KR101015588B1 - Apparatus for molding an electronic device - Google Patents

Abstract

In an apparatus for molding an electronic component comprising a substrate and semiconductor chips mounted on the substrate with molten resin, two molds are arranged in a first direction, and the rod is loaded with resin powder for molding the electronic components. It is disposed between the molds for loading trays and the electronic components into the molds. A pickup unit is disposed on one side of the loader in a second direction perpendicular to the first direction to transfer the electronic components to the loader. The resin supply unit is disposed on the other side of the loader opposite to the pickup unit to transfer the trays loaded with the resin powder to the loader.

Description

Apparatus for molding an electronic device

The present invention relates to an electronic component molding apparatus. More particularly, the present invention relates to an apparatus for molding semiconductor chips mounted on a substrate with a resin.

A molding process of an electronic component such as a semiconductor device may be performed to package semiconductor chips mounted on a substrate using a molding material such as an epoxy resin. The molding process may be performed by a molding apparatus having a mold for providing a molding space of the electronic component.

An example of such a molding apparatus is disclosed in Korean Patent No. 776630. According to the Republic of Korea Patent No. 776630, a general molding apparatus may include a plurality of molds arranged in a line, and a loader provided to be movable in a direction parallel to the array direction of the molds. The loader may transfer electronic components and trays loaded with resin powder for molding the electronic components to the molds.

In addition, the first magazines in which the electronic components are accommodated and the second magazines in which the molded electronic components are accommodated may be disposed at both sides of the molds in the arrangement direction of the molds. A first magazine elevator may be disposed adjacent to the first magazines, and a first pickup unit for transferring the electronic components may be disposed between the first magazine elevator and the loader. In addition, a second magazine elevator may be disposed adjacent to the second magazines, and a second pickup unit may be disposed between the second magazine elevator and the loader to transfer the molded electronic components.

In the case of using the general molding apparatus as described above, the time required to perform the molding process may be increased because the distance that the electronic component moves from the first magazine to the second magazine is relatively long. In addition, since the first magazines and the second magazines are disposed on both sides of the molds, the size of the molding apparatus may be increased.

An object of the present invention for solving the above problems is to provide an electronic component molding apparatus having a reduced size and can reduce the time required for the molding process for the electronic component.

An electronic component molding apparatus according to an aspect of the present invention for achieving the above object is, two molds arranged in a first direction and for molding the electronic components, disposed between the molds and molding the electronic components. A tray for loading the electronic components into the molds and trays on which resin powder is loaded, and disposed on one side of the loader in a second direction perpendicular to the first direction and transferring the electronic components to the loader. And a resin supply unit arranged at the other side of the loader opposite to the pickup unit and transferring trays on which the resin powder is loaded to the loader.

According to embodiments of the present invention, each mold may include an upper mold and a lower mold. The upper die may include an upper die having an upper support and a lower surface disposed on the lower surface of the upper support and loaded with one of the electronic components. The lower mold is disposed to enclose the lower die and the lower die having an upper surface disposed on the lower support so as to face the upper die and serving as a bottom of a cavity for molding one of the electronic components. It may include a cavity member having inner surfaces defining the cavity. In addition, the lower mold may be disposed to be movable in the vertical direction below the upper mold.

According to the embodiments of the present invention, each mold may include a film supply unit for supplying a release film between the upper mold and the lower mold, and a vertically movable upper portion of the release film for clamping the supplied release film. An upper clamp, a lower clamp disposed below the release film and vertically movable to clamp the supplied release film, the release film being clamped by the upper clamp and the lower clamp, and the clamped release film being The apparatus may further include a driving unit for moving the upper clamp in a vertical direction to closely contact the upper surface of the cavity member.

According to embodiments of the present invention, the lower mold vacuum-vents the cavity defined by the release film in close contact with the upper surface of the cavity member to cover the release film on the bottom and inner surfaces of the cavity. Vacuum holes may be formed.

According to embodiments of the present invention, the lower mold may further include a lower tube disposed to surround the cavity member, and the upper mold may further include an upper die disposed to surround the upper die. Here, the upper clamp may be disposed inside the lower tube.

