JP2016192556A - Optical semiconductor light source and vehicular lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical semiconductor light source capable of promoting heat radiation and a vehicular lighting system.SOLUTION: An optical semiconductor light source according to an embodiment includes: an optical semiconductor mounting substrate; a semiconductor light-emitting element provided on the optical semiconductor mounting substrate; a first heat dissipation member including a heat dissipation fin and in contact with a rear face of the optical semiconductor mounting substrate for transferring heat released from the semiconductor light-emitting element to the outside; a connector insertion part provided to the first heat dissipation member and including a connector insertion hole and a connector insertion wall provided to the periphery of the connector insertion hole; and a feeding terminal extending in the connector insertion part and electrically connected to the optical semiconductor mounting substrate. The extending direction of the dissipation fin is in parallel to the direction of the longer sides of the connector insertion part.SELECTED DRAWING: Figure 2

Description

  Embodiments described herein relate generally to an optical semiconductor light source and a vehicle lighting device.

  An optical semiconductor light source using a semiconductor light emitting element such as a light emitting diode (LED) can reduce power consumption or extend its life compared to a light source using an incandescent bulb, a cold cathode tube, a discharge tube, or the like. Easy.

  As an example, exterior lighting for vehicles using a semiconductor light-emitting element as a light source has begun to be adopted mainly by high-end vehicles of various automobile manufacturers, and is used for front combination lights, rear combination lights, and the like. Furthermore, the use of rear combination lights is expanding to popular vehicles such as the so-called liter car class and minicars, and the number of installed vehicles is steadily increasing.

  In adopting the semiconductor light emitting element, an important item in design is the heat radiation design of the semiconductor light emitting element. The semiconductor light emitting device has a characteristic that the light emission efficiency decreases when the temperature of the device itself increases. Therefore, it is important how to reduce the influence of temperature due to self-temperature rise and heat generation of surrounding parts.

  As means for suppressing heat generation, the mounting interval of heat-emitting elements such as semiconductor light-emitting elements and current limiting resistors is widened to alleviate the thermal effect between adjacent elements, and the drive current of the semiconductor light-emitting elements is lowered to reduce the required light quantity. Means for compensating for the number of semiconductor light-emitting elements used.

  However, according to these means, since the light source itself becomes large, various restrictions are caused by the lamp design, and the light source is not versatile, and it is necessary to design a uniform light source for the lamp. In addition, the cost tends to increase due to the increase in the area of the substrate material to be used and the number of semiconductor light emitting elements used.

  Another way to suppress heat generation is to mount a semiconductor light-emitting element or current limiting resistor on a metal substrate with high thermal conductivity or a ceramic material substrate and bring it into contact with a heat dissipation member to reduce the temperature rise. It is done.

  This means is effective for reducing the size of the light source, and makes the light source versatile. However, since a semiconductor light source, a current limiting resistor, an external power supply component such as a connector, and other necessary components are mounted on a metal substrate or a ceramic substrate, a corresponding substrate area is required, which tends to increase costs.

  On the other hand, by increasing the driving power per semiconductor light emitting element, reducing the number of semiconductor light emitting elements used, and using low cost and low thermal conductivity materials for the semiconductor light emitting element mounting substrate, the material cost can be reduced. A measure to lower it is also conceivable. However, this is also likely to lead to a decrease in the light emission efficiency and long-term reliability of the semiconductor light emitting device.

JP 2003-115208 A

  An optical semiconductor light source and a vehicle lighting device that can promote heat dissipation are provided.

The optical semiconductor light source according to the embodiment includes an optical semiconductor mounting substrate, a semiconductor light emitting element provided on the optical semiconductor mounting substrate, and a heat radiation fin, and is in contact with the back surface of the optical semiconductor mounting substrate. A first heat dissipating member for transmitting heat emitted from the element to the outside; a connector inserting hole provided in the first heat dissipating member; and a connector inserting wall provided around the connector inserting hole. A connector insertion portion; and a power supply terminal extending through the connector insertion portion and electrically connected to the optical semiconductor mounting substrate.
The extending direction of the radiating fin and the long side direction of the connector insertion portion are parallel.

  Moreover, the vehicle lighting device according to the embodiment includes the optical semiconductor light source.

  An optical semiconductor light source and a vehicle lighting device that can promote heat dissipation are provided.

