KR100989516B1 - LED package and Back light unit using the same - Google Patents

LED package and Back light unit using the same Download PDF

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Publication number
KR100989516B1
KR100989516B1 KR1020080063589A KR20080063589A KR100989516B1 KR 100989516 B1 KR100989516 B1 KR 100989516B1 KR 1020080063589 A KR1020080063589 A KR 1020080063589A KR 20080063589 A KR20080063589 A KR 20080063589A KR 100989516 B1 KR100989516 B1 KR 100989516B1
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KR
South Korea
Prior art keywords
light emitting
emitting diode
diode package
circuit board
printed circuit
Prior art date
Application number
KR1020080063589A
Other languages
Korean (ko)
Other versions
KR20100003608A (en
Inventor
박장대
신정훈
홍대운
Original Assignee
주식회사 디에스엘시디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 디에스엘시디 filed Critical 주식회사 디에스엘시디
Priority to KR1020080063589A priority Critical patent/KR100989516B1/en
Publication of KR20100003608A publication Critical patent/KR20100003608A/en
Application granted granted Critical
Publication of KR100989516B1 publication Critical patent/KR100989516B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to a light emitting diode package and a backlight unit using the same, the light emitting diode package of the present invention is provided on a printed circuit board, the light emitting diode package for emitting light to the outside, the light emitting diode chip; A main body having a first surface on which the light emitting diode chip is installed and a second surface provided on an opposite side of the first surface; And a terminal layer electrically connected to the light emitting diode chip, the terminal layer being formed on the first surface side, and mounted on the printed circuit board so that the first surface of the main body part and the printed circuit board face each other. .

Description

Light emitting diode package and backlight unit using the same {LED package and Back light unit using the same}

The present invention relates to a light emitting diode package and a backlight unit using the same, and more particularly, a light emitting diode package having an improved structure such that an upper surface of the light emitting diode package is mounted on a printed circuit board, a printed circuit board and a chassis on which the light emitting diode package is mounted. A light emitting diode package having a heat dissipation structure in a portion thereof and a backlight unit using the same.

A light emitting diode (LED) package is a device in which electrons and holes meet and emit light at a P-N semiconductor junction by application of current, and are generally manufactured in a package in which a light emitting diode chip is mounted. Such a light emitting diode package is generally mounted on a printed circuit board (PCB) and configured to emit light by receiving current from an electrode formed on the printed circuit board.

In the light emitting diode package, the heat generated from the light emitting diode chip together with the light emitted from the light emitting diode chip directly affects the light emitting performance and lifetime of the light emitting diode package. This is because when heat is generated in the light emitting diode chip and stays in the light emitting diode chip for a long time, dislocations and mismatches occur in the crystal structure of the light emitting diode chip.

1 is a plan view of an example of a conventional backlight unit, and FIG. 2 is a cross-sectional view of a conventional light emitting diode package used in the backlight unit of FIG. 1.

1 and 2, the backlight unit 1 is an edge type backlight unit 1, in which a light emitting diode package 10 is disposed on a side surface of the light guide plate 40, and the light emitting diode package 10 is disposed on a bottom surface thereof. The printed circuit board 20 is mounted on the printed circuit board 20 so as to contact the printed circuit board 20. The chassis unit 30 supports the printed circuit board 20 to be fixed.

As shown in FIG. 2, the light emitting diode package 10 includes a light emitting diode chip 11, a main body portion 14 on which the light emitting diode chip 11 is mounted, and a bonding wire 17. The lead portion 13 electrically connected to the chip 11, the encapsulation portion 16 covering the light emitting diode chip 11, and the light emitting diode chip 11 are installed to be in contact with each other and are generated from the light emitting diode chip 11. And a heat dissipation unit 15 for dissipating the heat to the outside.

In the conventional light emitting diode package and the backlight unit, since the lead portion 13 for electrically connecting the light emitting diode package 10 and the printed circuit board 20 is located on the lower surface side of the light emitting diode package 10, As the lower surface of the diode package 10 contacts the printed circuit board 20, the light emitting diode package 10 is mounted on the printed circuit board 20. Therefore, the heat generated from the light emitting diode package 10 is transferred to the outside through the printed circuit board 20 and the chassis 30, the heat dissipation mechanism is made, between the light emitting diode package 10 and the chassis 30 The printed circuit board 20 disposed has a problem of making heat conduction inefficient.

