KR101032091B1 - Illuminator using light-emitting diode - Google Patents

Abstract

The light emitting diode lighting device according to the present invention is characterized by having a heat radiating fin in a horizontal direction and a heat radiating fin in a vertical direction and having a PCB substrate made of alumina-based ceramics, thereby effectively dissipating heat generated from the light emitting diode to the outside. .

Light Emitting Diodes, Lighting, Heat Sink, PCB, Ceramic

Description

Light emitting diode luminaires {Illuminator using light-emitting diode}

The present invention relates to a lighting device, and more particularly, to a light emitting diode lighting device having a heat radiation fin in the horizontal direction and a heat radiation fin in the vertical direction and having a PCB substrate made of alumina-based ceramic.

In general, a light-emitting diode (LED) as a light source for generating light has a small power and a long life compared to a conventional light source, and has low power consumption and high-speed response characteristics because electrical energy is directly converted into light energy. I have it.

The lighting apparatus using the light emitting diode has a structure in which a PCB substrate (printed circuit board) provided with a light emitting diode is accommodated in a case.

A lot of heat is generated in the light emitting diode, but if the heat is not smoothly released to the outside, there is a problem that the lifespan of the light emitting diode is shortened and the illuminance is lowered.

In order to solve this problem, a method of attaching a heat sink to a PCB substrate, a method of attaching a fan, a method of widening a contact surface of the heat sink, and a method of attaching and cooling a thermoelectric element to the heat sink have been proposed. . However, these methods have many disadvantages in terms of efficiency and / or cost.

On the other hand, in order to solve this heat dissipation problem, if a current smaller than the rated current flows in the light emitting diode, the brightness of the light emitting diode is reduced, and if the brightness of the light emitting diode is decreased, the number of light emitting diodes must be increased to meet the set illumination level, thereby increasing the cost. There is a problem.

An object of the present invention is to provide a light emitting diode lighting device that can effectively radiate heat generated from the light emitting diode to the outside because it has a heat radiation fin in the horizontal direction and a heat radiation fin in the vertical direction.

Still another object of the present invention is to provide a light emitting diode lighting apparatus which can effectively radiate heat generated from the light emitting diode to the outside because it has a PCB substrate made of alumina-based ceramic.

Still another object of the present invention is to provide a light emitting diode lighting device, which includes the first and second heat dissipation members and / or housings made of alumina-based ceramics, which can effectively discharge heat generated from the light emitting diodes to the outside. .

In order to achieve the above object, a light emitting diode lighting device according to the present invention comprises: a PCB substrate provided with a light emitting diode; A first heat dissipation member installed under the PCB and provided with a plurality of first direction heat dissipation fins; And a second heat dissipation member installed under the first heat dissipation member to be in contact with the first heat dissipation member, the second heat dissipation member having a plurality of second direction heat dissipation fins formed in a direction different from the first direction. At least one of the second heat dissipation members may be in contact with the PCB to transfer heat generated from the light emitting diodes. The first heat dissipation member may include a fin part in which the first direction heat dissipation fin is installed; And an insertion part in which the first direction heat dissipation fin is not installed, and at least a portion of the second heat dissipation member is installed to be inserted into the insertion part.

Preferably, the first heat dissipation member is formed by stacking at least two heat sinks, a heat sink is formed with a spacer, and spaced between the heat sinks due to the spacers when the heat sink is stacked.

Preferably, a through portion is formed in the center of the first heat dissipation member, and a second protrusion of the second heat dissipation member is inserted in the through portion to contact the PCB substrate.

Preferably, the first heat dissipation member is a body; And the first direction heat dissipation fin formed in a plurality of layers around the body.

Preferably, a first protrusion protruding upward is formed around the second heat dissipation member, and the first protrusion is inserted into the insertion portion to perform heat transfer between the first heat dissipation member and the second heat dissipation member.