FIG. 1 is a perspective assembly view of a vehicle lighting device according to an embodiment of the present invention. 2A is a schematic perspective view of the vehicular lighting device according to the embodiment of the present invention as seen from the front side, and FIG. 2B is a schematic view as seen from the back side. FIG. 3 is a schematic perspective view showing the optical semiconductor mounting substrate 10 and the control substrate 50 in an enlarged manner. 4A is a schematic plan view showing a circuit configuration of the optical semiconductor light source according to the embodiment of the present invention, FIG. 4B is an equivalent circuit diagram thereof, and FIG. 4C is a trimming. Represents the state after. FIG. 5A is a schematic perspective view illustrating the relationship among the first heat sink 300, the optical semiconductor mounting substrate 10, and the control substrate 50, and FIG. 5B is a cross-sectional perspective view thereof. 6 (a) is a schematic plan view corresponding to FIG. 5 (a), FIG. 6 (b) is a schematic plan view showing a state in which the control board 50 is removed, and FIG. FIG. 7 is a schematic perspective view corresponding to FIG. FIG. 7A is a schematic perspective view of the first heat sink 300. 7B, 7C, and 7D are schematic perspective views showing specific examples of the heat radiation fin 303, and are schematic views of the first heat sink 300 as viewed from the back surface side. FIG. 8A is a schematic perspective view showing a specific example in which the second heat sink 310 is provided outside the first heat sink 300, and FIGS. 8B and 8C are respectively a second view and a second view. It is the schematic diagram which looked at the heat sink 310 from the side in which the 1st heat sink 300 is accommodated. 9A is a schematic perspective view showing a specific example in which the surface area of the second heat sink 310 is increased, FIG. 9B is a sectional perspective view thereof, and FIG. 9C is a second heat sink. It is the figure seen from the back side of 310, FIG.9 (d) is sectional drawing in the dashed-dotted line AA of Fig.9 (a). FIG. 10A is a schematic perspective view showing a specific example in which the volume of the first heat sink 300 is increased, and FIG. 10B is a cross-sectional perspective view thereof. FIG. 11A is a schematic perspective view showing a specific example in which the surface areas of the first heat sink 300 and the second heat sink 310 are increased, and FIG. 11B is a cross-sectional perspective view thereof. FIG. 12A is a schematic view of the optical semiconductor light source according to the embodiment of the present invention viewed from the back side, and FIG. 12B illustrates the optical semiconductor light source of the comparative example according to the embodiment of the present invention on the back side. It is the schematic diagram seen from. FIG. 13A is a schematic view of the optical semiconductor light source 100 according to the present embodiment as viewed from the back side, and FIG. 13B is a schematic view as viewed from the right side. FIG. 14A is a schematic view of the optical semiconductor light source 100 according to the present embodiment as viewed from the back side, and FIG. 14B is a schematic view as viewed from the right side. FIG. 15 is a schematic cross-sectional view of a lamp equipped with the vehicle lighting device 100 of the present embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same element, and detailed description is abbreviate | omitted suitably.
FIG. 1 is a perspective assembly view of a vehicular lighting device according to a first embodiment of the present invention.
2A is a schematic perspective view of the vehicular illumination device according to the present embodiment as viewed from the front side, and FIG. 2B is a schematic view as viewed from the back side.
The vehicle lighting device 100 includes an optical semiconductor light source 150 and a cover 700 that covers the light source.

  The optical semiconductor light source 150 includes a first heat sink (first heat radiating member) 300, an optical semiconductor mounting substrate 10 mounted thereon, and a control substrate 50. The back surface of the optical semiconductor mounting substrate 10 is in contact with the first heat sink 300. Here, “contact” is not limited to the one in which the optical semiconductor mounting substrate 10 directly contacts the first heat sink 300. For example, the heat generated in the optical semiconductor mounting substrate 10 is the first heat sink. In order to efficiently transmit to 300, heat transfer grease, heat transfer adhesive, and the like are also included.

  On the optical semiconductor mounting substrate 10, a semiconductor light emitting element (not shown) using an LED (Light Emitting Diode) as a light source is mounted. The optical semiconductor mounting substrate 10 can be formed of an inorganic material such as alumina or aluminum nitride, for example. Alternatively, the optical semiconductor mounting substrate 10 can be a substrate in which the surface of a metal plate is covered with an insulating layer. In this case, the insulating layer may be an organic material or an inorganic material.

  A reflector 22 having a recess 27 is mounted on the semiconductor mounting substrate 10 so as to surround the semiconductor light emitting element. The region where the semiconductor light emitting element and the reflector 22 are mounted is hereinafter referred to as a light emitting unit.

  The reflector 22 is made of, for example, resin or ceramics, and the reflector 22 is mounted on the semiconductor mounting substrate 10 so that the semiconductor light emitting element 18 is exposed in the recess 27. And the inner wall surface of the recessed part 27 of the reflector 22 forms the reflective surface. The light emitted from the semiconductor light emitting device 10 is reflected directly or by the inner wall surface of the recess 27 and can be extracted upward. Note that the shape of the reflector 22 is not limited to the illustrated shape, and may be, for example, a shape hollowed in a conical shape at the center of a rectangular parallelepiped.

  On the control board 50, circuit elements (not shown) such as resistors included in the drive circuit of the semiconductor light emitting element mounted on the optical semiconductor mounting board 10 are mounted. The control board 50 can be a glass epoxy board, for example.