Accordingly, an object of the present invention is to solve such a conventional problem, by improving the structure of the light emitting diode package so that the bottom surface of the light emitting diode package is not mounted on the printed circuit board, and using the structure of the improved light emitting diode package A light emitting diode package and a backlight unit using the same, which allow heat to be efficiently emitted to the outside by allowing heat to be directly transmitted from the light emitting diode package to the chassis or directly from the light emitting diode package to the outside, rather than through a printed circuit board. In providing.

In order to achieve the above object, the light emitting diode package of the present invention, the light emitting diode package is installed on a printed circuit board to emit light to the outside, the light emitting diode chip; A main body having a first surface on which the light emitting diode chip is installed and a second surface provided on an opposite side of the first surface; And a terminal layer electrically connected to the light emitting diode chip, the terminal layer being formed on the first surface side, and mounted on the printed circuit board so that the first surface of the main body part and the printed circuit board face each other. .

In the light emitting diode package according to the present invention, Preferably, the body portion is provided with a metal material.

In the light emitting diode package according to the present invention, Preferably, the insulating layer is laminated between the main body portion and the terminal layer, and electrically insulates the main body portion and the terminal layer; And an encapsulation part covering the light emitting diode chip.

In addition, in order to achieve the above object, the backlight unit of the present invention includes a light emitting diode package, a printed circuit board on which the light emitting diode package is mounted, and a backlight unit including the chassis in which the printed circuit board is installed. The light emitting diode package is the light emitting diode package according to any one of claims 1 to 3, and is mounted on the printed circuit board so as to face the first surface of the main body and the printed circuit board, and the printed circuit board is And a through hole through which the light emitted from the light emitting diode package can pass, and wherein the chassis portion is installed to contact the second surface of the main body portion.

In the backlight unit according to the present invention, preferably, the chassis portion further includes a receiving portion formed to be recessed to receive the main body portion and to contact the second surface.

In addition, in order to achieve the above object, the backlight unit of the present invention includes a light emitting diode package, a printed circuit board on which the light emitting diode package is mounted, and a backlight unit including the chassis in which the printed circuit board is installed. The light emitting diode package is the light emitting diode package according to any one of claims 1 to 3, and is mounted on the printed circuit board so as to face the first surface of the main body and the printed circuit board, and the printed circuit board is And a through hole through which the light emitted from the light emitting diode package can pass, and the chassis portion includes an opening hole for exposing the main body to the outside.

According to the light emitting diode package of the present invention and the backlight unit using the light emitting diode package, the light emitting diode package and the chassis are contacted with each other without a printed circuit board interposed between the light emitting diode package and the chassis, thereby efficiently transferring heat from the light emitting diode package to the outside. Can be released.

In addition, according to the light emitting diode package and the backlight unit using the same, the main body portion of the light emitting diode package is configured to be directly exposed to the external environment, it is possible to more efficiently discharge the heat of the light emitting diode package to the outside.

In addition, according to the light emitting diode package and the backlight unit using the same, the body portion on which the light emitting diode chip is mounted may be provided with a metal having high thermal conductivity, thereby more efficiently transferring heat generated from the light emitting diode chip to the chassis.

Hereinafter, embodiments of the backlight unit according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view of a backlight unit according to an embodiment of the present invention, Figure 4 is a perspective view of a light emitting diode package according to an embodiment of the present invention used for the backlight unit of Figure 3, Figure 5 is the light emission of Figure 4 A cross-sectional view of a diode package.

3 to 5, the backlight unit 100 according to the present embodiment is for efficiently dissipating heat from the light emitting diode package to the outside, and includes the light emitting diode package 110, the printed circuit board 120, and the like. , A chassis 130, and a light guide plate 140.

The light emitting diode package 110 is configured such that a surface on which the light emitting diode chip 111 is installed is mounted on the printed circuit board 120, and includes a light emitting diode chip 111, a main body 112, and a terminal layer 115. And an insulating layer 116 and an encapsulation portion 117.

The light emitting diode chip 111 is a semiconductor that emits light of a predetermined wavelength, and generally uses a Group 3, 5 compound semiconductor. Light may be generated by doping a foreign material onto the semiconductor surface and diffusing the foreign material with heat of high temperature (700 to 900 ° C.).

The main body 112 includes an opening for accommodating the light emitting diode chip 111, and includes an upper surface on which the light emitting diode chip 111 is installed, a lower surface provided on the opposite side, and a side surface. The upper surface of the unit 112 is defined as the first surface 113 and the lower surface is defined as the second surface 114.

The main body 112 of the present embodiment is preferably made of a metal material in order to efficiently discharge the heat generated from the light emitting diode chip 111 to the outside. The light emitting diode chip 111 is coupled to be in direct contact with the main body part 112, so that heat of the light emitting diode chip 111 is discharged to the outside through the main body part 112 through a thermal conduction phenomenon.