According to embodiments of the present invention, the resin supply unit is disposed below the loader to supply the resin powder to the trays, and a tray on which the resin powder is loaded from the resin supply unit to the loader. It may include a loading elevator for transporting them.

According to embodiments of the present disclosure, the electronic component molding apparatus may include a tray cleaner disposed under the resin supply unit to supply the resin powder to the molds and to remove the resin powder remaining in the empty trays. And an unloading elevator for transferring the empty trays from the loader to the tray cleaner and from the tray cleaner to the resin supply unit.

According to embodiments of the present invention, the electronic component molding apparatus includes a magazine for moving the first magazine for accommodating the electronic components and a second magazine for accommodating the electronic components molded by the molds in a vertical direction. The electronic device may further include an elevator and a rail unit disposed adjacent to the magazine elevator and supporting one electronic component provided from the first magazine and one electronic component molded by one of the molds.

According to embodiments of the present invention, the pickup unit picks up a transfer plate movably disposed in the second direction, an electronic component disposed on a lower surface of the transfer plate and supported by the rail unit, and And a first picker for transferring the picked up electronic component to the loader.

According to embodiments of the present invention, the pickup unit may further include a second picker disposed on the bottom surface of the transfer plate and for transferring the molded electronic component from the loader to the rail unit.

According to embodiments of the present invention, the electronic component molding apparatus is disposed adjacent to the rail unit and the thickness measurement for measuring the thickness of the semiconductor chips of the electronic component while the electronic component is transported by the first picker It may further include wealth.

According to embodiments of the present disclosure, the thickness measuring unit may irradiate a ribbon beam onto the electronic component and detect light reflected from the electronic component. The thickness measuring unit may measure the thickness of the semiconductor chips by analyzing the detected light.

According to embodiments of the present invention, the rail unit may include: a rail plate movably disposed in the first direction; It may include in-rails and out-rails disposed on the rail plate to support the molded electronic component and to guide in the second direction.

According to embodiments of the present disclosure, the rail unit may further include a sensor for measuring a thickness of the molded electronic component moved in the first direction by the rail plate.

According to the embodiments of the present invention as described above, the electronic component molding apparatus may include two molds and a loader disposed between the molds. In addition, a resin supply unit for providing a pickup unit for transferring electronic components and a tray on which resin powder is loaded may be disposed adjacent to the loader. As a result, since the molds, the resin supply unit, and the pickup unit may be arranged around the loader, the transfer distance of the electronic component and the tray may be shortened. Therefore, the time required for the molding process of the electronic component can be shortened, and the size of the electronic component molding apparatus can be reduced.

The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.

Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the terms are defined by these terms. It won't work. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.

Spatially relative terms such as "bottom" or "bottom" and "top" or "top" may be used to describe the relationship of one element to other elements as described in the figures. Can be. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be tailored to being on the upper side of the other elements. Thus, the typical term "bottom" may include both "bottom" and "top" orientations for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, the elements described as "below" or "below" of the other elements will be fitted "above" of the other elements. Thus, a typical term "below" or "below" may encompass both orientations of "below" and "above."

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. In addition, where the terms “comprises” and / or “comprising” are used, they are characterized by the presence of the forms, regions, integrals, steps, actions, elements and / or components mentioned. It is not intended to exclude the addition of one or more other forms, regions, integrals, steps, actions, elements, components, and / or groups.

Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shape of the regions nor are they intended to limit the scope of the invention.

1 is a schematic diagram illustrating an electronic component molding apparatus according to an embodiment of the present invention.

Referring to FIG. 1, an electronic component molding apparatus 100 according to an exemplary embodiment may include a substrate 12 and a plurality of semiconductor chips 14 mounted on the substrate 12. (See FIG. 2) may be used to package the resins in a batch. The substrate 12 may be a PCB substrate and the semiconductor chips 14 may be mounted on the substrate 12 through a wire bonding process or a solder reflow process.

The molding apparatus 100 may include two molds 102 disposed to face each other. For example, two molds 102 may be disposed to face each other on both sides of the molding apparatus 100. The molds 102 may be used to mold the electronic components 10 using a resin, for example using an epoxy molding compound.