  The first heat sink 300 releases heat generated in the optical semiconductor mounting substrate 10 and the control substrate 50 to the outside of the optical semiconductor light source 150. The first heat sink 300 is formed of a material having high thermal conductivity such as aluminum. The first heat sink 300 is provided with an engaging convex portion 301 that engages with the cover 700, a flange portion 302, a plurality of fins 303, and a connector insertion portion 304.

  The optical semiconductor mounting substrate 10 and the control substrate 50 are electrically connected by the connecting means 40. The connection means 40 is connected to an electrode (not shown) formed on the optical semiconductor mounting substrate 10 and an electrode (not shown) formed on the control substrate 50. As the connection means 40, a metal wire, a ribbon, a strap, or the like can be used. As an example, the connection means 40 can be made of phosphor bronze. Alternatively, soldering can be used as the connecting means 40.

  The control board 50 is provided with power supply terminals 72, 74, and 76. The power supply terminals 72, 74, and 76 extend in the connector insertion portion 304 provided in the first heat sink 300, are connected to a connector 720 inserted from the rear of the first heat sink 300, and are supplied with power from the outside. The

  Note that the power supply terminals 72, 74, and 76 are not limited to this example, and for example, two power supply terminals may be configured. In short, the number of power supply terminals is not limited as long as the power supply terminals are provided so that the semiconductor light source 150 has desired characteristics.

  The cover 700 has an engagement opening 701 that engages with an engagement protrusion 301 provided on the first heat sink 300. In a state where the engagement opening 701 and the engagement convex portion 301 are engaged, the cover 700 is engaged with the first heat sink 300.

FIG. 3 is a schematic perspective view showing the optical semiconductor mounting substrate 10 and the control substrate 50 in an enlarged manner.
The semiconductor light emitting element 18 mounted on the optical semiconductor mounting substrate 10 emits light by electric power supplied from the outside. The semiconductor light emitting element 18 may be in the form of a semiconductor chip such as an LED diced from a wafer, or may be in the form of a semiconductor chip such as an LED mounted in a package of resin or ceramic. These semiconductor chips and packages can be mounted on the optical semiconductor mounting substrate 10 with solder, conductive adhesive, or the like.

The emission color of the semiconductor light-emitting element 18 such as an LED can be appropriately set according to the application, such as yellow or white, in addition to red light. In addition, when the semiconductor light emitting element 18 is mounted as a semiconductor chip, the light emitting unit is protected so as to cover the periphery of the semiconductor light emitting element 18, for example, in order to protect the semiconductor light emitting element 18 from moisture or gas derived from the outside. 20 may be sealed with a translucent resin (not shown). Further, when the semiconductor light emitting element 18 is sealed with a resin, for example, the light emitted from the semiconductor light emitting element 18 by being dispersed in the resin sealed in the light emitting portion 20 is absorbed to have different wavelengths. You may have the fluorescent substance (not shown) which emits the light of this.
On the other hand, circuit elements such as resistors (not shown) are appropriately disposed on the control board 50.

  In the specific example described above, when the optical semiconductor mounting substrate 10 is formed of a metal plate coated with alumina, aluminum nitride, or an insulating layer, and the control substrate 50 is formed of a glass epoxy substrate, the optical semiconductor mounting substrate 10 is more heated. It can be said that the conductivity is high.

  The light emitting efficiency of the semiconductor light emitting element 18 tends to decrease as the temperature rises, and the lifetime also decreases. On the other hand, according to the present embodiment, heat radiation can be promoted by mounting the semiconductor light emitting element 18 on the optical semiconductor mounting substrate 10 having high thermal conductivity. By mounting the optical semiconductor mounting substrate 10 on the heat sink 300, heat dissipation to the heat sink 300 can be promoted, and a decrease in the light emission efficiency and the life of the semiconductor light emitting element 18 can be suppressed.

  In particular, even when a plurality of semiconductor light emitting elements 18 are used, according to the present embodiment, the semiconductor light emitting element 18 is mounted on the optical semiconductor mounting substrate 10 having high thermal conductivity, thereby reducing the cost and reducing the cost. The heat dissipation from 18 can be promoted, and the decrease in luminous efficiency and the life can be suppressed. In particular, when a plurality of semiconductor light emitting elements 18 are mounted at a high density as in this specific example, heat is also generated at a high density, so heat dissipation is important. On the other hand, according to the present embodiment, heat radiation to the heat sink 300 can be promoted via the optical semiconductor mounting substrate 10, and high light emission efficiency and good long-term reliability can be maintained.

  When actually used as a light source for a vehicle lighting device or the like, it is necessary to appropriately mount circuit elements such as a diode, a capacitor, a resistor, a protection element, and a connector (not shown). That is, it is necessary to mount circuit elements included in the drive circuit of the semiconductor light emitting element 18. In such a case, if the light source is composed only of a substrate having a high thermal conductivity, it is necessary to secure a mounting area for circuit elements that do not generate heat on the substrate having a high thermal conductivity, which increases the cost of the light source.