The terminal layer 115 is electrically connected to the light emitting diode chip 111 and is also electrically connected to a power supply unit (not shown) of the printed circuit board 120, so that a power source for driving the light emitting diode chip 111 is a terminal. It is supplied to the light emitting diode chip 111 through the layer 115. In this embodiment, the terminal layer 115 is preferably made of a material having excellent electrical conductivity, and more preferably made of a material such as copper.

The terminal layer 115 is formed on the first surface 113 side. As such, the light emitting diode package 110 and the printed circuit board 120 are coupled such that the terminal layer 115 formed on the first surface 113 is in direct contact with the power supply of the printed circuit board 120. The second side (lower surface of the) is different from the shape that was bonded to the printed circuit board.

The insulating layer 116 is stacked between the main body 112 and the terminal layer 115, and is stacked on the main body 112 before the terminal layer 115 is stacked on the main body 112. The insulating layer 116 electrically insulates the main body 112 and the terminal layer 115.

The encapsulation 117 protects the light emitting diode chip 111 and is made of a light transmissive material. The encapsulation part 117 is filled in the opening formed in the upper part of the main body part 112 in a molding manner, and then cured to cover and cover the LED chip 111. The encapsulation portion 117 is preferably formed of a transparent material such as epoxy, and may include phosphors excited to light generated from the light emitting diode chip 111, and such phosphors may be used for color conversion of light. .

The printed circuit board 120 is equipped with a light emitting diode package 110 having the above-described configuration, and supplies power to drive the light emitting diode package 110. The light emitting diode package 110 is disposed on the printed circuit board 120 such that the first surface 113 of the main body 112 having the light emitting diode chip 111 and the terminal layer 115 and the printed circuit board 120 face each other. Is mounted. Due to this installation structure, as shown in FIG. 3, the printed circuit board 120 includes a through hole 121 through which light emitted from the light emitting diode package 110 passes. The light emitted from the light emitting diode package 110 passes through the through hole 121 and proceeds toward the light guide plate 140 to be described later.

The chassis 130 is a printed circuit board 120 is installed, and corresponds to the bottom chassis in the backlight unit. The light emitting diode package 110 is installed such that the second surface 114 of the main body 112 contacts the chassis 130. Since the printed circuit board 120 is not interposed between the light emitting diode package 110 and the chassis 130, heat of the light emitting diode package 110 may be more effectively discharged to the outside by using a thermal conduction phenomenon.

Preferably, the chassis portion 130 includes a receiving portion 131 is formed recessed. The accommodating part 131 accommodates the main body part 112, and the second surface (lower surface) 114 or the side surface of the main body part 112 is in contact with the accommodating part 131.

The light guide plate 140 serves to uniformly transmit the light emitted from the light emitting diode package 110 to the entire surface of the liquid crystal display, and thus a detailed description thereof will be omitted.

In the light emitting diode package and the backlight unit using the same according to the present embodiment configured as described above, the light emitting diode package is mounted on the printed circuit board so that the surface on which the light emitting diode chip is installed and the printed circuit board face each other, and the printed circuit board is not interposed. Since the light emitting diode package is installed in contact with the chassis, the heat of the light emitting diode package can be more efficiently discharged to the outside.

In general, in the case of heat conduction, which is a kind of heat transfer through a medium, the heat transfer effect decreases rapidly as more medium layers exist in the process of transferring heat from a high temperature space to a low temperature space. That is, since the added medium layer serves as a kind of resistive layer that prevents the flow of heat, the more medium layers added, the lower the heat transfer efficiency. In addition, when a medium layer having a relatively low thermal conductivity (k), which is a measure of the amount of heat transfer as a material property of a material, is added, a greater heat transfer efficiency is reduced.

Therefore, unlike the conventional structure in which the light emitting diode package is installed to be in contact with the printed circuit board and the printed board is in contact with the chassis again, the light emitting diode package is installed in direct contact with the chassis, whereby the heat transfer efficiency is remarkably increased. Can be improved.

In addition, the light emitting diode package according to the present embodiment configured as described above, the body portion on which the light emitting diode chip is mounted is provided with a high thermal conductivity metal material, it is possible to more efficiently transfer heat generated from the light emitting diode chip to the chassis portion Can be obtained.

6 is a plan view of a backlight unit according to another exemplary embodiment of the present invention.

In FIG. 6, members referred to by the same reference numerals as the members illustrated in FIGS. 3 to 5 have the same configuration and function, and detailed descriptions thereof will be omitted.