A loader 152 for transferring the electronic components 10 to the molds 102 may be disposed between the molds 102. The loader 152 may be disposed to be movable in a first direction in which the molds 102 are arranged. For example, the loader 152 may move along a rail extending in the first direction, for example, the X-axis direction, and the electronic components 10 and the electronic components inside the molds 102. The trays 50a and 50b (see FIG. 5) loaded with the resin powder 60 (see FIG. 5) for packaging the fields 10 may be loaded.

The resin powder in the pickup unit 168 and the trays 50a and 50b in a second direction perpendicular to the first direction, for example, in the Y-axis direction, for transporting the electronic components 10. The resin supply unit 140 for supplying the 60 may be disposed. For example, the pickup unit 168 may be disposed on one side of the loader 152, and the resin supply unit 140 may be disposed on the other side of the loader 152 facing the pickup unit 168. Can be. The pickup unit 168 may be disposed to be movable along a rail extending in the Y-axis direction.

In particular, the pickup unit 168 may be disposed higher than the loader 152, and the resin supply unit 140 may be disposed lower than the loader 152. A support member 156 (see FIG. 5) for supporting the electronic components 10 may be disposed on the loader 152, and the trays 50a and 50b may be disposed below the loader 152. Holder 158 for holding the can be disposed.

2 and 3 are schematic configuration diagrams for explaining the molds shown in FIG. 1, and FIG. 4 is a schematic side view for explaining the molds shown in FIG. 1.

2 to 4, each of the molds 102 may include an upper mold 104 and a lower mold 112, and the lower mold 112 may be disposed to be movable in the vertical direction.

The upper die 104 may include an upper support 106, an upper die 108, and an upper tube 110. The upper die 108 may be disposed on the lower surface of the upper support 106, and the upper tube 110 may be disposed on the lower surface of the upper support 106 to surround the upper die 108. Can be arranged. In addition, the upper die 108 may have a lower surface on which the electronic component 10 is loaded.

Although not shown, the upper die 104 may be configured to hold vacuum holes and / or grip the electronic component 10 on the lower surface of the upper die 108 to attract and fix the electronic component 10. It may have a holder.

The lower mold 112 may include a lower support 114, a lower die 116, a cavity member 118, and a lower tube 120. The lower die 116 may be disposed on the lower support 114, and the cavity member 118 may be disposed on the lower support 114 to surround the lower die 116. For example, the cavity member 118 may be elastically supported by the elastic member 122 disposed on the lower support 114. In addition, the lower tube 120 may be disposed on the lower support 114 to correspond to the upper tube 110.

In particular, the lower die 116 may have an upper surface that functions as a bottom surface of the cavity 20 for molding the electronic component 10 into a resin, for example an epoxy resin. The cavity member 118 may have a ring shape disposed to surround the lower die 116. In particular, the cavity member 118 may be disposed to protrude upward from the lower die 116, and may have inner surfaces defining the cavity 20.

The release film 30 may be disposed between the upper mold 104 and the lower mold 112. The release film 30 may be supplied between the upper mold 104 and the lower mold 112 by a film supply unit disposed adjacent to the mold 100. As shown in FIG. 3, the film supply part may include a supply roller 124 and a winding roller 126 disposed on both sides of the mold 102.

The lower die 116 may have vacuum holes (not shown) for sucking the release film 30 to cover the bottom and side surfaces of the cavity 20.

Each of the molds 102 may include an upper clamp 128 and a lower clamp 130 for clamping the release film 30. The upper clamp 128 may have a ring shape and may be connected to a driving shaft 132 extending in the vertical direction through the lower support 114. In addition, a clamp driver 134 for driving the upper clamp 128 in the vertical direction may be disposed below the lower support 114.

The lower clamp 130 may be disposed below the upper clamp 128, and may be elastically supported on the lower support 114. For example, an elastic member 136 may be disposed between the lower support 114 and the lower clamp 130, whereby the lower clamp 130 may move in the vertical direction.

The release film 30 may be supplied between the upper clamp 128 and the lower clamp 130 by the supply roller 124. That is, as shown, the upper clamp 128 and the lower clamp 130 may be disposed outside the cavity member 118, by the clamp driver 134 and the elastic member 136 Can move in the vertical direction.

