JP7420496B2 - Mask holding mechanisms, vapor deposition equipment, and electronic device manufacturing equipment - Google Patents

Description

The present invention relates to a mask holding mechanism that holds a mask using magnetic force in an apparatus for manufacturing electronic devices such as organic EL panels.

Conventionally, a vapor deposition apparatus has been used to form a film by vapor-depositing a vapor deposition material onto a film-forming object such as a glass substrate. For example, an organic layer vapor deposition apparatus is known that vapor-deposit an organic layer during the production of an organic EL panel. . The organic layer is a thin film with a thickness of several tens of micrometers to several micrometers, and a film formation mask provided with one or more openings is used to form the film. The vapor deposition material passes through the opening of the film-forming mask and is deposited on the object to be film-formed, thereby forming an organic layer in a desired pattern shape at a desired position.
In organic layer deposition apparatuses, in order to prevent contamination from adhering to the surface to be film-formed, such as a glass substrate, it is often adopted to orient the surface to be film-formed downward in the direction of gravity. The glass substrate is held horizontally with the film-forming surface facing downward, and the mask is held horizontally facing it. In panel layouts such as large display panels that combine several types of patterns with large openings, the mask foil has a shape that is a combination of lines rather than a simple matrix shape. The glass substrate and the mask have alignment marks for positioning at opposing positions, and are superimposed through an alignment process until the required positioning accuracy is achieved. The stacked masks are attracted to the glass substrate by applying magnetic attraction force to the mask foil through the glass substrate.

To deposit a thin layer such as an organic layer, a thin mask foil is used to avoid shadows from the mask during deposition, but it is essential that the mask foil adhere to the object to be deposited without any gaps. . In some cases, the gap between the mask foil and the glass substrate is required to be within several μm to prevent crosstalk from occurring due to short circuits or leakage currents between elements or wiring patterns.
Therefore, as a prior art, the organic EL display manufacturing apparatus described in Patent Document 1 has a permanent magnet arranged on the opposite side of the film-forming surface of the substrate, and the permanent magnet is arranged to attract the mask foil on the film-forming surface. Are listed. In Patent Document 1, a plurality of N poles and a plurality of S poles are periodically arranged in the longitudinal direction of a mask foil. Further, it is described that a predetermined interval is provided between the plurality of permanent magnets.

Japanese Patent Application Publication No. 2017-119905

However, when permanent magnets are periodically arranged with a plurality of N poles and a plurality of S poles in the longitudinal direction of the mask foil as described in Patent Document 1, magnetic interference occurs at the intersections of the mask foil. Therefore, the adsorption force may become larger or smaller than expected, and the adsorption force of the mask foil may become uneven. Further, if a space is provided between the plurality of permanent magnets, magnetic interference can be avoided, but the attraction force will be lower than in other places. Such unevenness in adsorption force can be a cause of a gap between the substrate and the mask foil.

An object of the present invention is to provide a technique that can bring a film-forming object and a mask into close contact with each other by forming a uniform attraction force distribution over the entire contact area.

In order to achieve the above object, the mask holding mechanism of the present invention includes:
A mask holding mechanism that uses magnetic force to attract and hold a mask for forming a desired film formation pattern on the surface of the film formation object, the mask holding mechanism comprising:
The mask is disposed on the opposite side of the film-forming object from the mask, and has a lattice shape corresponding to a shielding portion of the mask for shielding a film-forming region of the film-forming object in the film-forming pattern. York and
A plurality of first permanent magnets attached to the mask side of the yoke, of the first linear portions and second linear portions that intersect with each other in the lattice shape of the yoke, the first linear portion extends a plurality of first permanent magnets arranged at intervals along the direction and arranged so that the magnetization directions of adjacent first permanent magnets are alternated;
In a mask holding mechanism comprising:
a second permanent magnet disposed at an intersection connecting the first linear portion and the second linear portion that are different in direction in the lattice shape of the yoke;
The second permanent magnet has a magnetization direction opposite to the magnetization direction of adjacent first permanent magnets among the plurality of first permanent magnets,
The second permanent magnet disposed at the intersection connecting the first straight section and the second straight section is divided into two along the first direction in which the first straight section extends at the intersection. It is characterized in that it is arranged symmetrically in the first direction with respect to the center of the width of the second straight section in the first direction.
In order to achieve the above object, the vapor deposition apparatus of the present invention includes:
a mask for forming a desired film formation pattern on a film formation target;
The mask holding mechanism of the present invention,
a deposition chamber in which a deposition material is deposited on the film-forming object to which the mask is adsorbed by the mask holding mechanism;
It is characterized by having the following.
In order to achieve the above object, the electronic device manufacturing apparatus of the present invention includes:
The method is characterized in that an electronic device is manufactured by depositing a film on the object to be deposited using the vapor deposition apparatus of the present invention.

