 and the pickup rubber 20 in close contact with the die upper surface on the wafer. When the vacuum force is generated in the c), the die is in close contact with the bottom surface of the pickup rubber 20 so that the die can be safely transported through the suction vacuum force.

또한, 상기의 가이드판(30)(30')은 금속판재를 절곡 형성하여 된 것으로서, 가이드판(30)(30')의 하부는 툴몸체(10)의 중심부를 향하여 절곡된 안내부(31)(31')를 형성하여 된 것이고, 상기의 안내부(31)(31')는 툴몸체(10)의 저면으로부터 하향 이격되어 있으므로 결국 툴몸체(10)의 저면과 안내부(31)(31')의 상면 사이에는 소정의 간격으로 된 끼움틈새가 발생하게 된다.In addition, the guide plates 30 and 30 'are formed by bending a metal plate, and the lower portion of the guide plates 30 and 30' is bent toward the center of the tool body 10. 31 '), and the guide parts 31 and 31' are spaced downward from the bottom of the tool body 10, so that the bottom and the guide part 31 ( 31 '), there is a gap between the upper surfaces of the predetermined interval.

또한, 상기의 가이드블록(40)은 금속재를 가공하여 이루어진 것으로서, 양측으로는 상기 툴몸체(10)의 저면과 안내부(31)(31')의 상부 사이로 끼워지기 위한 삽입부(41)(41')가 형성되어 있고 중앙에는 수직의 관통공(43)이 형성되어 있으며, 가이드블록(40)의 하측으로는 픽업러버(20)가 인위적인 가압에 의해 결합되고, 상기 삽입부(41)(41')의 저면에는 돌출 형성된 탄성체(42)(42')가 고정되어 있는 것이다.In addition, the guide block 40 is made by processing a metal material, both sides of the insertion portion 41 for fitting between the bottom of the tool body 10 and the upper portion of the guide portion 31, 31 '( 41 ') is formed, and a vertical through hole 43 is formed at the center thereof, and a pickup rubber 20 is coupled to the lower side of the guide block 40 by artificial pressure, and the insertion portion 41 ( The protruding elastic bodies 42 and 42 'are fixed to the bottom of 41'.

이에 따라 상기의 가이드블록(40) 저면에 픽업러버(20)를 가압하여 고정 형성한 상태에서 상기의 가이드블록(40)을 툴몸체(10)의 저면에 결합하면 되는 것인데, 픽업러버(20)를 가이드블록(40)에 수평도가 이루어지도록 선행하여 미리 결합한 상태에서 상기의 가이드블록(40)을 안내부(31)(31')를 통해 툴몸체(10)의 측하부로부터 슬라이딩 삽입하게 되면 가이드블록(40)의 상면과 툴몸체(10)의 저면이 긴밀하게 밀착되면서 상호간의 결합이 이루어지게 된다.Accordingly, the guide block 40 may be coupled to the bottom surface of the tool body 10 in a state in which the pick-up rubber 20 is fixed to the bottom of the guide block 40 by pressing the pick-up rubber 20. When the guide block 40 is slidably inserted from the lower side of the tool body 10 through the guide portions 31 and 31 'in a state where the guide block 40 is previously coupled to the guide block 40 in advance. The upper surface of the guide block 40 and the bottom of the tool body 10 are in close contact with each other, thereby making the coupling.

즉, 가이드블록(40)의 삽입부(41)(41') 두께는 툴몸체(10)의 저면과 안내부(31)(31') 상면 사이의 상,하 폭보다 얇게 제작하고, 삽입부(41)(41')와 탄성체(42)(42')를 포함한 두께는 툴몸체(10)의 저면과 안내부(31)(31') 상면 사이의 상,하 폭보다 두껍게 제작함에 따라 상기의 삽입부(41)(41')를 안내부(31)(31')의 상면을 통해 툴몸체(10)의 저면에 강제로 밀어 넣으면,That is, the thickness of the insertion portions 41 and 41 'of the guide block 40 is made thinner than the upper and lower widths between the bottom surface of the tool body 10 and the upper surface of the guide portions 31 and 31'. The thickness including the 41 and 41 'and the elastic bodies 42 and 42' is made thicker than the upper and lower widths between the bottom of the tool body 10 and the upper surfaces of the guides 31 and 31 '. Of the inserts 41 and 41 'are forced into the bottom of the tool body 10 through the upper surfaces of the guides 31 and 31',

상기의 탄성체(42)(42')가 압축되면서 탄성체(42)(42')의 반발력으로 인해 상기의 가이드블록(40)은 툴몸체(10)를 향하여 탄성력을 제공받게 되므로 이들 툴몸체(10)와 가이드블록(40)은 긴밀하게 밀착되면서 평활면인 툴몸체(10)의 저면과 가이드블록(40)의 상면에 서로 맞닿으며 안정적인 수평도를 유지할 수 있게 된다.As the elastic bodies 42 and 42 'are compressed, the guide block 40 is provided with an elastic force toward the tool body 10 due to the repulsive force of the elastic bodies 42 and 42'. ) And the guide block 40 are in close contact with each other on the bottom surface of the tool body 10, which is a smooth surface, and the top surface of the guide block 40, thereby maintaining a stable horizontal level.