More preferably, the second direction heat dissipation fin is formed on the outer surface of the first protrusion, the second heat dissipation member is accommodated in the housing, and the housing has a cutout formed at a position corresponding to the first protrusion. The first heat dissipation member is exposed to the outside through the cutout, and the first direction heat dissipation fin is exposed to the outside.

Preferably, the first direction is horizontal and the second direction is vertical.

On the other hand, the light emitting diode lighting device may be provided with a plurality of through holes penetrating the first direction heat radiation fins.

In this case, the PCB substrate is preferably made of alumina-based ceramic and has a substrate body on which the light emitting diode is installed.

Preferably, the alumina-based ceramic has an emissivity of at least 0.97 and an insulation strength of at least 10 KV / mm.

In addition, the first heat dissipation member and the second heat dissipation member may be made of alumina-based ceramics.

In addition, the housing may also be made of alumina-based ceramics.

The light emitting diode lighting device according to the present invention has the following effects.

First, since the heat dissipation fins in the horizontal direction and the heat dissipation fins in the vertical direction and the heat dissipation fins in the horizontal direction and the heat dissipation fins in the vertical direction are directly exposed to the outside, heat generated from the light emitting diodes can be effectively discharged to the outside.

Second, since a PCB substrate made of alumina-based ceramics is provided, heat generated from the light emitting diodes can be effectively released to the outside.

Third, since the first and second heat dissipation members and / or housings made of alumina-based ceramics are provided, heat generated from the light emitting diodes can be effectively discharged to the outside.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely examples of the present invention and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

The present invention is characterized in that it can effectively transfer the heat generated in the light emitting diode to the outside. The heat transfer is performed by the first and second heat dissipation members, and at least one of the first and second heat dissipation members may be in contact with the PCB substrate on which the light emitting diode is installed to receive heat.

1A is a perspective view showing a light emitting diode lighting fixture according to a first embodiment of the present invention, FIG. 1B is a front view of the light emitting diode lighting fixture, and FIG. 2 is an exploded perspective view of the light emitting diode lighting fixture.

Referring to the drawings, the LED lighting apparatus 100 includes a PCB substrate 10 provided with a light emitting diode 1 and a first and second heat dissipation member 30 for discharging heat generated from the light emitting diode 1 to the outside. 50).

PCB substrate 10 is provided with a substrate body 11, an electrode provided on the substrate body 11 and electrically connected to an external power source (not shown), and generates light by application of an external power source electrically connected to the electrode. A light emitting diode 1 is provided. The electrode and the light emitting diode 1 may be provided with an appropriate number to obtain the desired brightness.

The substrate body 11 may have a first through hole 12 for fixing the leg 22 of the lens member 21 and a second through hole 13 through which an electric wire (not shown) passes. . The first and second through holes 12 and 13 may be formed as many as necessary according to product specifications. The substrate body 11 is installed in the through part 36 to be in contact with the second heat dissipation member 50.

Preferably, the substrate body 11 is formed of an alumina-based ceramic material having excellent heat dissipation and insulating properties in order to integrate the functions of a conventional printed circuit board and a heat sink into one.

The ceramic material has a high emissivity and a high dielectric strength instead of low thermal conductivity. Alumina-based ceramic materials that satisfy these characteristics include N-9H of Nishimura, Japan. N-9H contains a small amount of impurities in 96% or more of alumina (Al ₂ O ₃ ). The ceramic material emits heat generated in the light emitting diode 1 by emitting radiant heat, that is, thermal energy in a far infrared region, unlike conventional heat sinks emitting heat through heat conduction and convection.

Table 1 below shows the emissivity and thermal conductivity according to the material.

material Emissivity (ε) Thermal Conductivity (W / mK) N-9H 0.97 39 Copper 0.1 or less 394 Aluminum (Al) 0.1 or less 238

As shown in Table 1, metals such as copper or aluminum have a high emissivity but a considerably low emissivity, whereas N-9H has a high emissivity of 0.97 and a low thermal conductivity of 39 W / mK. In addition, N-9H is a material having a high insulation property with an insulation strength of 10KV / mm or more. In addition, N-9H has the advantage that the price is low.

