KR100925362B1 - Film forming device, film forming method, and method of producing organic el element - Google Patents

Abstract

The film forming apparatus is a film forming apparatus including a film supplying device and a substrate on which a film of film forming material is formed. ) And a magnet 22 provided on the back side of the substrate, and a movement limiting means 24 for limiting the movement of the magnet 22 to within a predetermined range. It is a structure provided.

Description

Film-forming apparatus, film-forming method, and manufacturing method of organic EL element {FILM FORMING DEVICE, FILM FORMING METHOD, AND METHOD OF PRODUCING ORGANIC EL ELEMENT}

The present invention relates to a film forming apparatus, a film forming method and a method for producing an organic EL element.

A film forming apparatus for forming a predetermined pattern on a substrate includes a configuration including a chuck holding the substrate in a planar shape, a mask in which a predetermined opening pattern is formed and made of a magnetic material, and a magnet for fixing the mask on the substrate. Have And when forming into a film, a board | substrate is attached and hold | maintained on the surface of a chuck, and a mask is put on the board | substrate. The mask is fixed on the substrate by the magnetic force of the magnet provided on the rear surface of the chuck.

In Patent Document 1 disclosed in the thin film forming apparatus, when the mask is fixed on the substrate, the permanent magnet is kept away from the substrate, and after the mask is covered on the substrate, the permanent magnet is approached to the substrate to prevent displacement of the mask. It is described to prevent the occurrence of a patterning failure.

<Patent Document 1: Japanese Patent Application Laid-Open No. 2004-79349>

(Tasks to be solved by the invention)

As the mask, a configuration in which the periphery of the mask film is fixed with a mask frame is generally used. The mask film has a thin metal film state made of a magnetic material having a predetermined opening pattern formed thereon. In addition, a mask frame is a structure of a hard frame shape which hold | maintains the periphery of a mask film. When the mask is separated from the substrate after the film is formed, there is a problem that the mask film is pulled toward the substrate by the magnetic force of the magnet and bent. That is, when mounting and detaching are performed many times in such a manner that the mask is forcibly removed from the substrate against the magnetic force of the magnet, the mask film is stretched and the opening pattern is also distorted and deformed in the same manner. If the opening pattern is deformed, there is a problem that an accurate film formation pattern cannot be obtained on the substrate.

In addition, even when the mask is separated from the substrate, even if the magnet is separated from the substrate to weaken the influence of the magnetic force acting on the mask, there is a problem that the movement takes time if the magnet can be moved indefinitely. In particular, when manufacturing an organic EL (Electroluminescence) device, since a shortening of the manufacturing time is required to improve the yield, there is a problem that the manufacturing time becomes longer by allowing the magnet to be moved indefinitely.

An object of this invention is to provide the film-forming apparatus, the film-forming method, and the manufacturing method of an organic EL element which aim at shortening of a manufacturing time. Secondly, an object of the present invention is to provide a film forming apparatus, a film forming method, and a method for producing an organic EL element which can prevent the mask from being deformed.

(Means to solve problems)

In order to achieve the above object, the film forming apparatus according to the present invention is a film forming apparatus in which a mask is bonded to a substrate to form a thin film according to a mask pattern, the mask is formed of a magnetic material, and the mask is bonded to the substrate. The magnet is characterized in that the stroke is regulated by movement limiting means disposed within the limit position of the adsorption action on the mask.

In addition, the magnet is provided in an area range corresponding to the plane size of the mask, characterized in that the magnetic force acting on the center portion of the mask is weaker than the magnetic force acting on the peripheral portion of the mask.

The magnet is provided with a plurality of magnets on the magnet mounting plate. In this case, what is necessary is just to arrange | position a some magnet at plane lattice point position on a plane.

In addition, the movement limiting means is provided in the chuck on which the substrate is mounted so as to restrict the stroke of the magnet approaching and spaced from the chuck. In this case, the chuck and the mask can be configured to be rotatable in the horizontal direction. The movement limiting means can be configured with a simpler structure if it is constituted by the locking screw.

