KR20200072976A - Substrate supply module and die bonding apparatus including the same - Google Patents

Abstract

Disclosed is a die bonding apparatus comprising: a die bonding module for bonding a die on a substrate; a substrate supply module for supplying the substrate; and a substrate transfer module disposed between the die bonding module and the substrate supply module, and transferring the substrate between the die bonding module and the substrate supply module. The substrate supply module includes: a magazine handling unit for handling a first magazine, wherein substrates to be introduced to a die bonding process are accommodated, and a second magazine for accommodating the substrates wherein the die bonding process is completed; a substrate carrying-in/out unit for withdrawing the substrate to be introduced to the die bonding process from the first magazine, and accommodating the substrate in which the die bonding process is completed in the second magazine; a substrate support unit for supporting the substrate withdrawn from the first magazine and the substrate to be accommodated in the second magazine; and a port stage disposed on an upper portion of the magazine handling unit and provided with a plurality of magazine load ports for loading and unloading the first and second magazines. According to the present invention, the time required for loading and unloading a magazine can be shortened.

Description

Substrate supply module and die bonding device including the same {SUBSTRATE SUPPLY MODULE AND DIE BONDING APPARATUS INCLUDING THE SAME}

Embodiments of the present invention relate to a substrate supply module and a die bonding device comprising the same. More specifically, the present invention relates to a substrate supply module for supplying a target substrate such as a lead frame or a printed circuit board in a die bonding process, and a die bonding device for bonding a die on a substrate supplied from the substrate supply module.

In general, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed may be divided into a plurality of dies through a dicing process, and individualized dies through the dicing process may be bonded onto a substrate through a die bonding process.

The apparatus for performing the die bonding process may include a pickup module for picking up and separating the dies from the wafer divided into the dies, and a bonding module for attaching the picked up die on a substrate. The pickup module picks up and attaches the die from the wafer and a die ejector movably installed in a vertical direction to selectively separate the die from the stage unit supporting the wafer and the wafer supported on the stage unit. It may include a pickup unit for.

In addition, the die bonding apparatus may include a substrate supply module for supplying the substrate. The substrate supply module may take a substrate from a magazine in which a plurality of substrates are stored and transfer it to a die bonding area, and transfer the substrate where the die bonding process is completed to another magazine. A bonding stage supporting the substrate may be provided in the die bonding region.

Meanwhile, as various types of semiconductor devices are developed, die bonding processes using different process recipes may be simultaneously performed in a plurality of die bonding devices. As an example, in Korean Patent Application Publication No. 10-2018-0112527 filed and published by the applicant, die bonding is provided with a plurality of die bonding modules and a substrate supply module for supplying substrates to the die bonding modules. The device is disclosed. However, in the case of the substrate supply module, since loading and unloading of the magazines is performed using one magazine load port, it may take considerable time to load and unload the magazines.

Republic of Korea Patent Publication No. 10-2018-0112527 (published on October 12, 2018)

It is an object of the embodiments of the present invention to provide a substrate supply module capable of reducing the time required for loading and unloading a magazine and a die bonding device including the same.

The substrate supply module according to an aspect of the present invention for achieving the above object is a magazine for handling a first magazine in which the substrates to be input to the die bonding process are accommodated and a second magazine for storing the substrates in which the die bonding process is completed. A handling unit, a substrate take-out unit for taking out a substrate to be put into the die bonding process from the first magazine and receiving the die-bonding substrate into the second magazine, a substrate taken out from the first magazine, and the A substrate support unit supporting a substrate to be accommodated in a second magazine, and a port stage disposed above the magazine handling unit and provided with a plurality of magazine load ports for loading and unloading the first and second magazines Can.

According to some embodiments of the present invention, the substrate supply module may further include a magazine transfer robot for transferring the first and second magazines between the magazine handling unit and the port stage.

According to some embodiments of the present invention, the magazine handling unit includes a first magazine gripper for holding the first magazine and an upper or lower portion of the first magazine gripper and for holding the second magazine. A second magazine gripper and a magazine lifting mechanism for moving the first and second magazines in the vertical direction may be included.