The release film 30 may be clamped between the upper clamp 128 and the lower clamp 130 by the downward movement of the upper clamp 128, the lower clamp 130 by the downward movement of the upper clamp 128 It may be in close contact with the top surface of the butt member 118. Accordingly, the interior space of the cavity 20 may be sealed by the release film 30, and the sealed cavity 20 is provided by a vacuum pressure provided through the vacuum holes of the lower die 116. Can be evacuated. As a result, the release film 30 may be coated on the bottom and inner surfaces of the cavity 20.

The resin powder may be supplied into the cavity 20 coated with the release film 30 and may be melted by a heater (not shown) connected to the lower mold 112. The electronic component 10 may be immersed in the molten resin 40 by raising the lower mold 112, and then the electronic component 10 may be packaged as the molten resin 40 is cured. Can be.

In addition, the lower tube 120 may be in close contact with the upper tube 110 by the rising of the lower mold 112. Here, a sealing member 138 may be interposed between the upper tube 110 and the lower tube 120. As a result, a space enclosed by the upper support 106, the upper tube 110, the sealing member 138, the lower tube 120, and the lower support 114 may be formed, and the pressure inside the sealed space may be formed. May be maintained lower than atmospheric pressure during the molding process of the electronic component 10.

FIG. 5 is a schematic configuration diagram illustrating the resin supply unit shown in FIG. 1.

Referring to FIG. 5, the resin supply unit 140 may be disposed adjacent to the loader 152, and may supply a resin supply unit 142 for supplying the resin powder 60 to trays 50a and 50b. It may include. The tray 50a supplied with the resin powder 60 by the resin supply unit 142 may be supplied to the loader 152 by the loading elevator 144. In addition, after supplying the resin powder 60 into the cavity 20 of the lower mold 112, the empty tray 50b may be moved to the unloading elevator 146 by the loader 152. .

The loading and unloading elevators 144 and 146 may be disposed adjacent to the loader 152 and arranged parallel to each other in a vertical direction.

Below the resin supply unit 142, a tray handler 148 for moving the tray 50a on which the resin powder 60 is loaded or the empty tray 50b in the horizontal direction may be disposed. For example, the tray handler 148 may move the empty tray 50b in the X-axis direction and the Y-axis direction so that the resin powder 60 is uniformly supplied into the empty tray 50b. In addition, the tray 50a supplied with the resin powder 60 may be moved to a position adjacent to the loading elevator 144 so that the loading elevator 144 may raise it.

A tray cleaner 150 may be disposed under the tray handler 148 to remove the resin powder remaining on the empty tray 50b. The unloading elevator 146 may move the empty tray 50b to the tray cleaner 150, and further, after cleaning the empty tray 150b, a resin powder ( The empty tray 50b may be moved to the tray handler 148 to supply 60.

The tray cleaner 150 is disposed on the upper cleaner and the lower surfaces of the empty tray 50b to remove the resin powder remaining inside the empty tray 50b and on the upper surfaces of the empty tray 50b. It may include a lower cleaner for removing the resin powder remaining in the. The upper and lower cleaners may be configured to be movable in a horizontal direction, and the resin powder may be removed using a vacuum.

The loader 152 may be configured to be movable along a rail 154 extending in the X-axis direction between the molds 102. In particular, the loader 152 may move the electronic component 10 and the tray 50a between the upper mold 104 and the lower mold 112 of each mold 102.

A support member 156 for supporting the electronic component 10 may be disposed at an upper portion of the loader 152, and a holder for holding the trays 50a and 50b may be disposed at a lower portion of the loader 152. 158 may be provided. In addition, although not shown in detail, the support member 156 may be configured to move in the vertical direction to load the electronic component 10 on the lower surface of the upper mold 104.

Although not shown in detail, the trays 50a and 50b may have an inner space for loading the resin powder 60 and may have a lower door that closes the inner space. The lower door may be arranged to be slidable in a horizontal direction, and may be opened to supply the resin powder 60 into the cavity 20 of the lower mold 112.