Moreover, the film-forming method which concerns on this invention arrange | positions a mask and a magnet in the position which clamps a board | substrate, fixes the mask which covered the board | substrate with the magnetic force of a magnet, and forms the shape according to the opening pattern provided in the mask on the surface of a board | substrate. As a film forming method, a magnet can be approached and spaced apart from the backside of the chucked substrate, and the magnet is placed within a range where the maximum position is a position at which the adsorption force by the magnetic force is limited to the mask on the surface side of the substrate. The film is formed by restricting the stroke and repeating the substrate replacement by removing the mask from the substrate when the stroke is moved within the regulated range while the magnet is at the maximum distance from the magnet. In this case, the mask is bonded to the substrate surface in advance before the substrate is chucked. After chucking in this bonded state, the mask may be moved so as to approach the magnet, so that the mask is attracted to the substrate surface.

Moreover, as a film-forming method which arrange | positions a mask and a magnet in the position which clamps a board | substrate, and forms the shape according to the opening pattern provided in the mask on the surface of a board | substrate, after performing alignment of a board | substrate and a mask, a process of covering a mask on a board | substrate and; Accessing the magnet disposed at a position away from the substrate to the substrate, and fixing the mask by the magnetic force of the magnet; Forming a film on the surface of the substrate; Moving the magnet in a direction away from the substrate; And moving the mask in a direction away from the substrate.

Moreover, the manufacturing method of the organic electroluminescent element which concerns on this invention arrange | positions a mask and a magnet in the position which clamps a board | substrate, fixes the mask which covered the board | substrate by the magnetic force of a magnet, A method of manufacturing an organic EL element for forming a pixel pattern on a surface of a substrate, the method comprising: moving a magnet in a direction away from the substrate while restricting a moving distance of the magnet by a locking screw; And moving the mask in a direction away from the substrate.

(Effects of the Invention)

According to this, if the magnet is moved in the direction in which the magnet is separated from the substrate before the mask is moved in the direction of separating from the substrate, the magnetic force of the magnet does not affect the mask, and when the mask moves, the magnet is stretched for a long time. You can prevent it. Therefore, since deformation of the mask can be prevented, it is possible to form an accurate film formation pattern on the substrate without deforming the opening pattern provided in the mask even if the mask is attached and detached many times.

In addition, the movement limiting means regulates the movement distance of the magnet (magnet mounting plate) as the maximum stroke position for exerting the attraction force by the magnetic force to the mask bonded to the chucked substrate. According to this, the mask can be removed and the substrate can be replaced while the magnet is moved within the minimum stroke range, whereby the tact time can be made very short. Therefore, manufacturing time can be shortened.

In addition, since the magnet is formed in an area range corresponding to the planar size of the mask, the magnet's magnetic force can be applied to the entire surface of the mask. Since the magnetic force of the magnet acting on the center of the mask is weaker than the magnetic force acting on the periphery of the mask, when the substrate and the mask require a certain gap, such as when performing alignment, the magnetic force is applied to the peripheral portion having strong film rigidity. And by uniformly acting on the weak central part of the film stiffness, a constant gap can be made between the substrate and the mask. Moreover, even when the thickness of a film, the thickness of a chuck, and the thickness of a board | substrate differ, it becomes possible to respond by adjusting a magnetic force with respect to a peripheral part or a center part. Moreover, by providing a plurality of magnets on the magnet mounting plate, the magnetic force of the magnet acting on the center portion of the mask can be made weaker than the magnetic force acting on the peripheral portion of the mask.

In addition, when the chuck is rotatable, the glass substrate mounted and held on the chuck also rotates in the horizontal plane. And together with these, a magnet mounting plate, a magnet, a mask, etc. also rotate. Accordingly, by rotating the chuck or the like during film formation, a film having a uniform thickness in the substrate surface can be obtained.

