KR100994233B1 - 셀 장착 장치 세트 - Google Patents
셀 장착 장치 세트 Download PDFInfo
- Publication number
- KR100994233B1 KR100994233B1 KR1020040024349A KR20040024349A KR100994233B1 KR 100994233 B1 KR100994233 B1 KR 100994233B1 KR 1020040024349 A KR1020040024349 A KR 1020040024349A KR 20040024349 A KR20040024349 A KR 20040024349A KR 100994233 B1 KR100994233 B1 KR 100994233B1
- Authority
- KR
- South Korea
- Prior art keywords
- cell
- guide
- nozzle
- circumferential surface
- mounting
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (4)
- 증착 재료가 내부에 수용된 원통형 셀이 삽입되는 복수개의 셀 장착부가 형성되고, 상기 셀 장착부의 내부에는 상기 셀을 소정 거리만큼 이격된 상태로 감싸는 히터부가 각각 형성된 리볼버에 상기 셀을 장착하기 위한 셀 장착 장치 세트에 있어서,상기 셀의 상부에 형성된 개구를 폐쇄하고, 중심부에 형성된 노즐을 통해 기화된 증착 재료가 배출되는 노즐부;중심부에 기화된 증착 재료의 배출부가 형성되고 외주면에 나사산이 형성된 원판형 몸체부, 상기 몸체부로부터 수직으로 돌출되어 상기 노즐부를 수용하는 공간을 형성하는 제 1 가이드부 및 상기 제 1 가이드부로부터 소정 거리만큼 이격된 상태로 상기 몸체부로부터 수직으로 돌출되어 상기 제 1 가이드부와의 사이에 상기 히터부를 수용하는 공간을 형성하는 제 2 가이드부를 포함하는 셀 커버; 및상기 셀 커버의 나사산과 대응되는 나사산이 내주면에 형성되어 상기 셀 커버와 나사 결합하는 셀 고정부가 상기 셀 장착부와 대응되도록 복수개가 형성된 원판형 지그를 포함하는 것을 특징으로 하는 셀 장착 장치 세트.
- 제 1 항에 있어서, 상기 셀 커버는상기 제 2 가이드부가 상기 몸체부의 가장자리에 형성됨으로서 상기 제 2 가이드부의 외주면에 상기 몸체부의 나사산이 연장되어 형성된 것을 특징으로 하는 셀 장착 장치 세트.
- 제 1 항 또는 제 2 항에 있어서, 상기 셀 커버는상기 제 1 가이드부 및 제 2 가이드부 사이의 간격이 상기 몸체부를 향하여 감소되는 것을 특징으로 하는 셀 장착 장치 세트.
- 제 1 항에 있어서, 상기 셀 장착 장치 세트는상기 노즐부의 외주면에는 나사산이 형성되고, 상기 제 1 가이드부의 내주면에도 나사산이 형성되어 상호간에 나사 결합이 되는 것을 특징으로 하는 셀 장착 장치 세트.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040024349A KR100994233B1 (ko) | 2004-04-09 | 2004-04-09 | 셀 장착 장치 세트 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040024349A KR100994233B1 (ko) | 2004-04-09 | 2004-04-09 | 셀 장착 장치 세트 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050099161A KR20050099161A (ko) | 2005-10-13 |
KR100994233B1 true KR100994233B1 (ko) | 2010-11-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020040024349A KR100994233B1 (ko) | 2004-04-09 | 2004-04-09 | 셀 장착 장치 세트 |
Country Status (1)
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KR (1) | KR100994233B1 (ko) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003502494A (ja) | 1998-11-12 | 2003-01-21 | フレックス プロダクツ インコーポレイテッド | 直線開口蒸着装置および被覆方法 |
JP2003293121A (ja) | 2002-04-05 | 2003-10-15 | Cluster Ion Beam Technology Kk | 蒸着材料供給手段を備えた蒸着用坩堝 |
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2004
- 2004-04-09 KR KR1020040024349A patent/KR100994233B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003502494A (ja) | 1998-11-12 | 2003-01-21 | フレックス プロダクツ インコーポレイテッド | 直線開口蒸着装置および被覆方法 |
JP2003293121A (ja) | 2002-04-05 | 2003-10-15 | Cluster Ion Beam Technology Kk | 蒸着材料供給手段を備えた蒸着用坩堝 |
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KR20050099161A (ko) | 2005-10-13 |
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