According to the present invention, a film-forming object and a mask can be brought into close contact with each other by forming a uniform attraction force distribution over the entire contact region.

Schematic diagram showing the production line of organic EL panels Control block diagram of organic EL panel production line Schematic diagram showing a transport carrier Exploded perspective view of transport carrier Flow diagram showing the alignment process Schematic diagram showing each stage of alignment progression Schematic diagram showing the continuation of each stage of alignment progression Schematic diagram showing the continuation of each stage of alignment progression Diagram showing the arrangement of magnetic attraction magnets and the attraction force density of the mask Diagram showing the permanent magnet arrangement at the intersection of magnetic attraction magnets Diagram showing a comparison of the permanent magnet arrangement at the intersection of magnetic attraction magnets Diagram showing the relationship between permanent magnet size and uniformity of attractive force density Diagram showing the relationship between average attractive force density and permanent magnet pitch Diagram showing other examples of permanent magnet arrangement A diagram showing an embodiment of the present invention when applied to a fine metal mask.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the embodiments and examples described below are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Furthermore, in the following description, the hardware configuration, software configuration, manufacturing conditions, dimensions, materials, shape, etc. of the device are not intended to limit the scope of the present invention to only those, unless specifically stated. do not have. In addition, in principle, the same reference numerals are given to the same components, and repeated explanations will be omitted.

INDUSTRIAL APPLICABILITY The present invention is suitable for a holding mechanism for a vapor deposition mask used in a vapor deposition apparatus that forms a film on an object by vapor deposition. It can be applied to a vapor deposition apparatus that forms a film by vapor-depositing. INDUSTRIAL APPLICATION This invention is suitable for the magnetic adsorption mechanism which attracts and holds the mask to the film-forming object by magnetic force for forming a thin film, especially an inorganic thin film, in a desired film-forming pattern on the film-forming object, such as a board|substrate. .
The material of the substrate to be film-formed may be any material that transmits magnetic force, and in addition to glass, materials such as a film of a polymeric material, a metal other than a ferromagnetic material, etc. can be selected. The substrate may be, for example, a substrate in which a film of polyimide or the like is laminated on a glass substrate. In addition to organic materials, metallic materials (metals, metal oxides, etc.) may also be selected as the vapor deposition material.
The present invention can also be regarded as a method for controlling a vapor deposition apparatus, a method for vapor deposition, a film forming apparatus for forming a thin film, a method for controlling the same, and a method for forming a film. The present invention can also be regarded as an electronic device manufacturing apparatus and an electronic device manufacturing method using an organic EL panel such as an organic EL display. The present invention can also be understood as a program that causes a computer to execute a control method, and a storage medium that stores the program. A storage medium may be a non-transitory computer readable storage medium.
The electronic device in the present invention includes a display device (for example, an organic EL display device) equipped with a light emitting element, a lighting device (for example, an organic EL lighting device), a sensor (for example, an organic CMOS image sensor) equipped with a photoelectric conversion element, and the like. It will be done.

[Example 1]
(Entire production line configuration)
FIG. 1 is a conceptual diagram showing the overall configuration of an organic EL panel manufacturing line 100. Generally speaking, the production line 100 is a circulation type transport path including a vapor deposition process transport path 100a, a return transport path 100b, a mask delivery mechanism 100c, a carrier shifter 100d, a mask delivery mechanism 100e, a pre-alignment chamber 100g, and a carrier shifter 100f. Configure. Each of the components constituting the circulation conveyance path, such as a substrate loading chamber 101, an inversion chamber 102, an alignment chamber 103, an acceleration chamber 104, a deposition chamber 105, a deceleration chamber 106, a mask separation chamber 107, an inversion chamber 108, and a glass substrate discharge chamber 109, etc., a transport module 301 for configuring a transport path is arranged. Although details will be described later, this figure shows how the glass substrate G, mask M, and electrostatic chuck 308 (symbol C) are transported on the transport path in each step of the manufacturing process.