Therefore, the substrate body 11 is formed by using a ceramic material such as N-9H having excellent emissivity and insulation and low cost, thereby maximizing heat dissipation efficiency using radiant heat and integrating the functions of a conventional printed circuit board and a heat sink. In this way, manufacturing cost can be reduced.

Preferably, the LED lighting apparatus 100 includes a lens member 21 installed on the PCB substrate 10, a cover 24 covering the lens member 21, and a guide member for guiding the lens member 21. (27) is provided.

The lens member 21 has a number of holes 25 corresponding to the number of light emitting diodes 1. Light of the light emitting diode 1 passes through the hole 25. On the other hand, as shown in Figure 3, the cover 24 may be provided with a diffusion member 26 for uniformly diffusing the light of the light emitting diode (1). The diffusion member 26 is a transparent or translucent material through which light can pass, and is a member widely used in lighting fixtures. On the other hand, the cover 24 and the guide member 27 has a conventional structure and function.

The first heat dissipation member 30 is installed to be in contact with the second heat dissipation member 50 to receive heat from the second heat dissipation member 50. The first heat dissipation member 30 is formed by stacking at least two heat dissipation plates 31.

The heat sink 31 includes a fin portion and an insertion portion. The fin direction first heat radiation fins 32 are installed. At least a portion of the second heat dissipation member 50, preferably the first protrusion 53, is inserted into the insertion portion.

Preferably, the heat sink 31 has a spacer 33 formed to protrude downward. When the heat sinks 31 are stacked, the spaces between the heat sinks 31 are separated by the spacers 33. In addition, the first direction heat dissipation fins 32 are not housed in the housing 60 but are exposed to the outside. As such, the air may move through the spaced gaps between the heat sinks 31 and the first direction heat dissipation fins 32 may be exposed to the outside and directly contact with the outside air, thereby making the heat transfer more effective.

On the other hand, the drawing shows that the spacer 33 protrudes downward, but the spacer may protrude upward. Even when the spacer protrudes upward, the heat sink 31 may be spaced apart by the spacer 33.

Preferably, the first heat dissipation member 30 has a through portion 36 formed at the center thereof. The second protrusion 56 of the second heat dissipation member 50 is inserted into the through part 36 so that the second protrusion 56 is in contact with the PCB substrate 10 to perform heat transfer. In this case, when the second protrusion 56 is inserted into the through part 36, a plurality of heat sinks 31 are inserted and stacked between the first protrusion 53 and the second protrusion 56.

On the other hand, the first direction radiation fin 32 is preferably formed in a horizontal direction, more preferably a plurality of through-holes 34 are formed in the first direction radiation fin 32. Since air may move through the through hole 34, heat emission may be effectively performed.

Preferably, the first heat dissipation member 30 is made of aluminum alloy or made of alumina-based ceramic material. Examples of the alumina-based ceramic material include N-9H and N-6H of Nishimura, Japan. N-6H has a high emissivity of 0.963 and a low thermal conductivity of 21.8 W / mK. In addition, N-6H is a material having a high insulation property with an insulation strength of 10KV / mm or more.

The second heat dissipation member 50 is installed to be in contact with the PCB substrate 10 so that heat of the light emitting diode 1 can be transferred. The second heat dissipation member 50 includes a second direction heat dissipation fin 52 formed in a plurality of directions different from the first direction, and first and second protrusions 53 and 56 protruding upward.

The second direction radiation fins 52 are preferably formed in the vertical direction.

The first protrusion 53 is formed at a position that can be inserted into the insertion portion. That is, the first protrusion 53 is inserted between the first direction heat dissipation fins 32 to transfer heat to the first heat dissipation member 30. A plurality of second direction heat dissipation fins 52 are formed on the outer surface of the first protrusion 53, and the second direction heat dissipation fins 52 discharge heat transferred from the PCB substrate 10 to the outside.