According to some embodiments of the present invention, the magazine handling unit includes a second magazine load port for loading and unloading the first and second magazines, and a port for moving the second magazine load port in the vertical direction. A first magazine transfer mechanism for transferring the first magazine between the lifting mechanism and the second magazine load port and the first magazine gripper; and the second between the second magazine load port and the second magazine gripper. A second magazine delivery mechanism for delivery of the magazine may be further included.

According to some embodiments of the present invention, the magazine handling unit may further include a horizontal driving unit for moving the first and second magazine grippers in a horizontal direction for delivery of the first and second magazines.

According to some embodiments of the invention, the magazine handling unit further comprises a third magazine delivery mechanism for delivering the first and second magazines from the first and second magazine grippers to the second magazine load port. It can contain.

According to some embodiments of the present invention, the substrate carrying-in unit includes a pushing mechanism that pushes the substrate so that a portion of the substrate to be input to the die bonding process protrudes from the first magazine, and the substrate on which the portion protrudes. A substrate take-out mechanism for moving onto the substrate support unit and a substrate storage mechanism for moving the substrate on which the die bonding process is completed from the substrate support unit into the second magazine.

According to some embodiments of the present invention, the substrate support unit includes first and second guide rails supporting the withdrawn substrate and the substrate to be accommodated and guiding them in the withdrawing and receiving directions, respectively, and the first and first substrates. It may include a shuttle on which two guide rails are installed, and a shuttle transport mechanism for moving the shuttle so that one of the first and second guide rails faces one of the first and second magazines.

A die bonding apparatus according to another aspect of the present invention for achieving the above object, a die bonding module for bonding a die on a substrate, a substrate supply module for supplying the substrate, and the die bonding module and the substrate supply It may be disposed between the module and may include a substrate transfer module for transferring the substrate between the die bonding module and the substrate supply module, wherein the substrate supply module is a first magazine in which substrates to be introduced into a die bonding process are housed. And a magazine handling unit that handles a second magazine for storing the substrates on which the die bonding process is completed, and a substrate to be input to the die bonding process from the first magazine, and the die bonding process is completed with the second magazine. A substrate carrying-in unit for receiving a substrate, a substrate support unit supporting a substrate drawn out from the first magazine and a substrate to be accommodated in the second magazine, and the first and second magazines disposed above the magazine handling unit It may include a port stage provided with a plurality of magazine load ports for loading and unloading.

According to some embodiments of the present invention, the die bonding module includes a wafer load port on which a wafer storage container in which a plurality of wafers are accommodated is placed, and the wafer load port and the magazine load ports travel paths of the ceiling transport device. It can be placed below.

According to some embodiments of the present invention, the die bonding apparatus may further include an inspection module for inspecting whether the die is normally bonded on the substrate.

According to embodiments of the present invention as described above, the substrate supply module includes a port stage having a plurality of magazine load ports for loading and unloading the first and second magazines, and the magazine load ports and And a magazine transfer robot for transferring the first and second magazines between the magazine handling units. Therefore, it is possible to significantly reduce the time required for loading and unloading the first and second magazines compared to the prior art that loads and unloads the magazines using one magazine load port.

1 is a schematic plan view for explaining a substrate supply module and a die bonding apparatus including the same according to an embodiment of the present invention.
FIG. 2 is a schematic plan view for describing the die bonding module illustrated in FIG. 1.
3 is a schematic configuration diagram for describing the wafer stage illustrated in FIG. 2.
FIG. 4 is a schematic plan view for explaining the substrate supply module illustrated in FIG. 1.
5 is a schematic front view illustrating the substrate supply module illustrated in FIG. 1.
6 to 9 are schematic diagrams for explaining the operation of the substrate supply module shown in FIG. 5.
10 is a schematic plan view for explaining the inspection module shown in FIG. 1.
11 is a schematic plan view for explaining the substrate transfer module shown in FIG. 1.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be configured as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided to sufficiently convey the scope of the present invention to those skilled in the art of the present invention rather than to provide the present invention to be completely completed.

In the embodiments of the present invention, when one element is described as being disposed on or connected to another element, the element may be disposed or connected directly on the other element, and other elements are interposed between them. It may be. Alternatively, if it is described that one element is disposed or connected directly on the other element, there cannot be another element between them. Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or parts, but the items are not limited by these terms. Would not.