  In contrast, in the present embodiment, circuit elements other than the semiconductor light emitting element 18 are mounted not on the optical semiconductor mounting substrate 10 but on the control substrate 50 which has low thermal conductivity but is inexpensive. By doing so, the cost for the component mounting area can be kept low.

  Further, by mounting circuit elements other than the semiconductor light emitting element 18 on the control substrate 50 side, the amount of heat generated on the optical semiconductor mounting substrate 10 is reduced, and the temperature rise of the semiconductor light emitting element 18 disposed adjacent thereto is also reduced. To do. Thereby, the light emission efficiency of the semiconductor light emitting element 18 is improved, the optical semiconductor mounting substrate 10 can be downsized, and the cost can be further reduced.

  Further, compared to the case where a glass epoxy substrate or the like is used as the optical semiconductor mounting substrate 10, heat radiation is improved, so that components can be arranged densely and the light source can be downsized. As a result, it is possible to reduce the restrictions on the mounting of the light source for various lamp designs and to provide a highly versatile light source. Furthermore, cost reduction can be expected by minimizing the substrate area and the quantity of semiconductor light emitting elements used.

Next, the circuit configuration of the optical semiconductor light source according to the present embodiment will be described in more detail.
FIG. 4A is a schematic plan view of an optical semiconductor light source according to the embodiment of the present invention, and FIG. 4B is an equivalent circuit diagram thereof.

  On the optical semiconductor mounting substrate 10, electrodes 12, 14, and 16 are formed. A semiconductor light emitting element 18 is connected between the electrode 12 and the electrode 14, and a light emitting section 20 is formed by arranging a reflector 22 so as to surround the semiconductor light emitting element 18. A first current limiting resistor 30 is connected between the electrode 14 and the electrode 16.

  As shown in FIG. 4B, the semiconductor light emitting element 18 includes two circuits connected in parallel in series in three stages.

However, the number of the semiconductor light emitting elements 18 is not limited to the illustrated one. That is, it is sufficient that at least one semiconductor light emitting element 18 is provided. Further, the connection in the case of providing a plurality of semiconductor light emitting elements 18 may be in series or in parallel.
On the other hand, electrodes 52, 54, and 56 are formed on the control substrate 50. A second current limiting resistor 60 is connected between the electrode 54 and the electrode 56. The electrodes 52 and 56 are connected to power supply terminals 70 and 70 from an external circuit.
The electrodes 12 and 16 of the optical semiconductor mounting substrate 10 and the electrodes 52 and 54 of the control substrate 50 are electrically connected by connecting means 40 and 40.

  Note that the connection locations of the electrodes 12, 16 and 52, 54 and the connection means 40, 40 provided on the optical semiconductor mounting substrate 10 and the control substrate 50 are not limited to the illustrated locations. In short, as long as the connection means 40, 40 electrically connect the optical semiconductor mounting substrate 10 and the control substrate 50, the connection location is not limited.

  As can be seen from the equivalent circuit shown in FIG. 4B, between the pair of power supply terminals 70, 70, the light emitting unit 20, the first current limiting resistor 30, the second current limiting resistor 60, Are connected in series. Therefore, when a driving voltage is applied between the power supply terminals 70 and 70, the current limited by the first and second current limiting resistors 30 and 60 can flow through the light emitting unit 20 to emit light.

  A plurality of the first current limiting resistors 30 may be arranged, and in electrical connection with the semiconductor light emitting device 18, the power source minus (+) on the wiring on the power source plus (+) side as viewed from the semiconductor light emitting device 18. You may arrange | position on both the wiring of a power supply plus (+) side and a power supply minus (-) side on the wiring of (-) side. Examples of the form of the first current limiting resistor 30 include a surface-mounted resistor element and a printing resistor formed on the substrate by printing means.

  Also, a plurality of second current limiting resistors 60 may be arranged, and in the electrical connection with the semiconductor light emitting element 18 shown in FIG. 4B, the power source plus (+ ) Side wiring, power source minus (−) side wiring, power source plus (+) side and power source minus (−) side wiring. Further, examples of the form of the second current limiting resistor 60 include a discrete mounting resistance element and a surface mounting resistance element.

  A part of the function of the first current limiting resistor 30 provided on the optical semiconductor mounting substrate 10 by mounting the second current limiting resistor 60 on the control substrate 50 side as in the configuration of the present embodiment. Can be transferred to the second current limiting resistor 60, the amount of heat generated by the first current limiting resistor 30 is reduced, and the temperature rise of the semiconductor light emitting element 18 disposed in the vicinity thereof is also reduced. Thereby, the light emission efficiency of the semiconductor light emitting element 18 is improved, the optical semiconductor mounting substrate 10 can be downsized, and the cost can be further reduced.

In the optical semiconductor light source 150 of the present embodiment, the first current limiting resistor 30 can be trimmed.
FIG. 4C shows a state after trimming. That is, the first current limiting resistor 30 has a cut portion 36 formed by trimming. The cut portion 36 can be formed, for example, by removing a part of the current limiting resistor 30 by irradiating a laser. Alternatively, it is possible to remove a part of the current limiting resistor 30 by pressing a jig.