또한, 상기와 같은 가이드블록(40)의 결합에 따라 흡입공(12)과 관통공(43)은 서로 수직 방향으로 연속하여 연결되므로 결국 픽업러버(20)의 저면을 이용하여 웨이퍼 상의 다이를 진공력에 의해 효과적으로 흡입 부착하여 이송시킬 수 있게 된다.In addition, since the suction hole 12 and the through hole 43 are continuously connected to each other in the vertical direction according to the combination of the guide block 40 as described above, the die on the wafer is vacuumed using the bottom of the pickup rubber 20. It can be attached and transported effectively by force.

이때, 상기의 툴몸체(10) 일측면에는 상기의 가이드블록(40)이 지나치게 과다 삽입되는 것을 방지하기 위한 스토퍼(32)(32')가 부착 형성되어 있는 것으로서, 툴몸체(10)의 개방된 안내부(31)(31')의 일측으로부터 가이드블록(40)을 삽입하면 상기의 가이드블록(40)은 스토퍼(32)(32')에 의해 가로막혀 더이상 삽입되지 않게 되므로 결국 균일한 위치로의 안정적인 삽입이 이루어지게 되면서도, 툴몸체(10)의 흡입공(12)과 가이드블록(40)의 관통공(42)이 서로 정확하게 일치하게 된다.At this time, one side of the tool body 10 is formed with a stopper 32, 32 'is attached to prevent the excessive insertion of the guide block 40, the tool body 10 is opened When the guide block 40 is inserted from one side of the guides 31 and 31 ', the guide block 40 is blocked by the stoppers 32 and 32' so that it is no longer inserted. While the stable insertion of the furnace is made, the suction hole 12 of the tool body 10 and the through hole 42 of the guide block 40 are exactly matched with each other.

또한, 상기의 스토퍼(32)(32')는 툴몸체(10)에 대하여 단일의 개체만을 고정 형성할 수도 있으나, 두 개의 스토퍼(32)(32')를 이격 형성하는 경우 서로 이격된 스토퍼(32)(32')의 사이를 통해 상기의 가이드블록(40)을 손가락으로 전,후 파지할 수 있게 되어 상기의 가이드블록(40) 및 픽업러버(20)를 교체하고자 하는 경우 더욱 용이한 작업이 이루어질 수 있게 된다.In addition, the stoppers 32 and 32 ′ may be fixed to only a single object with respect to the tool body 10. However, when the two stoppers 32 and 32 ′ are spaced apart from each other, the stoppers 32 and 32 ′ may be spaced apart from each other. The guide block 40 can be gripped before and after with the finger between the 32 and 32 ', so that the guide block 40 and the pickup rubber 20 can be replaced more easily. This can be done.

따라서, 종래와 같이 툴몸체(10)에 직접 픽업러버(20)를 결합함에 따라 발생하는 불안정한 수평도의 문제점을 금속재로 된 가이드블록(40)과 금속재의 툴몸체(10) 간의 결합에 의해 극복할 수 있는 것이고, 지속적으로 상향의 탄성력을 제공하는 탄성체(42)(42')로 인해 상기의 가이드블록(40)은 툴몸체(10)의 저면에 안정적으로 밀착 고정된 상태를 유지할 수 있게 된다.Therefore, the problem of unstable horizontality caused by coupling the pickup rubber 20 directly to the tool body 10 as in the related art is overcome by coupling between the metal guide block 40 and the metal tool body 10. The guide block 40 can be stably maintained on the bottom surface of the tool body 10 due to the elastic bodies 42 and 42 'that continuously provide upward elastic force. .