In addition, even when the mask is covered with the substrate, if the magnet is moved away from the substrate, the magnetic force of the magnet does not affect the mask, so that the position of the mask and the substrate does not shift.

In addition, in the manufacturing method of an organic EL element, since the moving distance of a magnet is regulated, manufacturing time can be shortened and a mask is moved by moving a magnet away from a board | substrate before moving a mask away from a board | substrate. It is possible to weaken the magnetic force of the magnet acting on, thereby preventing deformation of the mask.

1 is an explanatory view of a device upper mechanism.

2 is an explanatory diagram of a vacuum deposition apparatus.

3 is a bottom view schematically showing a magnet mounting plate on which magnets are arranged.

4 is an explanatory view of the movement limiting means.

It is explanatory drawing for the position alignment of a glass substrate and a mask.

It is explanatory drawing when a mask is covered on a glass substrate.

<Code description>

10: vacuum deposition apparatus, 18: chuck, 20: magnet mounting plate, 22: magnet, 24: movement limiting means, 32: glass substrate, 34: stretching means, 36: mask

EMBODIMENT OF THE INVENTION Below, the preferable Example regarding the film-forming apparatus, the film-forming method, and the manufacturing method of organic electroluminescent element which concerns on this invention is demonstrated. In the present embodiment, a vacuum vapor deposition apparatus is used as the film deposition apparatus, and a mode for producing an organic EL element by the vacuum vapor deposition apparatus will be described.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing of the upper mechanism of the vacuum vapor deposition apparatus which concerns on an Example. 2 is an explanatory diagram of a vacuum deposition apparatus. The vacuum evaporation apparatus 10 has a structure which is roughly demonstrated, and is equipped with the evaporation apparatus (source) 14 of the organic material 12 in the bottom part, and the apparatus upper mechanism 16 in the upper part. The apparatus upper mechanism 16 includes a chuck 18, a magnet mounting plate 20 having a magnet 22, a movement limiting means 24, a substrate clamp 26, and a mask clamp 28. to be.

The evaporation apparatus 14 of the organic material 12 is equipped with the crucible 14a which can accommodate the organic material 12, and heats and evaporates (sublimes) the organic material 12 in the outer surface of the crucible 14a. Heater 14b) is provided. Moreover, the chuck | zipper 18 provided in the upper part of the vacuum vapor deposition apparatus 10 is provided facing the crucible 14a, and is a flat plate arrange | positioned along the horizontal direction. According to this, the chuck | zipper 18 can hold | maintain the glass substrate 32 in planar shape in the position which opposes the crucible 14a. The chuck 18 is rotatable horizontally by a rotating mechanism (not shown) provided on the outer upper part of the apparatus main body 30.

The magnet mounting plate 20 is a flat plate and is provided to be movable in a direction approaching and spaced apart from the upper surface of the chuck 18, that is, the rear surface of the glass substrate 32. The magnet mounting plate 20 is suspended by a support shaft 20a that penetrates the ceiling plate portion of the apparatus main body 30. The horizontal support part 20b is connected to the upper end of this support shaft 20a. Stretching means 34 is provided between the horizontal support portion 20b and the ceiling plate portion of the apparatus main body 30, and the magnet mounting plate 20 is elevated (moving up and down) by the stretching operation of the stretching means. It is possible. And the expansion means 34 should just be able to expand | contract up and down, For example, what is necessary is just to comprise with actuators, such as an air cylinder.

