KR100962619B1

KR100962619B1 - Apparatus for fixing a substrate and molding apparatus for semiconductor package manufacturing

Info

Publication number: KR100962619B1
Application number: KR20080017662A
Authority: KR
Inventors: 이수영
Original assignee: 세크론 주식회사
Priority date: 2008-02-27
Filing date: 2008-02-27
Publication date: 2010-06-11
Also published as: KR20090092423A

Abstract

The substrate holding device includes a base body, a seating portion, an elastic portion and an insertion portion. The seating part is installed on top of the base body. In the seating part, a molding process is performed to mount a substrate for manufacturing a semiconductor package, and a vacuum hole to which vacuum pressure is applied from the outside is formed to suck and fix the seated substrate. The elastic portion is provided between the base body and the seating portion, and provides elasticity to the seating portion so that the seating portion is located above the reference position at which the molding process begins. The insertion part is inserted into the vacuum hole, and when the seating part is located above the reference position, the vacuum hole is opened to apply the vacuum pressure. To prevent ingress. Therefore, when the molding process is performed on the substrate or the mounting part is cleaned, foreign matters can be prevented from flowing into the vacuum hole through the insertion part.

Description

A substrate fixing device and a molding device for manufacturing a semiconductor package including the same {APPARATUS FOR FIXING A SUBSTRATE AND MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE MANUFACTURING}

The present invention relates to a substrate fixing apparatus and a molding apparatus for manufacturing a semiconductor package including the same, and more particularly, to an apparatus for fixing a substrate for manufacturing a semiconductor package by performing a molding process and the molding process using the apparatus. A device to perform.

In general, a semiconductor package is manufactured by performing a molding process with a chip separated from a wafer mounted on a substrate on which a circuit pattern is printed.

Specifically, the semiconductor package includes the steps of separating the chip from the wafer, mounting the separated chip on the substrate, connecting the chip and the substrate through a wire, and the chip on the substrate It is manufactured including the step of molding using a resin material injected from the outside in a state connected to the wire.

Among these, the molding process is coupled to the substrate fixing portion so that the substrate is fixed between the substrate holding portion and the substrate fixed to the substrate holding portion is mounted in the state where the chip is mounted and the substrate is interposed The resin material is injected into the position and is advanced by a molding apparatus including a mold part for molding the substrate.

At this time, the substrate fixing part is formed with a plurality of vacuum holes to which a vacuum pressure is applied from the outside in order to fix the substrate in a vacuum adsorption method.

However, when the substrate on which the chip is mounted is molded through the resin material, the substrate is torn due to the vacuum pressure applied to the vacuum holes or the resin material is introduced into the vacuum holes to block the vacuum holes. There is a problem that can be.

In addition, when cleaning the surface on which the substrate is mounted on the substrate fixing part through a separate cleaning material, a separate cleaning jig is attached to the substrate fixing part to prevent the cleaning material from flowing into the vacuum holes. There is also an uncomfortable problem that must be combined.

Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a substrate fixing apparatus capable of preventing foreign matter from flowing into a vacuum hole for fixing a substrate to be seated.

Another object of the present invention is to provide a molding apparatus for manufacturing a semiconductor package including the substrate holding apparatus.

In order to achieve the above object of the present invention, a substrate fixing apparatus according to one feature includes a base body, a seating portion, an elastic portion and an insertion portion. The seating part is installed on an upper portion of the base body. In the seating part, a substrate for manufacturing a semiconductor package is mounted by a molding process, and a vacuum hole to which vacuum pressure is applied from the outside is formed to suck and fix the seated substrate. The elastic portion is provided between the base body and the seating portion, and provides the elasticity to the seating portion so that the seating portion is located above the reference position where the molding process starts. The insertion part is inserted into the vacuum hole, and when the seating part is located above the reference position, the vacuum hole is opened to apply the vacuum pressure, and the seating part is pressed and positioned at the reference position. Blocks the foreign matter from being prevented from entering the vacuum hole from the outside.

The inlet of the vacuum hole is formed to be tapered to widen from the same cross-sectional area as the inserting portion, and the inserting portion has a structure of opening and blocking the vacuum hole while moving the tapered position of the vacuum hole. Accordingly, the insertion part may be positioned on the same surface as the surface on which the substrate is seated when the vacuum hole is blocked.

