TWI336724B - - Google Patents

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Publication number
TWI336724B
TWI336724B TW095137605A TW95137605A TWI336724B TW I336724 B TWI336724 B TW I336724B TW 095137605 A TW095137605 A TW 095137605A TW 95137605 A TW95137605 A TW 95137605A TW I336724 B TWI336724 B TW I336724B
Authority
TW
Taiwan
Prior art keywords
adhesive component
radical
adhesive
thermoplastic resin
signal
Prior art date
Application number
TW095137605A
Other languages
English (en)
Chinese (zh)
Other versions
TW200718764A (en
Inventor
Toshiaki Shirasaka
Shigeki Katogi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200718764A publication Critical patent/TW200718764A/zh
Application granted granted Critical
Publication of TWI336724B publication Critical patent/TWI336724B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
TW095137605A 2005-10-18 2006-10-12 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices TW200718764A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005302944 2005-10-18
JP2006182388 2006-06-30

Publications (2)

Publication Number Publication Date
TW200718764A TW200718764A (en) 2007-05-16
TWI336724B true TWI336724B (fr) 2011-02-01

Family

ID=37962289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137605A TW200718764A (en) 2005-10-18 2006-10-12 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices

Country Status (5)

Country Link
JP (1) JPWO2007046190A1 (fr)
KR (1) KR101010108B1 (fr)
CN (2) CN102277091A (fr)
TW (1) TW200718764A (fr)
WO (1) WO2007046190A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618790B (zh) * 2011-09-09 2018-03-21 漢高股份有限及兩合公司 電子裝置用密封劑組成物

Families Citing this family (6)

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CN102222649A (zh) 2011-10-19
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JPWO2007046190A1 (ja) 2009-04-23
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CN102277091A (zh) 2011-12-14
WO2007046190A1 (fr) 2007-04-26

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