Referring back to FIG. 1, the molding apparatus 100 includes a magazine unit 160 supporting magazines for accommodating a plurality of electronic components 10 and a magazine elevator 162 for moving the magazines in a vertical direction. It may further include.

FIG. 6 is a schematic front view for explaining the magazine unit and the magazine elevator shown in FIG. 1.

Referring to FIG. 6, the magazine unit 160 includes the first stage 164 on which the plurality of first magazines 70 in which the electronic components 10 are stored before the molding process and the electrons after the molding process are supported. The second stage 166 may include a plurality of second magazines 90 in which the parts 80 are accommodated. The second stage 166 may be disposed above the first stage 164.

The magazine elevator 162 may be disposed to be adjacent to the magazine unit 160, as shown in FIG. 6, configured to move the first magazine 70 and the second magazine 90 in a vertical direction. Can be.

The electronic components 10 accommodated in the first magazine 70 may be moved on the rail unit 182 disposed between the magazine elevator 162 and the pickup unit 168.

FIG. 7 is a schematic front view illustrating the pickup unit and the rail unit illustrated in FIG. 1, and FIG. 8 is a schematic side view illustrating the pickup unit and the rail unit illustrated in FIG. 1.

Referring to FIGS. 7 and 8, the pickup unit 168 may be configured to be movable along rails 170 extending in the Y-axis direction. In particular, the first picker 172 for picking up the electronic component 10 provided from the first magazine 70 and transporting it to the loader 152 and the molded electronic component 80 from the loader 152 are picked up. It may include a second picker 174 to transfer to the second magazine (90).

The first picker 172 and the second picker 174 may be mounted on a lower surface of the transfer plate 176 that is movably disposed along the rails 170. The first picker 172 may include a vacuum block 178 having a plurality of vacuum holes for picking up the electronic component 10, and the second picker 174 may be molded electronic component 80. It may include a plurality of vacuum nozzles 180 for picking up. In addition, the first and second pickers 172 and 174 perform pick-up and placing operations on the electronic component 10 and the molded electronic component 80 before the molding, respectively. It may be configured to be movable in the vertical direction to perform.

The rail unit 182 may be disposed adjacent to the magazine elevator 162 and may support in-rails for supporting the electronic component 10 provided from the first magazine 70 and guiding in the Y-axis direction. 184, and out-rails 186 for supporting the molded electronic component 80 and guiding in the Y-axis direction.

The in-rails 184 and the out-rails 186 may be disposed on the rail plate 188, which is in the X-axis direction as shown on the rail stage 190. It may be arranged to be movable. In addition, a sensor 192 for measuring the thickness of the molded electronic component 80 may be disposed on the rail stage 190. In particular, the molded electronic component 80 placed on the out-rails 186 by the second picker 174 can move in the X-axis direction by the rail plate 188, thereby The upper and lower members 192a and 192b of the sensor 192 may be disposed. Subsequently, the thickness of the molded electronic component 80 may be measured by vertical movement of the upper and lower members 192a and 192b of the sensor 192.

In addition, the rail plate 188 may move in the X-axis direction to correspond to the magazine elevator 162. For example, when the electronic component 10 is transferred from the first magazine 70, the rail plate 188 may include the X-axis such that the in-rails 184 correspond to the first magazine 70. Direction, and when the molded electronic component 80 is accommodated in the second magazine 90, the rail plate 188 may be configured such that the out-rails 186 are connected to the second magazine 90. It may move in the X-axis direction so as to correspond.

Although not shown, the magazine elevator 162 may have a pusher for pushing the electronic components 10 from the first magazine 70 toward the in-rails 184. have.

The transfer plate 176 may be equipped with a gripper 194 for holding the electronic component 10 protruding from the first magazine 70 by the pusher of the magazine elevator 162. The gripper 194 may include an upper gripping member 194a and a lower gripping member 194b, and the upper gripping member 194a may be configured to be movable in the vertical direction. The electronic component 10 protruding from the first magazine 70 may be gripped between the upper gripping member 194a and the lower gripping member 194b, and the transfer plate 176 may be in the Y-axis direction. In other words, it may be loaded onto the in-rails 184 by moving toward the loader 152.