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to limit the present invention. In addition, unless otherwise limited, all terms including technical and scientific terms have the same meaning that can be understood by those of ordinary skill in the art. These terms, such as those defined in conventional dictionaries, will be construed to have meanings consistent with their meanings in the context of the description of the invention and the related art, ideally or excessively intuition, unless explicitly defined. It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Accordingly, variations from the shapes of the illustrations, for example, variations in manufacturing methods and/or tolerances, are those that can be expected sufficiently. Accordingly, the embodiments of the present invention are not limited to specific shapes of regions described as illustrations, but include variations in shapes, and the elements described in the figures are entirely schematic and their shapes Is not intended to describe the exact shape of the elements nor is it intended to limit the scope of the invention.

1 is a schematic plan view for explaining a substrate supply module and a die bonding apparatus including the same according to an embodiment of the present invention.

Referring to FIG. 1, the die bonding apparatus 10 according to an embodiment of the present invention includes die bonding modules 100, 102, 104, and 106 for bonding the die 30 on the substrate 20, and The substrate supply module (200, 202) for supplying the substrate 20, the die bonding modules (100, 102, 104, 106) and the substrate supply module (200, 202) disposed between the die bonding module ( It may include a substrate transfer module 300 for transferring the substrate 20 between the 100, 102, 104, 106 and the substrate supply module (200, 202). In addition, the die bonding apparatus 10 may include inspection modules 400 and 402 for inspecting whether the die 30 is normally bonded on the substrate 20.

In particular, the die bonding apparatus 10 includes at least one first die bonding module 100 and 102 for performing a die bonding process, and a first horizontal direction from the first die bonding modules 100 and 102, For example, the second die bonding modules 104 and 106 arranged to be spaced a predetermined distance in the X-axis direction, and the substrates 20 by the first and second die bonding modules 100, 102, 104, and 106 ) For at least one substrate supply module (200, 202) and the first and second die bonding modules (100, 102, 104, 106) for the die bonding process is completed for the substrate 20 At least one inspection module (400, 402) for inspecting the die bonding state, the first and second die bonding modules (100, 102, 104, 106) and the at least one substrate supply module (200, 202) ) And the at least one inspection module 400, 402, and may include a substrate transfer module 300 for transferring the substrates 20. At this time, the at least one substrate supply module (200, 202) and the at least one inspection module (400, 402) is a second horizontal direction perpendicular to the first horizontal direction, for example, in the Y-axis direction Each may be disposed on both sides of the substrate transfer module 300.

For example, as shown, two first die bonding modules 100 and 102 may be arranged in the Y-axis direction, and two second die bonding modules 104 and 106 may be applied to the first The die bonding modules 100 and 102 may be disposed in parallel. Also, the first substrate supply module 200 for supplying the substrate 20 to the first die bonding modules 100 and 102 and the substrate 20 to the second die bonding modules 104 and 106 are provided. A second substrate supply module 202 for supplying may be disposed on one side of the substrate transfer module 300 in the Y-axis direction, and the die bonding process is completed in the first die bonding modules 100 and 102 The first inspection module 400 for inspecting the substrate 20 and the second inspection module 402 for inspecting the substrate 20 on which the die bonding process is completed in the second die bonding modules 104 and 106 are It may be disposed on the other side of the substrate transfer module 300 in the Y-axis direction.

The first and second die bonding modules 100, 102, 104, and 106 may have substantially the same configuration, and for convenience of description, the first and second die bonding modules 100, 102, 104, 106).

FIG. 2 is a schematic plan view for describing the die bonding module illustrated in FIG. 1, and FIG. 3 is a schematic configuration diagram for describing the wafer stage illustrated in FIG. 2.

2 and 3, the first die bonding module 100 includes the wafer stage 120 and the wafer 40 supporting the substrate stage 110 and the wafer 40 on which the substrate 200 is placed. A bonding unit 130 for picking up the die 30 from and bonding it to the substrate 20 may be included. In addition, the first die bonding module 100 may include a wafer load port 140 on which a wafer storage container 50 in which a plurality of wafers 40 are accommodated is placed.