On the other hand, the substrate fixing device is coupled to the lower portion of the mounting portion, and may be inserted into the base body may further include a departure prevention portion for preventing the mounting portion is to be separated from the elastic portion.

The substrate fixing device may further include a fixing part extending outward from the position where the release preventing part of the base body is inserted and fixing the release preventing part according to the position of the seating part.

The fixing part is formed to be thicker than the first catching part and the first catching part to fix the release preventing part when the seating part is located above the reference position, and to fix the release preventing part when the seating part is located at the reference position. It may include a second locking portion. The fixing part may be connected to the first and second locking parts in a straight line to fix the separation preventing part through push and pull operations.

On the other hand, the substrate fixing device is installed between the base body and the seating portion, when coupled with the holder portion holding the insertion portion inserted into the vacuum hole and the seating portion and the seating portion is located in the reference position It may further include a support portion coupled to the base body to support the seating portion.

In order to achieve the above object of the present invention, a molding apparatus for manufacturing a semiconductor package according to one aspect includes a substrate fixing part and a mold part. In the substrate fixing part, a molding process is performed to fix a substrate for manufacturing a semiconductor package. The mold part is coupled to the substrate fixing part such that a substrate fixed to the substrate fixing part is interposed therebetween, and a resin material is provided from the outside at a position at which the substrate is interposed to mold the substrate.

Thus, the substrate fixing part is installed on the base body, the base body is mounted on the substrate is seated, the seating portion formed with a vacuum hole is applied from the outside to apply vacuum pressure to fix the seated substrate, the base body and It is installed between the seating portion, the seating portion is inserted into the elastic portion for providing elasticity to the seating portion, and the vacuum hole so as to be located above the reference position where the molding process starts by the mold portion, the seating When the upper part is located above the reference position, the vacuum hole is opened to apply the vacuum pressure, and when the seating part is pressed by the mold part to block the vacuum hole when the reference position is positioned, the resin material It includes an insert for preventing the flow into the vacuum hole.

According to such a substrate fixing device and a molding apparatus for manufacturing a semiconductor package including the same, when a semiconductor package is manufactured by manufacturing a semiconductor package, a foreign material such as a resin material is blocked by blocking a vacuum hole from the outside through an inserting part. It can be prevented from entering the hole.

In addition, by cutting off the vacuum pressure applied to the vacuum hole during the molding process, it is possible to prevent the substrate from being torn by the vacuum pressure.

In addition, when cleaning the surface on which the substrate is seated, the foreign material such as a cleaning material used for cleaning is fixed by fixing the insertion part in a state of blocking the vacuum hole by using a fixing part and a separation prevention part. It can be prevented from entering the vacuum hole. That is, by removing the separate cleaning jig mentioned in the background art when cleaning, it is possible to reduce the cost for manufacturing it.

Hereinafter, a substrate fixing apparatus and a molding apparatus for manufacturing a semiconductor package including the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

FIG. 1 is a schematic view illustrating an exploded view of a molding apparatus for manufacturing a semiconductor package according to an exemplary embodiment of the present invention, and FIG. 2 is a view illustrating the substrate fixing part illustrated in FIG. 1 in detail.

1 and 2, the molding apparatus 1000 for manufacturing a semiconductor package according to an exemplary embodiment of the present invention includes a substrate fixing part 100 and a mold part 200.

The substrate S for manufacturing the semiconductor package is fixed to the substrate fixing part 100. In detail, a circuit pattern is patterned on the substrate S, and the chip C separated from the wafer is mounted. The chip C is electrically connected to the substrate S by a wire (not shown).

The substrate fixing part 100 includes a base body 110, a seating part 120, an elastic part 130, and an insertion part 140. The base body 110 is fixed to an outer frame (not shown) to serve as a reference pedestal of the substrate fixing part 100. For example, the base body 110 may have a plate shape.

The seating part 120 is installed above the base body 110. The seating part 120 may have a plate shape like the base body 110. The substrate S is substantially seated and fixed to the seating part 120.