The second protrusion 56 is formed at the center of the second heat dissipation member 50. The second protrusion 56 is in contact with the PCB substrate 10 to receive heat. A second direction heat dissipation fin 52 may be formed around the second protrusion 56. Preferably, the second protrusion 56 has a through hole 56a penetrating through the center thereof.

The second heat dissipation member 50 is installed to be received in the housing 60. The housing 60 includes a cutout 62 formed at a position corresponding to the first protrusion 53, and a plurality of through holes 63. The second direction heat dissipation fins 52 are directly exposed to the outside through the cutout 62.

Like the first heat dissipation member 30, the second heat dissipation member 50 and the housing 60 may be made of aluminum alloy or made of alumina-based ceramic material. Examples of the alumina-based ceramic material include N-9H and N-6H of Nishimura, Japan.

In the meantime, reference numeral 65 denotes a main PCB board which controls the operation of the light emitting diode 1 and is electrically connected to an external power source and the PCB substrate 10, and 66 is a connection pin for connecting to the external power source.

Figure 4 is an exploded perspective view showing a light emitting diode lighting fixture according to a second embodiment of the present invention.

The luminaire 100a has the same structure as the above-described first embodiment except for the number of heat sinks 32 and the substrate body 11a. In FIG. 4, the same reference numerals as used in FIGS. 1 and 2 denote the same components having the same functions.

The substrate body 11a of the PCB substrate 10a is formed of an alumina-based ceramic material having excellent heat dissipation and insulation properties, for example, N-9H, to integrate the functions of a conventional printed circuit board and a heat sink into one. . In the substrate body 11a, grooves 14 are formed at edges at predetermined intervals, and the first protrusions 53 are inserted in the grooves 14.

On the other hand, Figure 5 is an exploded perspective view showing a light emitting diode lighting fixture according to a third embodiment of the present invention.

The luminaire 100b has the same structure as that of the first embodiment described above except that the structure of the first heat dissipation member 30b and the PCB substrate 10 are installed to contact the first heat dissipation member 30b. Have In FIG. 5, the same reference numerals as those of FIGS. 1 and 2 denote the same components having the same functions.

The first heat dissipation member 30b includes a body 31b and a first direction heat dissipation fin 32b formed of a plurality of layers around the body 31b. Although the first heat dissipation member 30 of the above-described embodiment is formed by stacking a plurality of heat dissipation plates 31, the first heat dissipation member 30b includes only one body 31b and has a first circumference around the body 31b. Directional radiation fins 32b are formed of a plurality of layers.

Preferably, the groove portion 35b is formed on the upper surface of the body 31b so that the PCB substrate 10 may be seated. Therefore, heat of the PCB substrate 10 is transferred to the first heat dissipation member 30b, and heat of the first heat dissipation member 30b is transferred to the second heat dissipation member 50.

6 is an exploded perspective view showing a light emitting diode lighting fixture according to a fourth embodiment of the present invention.

The luminaire 100c has a structure except that the structure of the substrate body 11a, the structure of the first heat dissipation member 30c, and the PCB substrate 10 are installed to contact the first heat dissipation member 30c. It has the same structure as in the first embodiment. In FIG. 6, the same reference numerals as those of FIGS. 1 to 5 denote the same components having the same functions.

The substrate main body 11a has the same structure as the substrate main body 11a of the second embodiment. In addition, the first heat dissipation member 30c is the third embodiment except that the groove 35b is not formed in the center of the body 31c and the number of the first direction heat dissipation fins 32c is different. 1 It has the same structure as the heat radiating member 30b. Therefore, heat of the PCB substrate 10 is transferred to the first heat dissipation member 30c, and heat of the first heat dissipation member 30c is transferred to the second heat dissipation member 50.