The wafer 40 includes a plurality of dies 30 individualized through a dicing process, a dicing tape 42 to which the dies 30 are attached, and an approximately circular ring on which the dicing tape 42 is mounted. It may include a wafer frame 44 of the form. On the wafer stage 120, the extension ring 122 for supporting the edge portion of the dicing tape 42 and the clamp 124 for gripping the wafer frame 44 and the clamp 124 are moved up and down. A clamp driving unit (not shown) may be disposed to make the device. Specifically, after the dicing tape 42 is placed on the expansion ring 122, the clamp 124 may be lowered while holding the wafer frame 44, thereby dicing the tape 42 ) Can be expanded. As a result, the distance between the dies 30 can be widened, and accordingly, the pickup of the dies 30 can be easily made.

The wafer stage 120 may have a central opening to expose a bottom surface of the dicing tape 42 to which the dies 30 are attached, and the dies from the dicing tape 42 are disposed under the opening. A die ejector 126 for separating 30 may be disposed. Specifically, as the eject pin of the die ejector 126 rises, one of the dies 30 can be partially separated from the dicing tape 42, and the separated die 30 is the bonding unit ( 130).

The bonding unit 130 includes a die stage 132 for supporting the picked up die 30 and a die for picking up the die 30 from the wafer 40 and transferring it to the die stage 132. A transfer unit 134 and a die attach unit 136 for picking up and bonding the die 30 on the die stage 132 to the substrate 20 may be included.

Although not shown, the first die bonding module 100 withdraws the wafer 40 from the wafer storage container 50 on the load port 140 and the dies 30 on the wafer 40 are all After being picked up, a wafer carrying-in unit (not shown) for storing the wafer 40 in the wafer storage container 50 may be further included. In addition, a die reversing mechanism (not shown) for reversing the die 30 may be further provided when the die 30 is inverted.

According to an embodiment of the present invention, the substrate stage 110 may be configured to be movable between a first position for loading and unloading the substrate 20 and a second position for bonding of the die 30. Can. For example, the first die bonding module 100 may include a horizontal driver 150 for moving the substrate stage 110 in the X-axis direction. That is, it can be moved to the first position, that is, the position adjacent to the substrate transfer module 300 by the horizontal driving unit 150, and after the load of the substrate 20 is made in the first position, the second position, that is, the It may be moved to a position adjacent to the bonding unit 130.

Although not shown, the substrate stage 110 may have a plurality of vacuum holes for adsorbing the substrate 20, the substrate stage 110 for heating the substrate 20 to a predetermined temperature A heater can be built.

On the other hand, another first die bonding module 102 and the second die bonding modules 104 and 106 may be configured substantially the same as the first die bonding module 100, so a description thereof will be omitted. In addition, as illustrated in FIG. 1, the first and second die bonding modules 100, 102, 104, and 106 are symmetrical to each other in the X-axis direction and the Y-axis direction with the substrate transfer module 300 interposed therebetween. Can be deployed.

The substrate supply modules 200 and 202 may be used to supply a substrate to the first and second die bonding modules 100, 102, 104, and 106 through the substrate transfer module 300.

4 is a schematic plan view for explaining the substrate supply module shown in FIG. 1, and FIG. 5 is a schematic front view for explaining the substrate supply module shown in FIG. 1.

4 and 5, the first substrate supply module 200 includes a first magazine 60 in which substrates 20 to be input to the die bonding process are housed and substrates in which the die bonding process is completed ( 20) a magazine handling unit 210 for handling the second magazine 62 for storage, and a substrate 20 to be input to the die bonding process from the first magazine 60 is withdrawn and the second magazine ( 62) the substrate carrying-in unit 230 for receiving the die bonding process completed substrate 20, the substrate 20 to be withdrawn from the first magazine 60 and the substrate to be accommodated in the second magazine 62 A substrate support unit 240 supporting the (20) and a plurality of magazine load ports arranged on top of the magazine handling unit 210 and for loading and unloading the first and second magazines 60 and 62 It may include a port stage 250 is provided with a field (252).

