KR101010108B1 - 접착제 조성물, 회로 접속 재료, 회로 부재의 접속 구조 및반도체 장치 - Google Patents

접착제 조성물, 회로 접속 재료, 회로 부재의 접속 구조 및반도체 장치 Download PDF

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KR101010108B1
KR101010108B1 KR1020087011834A KR20087011834A KR101010108B1 KR 101010108 B1 KR101010108 B1 KR 101010108B1 KR 1020087011834 A KR1020087011834 A KR 1020087011834A KR 20087011834 A KR20087011834 A KR 20087011834A KR 101010108 B1 KR101010108 B1 KR 101010108B1
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circuit
adhesive composition
semiconductor element
connection material
film
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KR1020087011834A
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Korean (ko)
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KR20080068865A (ko
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도시아끼 시라사까
시게끼 가또기
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히다치 가세고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
KR1020087011834A 2005-10-18 2006-08-24 접착제 조성물, 회로 접속 재료, 회로 부재의 접속 구조 및반도체 장치 KR101010108B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005302944 2005-10-18
JPJP-P-2005-00302944 2005-10-18
JP2006182388 2006-06-30
JPJP-P-2006-00182388 2006-06-30

Publications (2)

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KR20080068865A KR20080068865A (ko) 2008-07-24
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TW200718764A (en) 2007-05-16
KR20080068865A (ko) 2008-07-24
WO2007046190A1 (fr) 2007-04-26

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