On the lower surface of this magnet mounting plate 20, disk-shaped magnets 22 are arranged in a plane. 3 is a bottom view schematically showing a magnet mounting plate on which magnets are arranged. This magnet 22 is arrange | positioned in the form of a dot at the grid | lattice point position in the plate surface of the magnet mounting plate 20, and is attached in the range which can adsorb | suck the whole plane of the mask 36. As shown in FIG. And the center part of the mask 36 is set by considering the magnitude | size of the magnet 22, the magnitude | size of a magnetic force, the arrangement position of the magnet 22, the thickness of the glass substrate 32, the thickness and material of the chuck 18, etc. The magnetic force acting on is weakened compared to the magnetic force acting on the peripheral portion of the mask 36. As a specific example, a plurality of magnets 22 are arranged in a plane at the lattice point position of the lower surface of the magnet mounting plate 20, and a magnet 22 having strong magnetic force is provided at the periphery of the magnet mounting plate 20. At the same time, the magnet 22 with weak magnetic force is arranged in the center portion. And the magnet 22 can contact the upper surface of the chuck 18 by the vertical movement of the magnet mounting plate 20.

In addition, on the upper surface of the chuck 18, movement limiting means 24 for limiting the upward movement of the magnet mounting plate 20 within a predetermined range is formed. This movement limiting means 24 may be constituted by, for example, a locking screw. 4 is an explanatory view of the movement limiting means. The movement limiting means 24 is provided with an extension part 24a extending upward from an upper surface of the chuck 18 and a magnet mounting plate 20 provided at an upper end of the extension part 24a to attach a step in the horizontal direction. It is comprised by the limiting part 24b which performs the stopper function of a. In addition, in the magnet mounting plate 20, the extension part 24a of the movement limiting means 24 can be inserted, and the hole part 20c smaller than the plane size of the restriction part 24b is formed. According to this, the magnet mounting plate 20 cannot be moved above the limiting portion 24b by the limiting portion 24b larger than the hole portion 20c. The height of the limiting portion 24b, that is, the movement limiting range of the magnet mounting plate 20 takes into account the magnetic force of the magnet 22 acting on the mask 36, the travel time of the magnet mounting plate 20, and the like. You can set it appropriately. For example, at a position where the lift of the magnet mounting plate 20 is limited by the limiting portion 24b, the magnet adsorption action by the magnet 22 may be set to be the minimum distance that does not reach the mask 36, What is necessary is just a range to which adsorption force becomes weak within the range.

The substrate clamp 26 extends downward from the top of the apparatus main body 30 and has a hook shape in which the tip portion 26a is bent toward the side where the chuck 18 is located (center side of the apparatus main body 30). A plurality of chucks 18 are provided along the side circumference of the chuck 18. This board | substrate clamp 26 is set so that each front-end | tip part 26a may become the same height (in the same surface), in order to support the circumference | surrounding part of the glass substrate 32 with the front-end | tip part 26a (bending part). In addition, the board | substrate clamp 26 is movable up and down, maintaining the state which each front-end | tip part 26a is in the same surface by the elevating mechanism (not shown) provided in the outer upper part of the apparatus main body 30. As shown in FIG. And as the board | substrate clamp 26 raises, it is possible to make the back surface of the glass substrate 32 contact the chuck | zipper 18, and to mount and hold | maintain in planar form.

The mask clamp 28 extends downward from the top of the apparatus main body 30 and has a hook shape in which the tip portion 28a is bent toward the side where the chuck 18 is located (center side of the apparatus main body 30). A plurality is provided along the lateral circumference of the chuck 18 or the substrate clamp 26. This mask clamp 28 is set so that each front-end | tip part 28a may become the same height (in the same surface), in order to support the circumference | surrounding part of the mask 36 with the tip part 28a (bending part). In addition, the mask clamp 28 is movable up and down by maintaining the state where each tip part 28a is in the same surface by the elevating mechanism (not shown) provided in the outer upper part of the apparatus main body 30. As shown in FIG. According to this, the mask 36 can be moved in the direction approaching and spaced apart from the surface of the glass substrate 32. The mask 36 includes a mask film 36a provided with a plurality of opening patterns corresponding to each pixel of the organic EL element, and a mask frame 36b having a frame shape that holds the periphery of the mask film 36a. Doing.