The magazine handling unit 210 includes a first magazine gripper 212 for gripping the first magazine 60, a second magazine gripper 214 for gripping the second magazine 62, and the second It may include a magazine lifting mechanism 216 for moving the first and second magazines (60, 62) in the vertical direction. In addition, the magazine handling unit 210 includes a second magazine load port 218 for loading and unloading the first and second magazines 60 and 62, and the second magazine load port 218. And the first and second magazine grippers 212 and 214 between the first and second magazines 60 and 62, which may include magazine delivery mechanisms 222, 224 and 226. .

For example, as illustrated, the second magazine gripper 214 may be disposed under the first magazine gripper 212. However, contrary to the above, the second magazine gripper 214 may be disposed on the first magazine gripper 212. The magazine handling unit 210 includes a port lifting mechanism 220 for moving the second magazine rod port 218 in a vertical direction, the second magazine rod port 218 and the first magazine gripper 212 ) Between the first magazine delivery mechanism 222 for delivery of the first magazine 60, and between the second magazine load port 218 and the second magazine gripper 214, the second magazine 62 ) May include a second magazine delivery mechanism 224 for delivery.

In addition, the magazine handling unit 210, a horizontal driving unit for moving the first and second magazine grippers 212 and 214 in the horizontal direction for the delivery of the first and second magazines 60 and 62 (228) and a third magazine for delivering the first and second magazines (60, 62) from the first and second magazine grippers (212, 214) to the second magazine load port (218) It may include a delivery mechanism (226).

For example, the first, second and third magazine delivery mechanisms 222, 224, and 226 may be configured using a conveyor belt, and the second magazine load port 218 may also be used using a conveyor belt. Can be configured. The third magazine delivery mechanism 226 may be disposed between the first and second magazine delivery mechanisms 222 and 224, and the horizontal driving unit 228 may move the magazine lifting mechanism 216 in the X-axis direction. Can be moved. In particular, the first, second and third magazine delivery mechanisms 222, 224 and 226 may be used as magazine buffers for temporarily storing the magazines 60 and 62.

According to an embodiment of the present invention, a plurality of magazine load ports 252 may be arranged on the port stage 250 in the X-axis direction. In addition, a magazine transfer robot 260 for transferring the first and second magazines 60 and 62 between the magazine handling unit 210 and the port stage 250 is disposed on the port stage 250. It can be placed.

The magazine transfer robot 260 may include a third magazine gripper 262 for gripping the first magazine 60 or the second magazine 62, and the first and second magazines 60, For the transfer of 62), the third magazine gripper 262 may be moved in a horizontal direction, for example, the X-axis direction and the vertical direction. Particularly, the magazine transfer robot 260 moves the first and second magazines 60 and 62 between the magazine load ports 252 and the second magazine load ports 218 on the port stage 250. Can be transported.

6 to 9 are schematic diagrams for explaining the operation of the substrate supply module shown in FIG. 5.

Referring to FIG. 6, when supplying the first magazine 60 in which the substrates 20 to be put into the die bonding process are received, the port lifting mechanism 220 raises the second magazine load port 218 In addition, the magazine transfer robot 260 may transfer the first magazine 60 from the port stage 250 onto the second magazine load port 218. Subsequently, the port lifting mechanism 220 may lower the second magazine load port 218 so that the second magazine load port 218 is adjacent to the first magazine delivery mechanism 222, and the first The magazine 60 may be moved from the second magazine load port 218 onto the first magazine delivery mechanism 222 by the conveyor belts. Subsequently, the magazine lifting mechanism 216 is the first magazine gripper 212 to a position where the first magazine gripper 212 faces the first magazine 60 on the first magazine delivery mechanism 222. The horizontal driving unit 228 may horizontally move the first magazine gripper 212 so that the first magazine 60 can be gripped by the first magazine gripper 212.