FIG. 7 is a graph illustrating a temperature change of each part with time after power is supplied to the light emitting diode lighting fixture of FIG. 2. The graph shows that the substrate body 11 is made of alumina-based ceramic material (N-9H), and the first and second heat dissipation members 30 and 50 are made of aluminum alloy, and the light emitting diodes 1 are formed of 3W. It is the result of numerical analysis that causes heat to be generated. As shown in FIG. 7, the temperature of the electrode is about 58 degrees, the temperature of the first heat dissipation member 30 is about 31 degrees, and the temperature of the second heat dissipation member 50 is about 43 degrees. Since the second heat dissipation member 50 is in contact with the PCB substrate 10, the temperature of the second heat dissipation member 50 is higher than the temperature of the second heat dissipation member 30.

On the other hand, Figure 8 is a graph showing the temperature change of each part over time after the power is supplied to a general light emitting diode lighting fixture. The lighting fixture has a structure disclosed in FIG. 7, etc. of Korean Patent No. 10-899089. The graph shows a case where 3 W of heat is generated in the light emitting diodes.

As shown in FIG. 8, the temperature of the electrode is about 79 degrees, and the temperature of the heat sink (corresponding to the first and second heat dissipation members 30b and 50 of the present invention) is about 64 degrees.

As is known, when the temperature of the electrode is about 80 degrees, the lifetime of the light emitting diode is reduced by about 30% and the brightness is reduced by about 20%. In contrast, in the luminaire 100 of the present invention, since the temperature of the electrode is about 58 degrees, the lifetime of the light emitting diode is not reduced and the brightness is kept constant.

9A and 9B show the temperature of each part when the temperature change of each part reaches a steady state after power is supplied to the LED lighting device according to the present invention. The luminaire is the same as the luminaire of FIG. 5 except that the recess 35b is formed to pass therethrough. Therefore, the PCB substrate 10 in the luminaire is in direct contact with the second heat dissipation member 50.

The temperature distribution is obtained by numerical analysis, wherein the substrate body 11 is made of alumina-based ceramic material (N-9H), and the first and second heat dissipation members 30b and 50 are made of aluminum alloy. 100b). 9A is a result of numerical analysis for generating 4W of heat, and FIG. 9B is a result of numerical analysis for generating 3.2W of heat.

9A shows that the substrate body 11 is about 68 to 69 ° C, the first heat dissipation member 30b is about 67 ° C, and the second heat dissipation member 50 is about 68 ° C. 9B shows that the substrate body 11 is about 60 to 61 ° C, the first heat dissipation member 30b is about 59 ° C, and the second heat dissipation member 50 is about 60 ° C.

On the other hand, Figure 9c shows the temperature of each part when the temperature change of each part reaches a steady state after power is supplied to the light emitting diode luminaire of FIG. The temperature distribution is that 4W heat is applied to the luminaire 100 of which the substrate body 11 is made of alumina-based ceramic material (N-9H) and the first and second heat dissipation members 30 and 50 are made of aluminum alloy. This is the result of numerical analysis.

As shown in Figure 9c, the substrate body 11 is about 67 ~ 68 ℃, the first heat dissipation member 30 is about 66 ℃, the second heat dissipation member 50 shows about 67 ℃, this temperature is the same heat This is about 1 ° C. lower than in the case of FIG. 9A where this occurs. This is because the first heat dissipation member 30 of FIG. 9C is formed by stacking the heat dissipation plates 31 and the through hole 34 is formed in the first direction heat dissipation fin 32 so that the air flow is more smooth.

As described above, the lighting device 100, 100a, 100b, 100c according to the present invention is the first, second direction radiation fins 32 (for example, formed in different directions (for example, horizontal and vertical)) 32b, 32c, and 52, the first direction heat dissipation fins 32, 32b, and 32c are exposed to the outside, and the second direction heat dissipation fins 52 formed on the first protrusion 53 are exposed to the outside. Since the substrate bodies 11 and 11a are made of a ceramic material, heat generated from the light emitting diodes can be easily discharged to the outside.

Figure 1a is a perspective view showing a light emitting diode lighting fixture according to a first embodiment of the present invention.