  When a printing resistor formed by printing is formed as the first current limiting resistor 30, such trimming can be easily performed. By trimming the first current limiting resistor 30 on the optical semiconductor mounting substrate 10 with respect to variations in electrical and optical characteristics of the light emitting unit 20, it is possible to suppress variations between the light sources of the respective characteristics. .

Next, the heat radiation member of the optical semiconductor light source according to the embodiment of the present invention will be described in more detail.
FIG. 5A is a schematic perspective view illustrating the relationship among the first heat sink 300, the optical semiconductor mounting substrate 10, and the control substrate 50, and FIG. 5B is a cross-sectional perspective view thereof.
6A is a schematic plan view corresponding to FIG. 5A, FIG. 6B is a schematic plan view showing a state in which the control board 50 is removed, and FIG. 6C. FIG. 7 is a schematic perspective view corresponding to FIG.
The first heat sink 300 has a mounting surface 305 for mounting the optical semiconductor mounting substrate 10 and a mounting surface 306 for mounting the control substrate 50 on its upper surface.

  On the back side of the first heat sink 300, heat radiating fins 303 are formed. For example, by forming the first heat sink 300 from aluminum, the heat released from the optical semiconductor mounting substrate 10 can be efficiently conducted through the first heat sink 300 and efficiently transmitted to the outside through the fins 303. Can be released.

  In the case of the specific examples shown in FIGS. 5 and 6, a part of the control board 50 contacts the first heat sink 300 and the other part protrudes outside the first heat sink 300, The top of the connector insertion portion 304 formed on the first heat sink 300 is covered.

  The circuit elements provided on the control substrate 50 are resistors, diodes, capacitors, transistors, and the like that constitute the drive circuit of the semiconductor light emitting element 18 mounted on the optical semiconductor mounting substrate 10, and all of them have a small heat dissipation amount. Variations in characteristics are small with increasing temperature. For this reason, even if the control board 50 is arranged so as to protrude from the first heat sink 300, the operation of the circuit elements provided on the control board 50 is not adversely affected.

  By extending the control board 50 from the first heat sink 300 so as to cover the connector insertion portion 304 of the first heat sink 300, the power supply terminals 72, 74, and 76 are extended into the connector insertion portion 304. The connector 720 can be inserted and connected from the back side of the first heat sink 300.

  In addition, if the connector 720 is a waterproof connector around the connector insertion portion 304, it is possible to prevent moisture from entering the connector insertion portion 304 into the inside. That is, the vehicular illumination device 100 having a waterproof structure can be provided on the back surface side (the first heat sink 300 side).

FIG. 7 is a schematic diagram illustrating another specific example of the vehicular illumination device of the present embodiment.
That is, FIG. 7A is a schematic perspective view of the first heat sink 300. 7B, 7C, and 7D are schematic perspective views showing specific examples of the heat radiation fin 303, and are schematic views of the first heat sink 300 as viewed from the back surface side.
As shown in FIG. 7A, also in this specific example, the connector insertion portion 304 is provided in the first heat sink 300, and the power supply terminals 72, 74, and 76 of the control board 50 are inserted.

  Further, the shape of the heat dissipating fin 303 has a heat conducting portion 303A that spreads in a plurality of directions from the center of the first heat sink 300, as shown in FIG. 7B. With this configuration, when the optical semiconductor mounting substrate 10 is brought into contact with a position substantially opposite to the center of the first heat sink 300, heat generated from the optical semiconductor mounting substrate 10 is generated in the first heat sink 300. Heat can be quickly conducted in a plurality of directions to the heat dissipating fins 303, specifically, the heat conducting portion 303A. As a result, heat radiation from the first heat sink 300 to the surrounding atmosphere can be promoted.

  Moreover, as illustrated in FIG. 7C, a plurality of heat radiation portions 303 </ b> B branched from the heat conduction portions 303 </ b> A provided in the heat radiation fins 303 in FIG. 7B may be provided. By adopting such a configuration, the surface area of the first heat sink 300 can be further increased as compared with the configuration of FIG. 7B, and therefore heat dissipation from the first heat sink 300 to the surrounding atmosphere can be further promoted. In addition, as shown in FIG.7 (c), the thermal radiation part 303B is not limited to what each has connected. For example, as shown in FIG. 7D, the heat radiating portion 303B may be configured in a fragmentary manner. In short, if the heat radiating portion 303B is formed to be branched from the heat conducting portion 303A, The format is not limited.

Next, a heat radiating member of an optical semiconductor light source according to another embodiment of the present invention will be described.
FIG. 8A is a schematic perspective view showing a specific example in which a second heat sink (second heat radiating member) 310 is provided outside the first heat sink 300, and FIG. 8B and FIG. ) Are schematic views of the second heat sink 310 as viewed from the side where the first heat sink 300 is accommodated.