The substrate clamp 26 and the mask clamp 28 are rotated together with the chuck 18, the magnet mounting plate 20, and the like by a rotation mechanism (not shown) provided on the outer upper portion of the vacuum deposition apparatus 10. It is supposed to be.

Next, the manufacturing method (film formation method) of an organic EL element is demonstrated. First, the glass substrate 32 is put inside the apparatus main body 30 by a board | substrate conveyance mechanism, and is inserted between the chuck 18 and the mask 36. And the glass substrate 32 moves downward with the descending operation | movement of a board | substrate conveyance mechanism, and is mounted on the board | substrate clamp 26. As shown in FIG. Thereafter, the mask 36 is moved upward by raising the mask clamp 28 to bring the mask 36 and the glass substrate 32 into the bonded state.

Then, the mask clamp 28 is continuously raised until the glass substrate 32 contacts the bottom surface (chuck surface) of the chuck 18. And when the glass substrate 32 is mounted on the mask 36, it will become horizontal along the mask 36, and will contact the chuck 18, maintaining this horizontal state.

The substrate clamp 26 is then raised until it comes in contact with the glass substrate 32. As a result, the glass substrate 32 is attached to and held by the chuck 18 while maintaining the horizontal state by the substrate clamp 26. Then, the mask clamp 28 is lowered to move the mask 36 downward.

Thereafter, alignment of the glass substrate 32 and the mask 36 is performed using the alignment mark formed on the glass substrate 32 and the alignment mark formed on the mask 36. It is explanatory drawing which shows alignment of a glass substrate and a mask. 5 (A) is a figure explaining arrangement | positioning of a camera, a glass substrate, and a mask. 5B is an image captured by a camera, showing a case where a position shift occurs. 5C is a diagram showing a case where the position is correct as an image captured by a camera.

Specifically, the alignment mark 40 is formed in the glass substrate 32 in at least two position. The alignment mark 40 formed in the glass substrate 32 is formed in the diagonal part which the diagonal of the glass substrate 32, for example, and the electrode film of an organic electroluminescent element is made to the glass substrate 32, for example. At the same time as the forming, it may be formed of the same material as this electrode. And the shape of the alignment mark 40 formed in the glass substrate 32 should just be a circle | round | yen, a dot, a cross, etc., for example.

Moreover, what is necessary is just to form the alignment mark 42 formed in the mask 36 in the position corresponding to the alignment mark 40 formed in the glass substrate 32, and the shape should just be a dot, a circle, a cross shape, etc. And when the alignment mark 40 of the glass substrate 32 was made into a circle, the alignment mark 42 of the mask 36 should be made into a dot, and the alignment mark 40 of the glass substrate 32 was made into a point. In this case, the alignment mark 42 of the mask 36 may be circled.

In addition, the vacuum vapor deposition apparatus 10 may be provided with the camera 44 which image | photographs the alignment mark 40 formed in the glass substrate 32, and the alignment mark 42 formed in the mask 36 (FIG. 5 ( See A). And while confirming the image image | photographed with the camera 44, X (vertical) of the mask 36 so that the point of the alignment mark 42 (or 40) may enter in the circle of the alignment mark 40 (or 42), When the Y (horizontal) and θ (rotation) directions are adjusted, the alignment of the glass substrate 32 and the mask 36 ends (see FIGS. 5B and 5C).

Thereafter, the mask 36 and the magnet mounting plate 20 are moved. 6 is an explanatory diagram when the mask 36 is bonded to the glass substrate 32. When the alignment of the mask 36 and the glass substrate 32 is finished, the mask clamp 28 is moved upward until the mask 36 contacts the glass substrate 32. As a result, the mask 36 is covered with the glass substrate 32. Next, by reducing the expansion and contraction means 34, the magnet mounting plate 20 is moved downward to bring the magnet 22 into contact with the upper surface of the chuck 18. As a result, the magnetic force of the magnet 22 acts on the mask 36 to fix and hold the mask 36.