Referring to FIG. 7, when the empty second magazine 62 is supplied for the storage of the substrates 20 on which the die bonding process is completed, the port lifting mechanism 220 is the second magazine load port 218 In addition, the magazine transfer robot 260 may transfer the second magazine 62 from the port stage 250 onto the second magazine load port 218. Subsequently, the port lifting mechanism 220 may lower the second magazine load port 218 such that the second magazine load port 218 is adjacent to the second magazine delivery mechanism 224, and the second magazine loading port 218 is lowered. The magazine 62 can be moved from the second magazine load port 218 onto the second magazine delivery mechanism 224 by the conveyor belts. Subsequently, the magazine lifting mechanism 216 is such that the second magazine gripper 214 is positioned to face the second magazine 62 on the second magazine delivery mechanism 224, the second magazine gripper 214. The horizontal driving unit 228 may horizontally move the second magazine gripper 214 so that the second magazine 62 can be gripped by the second magazine gripper 214.

The magazine lifting mechanism 216 is provided for supplying the substrate 20 after the first and second magazines 60 and 62 are gripped by the first and second magazine grippers 212 and 214. The height of the first magazine 60 may be adjusted such that one of the substrates 20 accommodated in the first magazine 60 corresponds to the substrate carry-in unit 230 and the substrate support unit 240, In addition, for the storage of the substrate 20, the height of the second magazine 62 is adjusted such that one of the slots in the second magazine 62 corresponds to the substrate 20 on the substrate support unit 240. Can.

8 and 9, the first magazine 60 in which all of the received substrates 20 are taken out, and the second magazine 62 in which the die bonding processes are completed are received in the second magazine 62 in the third magazine. It can be carried out through the delivery mechanism 226.

Specifically, the first magazine 60 may be transferred from the first magazine gripper 212 onto the third magazine delivery mechanism 226, and then onto the second magazine load port 218. Can. The port lifting mechanism 220 may raise the second magazine load port 218, and the magazine transfer robot 260 may move the first magazine 60 onto the port stage 250. have. Meanwhile, since the first magazine 60 transferred onto the second magazine load port 218 is empty without the substrate 20, it can be transferred onto the second magazine delivery mechanism 224 and the second magazine 62 ).

The second magazine 62 can be transferred from the second magazine gripper 214 onto the third magazine delivery mechanism 226, and then onto the second magazine load port 218. The port lifting mechanism 220 may raise the second magazine load port 218, and the magazine transfer robot 260 may move the second magazine 62 onto the port stage 250. have.

Meanwhile, the first and second magazines 60 and 62 and the wafer storage container 50 are transferred to the die bonding device 10 by a ceiling conveying device (not shown), such as an overhead hoist transport (OHT) device. Can be supplied. According to an embodiment of the present invention, as shown in FIG. 1, wafer load ports 140 of the first and second die bonding modules 100, 102, 104, and 106 and the first and second The magazine load ports 218 of the substrate supply modules 200 and 202 may be arranged in a line under the travel path 70 of the ceiling transport device.

Referring back to FIG. 4, the substrate carry-in unit 230 pushes the substrate 20 so that a part of the substrate 20 to be input to the die bonding process protrudes from the first magazine 60. The substrate support unit (232), the substrate withdrawal mechanism (234) for moving the substrate 20 on which the part protrudes onto the substrate support unit (240), and the die bonding process completed substrate (20) It may include a substrate storage mechanism 236 for moving from the 240 into the second magazine (62).

The substrate support unit 240 includes first and second guide rails 242 and 244 supporting the withdrawn substrate 20 and the substrate 20 to be accommodated, and guiding them in the withdrawing and receiving directions, respectively. Shuttle 246 on which the first and second guide rails 242 and 244 are installed, and one of the first and second guide rails 242 and 244 on the first and second magazines 60, 62) may include a shuttle transfer mechanism 248 that moves the shuttle 246 to face one of the.

For example, the shuttle transport mechanism 248 is the shuttle so that one of the first and second guide rails 242 and 244 corresponds to the first magazine 60 for the withdrawal of the substrate 20 One of the first and second guide rails 242 and 244 may be used to move the 246 in the X-axis direction, and the die bonding process completed substrate 20 for the storage of the substrate 20 is completed. After being placed on, the shuttle 246 may be moved in the X-axis direction so that the substrate 20 corresponds to the second magazine 62.

Specifically, the substrate 20 partially projected by the pushing mechanism 232 from the first magazine 60 may be moved onto the first guide rails 242 by the substrate take-out mechanism 234, When the die bonding process is completed, the substrate 20 is transferred onto the second guide rails 244 by the substrate transfer module 300 and then the second magazine 62 by the substrate storage mechanism 236. ).

