KR100949256B1 - 웨이퍼 고정용 척 - Google Patents
웨이퍼 고정용 척 Download PDFInfo
- Publication number
- KR100949256B1 KR100949256B1 KR1020090130806A KR20090130806A KR100949256B1 KR 100949256 B1 KR100949256 B1 KR 100949256B1 KR 1020090130806 A KR1020090130806 A KR 1020090130806A KR 20090130806 A KR20090130806 A KR 20090130806A KR 100949256 B1 KR100949256 B1 KR 100949256B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- magnet
- rotary link
- fixing
- chuck
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
- 원판 형상으로 형성되고, 상면 둘레에는 복수개의 안내장공(101)이 형성된 몸체(100)와,상기 몸체(100)의 저면 중앙에 회전 가능하게 설치된 회전판(110)과,상기 회전판(110)을 선택적으로 회전시키는 회전축(120)과,상기 회전판(110)의 외측 둘레면에 설치된 복수개의 제1자석(111)과,상기 몸체(100)의 저면 둘레에 힌지(140)를 중심으로 설치된 복수개의 회전링크(130)와,상기 제1자석(111)과 근접되는 면에는 서로 다른 극성이 유지되게 회전링크(130)의 일측 단부에 설치된 제2자석(131)과,상기 회전링크(130)의 타측 단부에 설치되고 상단은 몸체(100)의 표면으로 돌출되도록 안내장공(101)에 이동 가능하게 끼워진 고정핀(150)과,상기 회전링크(130)를 초기상태로 복귀시키는 복귀수단으로 구성됨을 특징으로 하는 웨이퍼 고정용 척.
- 청구항 1에 있어서, 상기 몸체(100)의 저면에는 고정볼트(170)를 매개로 고정되어 회전링크(130)의 회전량을 제어하도록 회전링크(130)에 선택적으로 접촉되는 스토퍼(160)를 더 포함함을 특징으로 하는 웨이퍼 고정용 척.
- 청구항 1에 있어서, 상기 고정핀(150)의 상단에는 웨이퍼의 유동을 방지하도록 안착홈(151)이 형성됨을 특징으로 하는 웨이퍼 고정용 척.
- 청구항 1에 있어서, 상기 복귀수단은 스프링(180)으로 이루어짐을 특징으로 하는 웨이퍼 고정용 척.
- 청구항 1에 있어서, 상기 복귀수단은 제1자석(111)과 서로 반대방향으로 극성이 유지되게 회전판(110)에 설치된 제3자석(112)으로 이루어짐을 특징으로 하는 웨이퍼 고정용 척.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090130806A KR100949256B1 (ko) | 2009-12-24 | 2009-12-24 | 웨이퍼 고정용 척 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090130806A KR100949256B1 (ko) | 2009-12-24 | 2009-12-24 | 웨이퍼 고정용 척 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100949256B1 true KR100949256B1 (ko) | 2010-03-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090130806A KR100949256B1 (ko) | 2009-12-24 | 2009-12-24 | 웨이퍼 고정용 척 |
Country Status (1)
Country | Link |
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KR (1) | KR100949256B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011138706A2 (en) * | 2010-05-07 | 2011-11-10 | Lam Research Ag | Device for holding wafer shaped articles |
CN112676705A (zh) * | 2020-12-09 | 2021-04-20 | 陶金 | 一种硅晶片蚀刻方法 |
KR20220086256A (ko) * | 2020-12-16 | 2022-06-23 | 주식회사 에이치에스하이테크 | 스핀 척 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100359338B1 (ko) | 2000-01-31 | 2002-10-31 | (주)케이.씨.텍 | 웨이퍼 고정 척 |
KR100873153B1 (ko) | 2007-10-05 | 2008-12-10 | 세메스 주식회사 | 스핀 헤드 |
JP2009123800A (ja) | 2007-11-13 | 2009-06-04 | Sokudo:Kk | 基板処理装置 |
-
2009
- 2009-12-24 KR KR1020090130806A patent/KR100949256B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100359338B1 (ko) | 2000-01-31 | 2002-10-31 | (주)케이.씨.텍 | 웨이퍼 고정 척 |
KR100873153B1 (ko) | 2007-10-05 | 2008-12-10 | 세메스 주식회사 | 스핀 헤드 |
JP2009123800A (ja) | 2007-11-13 | 2009-06-04 | Sokudo:Kk | 基板処理装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011138706A2 (en) * | 2010-05-07 | 2011-11-10 | Lam Research Ag | Device for holding wafer shaped articles |
WO2011138706A3 (en) * | 2010-05-07 | 2012-04-12 | Lam Research Ag | Device for holding wafer shaped articles |
US9130002B2 (en) | 2010-05-07 | 2015-09-08 | Lam Research Ag | Device for holding wafer shaped articles |
CN112676705A (zh) * | 2020-12-09 | 2021-04-20 | 陶金 | 一种硅晶片蚀刻方法 |
KR20220086256A (ko) * | 2020-12-16 | 2022-06-23 | 주식회사 에이치에스하이테크 | 스핀 척 |
KR102481431B1 (ko) * | 2020-12-16 | 2022-12-26 | 주식회사 에이치에스하이테크 | 스핀 척 |
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