The seating part 120 may fix the substrate S according to a vacuum adsorption method. In this case, a vacuum hole 122 to which a vacuum pressure VP is applied from the outside may be formed in the seating part 120. The vacuum hole 122 may be formed in a plurality at regular intervals on the surface on which the substrate (S) of the seating portion 120 is seated to stably fix the substrate (S). In addition, the vacuum hole 122 has a structure that penetrates the seating part 120.

The elastic portion 130 is installed between the base body 110 and the seat (120). The elastic part 130 provides elasticity to the seating part 120 to push the seating part 120 from the base body 110. For example, the elastic portion 130 may be made of a compression spring.

The elastic part 130 allows the seating part 120 to be positioned above the reference position at which the molding process is started. Here, the reference position may mean a parting line formed by the molding process.

The insertion part 140 is inserted into the vacuum hole 122. The insertion part 140 has an elongated pin structure. The insertion portion 140 has a structure extending through the vacuum hole 122 to the lower portion of the seating portion 120. Accordingly, the substrate fixing part 100 is installed between the base body 110 and the seating part 120 to hold and fix the inserting part 140 extending below the seating part 120. The unit 150 may further include. The holder part 150 has a structure fixed to the outer frame. That is, the position of the insertion part 140 is fixed even when the seating part 120 is moved by the holder part 150.

The insertion part 140 may open and block the vacuum hole 122 of the seating part 120 in some cases. Specifically, the inserting portion 140 opens the vacuum hole 122 when the seating portion 120 is positioned above the reference position by the elastic portion 130 to open the vacuum pressure VP from the outside. ) Is applied to the vacuum hole 122, and when the seating portion 120 is pressed and positioned at the reference position, the vacuum hole 122 is blocked and the vacuum pressure (VP) is applied to the vacuum hole 122. ) Is not authorized.

Hereinafter, the shape of the inlet of the insertion part 140 and the vacuum hole 122 will be described in more detail with reference to FIG. 3.

3 is an enlarged view of a portion A of FIG. 2.

Referring to FIG. 3 further, the seating part 120 is formed at the inlet of the vacuum hole 122 with a tapered part 124 extending from the same cross-sectional area as the insertion part 140 to a predetermined size.

The insertion part 140 opens and blocks the inlet of the vacuum hole 122 while moving the taper part 124 according to the movement of the seating part 120. Specifically, as shown in FIG. 3, if the inserting part 140 is positioned below the taper part 124, the vacuum pressure VP is applied from the outside to the inlet of the vacuum hole 122, thereby providing the substrate S. FIG. ) Is fixed to the seating part 120.

Meanwhile, the substrate fixing part 100 is inserted into the base body 110 while being coupled with the lower part of the seating part 120 to prevent the seating part 120 from being separated from the elastic part 130. The prevention unit 160 further includes.

The departure prevention part 160 extends from the coupling part 162 and the coupling part 162 coupled with the seating part 120 and is inserted into the base body 110 to prevent the departure of the seating part 120. It consists of a stop part 164 to stop.

The coupling part 162 has a structure that penetrates the compression spring when the elastic part 130 is formed of a compression spring. The stop part 164 has a structure in which the longitudinal direction thereof is perpendicular to the coupling part 162 so as not to be released from the base body 110.

In addition, the substrate fixing part 100 extends outward from the position of the stop part 164 of the separation preventing part 160 inserted into the base body 110 so that the separation preventing part 160 is attached to the seating part. It further includes a fixing portion 170 for fixing in accordance with the position of (120).

The fixing part 170 is the first locking part 172 and the seating part 120 for fixing the departure prevention part 160 when the seating part 120 is located above the reference position. And a second catching part 174 which fixes the separation preventing part 160 when positioned at the position.

The first and second catching portions 172 and 174 have a structure that is substantially connected to each other in a straight line, and different from each other to fix the departure preventing portion 160 according to a change in position of the seating portion 120. Has a thickness. That is, the thickness of the second locking portion 174 for fixing the mounting portion 120 in a relatively low position is formed thicker than the thickness of the first locking portion 172.

The fixing part 170 is pushed and pulled to a portion extending outwardly so as to meet the first and second locking parts that meet the stop part 164 of the separation preventing part 160. By changing the positions of the 172 and 174, the separation preventing part 160 may be fixed according to the position of the seating part 120.