On the other hand, although not shown in detail, the substrate take-out mechanism 234 may be provided with a gripper for gripping the substrate 20, and the substrate storage mechanism 236 is pushed to push the substrate 20 It may be provided with a member. Further, as illustrated, the substrate take-out mechanism 234 is disposed on one side of the first guide rails 242, and the substrate storage mechanism 236 is disposed on one side of the second guide rails 244, The arrangement relationship may be changed as necessary, and the gripper may be used as the pushing member, or the pushing member may be configured in the form of a gripper. That is, since the detailed configurations of the substrate take-out mechanism 234 and the substrate storage mechanism 236 can be variously changed as necessary, the scope of the present invention will not be limited by the examples described above.

The second substrate supply module 202 may have a configuration substantially the same as that of the first substrate supply module 200, and thus detailed description thereof will be omitted.

The first and second inspection modules may be used to determine whether die bonding processes are normally performed in the first and second die bonding modules.

10 is a schematic plan view for explaining the inspection module shown in FIG. 1.

Referring to FIG. 10, the first inspection module 400 is disposed on the inspection stage 410 on which the substrate 20 on which the die bonding process is completed is placed, and on the inspection stage 410 and on the substrate 20 The distance sensor 420 for measuring the distance to the upper surface of the die 30 and the upper surface of the die 30 bonded on the substrate 20, and the substrate 20 and the die by the distance sensor 420 ( 30) may include a scanning driver 430 that moves the inspection stage 410 in a horizontal direction to enable scanning.

For example, the first inspection module 400 may use a laser distance sensor 420 for distance measurement, and scan the entirety of the substrate 20 using the scanning driver 430 to perform the substrate 20 ), the height of the die 30 bonded to the bonding position of the die 30 and the like can be accurately measured.

Meanwhile, since the second inspection module 402 may be configured substantially the same as the first inspection module 400, additional detailed description thereof will be omitted.

11 is a schematic plan view for explaining the substrate transfer module shown in FIG. 1.

Referring to FIG. 11, the substrate transfer module 300 may include substrate transfer robots 310 and 320 for transferring the substrate 20. In particular, the substrate transfer robots 310 and 320 may include a vacuum chuck 302 for vacuum adsorbing the upper surface of the substrate 20.

For example, the substrate transfer module 300 is the substrate 20 between the first substrate supply module 200 and the first die bonding modules 100 and 102 and the first inspection module 400 The substrate 20 between the first substrate transfer robot 310 for transferring the data, the second substrate supply module 202 and the second die bonding modules 104 and 106 and the second inspection module 402 ) May include a second substrate transfer robot 320, and the first and second substrate transfer robots 310 and 320 may be configured to be movable in the second horizontal direction, that is, the Y-axis direction. Can.

Also, the substrate 20 is between the first and second die bonding modules 100, 102, 104, and 106, and the substrate transfer module 300 and the first and second inspection modules 400, 402. ) Buffer units 330 for temporarily storing may be disposed. As illustrated, a scara robot is used as the first and second substrate transfer robots 310 and 320, but Cartesian coordinate robots may be used differently.

According to embodiments of the present invention as described above, the substrate supply module 200 includes a plurality of magazine load ports 252 for loading and unloading the first and second magazines 60 and 62 A magazine transfer robot (260) for transferring the first and second magazines (60, 62) between the port stage 250 and the magazine load ports 252 and the magazine handling unit 210 ). Therefore, it is possible to significantly reduce the time required for loading and unloading the first and second magazines 60 and 62 compared to the prior art that loads and unloads the magazines using one magazine load port. .

Although described above with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that there is.