The second heat sink 310 has an insertion hole 317 that accommodates the first heat sink 300. In the state in which the first heat sink 300 is accommodated, the first heat sink 300 and the second heat sink 310 are in close contact with each other and have good thermal contact.
In addition, the second heat sink 310 has a connector insertion portion 314, similar to the first heat sink 300. With this configuration, the power supply terminals 72, 74, and 76 provided on the control board 50 are connected to the connector insertion portion 304 provided to the first heat sink 300 and the connector insertion portion 314 provided to the second heat sink 310. It is connected to a connector 720 inserted from the rear of the second heat sink 310 and supplied with power from the outside. Alternatively, the connector insertion portion 314 may be provided only in the second heat sink 310 so that only the power supply terminals 72, 74, and 76 penetrate the first heat sink 300.

  By using a material having a higher emissivity than that of the first heat sink 300 as the material of the second heat sink 310, heat dissipation from the first heat sink 300 can be promoted. For example, when the first heat sink 300 is formed of aluminum and the second heat sink 310 is formed of a resin such as PBT (Poly Buthylene Terephthalete), the heat released from the light-emitting portion is the first heat sink 300. 2 is efficiently transmitted to the heat sink 310 and discharged to the outside.

  Specifically, the thermal emissivity of aluminum is as low as about 0.05 in the case of a mirror surface, and is only about 0.3 to 0.4 even in the case of a rough surface. On the other hand, the thermal emissivity of a resin such as PBT is as high as 0.9 to 0.95. Therefore, by forming the first heat sink 300 with a metal such as aluminum and the second heat sink 310 with a resin such as PBT, the heat from the optical semiconductor mounting substrate 10 and the control substrate 50 is transferred to the first heat sink 300. The second heat sink 310 can be efficiently discharged to the surrounding atmosphere.

On the other hand, the second heat sink 310 is provided with an insertion hole 317 for accommodating these heat radiation fins 303. That is, the heat radiating fins 303 of the first heat sink 300 are embedded in the second heat sink 310. From the viewpoint of waterproofing, it is desirable that the insertion hole 317 does not penetrate the second heat sink 310 and is terminated on the back surface side of the second heat sink 310.

  By doing so, the contact area between the first heat sink 300 and the second heat sink 310 is increased, and heat conduction from the first heat sink 300 to the second heat sink 310 can be promoted. As a result, heat radiation from the second heat sink 310 to the surrounding atmosphere can be promoted.

9A is a schematic perspective view showing a specific example in which the surface area of the second heat sink 310 is increased, FIG. 9B is a sectional perspective view thereof, and FIG. 9C is a second heat sink. FIG. 9D is a cross-sectional view taken along the alternate long and short dash line AA in FIG. 9A.
In this specific example, the first heat sink 300 has heat radiation fins 303 concentrically. In addition, the second heat sink 310 has a heat conducting portion 313A spreading in a plurality of directions from the center of the second heat sink 310 and a plurality of heat radiating portions 303B branched from the heat conducting portion 313A. Also good. That is, as shown in FIG. 9D, which is a cross-sectional view taken along one-dot chain line AA in FIG. 9A, the heat dissipating fins 303 and the second heat sinks 300 of the first heat sink 300 are disposed around the heat radiating portion 313 </ b> B. The heat conducting portions 313A of the heat sink 310 are alternately present. In this way, the heat released from the optical semiconductor mounting substrate 10 is transmitted both in the radial direction and in the concentric direction, and heat dissipation to the outside via the second heat sink 310 can be promoted.

FIG. 10A is a schematic perspective view showing a specific example in which the volume of the first heat sink 300 is increased, and FIG. 10B is a cross-sectional perspective view thereof.
Also in this specific example, the second heat sink 310 embedded in the back surface side of the first heat sink 300 can indirectly increase the emissivity of the first heat sink 300. As a result, it can be efficiently discharged from the wall surface of the second heat sink 310 to the outside. Thus, even if the 1st heat sink 300 is a simple block structure, heat dissipation can be improved.

FIG. 11A is a schematic perspective view showing a specific example in which the surface areas of the first heat sink 300 and the second heat sink 310 are increased, and FIG. 11B is a cross-sectional perspective view thereof.
In this specific example, a trench 318 is formed between adjacent radiating fins 303 while covering each of the radiating fins 303.
By forming such a trench 318, the surface area of the second heat sink 310 can be increased. As a result, the heat transferred through the heat radiation fin 303 can be efficiently released from the wall surface of the trench 318 to the outside.

  The second heat sink 310 may be configured by forming a material having a high thermal emissivity on the surface of the first heat sink 300. The second heat sink 310 may be formed by, for example, anodizing the surface of the first heat sink 300 made of aluminum.

Next, the relationship between the radiation fin and the connector of the optical semiconductor light source according to the embodiment of the present invention will be described in more detail.
FIG. 12A is a schematic view of the optical semiconductor light source according to the embodiment of the present invention viewed from the back side, and FIG. 12B illustrates the optical semiconductor light source of the comparative example according to the embodiment of the present invention on the back side. It is the schematic diagram seen from.