Thus, the base body 110 or the fixing unit 170 may include an LM guide structure to smoothly slide the operation of the fixing unit 170.

Meanwhile, the substrate fixing part 100 is coupled to the seating part 120, and when the seating part 120 is located at the reference position, the substrate fixing part 100 is coupled to the base body 110 to connect the seating part 120. It further includes a support 180 for supporting.

The support unit 180 supports the load generated as the seating unit 120 is pressed to be positioned at the reference position. As a result, the support 180 may prevent the seating part 120 from being pressed and sagging. The support part 180 may be formed at a position where the insertion part 140 is disposed for smoother support.

The mold part 200 is coupled to the seating part 120 of the substrate fixing part 100 so that the substrate S fixed to the substrate fixing part 100 is interposed therebetween. In this case, the mold part 200 is injected with the resin R to a portion of the chip C and the area around the chip C of the substrate S seated on the seating part 120. The molding space 210 is formed to enable the molding process. In addition, the mold part 200 is in direct contact with the substrate S about the circumference of the molding space 210 to press the substrate S when the molding process is performed.

Meanwhile, the molding apparatus 1000 further includes an injection part 300 inserted into a position adjacent to the molding space 210 from a lower portion of the substrate fixing part 100 to inject the resin R. In this case, the resin R may be supplied in a solid state from the outside for convenience of supply, and then melted in the vicinity of the molding space 210 and supplied to the molding space 210 in a liquid state.

Hereinafter, the features of the present invention will be described in more detail with reference to FIGS. 4 to 7.

4 is a view illustrating the substrate fixing unit in detail by combining the molding apparatus illustrated in FIG. 1, and FIG. 5 is an enlarged view of a portion B of FIG. 4.

1, 4, and 5, the substrate S, on which the chip C is mounted, is mounted on the seating part 120 of the molding apparatus 1000 through the vacuum hole 122. In the state, the mold part 200 is directly contacted with a part of the substrate S and pressed.

In this case, as the seating part 120 descends, the insertion part 140 inserted into the vacuum hole 122 blocks the vacuum hole 122 from the outside. Thereafter, the resin R in a liquid state is injected into the molding space 210 formed by the mold part 200. Thereafter, the semiconductor package is manufactured from the substrate S on which the chip C is mounted while the resin R in a liquid state is cured.

In this process, when the resin R in a liquid state is injected into the molding space 210 and cured, the insertion part 140 blocks the vacuum hole 122, thereby preventing the resin R. ) May be prevented from flowing into the vacuum hole 122.

In addition, the insertion unit 140 blocks the vacuum hole 122 to prevent the vacuum pressure VP from being applied to the vacuum hole 122, thereby preventing the vacuum pressure 122 from being applied to the substrate S. This can be prevented from tearing.

On the other hand, the insertion part 140 is located on the same surface as the surface on which the substrate (S) of the seating portion 120 is fixed and seated when the vacuum hole 122 is blocked. Thereby, it can prevent that a bad point generate | occur | produces in the said resin material R hardened by the said vacuum pressure VP while the said resin material R is hardening.

FIG. 6 is a view illustrating a state in which a seating part is pressed in order to clean the substrate fixing part shown in FIG. 1, and FIG. 7 is an enlarged view of part C of FIG. 6.

1, 6, and 7, the molding apparatus 1000 performs the molding process on the substrate S on which the chip C is mounted to manufacture the semiconductor package. In order to prevent contamination of the semiconductor package to be manufactured after the number of times, the semiconductor package is manufactured.

At this time, the cleaning process is substantially made based on the surface on which the substrate (S) of the seating portion 120 is seated. Specifically, the cleaning process may be accomplished by applying a separate cleaning material (CS) to the face or by rubbing the face with a separate polishing tool.

In the above cleaning process, the present invention artificially presses the seating portion 120 so that the seating portion 120 is located at a reference position for the molding process, and then the base body 110 The fixing part 170 inserted into the fixing member 170 is moved outward through a pull operation to fix the separation preventing part 160 coupled with the seating part 120 to the vacuum hole through the insertion part 140. By blocking the 122 from the outside, the foreign matter and the cleaning material CS may be prevented from flowing into the vacuum hole 122 during the cleaning process. In other words, by removing the cleaning jig mentioned in the background art when the cleaning process, the cost for manufacturing it can be reduced.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

The present invention described above may be used to prevent foreign substances, such as resin, from entering the vacuum hole by blocking the vacuum hole from the outside when the molding process is performed on the substrate to manufacture the semiconductor package from the outside.