10: die bonding apparatus 20: substrate
30: die 40: wafer
50: wafer storage container 60, 62: magazine
100: die bonding module 110: substrate stage
120: wafer stage 130: bonding unit
140: wafer load port 150: horizontal driving unit
200: board supply module 210: magazine handling unit
212: 1st magazine gripper 214: 2nd magazine gripper
216: magazine lifting mechanism 218: second magazine load port
220: port lifting mechanism 222: the first magazine delivery mechanism
224: second magazine delivery mechanism 226: third magazine delivery mechanism
228: horizontal drive unit 230: substrate carry-in unit
232: pushing mechanism 234: substrate drawing mechanism
236: substrate storage mechanism 240: substrate support unit
242: first guide rail 244: second guide rail
246: shuttle 248: shuttle transport mechanism
250: Port stage 252: Magazine loading port
260: magazine transfer robot 262: third magazine gripper
300: substrate transfer module 302: vacuum chuck
310, 320: substrate transfer robot 330: buffer unit
400: inspection module 410: inspection stage
420: distance sensor 430: scanning driver

Claims (11)

A magazine handling unit that handles a first magazine in which substrates to be put into a die bonding process are received and a second magazine for storing the substrates in which the die bonding process is completed;
A substrate take-out unit for drawing a substrate to be input to the die bonding process from the first magazine and receiving the die-bonding substrate into the second magazine;
A substrate support unit supporting a substrate drawn out from the first magazine and a substrate to be accommodated in the second magazine; And
And a port stage disposed on the magazine handling unit and provided with a plurality of magazine load ports for loading and unloading the first and second magazines. The substrate supply module according to claim 1, further comprising a magazine transfer robot for transferring the first and second magazines between the magazine handling unit and the port stage. The method of claim 1, wherein the magazine handling unit,
A first magazine gripper for gripping the first magazine;
A second magazine gripper disposed above or below the first magazine gripper to grip the second magazine; And
And a magazine elevating mechanism for moving the first and second magazines in a vertical direction. The method of claim 3, wherein the magazine handling unit,
A second magazine load port for loading and unloading the first and second magazines;
A port lifting mechanism for moving the second magazine load port in a vertical direction;
A first magazine delivery mechanism for delivery of the first magazine between the second magazine load port and the first magazine gripper; And
And a second magazine delivery mechanism for transferring the second magazine between the second magazine load port and the second magazine gripper. 5. The substrate supply module according to claim 4, wherein the magazine handling unit further comprises a horizontal driving unit for moving the first and second magazine grippers in a horizontal direction for delivery of the first and second magazines. 5. The method of claim 4, wherein the magazine handling unit further comprises a third magazine delivery mechanism for delivering the first and second magazines from the first and second magazine grippers to the second magazine load port. Substrate supply module. According to claim 1, The substrate carrying-in unit,
A pushing mechanism that pushes the substrate so that a part of the substrate to be input to the die bonding process protrudes from the first magazine;
A substrate take-out mechanism for moving the substrate on which the part protrudes onto the substrate support unit; And
And a substrate storage mechanism for moving the substrate on which the die bonding process is completed from the substrate support unit into the second magazine. According to claim 1, The substrate support unit,
First and second guide rails respectively supporting the withdrawn substrate and the substrate to be accommodated and guiding in the withdrawal and receiving directions;
A shuttle in which the first and second guide rails are installed; And
And a shuttle transfer mechanism for moving the shuttle so that one of the first and second guide rails faces one of the first and second magazines. A die bonding module for bonding a die on a substrate;
A substrate supply module for supplying the substrate; And
It is disposed between the die bonding module and the substrate supply module and includes a substrate transfer module for transferring the substrate between the die bonding module and the substrate supply module,
The substrate supply module,
A magazine handling unit that handles a first magazine in which substrates to be put into a die bonding process are received and a second magazine for storing the substrates in which the die bonding process is completed;
A substrate take-out unit for drawing a substrate to be input to the die bonding process from the first magazine and receiving the die-bonding substrate into the second magazine;
A substrate support unit supporting a substrate drawn out from the first magazine and a substrate to be accommodated in the second magazine; And
And a port stage disposed on the magazine handling unit and provided with a plurality of magazine load ports for loading and unloading the first and second magazines. The die bonding module of claim 9, wherein the die bonding module includes a wafer load port on which a wafer storage container is accommodated,
The wafer loading port and the magazine load ports are die bonding apparatus, characterized in that disposed under the travel path of the ceiling transport device. The die bonding apparatus according to claim 9, further comprising an inspection module for inspecting whether the die is normally bonded on the substrate.

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