더욱이, 상기의 가이드블록(40)과 픽업러버(20)는 툴몸체(10)로부터 분리가 가능하여 사전에 다양한 방법을 통해 상호 간의 수평도가 안정적으로 유지되게끔 예비작업이나 측정 및 가공이 가능하므로 이와 같이 정확한 수평도를 갖고 있는 상태의 가이드블록(40)과 픽업러버(20)를 툴몸체(10)에 결합함에 따라 전체적으로 안정적인 수평도의 유지가 가능하게 된다.In addition, the guide block 40 and the pickup rubber 20 can be separated from the tool body 10, so that preliminary work, measurement, and processing can be performed in advance so that the horizontal level is stably maintained by various methods in advance. Thus, by combining the guide block 40 and the pickup rubber 20 in the state having an accurate horizontal degree to the tool body 10, it is possible to maintain a stable level overall.

특히, 상기의 탄성체(42)(42')는 가이드블록(40)의 삽입부(41)(41') 저면에 장방형으로 길게 돌출시켜 고정할 수도 있을 것이고, 도 6의 도시와 같이 반복되는 원형으로 돌출하여 고정시킬 수도 있는 것으로서, 삽입부(41)(41')의 저면에 직접 본딩처리하여 부착하거나 삽입부(41)(41')의 저면에 탄성체(42)(42')를 안치시키기 위한 홈을 형성하여 이들을 더욱 안정적으로 부착 고정할 수도 있을 것이다.In particular, the elastic bodies 42 and 42 'may be fixed to protrude in a rectangular shape to the bottom of the insertion portions 41 and 41' of the guide block 40, and the circular shape may be repeated as shown in FIG. It can also be fixed by protruding into the bottom surface of the insertion portion 41, 41 'directly bonded to the bottom surface of the insertion portion 41, 41' to place the elastic body 42, 42 ' It may be possible to form a groove for fixing them more stably.

이에 따라 상기와 같은 가이드블록(40)을 사용하여 사전에 미리 수평도가 이루어지도록 한 픽업러버(20)를 간편하게 슬라이딩 장착할 수 있으면서도 픽업러버(20)의 마모에 의해 새로운 것으로 교체하고자 하는 경우에도 사전에 수평도가 이루어지도록 결합된 상태의 가이드블록(40)과 픽업러버(20)를 동시에 교체 삽입하면 연속적인 다이의 픽업 작업이 이루어질 수 있어 매우 합리적인 것이다.Accordingly, even if the pickup block 20 can be easily mounted and mounted in advance using the guide block 40 as described above, even when a new one is to be replaced by wear of the pickup rubber 20. If the guide block 40 and the pick-up rubber 20 are inserted and replaced at the same time in order to achieve the horizontal degree in advance, it is very reasonable that the pick-up operation of the continuous die can be made.

이상과 같은 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 이들을 대체할 수 있는 다양한 균등물과 변형 예들이 있을 수 있음을 이해하여야 한다.It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the present invention as defined by the appended claims. Examples should be understood.

도 1은 종래의 러버 픽업 툴에 대한 분리 사시도1 is an exploded perspective view of a conventional rubber pickup tool

도 2는 종래의 러버 픽업 툴에 대한 결합 단면도2 is a cross-sectional view of a combination of a conventional rubber pickup tool

도 3은 본 발명에 따른 러버 픽업 툴에 대한 분리 사시도Figure 3 is an exploded perspective view of the rubber pickup tool according to the present invention

도 4는 본 발명에 따른 러버 픽업 툴에 대한 장방향 결합 단면도4 is a longitudinal coupling cross-sectional view of the rubber pickup tool according to the present invention.

도 5는 본 발명에 따른 러버 픽업 툴에 대한 단방향 분리 단면도5 is a unidirectional separation cross-sectional view of the rubber pickup tool according to the present invention.

도 6은 본 발명에 따른 러버 픽업 툴의 다른 실시예도6 is another embodiment of the rubber pickup tool according to the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 : 툴몸체 11 : 샹크10: tool body 11: shank

12 : 흡입공12: suction hole

20 : 픽업러버20: pickup rubber

30,30' : 가이드판 31,31' : 안내부30,30 ': Guide plate 31,31': Guide part

32,32' : 스토퍼32,32 ': stopper

40 : 가이드블록 41,41' : 삽입부40: guide block 41,41 ': insertion portion

42,42' : 탄성체 43 : 관통공42,42 ': elastomer 43: through hole

Claims (5)