After the mask 36 is mounted, the glass substrate 32, the mask 36, and the like are rotated, and the organic material 12 is heated and evaporated by the heater 14b to form the glass substrate 32. A predetermined pattern is formed. Thereby, an organic EL element is manufactured.

Next, the process after completion | finish of vapor deposition is demonstrated. 6, the mask 36 contacts the lower surface of the chuck 18 via the glass substrate 32, and the magnet mounting plate 20 (magnet 22) is attached to the chuck (see Fig. 6). It is in contact with the upper surface of 18). In the attaching and detaching process of the mask 36, the magnet mounting plate 20 is first moved upward. The mask clamp 28 is then lowered to move the mask 36 downward. Then, the substrate clamp 26 is lowered and the glass substrate 32 is moved downward. Subsequently, the substrate transfer mechanism enters the inside of the apparatus main body 30 to recover the glass substrate 32.

In such a vacuum evaporation apparatus 10 and the manufacturing method (film-forming method) of an organic electroluminescent element, the magnet mounting plate 20 (magnet 22) is formed by providing the expansion and contraction means 34 on the outer upper part of the apparatus main body 30. ] Can be moved in the direction of approaching and spaced apart from the upper surface of the chuck 18, so that the magnet 22 is lowered during deposition, and the magnet 36 is fixedly held by magnetic force, and the magnet 22 ) May be raised so that the influence of the magnetic force does not reach the mask 36. That is, the mask 36 can be attached and detached so that the mask film 36a is not loaded, and the mask film 36a does not stretch even if it mounts and detaches several times. Therefore, since the opening pattern of the mask 36 is not deformed, it is possible to form an accurate organic EL element pattern on the glass substrate 32.

In addition, by providing the movement limiting means 24 of the magnet mounting plate 20 on the upper surface of the chuck 18, the movement distance of the magnet mounting plate 20 can be limited to a predetermined range. That is, the lower limit of the movement distance is a position where the magnet 22 and the chuck 18 contact each other, and the upper limit of the movement distance is a position where the magnetic force of the magnet 22 does not affect the mask 36. Therefore, since the moving distance of the magnet mounting plate 20 can be suppressed to a minimum, the manufacturing time can be shortened and the yield of the organic EL element can be improved.

In addition, since the height of the limiting portion 24b of the movement limiting means 24 can be arbitrarily set, the movement distance of the magnet mounting plate 20 can be adjusted, and the magnetic force acting on the mask 36 can be freely adjusted. .

In addition, since the glass substrate 32 is once mounted in the mask 36 under the glass substrate 32 before being installed in the chuck surface, it is clamped to the chuck surface for every mask 36 in that state, It is possible to prevent the bending when the clamp 26 acts. That is, even when the thin glass substrate 32 is used, since the glass substrate 32 is attached to the chuck 18 while maintaining the horizontal state, the center portion of the glass substrate 32 is moved downward by weight or gravity. The warpage can be prevented.

And, in the above-described embodiment, the magnet 22, as shown in Figure 3, the size and arrangement pattern of the magnet 22 in the center portion of the magnet mounting plate 20, and the magnet 22 in the peripheral portion The magnetic force acting on the center portion of the mask 36 is made weaker than the peripheral circumference portion by changing the size and the arrangement pattern of the diaphragm. However, the present invention is not limited to this embodiment. That is, for example, by making all the sizes of the magnets 22 the same and changing the arrangement pattern of the magnets 22, the magnetic force acting on the center portion of the mask 36 can be made weaker than the peripheral portion. Moreover, by making the arrangement pattern of the magnet 22 the same, and changing the magnitude | size of the magnet 22, the magnetic force acting on the center part of the mask 36 can be made weak compared with the circumference | surroundings part.

In addition, in the above-mentioned embodiment, the alignment marks 40 and 42 used for the alignment of the mask 36 and the glass substrate 32 were demonstrated as a dot or a circle, as shown in FIG. It is not limited. In other words, the alignment marks 40 and 42 may be composed of circles or crosses.