  As shown in FIG. 2B, a plurality of heat radiation fins 303 are formed on the back side of the optical semiconductor light source 100. These radiating fins 303 are formed to extend in one direction (vertical direction in FIG. 12).

  On the other hand, the connector insertion portion 304 into which the connector 720 (see FIG. 1) is inserted is composed of a connector insertion hole 304A and a connector insertion wall 304B provided at the periphery of the connector insertion hole 304A, and the connector insertion hole 304A and the connector insertion wall 304B. Each have a rectangular shape. That is, the cross-sectional shape of the connector 720 (see FIG. 1) inserted into the connector insertion portion 304 is also rectangular. Alternatively, the connector insertion portion 304 may be a square, a flat circle, an oval, or the like. In short, the shapes of the connector insertion portion 304 and the connector 720 are not limited to specific shapes.

  In the specific example shown in FIG. 12A, the extending direction of the heat dissipating fins 303 and the connector insertion portion 304, that is, the direction of the long side of the connector 720 are parallel. That is, the extending direction of the radiation fin 303 and the direction of the long side of the connector insertion portion 304 (connector 720) are both the vertical direction in FIG.

  On the other hand, in the case of the comparative example shown in FIG. 12B, the extending direction of the heat dissipating fins 303 and the direction of the long side of the connector insertion portion 304, that is, the connector 720, are substantially perpendicular. That is, the extending direction of the radiating fin 303 is the vertical direction in FIG. 12A, and the long side direction of the connector insertion portion 304 (connector 720) is the left-right direction in FIG.

  As illustrated in FIG. 12A, when the extending direction of the heat dissipating fins 303 is arranged to be parallel to the vertical direction, as indicated by the arrow 303 </ b> C, the upward air flows in the gap between the adjacent heat dissipating fins 303. This is likely to occur. That is, the air that has been warmed and lightened by the heat released from the radiating fins 303 tends to form an air current that rises vertically upward in the gaps of the radiating fins 303. As a result, heat radiation from the heat radiation fins 303 can be promoted.

Then, as shown in FIG. 12A, when the long side of the connector insertion portion 304 is arranged so as to be parallel to the extending direction of the radiating fin 303, the air flow indicated by the arrow 303C It is not hindered by 304B or the connector 720 (see FIG. 1). That is, the heat radiation from the heat radiation fins 303 can be further promoted.
However, as shown in FIG. 12B, when the connector insertion portion 304, that is, the connector insertion hole 304 </ b> A and the connector insertion wall 304 </ b> B are formed perpendicular to the extending direction of the radiating fins 303, the arrow 303 </ b> C represents. Since the air flow is hindered by the connector insertion wall 304 </ b> B and the connector 720, heat radiation from the heat radiation fins 303 is inhibited. Therefore, as shown in FIG. 12A, it is more preferable that the long side of the connector insertion portion 304 is parallel to the extending direction of the radiating fins 303.

  Even when the connector insertion portion 304 is configured only by the connector insertion hole 304A, if the connector insertion hole 304A is formed perpendicular to the extending direction of the heat dissipating fin 303, the air flow indicated by the arrow 303C Therefore, the heat radiation from the heat radiation fins 303 is hindered. Therefore, similarly to the case where the connector insertion portion 304 is configured by the connector insertion hole 304A and the connector insertion wall 304B, the long side of the connector insertion hole 304A is not limited even when the connector insertion portion 304 is configured only by the connector insertion hole 304A. More preferably, it is parallel to the extending direction of the radiating fins 303.

FIG. 13A is a schematic view of the optical semiconductor light source 100 according to the present embodiment as viewed from the back side, and FIG. 13B is a schematic view as viewed from the right side.
As shown in FIG. 13A, a cable 722 as an electrical wiring extends from the connector 720 inserted into the connector insertion portion 304. In the case of the specific example shown in FIG. 13, the cable 722 is connected to the connector 720 so as to extend in the long side direction of the connector 720, that is, upward in FIG. By connecting the cable 722 in this way, the flow of air flowing through the gap between the heat radiation fins 303 is not hindered.

  In addition to the specific examples shown in FIGS. 13A and 13B, for example, the cable 722 extends in the penetration direction of the connector insertion portion 304, that is, in the direction perpendicular to the paper surface in FIG. As is present, it may be connected to the connector 720. Alternatively, the cable 722 may be connected to the connector 720 so as to extend in a direction perpendicular to the extending direction of the radiation fins 303, that is, in the right direction in FIG. In any of these cases, the cable 722 does not hinder the flow of air flowing through the gaps between the radiation fins 303.

FIG. 14A is a schematic view of the optical semiconductor light source 100 according to the present embodiment as viewed from the back side, and FIG. 14B is a schematic view as viewed from the right side.
In this specific example, the connector 720 is connected to the side surface instead of the back surface of the optical semiconductor light source 100. That is, the connector insertion portion 304 (see FIG. 2) is formed on the side surface instead of the back surface of the optical semiconductor light source 100, and the connector 720 is inserted into the connector insertion portion 304.