Figure 1b is a front view showing the light emitting diode luminaire of Figure 1;

2 is an exploded perspective view showing the light emitting diode lighting fixture of FIG.

Figure 3 is a perspective view showing that the diffusion member is installed on the cover of the light emitting diode lighting fixture of FIG.

Figure 4 is an exploded perspective view showing a light emitting diode lighting fixture according to a second embodiment of the present invention.

5 is an exploded perspective view showing a light emitting diode lighting fixture according to a third embodiment of the present invention.

Figure 6 is an exploded perspective view showing a light emitting diode lighting fixture according to a fourth embodiment of the present invention.

Figure 7 is a graph showing the temperature change of each part over time after the power is supplied to the light emitting diode lighting fixture of FIG.

8 is a graph showing the temperature change of each part over time after power is supplied to a general light emitting diode lighting fixture.

9a to 9c are views showing the temperature of each part when the temperature change of each part reaches a steady state after power is supplied to the light emitting diode luminaire according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10, 10a: PCB substrate 30, 30b, 30c: the first heat radiation member

50: second heat radiation member 60: housing

100, 100a, 100b, 100c: light emitting diode lighting fixture

Claims (12)

A PCB substrate provided with a light emitting diode; A first heat dissipation member installed under the PCB and provided with a plurality of first direction heat dissipation fins; And, And a second heat dissipation member installed under the first heat dissipation member to be in contact with the first heat dissipation member, the second heat dissipation member having a plurality of second direction heat dissipation fins formed in a direction different from the first direction. At least one of the first heat dissipation member and the second heat dissipation member may be in contact with the PCB to transfer heat generated from the light emitting diode. The first heat dissipation member, A fin part provided with the first direction heat dissipation fins; And And an insertion part not provided with the first direction heat dissipation fins, wherein at least a portion of the second heat dissipation member is installed to be inserted into the insertion part. The method of claim 1, The first heat dissipation member is formed by stacking at least two heat sinks, Spacer is formed on the heat sink, the light emitting diode light fixture, characterized in that the spaced apart between the heat sink due to the spacer when the heat sink is laminated. The method of claim 1, A through part is formed in the center of the first heat dissipation member, The second projection of the second heat dissipation member is inserted into the penetrating portion, characterized in that the second projection is in contact with the PCB substrate. The method of claim 1, The first heat dissipation member, Body; And And a first direction heat dissipation fin formed in a plurality of layers around the body. The method of claim 1, The first protrusion protruding upward is formed around the second heat dissipation member, The first projection is inserted into the insertion portion, characterized in that the heat transfer between the first heat dissipation member and the second heat dissipation member, the light emitting diode lighting device. The method of claim 5, The second direction heat dissipation fins are formed on the outer surface of the first protrusion, The second heat dissipation member is accommodated in the housing, the housing has a cutout formed at a position corresponding to the first protrusion, and the second direction heat dissipation fin is exposed to the outside through the cutout, and the first heat dissipation member has the first direction heat dissipation fin outside. A light emitting diode luminaire, characterized in that exposed to. The method of claim 1, A light emitting diode lighting device, characterized in that the first direction is a horizontal direction and the second direction is a vertical direction. The method of claim 1, A light emitting diode lighting device, characterized in that a plurality of through holes penetrating through the first direction heat radiation fins. The method according to any one of claims 1 to 8, Pcb board, A light emitting diode luminaire comprising a substrate body made of alumina ceramic and provided with the light emitting diode. 10. The method of claim 9, The alumina-based ceramics have an emissivity of 0.97 or more and having a dielectric strength of 10 KV / mm or more, the light emitting diode lighting fixture. The method according to any one of claims 1 to 8, The first heat dissipation member and the second heat dissipation member, characterized in that made of alumina-based ceramics, LED lighting device. The method according to any one of claims 1 to 8, The second heat dissipation member is housed in the housing, wherein the housing is made of alumina-based ceramic, light emitting diode lighting fixture.

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