In addition, in the above-mentioned embodiment, although the camera 44 used for the alignment of the mask 36 and the glass substrate 32 is a form using two, as shown in FIG. 5, it is not limited to this form. . That is, three or more cameras 44 may be provided. In this case, the alignment marks 40 and 42 may be made in each part of the glass substrate 32 and the mask 36.

Moreover, although the form which used the vacuum vapor deposition apparatus 10 was demonstrated as a film-forming apparatus in the above-mentioned embodiment, it is not limited to this form, It may be other film-forming apparatuses, such as a sputter apparatus and a vapor phase growth apparatus. In addition, the board | substrate is not limited to the glass substrate 32, The board | substrate which consists of materials other than glass may be sufficient.

It can be used for pattern formation techniques, such as an organic EL substrate.

Claims (9)

A film forming apparatus in which a mask is bonded to a substrate to form a thin film according to a mask pattern, The mask is formed of a magnetic material, A magnet for bonding the mask to the substrate, The magnet is restricted in stroke by movement limiting means disposed within a limit position of the adsorption action on the mask, And the movement limiting means is height adjustable. The method of claim 1, The said magnet is a film-forming apparatus in which the magnetic force which acts on the center part of the said mask becomes weak compared with the magnetic force which acts on the circumferential part of the said mask. The method according to claim 1 or 2, The magnet is made of a plurality of magnets, the plurality of magnets arranged in a plane at a lattice point position on a plane, the film deposition apparatus. The method of claim 1, The film forming apparatus, wherein the movement limiting means is provided in the chuck on which the substrate is mounted, and is capable of regulating the stroke of the magnet approaching and spaced from the chuck. The method of claim 1, The film forming apparatus, wherein the movement limiting means is a locking screw. A film forming method of disposing a mask and a magnet at a position sandwiching a substrate, fixing the mask covered on the substrate with a magnetic force of the magnet, and forming a shape according to an opening pattern formed in the mask on the surface of the substrate, Determining the stroke movement limit position of the magnet according to the magnitude of the magnetic force of the magnet, which is mounted in advance, In addition to allowing the magnet to be approached and spaced apart from the backside of the chucked substrate, the magnet is attracted by the magnetic force within the range of the maximum spaced position, which is a limit on the mask on the surface of the substrate. Regulating the stroke of the magnet, When the magnet is at the maximum spaced position while the magnet is moved within the restricted range, the film forming process is performed by separating the mask from the substrate and repeating the substrate exchange. Deposition method comprising a. The method of claim 6, And the mask is bonded to the substrate surface in advance prior to chucking of the substrate, and after the chucking is performed in such a bonded state, the magnet is moved in the approaching direction to adsorb the mask to the substrate surface. A film forming method in which a mask and a magnet are disposed at a position at which a substrate is sandwiched, and a shape corresponding to an opening pattern formed in the mask is formed on a surface of the substrate. Determining the stroke movement limit position of the magnet according to the magnitude of the magnetic force of the magnet, which is mounted in advance, Placing the mask on the substrate after aligning the substrate with the mask; Accessing the magnet disposed at a position spaced apart from the substrate to the substrate to fix the mask by the magnetic force of the magnet; Forming a film on the surface of the substrate; Moving the magnet in a direction away from the substrate; And Moving the mask away from the substrate Deposition method comprising a. Placing a mask and a magnet at a position where the substrate is sandwiched, fixing the mask covered by the substrate with the magnetic force of the magnet, and forming a pixel pattern of an organic EL element according to the opening pattern formed in the mask on the surface of the substrate; As a manufacturing method of an organic EL element, Determining the stroke movement limit position of the magnet according to the magnitude of the magnetic force of the magnet, which is mounted in advance, Moving the magnet in a direction away from the substrate while restricting a moving distance of the magnet by a locking screw; And Moving the mask away from the substrate Method for producing an organic EL device comprising a.

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