  In this way, it is possible to form the heat radiation fins 303 on almost the entire surface on the back surface side of the optical semiconductor light source 100, thereby further promoting heat radiation. Further, since the connector 720 and the cable 722 are not provided on the back side of the optical semiconductor light source 100, the air flow generated around the heat radiating fin 303 is not obstructed.

  In addition to the specific examples shown in FIGS. 14A and 14B, for example, the cable 722 is perpendicular to the extending direction of the connector insertion portion 304, that is, in FIG. And may be connected to the connector 720 so as to extend in a vertical direction. Alternatively, the cable 722 may be connected to the connector 720 so as to extend in a direction perpendicular to the extending direction of the radiation fins 303, that is, in the right direction in FIG. In any of these cases, the cable 722 does not hinder the flow of air flowing through the gaps between the radiation fins 303.

FIG. 15 is a schematic cross-sectional view of a lamp equipped with the vehicle lighting device 100 of the present embodiment.
The lamp 600 includes a reflector 620 and a lens 650. The vehicle lighting device 100 of this embodiment is inserted into an opening 640 provided at a position facing the reflector 620 and the lens 650. The light emitted from the vehicular lighting device 100 is directly emitted to the outside or reflected by the reflector 620 and emitted to the outside via the lens 650. This lamp 600 can be provided, for example, in a taillight part of an automobile.

  In the lamp 600, a portion in front of the flange portion 302 formed on the first heat sink 300 is surrounded by the reflector 620 and the lens 650. The vehicle lighting device 100 and the reflector 620 can be engaged in a watertight manner. If necessary, a seal 660 made of a material such as rubber or silicone may be provided between the vehicle lighting device 100 and the reflector 620.

  Note that the vehicular lighting device 100 has a lamp engaging convex portion 350 as shown in FIG. 11A, for example, and the engagement with the lamp 600 is further strengthened as shown in FIG. 15B. Also good. Further, the lamp may have an engaging opening (not shown) corresponding to the lamp engaging convex portion 350. Moreover, you may have an engaging means (not shown) comprised, for example with the elastic body in the lamp. In short, any means may be used to make the engagement between the vehicle lighting device 100 and the lamp 600 stronger.

Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

 DESCRIPTION OF SYMBOLS 10 Optical semiconductor mounting board | substrate, 12, 14, 16 electrodes, 18 Semiconductor light-emitting device, 20 Light emission part, 22 Reflector, 27 Recessed part, 30 Current limiting resistance, 36 Cutting part, 40 Connection means, 48 Connection means, 50 Control board, 52 , 54, 56 electrode, 60 current limiting resistor, 70, 72, 74, 76 feeding terminal, 100 vehicle lighting device, 150 optical semiconductor light source, 300 first heat sink, 301 engaging convex portion, 302 flange portion, 303 heat dissipation Fin, 303A, 303B Thermal conduction portion, 304 Connector insertion portion, 304A Connector insertion hole, 304B Connector insertion wall, 305 Mounting surface, 306 Mounting surface, 310 Second heat sink, 311 Engaging convex portion, 312 Flange portion, 313 Heat dissipation Fin, 317 insertion hole, 318 trench, 700 cover, 701 engagement opening, 72 0 connector, 722 cable

Claims (7)

An optical semiconductor mounting substrate;
A semiconductor light emitting device provided on the optical semiconductor mounting substrate;
A first heat dissipating member having heat dissipating fins, contacting the back surface of the optical semiconductor mounting substrate and transmitting heat released from the semiconductor light emitting element to the outside;
A connector insertion portion provided in the first heat dissipation member, and having a connector insertion hole and a connector insertion wall provided around the connector insertion hole;
A power supply terminal extending through the connector insertion portion and electrically connected to the optical semiconductor mounting substrate;
With
An optical semiconductor light source in which an extending direction of the radiation fin and a long side direction of the connector insertion portion are parallel.   2. The optical semiconductor light source according to claim 1, further comprising a second heat radiating member that covers at least a part of the first heat radiating member and releases the heat transmitted through the first heat radiating member to the outside.   The optical semiconductor light source according to claim 2, wherein the radiation fin is embedded in the second radiation member. The first heat dissipation member is made of metal,
The optical semiconductor light source according to claim 2 or 3, wherein the second heat radiation member is formed of a resin.   4. The optical semiconductor light source according to claim 2, wherein the second heat radiating member is formed on a surface of the first heat radiating member and is made of a material having an emissivity higher than that of the first heat radiating member.   A vehicular lighting device comprising the optical semiconductor light source according to claim 1.   The vehicle illumination device according to claim 6, wherein the vehicle illumination device is attached to a lamp such that an extending direction of a heat dissipating fin provided in the optical semiconductor light source is parallel to a vertical direction.

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