상부에 샹크(11)가 돌출된 툴몸체(10)와, 상기 툴몸체(10)의 하측에 결합되는 픽업러버(20)로 이루어지고, 상기 툴몸체(10)와 픽업러버(20)에는 수직 관통의 흡입공(12)이 형성된 공지의 러버 픽업 툴에 있어서,It consists of a tool body 10, the shank 11 protrudes in the upper portion, and a pickup rubber 20 coupled to the lower side of the tool body 10, vertical to the tool body 10 and the pickup rubber 20 In a known rubber pickup tool having a through hole 12 formed therein, 상기 툴몸체(10)의 양측에는 하단이 서로 대향되게 절곡된 안내부(31)(31')를 갖는 가이드판(30)(30')을 고정하고,Both sides of the tool body 10 is fixed to the guide plate 30, 30 'having the lower end guides 31, 31' bent to face each other, 상기 픽업러버(20)의 상부에는 툴몸체(10)의 저면과 안내부(31)(31')의 사이로 끼워지는 삽입부(41)(41')와 수직의 관통공(43)를 갖는 가이드블록(40)을 결합 형성하되,A guide having a through hole 43 perpendicular to the insertion portions 41 and 41 ′ fitted between the bottom of the tool body 10 and the guide portions 31 and 31 ′ on the upper portion of the pickup rubber 20. To form a block 40 combined, 상기 가이드블록(40)의 삽입부(41)(41') 저면에는 탄성체(42)(42')를 돌출 형성하여 구성함을 특징으로 하는 가이드블록을 구비한 러버 픽업 툴.Rubber pick-up tool having a guide block, characterized in that the bottom of the insertion portion 41 (41 ') of the guide block 40 is formed by protruding the elastic body (42, 42'). 제 1항에 있어서,The method of claim 1, 툴몸체(10)에는, 가이드판(30)(30')의 안내부(31)(31')로 끼워지는 가이드블록(40)의 삽입부(41)(41')가 맞닿아 멈추게 하는 스토퍼(32)(32')를 구성하여 됨을 특징으로 하는 가이드블록을 구비한 러버 픽업 툴.The tool body 10 has a stopper which abuts and stops the insertion portions 41 and 41 'of the guide block 40 fitted into the guide portions 31 and 31' of the guide plates 30 and 30 '. A rubber pick-up tool having a guide block, comprising (32) and (32 '). 제 1항에 있어서,The method of claim 1, 탄성체(42)(42')는 가이드블록(40)의 삽입부(41)(41') 저면으로 돌출되도록 고정 형성하되,The elastic bodies 42 and 42 'are fixed to protrude to the bottom of the insertion portions 41 and 41' of the guide block 40, 삽입부(41)(41')의 두께는 툴몸체(10)의 저면과 안내부(31)(31') 상면 사이의 상,하 폭보다 얇게 형성하고, 삽입부(41)(41')와 탄성체(42)(42')를 포함한 두께는 툴몸체(10)의 저면과 안내부(31)(31') 상면 사이의 상,하 폭보다 두껍게 형성하여 상기 탄성체(42)(42')를 갖는 가이드블록(40)의 삽입부(410(41')가 툴몸체(10)의 저면과 안내부(31)(31') 상면 사이로 강제 압입에 의해 슬라이딩 결합되도록 구성함을 특징으로 하는 가이드블록을 구비한 러버 픽업 툴.The thickness of the insertion portions 41 and 41 'is formed to be thinner than the upper and lower widths between the bottom surface of the tool body 10 and the upper surface of the guide portions 31 and 31', and the insertion portions 41 and 41 '. And the thickness including the elastic bodies 42 and 42 'are formed to be thicker than the upper and lower widths between the bottom surface of the tool body 10 and the upper surfaces of the guide parts 31 and 31'. Inserts 410 (41 ') of the guide block 40 having a guide characterized in that configured to be slidingly coupled by a forced press between the lower surface of the tool body 10 and the upper surface of the guide portion 31 (31') Rubber pickup tool with blocks. 제 1항에 있어서,The method of claim 1, 탄성체(42)(42')는, 가이드블록(40)의 삽입부(41)(41') 저면에 장방형으로 돌출되도록 부착하여 구성함을 특징으로 하는 가이드블록을 구비한 러버 픽업 툴.The rubber pick-up tool with a guide block characterized in that the elastic body (42) (42 ') is attached to the bottom of the insertion portion (41) (41') of the guide block 40 to protrude in a rectangular shape. 제 1항에 있어서,The method of claim 1, 탄성체(42)(42')는 가이드블록(40)의 삽입부(41)(41') 저면에 반복의 원형으로 돌출되도록 부착하여 구성함을 특징으로 하는 가이드블록을 구비한 러버 픽업 툴.Rubber pick-up tool having a guide block, characterized in that the elastic body (42, 42 ') is attached to the bottom of the insertion portion (41) (41') of the guide block 40 so as to protrude in a circular shape repeatedly.
KR1020090052282A 2009-06-12 2009-06-12 Rubber pick-up frame equiped with guiding block KR101035167B1 (en)

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