The chassis of the backlight unit of this embodiment is characterized by having an opening for exposing the main body of the light emitting diode package to the outside.

Although the backlight unit 100 of the embodiment of FIG. 3 is configured such that the main body 112 of the light emitting diode package 110 is in direct contact with the chassis 130, the chassis 230 of the backlight unit 200 according to the present embodiment is provided. ) Is provided with an opening hole 231 through which the main body 112 of the light emitting diode package 110 can pass, and the second surface 114 of the main body 112 is not in contact with the chassis 230. It is placed exposed to the outside environment.

The backlight unit according to the present embodiment configured as described above can remove heat from the light emitting diode package by removing contact with the chassis, which is one of the additional medium layers serving as a kind of resistive layer that prevents the flow of heat. The effect that can be efficiently released to the outside can be obtained.

In the exemplary embodiments, the light emitting diode package is illustrated to be applied to the edge type backlight unit, but may be applied to the direct type backlight unit.

The scope of the present invention is not limited to the above-described embodiments and modifications, but may be embodied in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the invention claimed in the claims, it is intended that any person skilled in the art to which the present invention pertains falls within the scope of the claims described herein to various extents that can be modified.

1 is a plan view of an example of a conventional backlight unit;

2 is a cross-sectional view of a conventional light emitting diode package used in the backlight unit of FIG.

3 is a plan view of a backlight unit according to an embodiment of the present invention,

4 is a perspective view of a light emitting diode package according to an embodiment of the present invention used in the backlight unit of FIG.

5 is a cross-sectional view of the light emitting diode package of FIG.

6 is a plan view of a backlight unit according to another exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: backlight unit 110: light emitting diode package

111: light emitting diode chip 112: main body

115: terminal layer 120: printed circuit board

121: through hole 130: chassis

131: receiving portion 140: light guide plate

Claims (6)

delete delete delete delete delete A backlight unit comprising a light emitting diode package, a printed circuit board on which the light emitting diode package is mounted, and a chassis unit on which the printed circuit board is installed, The light emitting diode package may include a light emitting diode chip, a main body having a first surface on which the light emitting diode chip is installed, and a second surface provided on an opposite side of the first surface, and electrically connected to the light emitting diode chip. A terminal layer formed on a surface side, an insulating layer stacked between the main body part and the terminal layer and electrically insulating the main body part and the terminal layer, and an encapsulation part covering the light emitting diode chip; Mounted on the printed circuit board so that a surface and the printed circuit board face each other; The printed circuit board may include a through hole through which light emitted from the light emitting diode package may pass. The chassis unit, the backlight unit characterized in that it has an opening through which the main body portion to expose the side surface of the main body portion to the outside.
KR1020080063589A 2008-07-01 2008-07-01 LED package and Back light unit using the same KR100989516B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080063589A KR100989516B1 (en) 2008-07-01 2008-07-01 LED package and Back light unit using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080063589A KR100989516B1 (en) 2008-07-01 2008-07-01 LED package and Back light unit using the same

Publications (2)

Publication Number Publication Date
KR20100003608A KR20100003608A (en) 2010-01-11
KR100989516B1 true KR100989516B1 (en) 2010-10-25

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Application Number Title Priority Date Filing Date
KR1020080063589A KR100989516B1 (en) 2008-07-01 2008-07-01 LED package and Back light unit using the same

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003004622A (en) * 2001-04-17 2003-01-08 Seiko Instruments Inc Near field light emitting element, near field light recorder and near field light microscope
KR20060068371A (en) * 2004-12-16 2006-06-21 알티전자 주식회사 Power led package and method for producing the same
JP2006253689A (en) 2005-03-08 2006-09-21 Avago Technologies General Ip (Singapore) Private Ltd Packaging of led with high performance for heat dissipation
JP2007109656A (en) * 2005-10-12 2007-04-26 Samsung Electro-Mechanics Co Ltd Led back light unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003004622A (en) * 2001-04-17 2003-01-08 Seiko Instruments Inc Near field light emitting element, near field light recorder and near field light microscope
KR20060068371A (en) * 2004-12-16 2006-06-21 알티전자 주식회사 Power led package and method for producing the same
JP2006253689A (en) 2005-03-08 2006-09-21 Avago Technologies General Ip (Singapore) Private Ltd Packaging of led with high performance for heat dissipation
JP2007109656A (en) * 2005-10-12 2007-04-26 Samsung Electro-Mechanics Co Ltd Led back light unit

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Publication number Publication date
KR20100003608A (en) 2010-01-11

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