Further, the gripper 194 pushes the molded electronic component 80 to receive the molded electronic component 80 loaded on the out-rails 186 in the second magazine 90. It can also function as a pusher.

The rail unit 182 may be disposed on the base plate 196. The thickness of the semiconductor chips 14 of the electronic component 10 is measured on the base plate 196 while the electronic component 10 is transferred to the loader 152 by the first picker 172. The thickness measuring unit 198 may be disposed. The thickness measuring unit 198 may irradiate a ribbon beam having a predetermined width onto the electronic component 10, and detect light reflected from the electronic component 10. In addition, the thickness measuring unit 198 may measure the thicknesses of the semiconductor chips 14 by analyzing the detected light.

Unlike the above, the thickness measuring unit 198 may obtain an image of the electronic component 10 from the detected light, and may measure the thickness of the semiconductor chips 14 by analyzing the image. .

In addition, although not shown in detail, the thickness measuring unit 198 may be configured to be movable in the X-axis direction. This is to repeatedly scan the semiconductor chips 14 using the ribbon beam when the width of the ribbon beam is smaller than the width of the semiconductor chips 14.

The thicknesses of the semiconductor chips 14 measured by the thickness measuring unit 198 may be transmitted to the resin supply unit 140, and the resin supply unit 140 may depend on the thicknesses of the semiconductor chips 14. The amount of the resin powder 60 supplied to the empty tray 50b may be adjusted.

Referring again to FIG. 1, the electronic component 10 on the in-rails 184 may be transported by the first picker 172 of the pickup unit 168, followed by the loader 152. It may be supplied to one of the molds (102). That is, the electronic component 10 may be supported by the support member 156 of the loader, and may be supplied to one of the molds 102 by the X-axis movement of the loader 152.

In addition, after the molding process is performed by the mold 102, the molded electronic component 80 may be unloaded from the mold 102 by the loader 152. It may be transported onto the out-rails 186 by a second picker 174. The molded electronic component 80 on the out-rails 186 may be measured by the sensor 192 and then be accommodated in the second magazine 90 by the gripper 194. Can be.

Meanwhile, as shown in FIG. 1, the electronic components 10 and 80 may be disposed in the longitudinal direction, that is, the Y-axis direction while being transported for the molding process. That is, it is not necessary to rotate the electronic components 10 and 80 while transferring the electronic components 10 and 80 for the molding process.

According to the embodiments of the present invention as described above, the electronic component molding apparatus may include two molds and a loader disposed between the molds. In addition, a resin supply unit for providing a pickup unit for transferring electronic components and a tray on which resin powder is loaded may be disposed adjacent to the loader. As a result, since the molds, the resin supply part, and the pickup unit can be arranged around the loader, the transfer distance of the electronic component and the tray can be shortened. Therefore, the time required for the molding process of the electronic component can be shortened, and the size of the electronic component molding apparatus can be reduced.

In addition, since there is no need to rotate the electronic component, the unit necessary for the rotation of the electronic component can be removed, and since the loading and unloading of the electronic component can be performed by one pick-up unit, Manufacturing costs can be reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

1 is a schematic diagram illustrating an electronic component molding apparatus according to an embodiment of the present invention.

2 and 3 are schematic configuration diagrams for describing the molds shown in FIG. 1.

FIG. 4 is a schematic side view for describing the mold illustrated in FIG. 1.

FIG. 5 is a schematic configuration diagram illustrating the resin supply unit shown in FIG. 1.

FIG. 6 is a schematic front view for explaining the magazine unit and the magazine elevator shown in FIG. 1.

FIG. 7 is a schematic front view for describing the pickup unit and the rail unit illustrated in FIG. 1.

FIG. 8 is a schematic side view for describing the pickup unit and the rail unit illustrated in FIG. 1.