1 is a schematic diagram illustrating an exploded view of a molding apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.

FIG. 2 is a view specifically illustrating a substrate fixing part shown in FIG. 1.

3 is an enlarged view of a portion A of FIG. 2.

4 is a view illustrating the substrate fixing unit in detail by combining the molding apparatus illustrated in FIG. 1.

5 is an enlarged view of a portion B of FIG. 4.

FIG. 6 is a view illustrating a state in which a seating part is pressed in order to clean the substrate fixing part shown in FIG. 1.

FIG. 7 is an enlarged view of a portion C of FIG. 6.

S: Substrate R: Resin

100: substrate fixing part 110: base body

120: mounting portion 122: vacuum hole

124: tapered portion 130: elastic portion

140: insertion portion 150: holder portion

160: departure prevention part 170: fixing part

200: mold portion 300: injection portion

1000: Molding apparatus for manufacturing semiconductor package

Claims

Base body;

A seating part installed on an upper portion of the base body and having a molding process in which a substrate for manufacturing a semiconductor package is mounted, and a vacuum hole to which vacuum pressure is applied from outside to adsorb and fix the seated substrate;

An elastic part provided between the base body and the seating part and providing elasticity to the seating part so that the seating part is located above a reference position at which the molding process starts; And

The vacuum hole is inserted into the vacuum hole, and the vacuum hole is applied when the seating portion is positioned above the reference position, and the vacuum pressure is applied. When the seating portion is pressed and positioned at the reference position, the vacuum hole is blocked. Substrate fixing device including an insertion unit for preventing foreign matter from flowing into the vacuum hole from the outside.

According to claim 1, wherein the inlet of the vacuum hole is formed to be tapered so as to widen from the same cross-sectional area as the insertion portion, the insertion portion has a structure for opening and blocking the vacuum hole while moving the tapered position of the vacuum hole. The board | substrate fixing apparatus made of.

The substrate holding apparatus of claim 2, wherein the insertion part is positioned on the same surface as the surface on which the substrate is seated when the vacuum hole is blocked.

The substrate holding apparatus of claim 1, further comprising a release preventing unit coupled to a lower portion of the mounting unit and inserted into the base body to prevent the mounting unit from attempting to detach from the elastic unit.

5. The substrate fixing apparatus of claim 4, further comprising a fixing part extending outward from the position where the release preventing part of the base body is inserted and fixing the release preventing part according to the position of the seating part.

The method of claim 5, wherein the fixing portion

A first catching part for fixing the release preventing part when the seating part is positioned above the reference position; And

And a second locking portion formed thicker than the first locking portion and fixing the release preventing portion when the seating portion is positioned at the reference position.

The substrate fixing apparatus of claim 6, wherein the fixing unit connects the first and second locking units in a straight line to fix the separation preventing unit through push and pull operations.

The method of claim 1,

A holder part installed between the base body and the seating part and holding an insertion part inserted into the vacuum hole; And

And a support portion coupled to a lower portion of the seating portion and coupled to the base body to support the seating portion when the seating portion is positioned at the reference position.

A substrate fixing part in which a substrate for manufacturing a semiconductor package is mounted and fixed by going through a molding process; And

And a mold unit coupled to the substrate fixing part such that a substrate fixed to the substrate fixing part is interposed therebetween, and a resin part is provided from the outside at a position where the substrate is interposed to mold the substrate.

The substrate fixing part

Base body;

A seating part installed on an upper portion of the base body, on which the substrate is mounted;

An elastic part provided between the base body and the seating part and providing elasticity to the seating part so that the seating part is positioned above the reference position at which the molding process is started by the mold part; And

Inserted into the vacuum hole and opening the vacuum hole when the seating portion is located above the reference position so that the vacuum pressure is applied; and when the seating portion is pressed by the mold part and positioned at the reference position Molding apparatus for manufacturing a semiconductor package, characterized in that it comprises an insert for blocking the vacuum hole to prevent the resin material from flowing into the vacuum hole.