Explanation of symbols on the main parts of the drawings

10, 80: electronic component 20: cavity

30: release film 40: molten resin

50a, 50b: Tray 60: Resin Powder

100: electronic component molding apparatus 102: mold

104: upper die 108: upper die

112: lower die 116: lower die

118: cavity member 128: upper clamp

130: lower clamp 140: resin supply

142: resin supply unit 144: loading elevator

146: unloading elevator 148: tray handler

150: tray cleaner 152: loader

160: magazine unit 162: magazine elevator

168: pickup unit 172, 174: first, second picker

184: Rail unit 184, 186: In and out rail

194: gripper 198: thickness measuring unit

Claims (14)

Two molds arranged in a first direction and for molding the electronic components; Trays disposed between the molds and loaded with resin powder for molding the electronic components, and a loader for loading the electronic components into the molds; A pickup unit disposed at one side of the loader in a second direction perpendicular to the first direction and transferring the electronic components to the loader; And And a resin supply unit disposed on the other side of the loader opposite to the pickup unit and transferring the trays on which the resin powder is loaded to the loader. The method of claim 1, wherein each mold, An upper die comprising an upper die and an upper die disposed on a lower surface of the upper support and having a lower surface on which one of the electronic components is loaded; And A lower die, a lower die having an upper surface disposed on the lower support so as to face the upper die and serving as a bottom of a cavity for molding one of the electronic components, and arranged to enclose the lower die An electronic component molding apparatus comprising a cavity member having inner surfaces defining an upper surface thereof, the lower mold being movably disposed in a vertical direction below the upper mold. The method of claim 2, wherein each mold, A film supply unit for supplying a release film between the upper mold and the lower mold; An upper clamp disposed above the release film and movable in a vertical direction to clamp the supplied release film; A lower clamp disposed below the release film and movable in a vertical direction to clamp the supplied release film; And And a driving unit for moving the upper clamp in a vertical direction such that the release film is clamped by the upper clamp and the lower clamp and the clamped release film is in close contact with the upper surface of the cavity member. Component molding device. According to claim 3, Vacuum holes for evacuating the cavity defined by the release film in close contact with the upper surface of the cavity member in order to cover the release film on the bottom and the inner surface of the cavity is in the lower mold Electronic component molding apparatus, characterized in that formed. 4. The lower mold of claim 3, wherein the lower mold further comprises a lower tube disposed to enclose the cavity member, the upper mold further comprises an upper die disposed to enclose the upper die, and the upper clamp further comprises the lower tube. Electronic component molding apparatus, characterized in that disposed on the inside. The method of claim 1, wherein the resin supply unit, A resin supply unit disposed below the loader for supplying the resin powder to the trays; And And a loading elevator for transferring the trays in which the resin powder is loaded from the resin supply unit to the loader. The apparatus of claim 6, further comprising: a tray cleaner disposed under the resin supply unit to remove resin powder remaining in empty trays after the resin powder is supplied to the molds; And And an unloading elevator for transferring said empty trays from said loader to said tray cleaner and from said tray cleaner to said resin supply unit. 2. The apparatus of claim 1, further comprising: a magazine elevator for moving in a vertical direction a first magazine for accommodating the electronic components and a second magazine for accommodating the electronic components molded by the molds; And And a rail unit supporting one electronic component provided from the first magazine and one electronic component molded by one of the molds. The method of claim 8, wherein the pickup unit, A transfer plate movably disposed in the second direction; And And a first picker disposed on a lower surface of the transfer plate and configured to pick up the electronic component supported by the rail unit and transfer the picked up electronic component to the loader. The method of claim 9, wherein the pickup unit, And a second picker disposed on the bottom surface of the transfer plate and configured to transfer the molded electronic component from the loader to the rail unit. The electronic component molding apparatus of claim 9, further comprising a thickness measuring unit configured to measure thicknesses of semiconductor chips of the electronic component while the electronic component is transferred by the first picker. The semiconductor device of claim 11, wherein the thickness measuring unit irradiates a ribbon beam onto the electronic component, detects light reflected from the electronic component, and analyzes the detected light to measure thicknesses of the semiconductor chips. Electronic component molding apparatus. The method of claim 8, wherein the rail unit, A rail plate disposed to be movable in the first direction; In-rails disposed on the rail plate for supporting the electronic component and guiding in the second direction; And And out-rails disposed on the rail plate to support and guide the molded electronic component in the second direction. The method of claim 13, wherein the rail unit, And a sensor for measuring a thickness of the molded electronic component moved in the first direction by the rail plate.

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