In the vapor deposition process transport path 100a, a glass substrate G is generally carried in from the outside in the transport direction (arrow A), the glass substrate G and the mask M are positioned and held on the transport carrier, and are moved along the transport path together with the transport carrier 302. After being subjected to the vapor deposition process while moving, the glass substrate G on which the film has been formed is discharged. In the return transport path 100b, the mask M separated after the completion of the vapor deposition process and the transport carrier 302 after the glass substrate has been discharged return to the substrate loading chamber side.

In the mask delivery mechanism 100c, the mask M separated from the transport carrier after the vapor deposition process is completed is moved to the return transport path. The mask M that has been moved to the return transport path is placed again on the transport carrier 302 which has been emptied after the substrate has been discharged. In the carrier shifter 100d, the empty transport carrier 302 from which the glass substrate G has been discharged to the next process is transferred to the return transport path 100b. In the mask delivery mechanism 100e, the mask M separated from the transport carrier transported through the return transport path 100b is transported to the mask mounting position P2 on the vapor deposition process transport path 100a. In the carrier shifter 100f, the empty transport carrier after the separation of the masks M is transported from the return transport path 100b to the glass substrate loading position P1 at the starting point of the vapor deposition process transport path 100a. Details of the manufacturing process using the manufacturing line 100 will be described later.

FIG. 2 is a conceptual diagram of control blocks of the manufacturing line 100. The control block includes an operation management control section 700 that manages operation information of the entire manufacturing line 100 and an operation controller 20. In addition, each chamber (each device) such as the substrate loading chamber 101, the reversing chamber 102, the alignment chamber 103, the acceleration chamber 104, and the evaporation chamber 105, which constitute the manufacturing line 100, has a drive control system that controls the drive mechanism inside each chamber. A section has been established. That is, the substrate loading chamber 101 has a substrate loading chamber control section 701a, the reversing chamber 102 has an inversion chamber control section 701b, the alignment chamber 103 has an alignment chamber control section 701c, the acceleration chamber 104 has an acceleration chamber control section 701d, and a deposition chamber. 105 is provided with a deposition chamber control section 701e. Each device (each room) other than the above is also provided with a control section 701N. These drive control units and the operation management control unit 700 that manages the entire system may be considered to be included in the control means. Further, the operation controller 20 may also be considered as being included in the control means.

Further, the substrate loading chamber 101 has a transfer module a (301a), the reversing chamber 102 has a transfer module b (301b), the alignment chamber 103 has a transfer module c (301c), and the acceleration chamber 104 has a transfer module d (301d). , the vapor deposition chamber 105 is provided with a transport module e (301e). Each room other than the above is also provided with a transport module 301N. A plurality of drive coils are arranged in a line in the transport module 301 disposed in each device along the transport direction of the glass substrate G and the transport carrier 302. The drive of the transport carrier 302 is controlled by controlling the current or voltage flowing through each drive coil according to the value of the encoder provided in each transport module 301. Since the magnets arranged in a line on the transport carrier 302 and the coils arranged on the transport module 301 so as to face the magnets of the transport carrier 302 work together to transport the substrate, the transport carrier 302 and the transport module 301 Together, these may be considered as a substrate transport unit 300 (transport mechanism).

Each transport module 301 is provided with an encoder that detects the position of the transport carrier 302. According to the detected value of the encoder, the operation management control section 700 sends an instruction to the drive control section of each room to start or stop control of the drive mechanism of each room or change the control state. Note that the control trigger is not limited to the encoder detection value, and any sensor that can be used for control may be used.

(Conveyance carrier configuration)
FIG. 3(A) is a front view of the substrate transport unit 300, which includes a transport module 301 as a fixed part and a transport carrier 302 as a movable part, as viewed from the transport direction indicated by arrow A in FIG. 3(B) is an enlarged view of the main part surrounded by a frame S in FIG. 3(A), FIG. 3(C) is a side view of the transport carrier 302, and FIG. 4 is an exploded perspective view of the transport carrier. A plurality of transport modules 301 are arranged throughout the entire manufacturing line 100 to form a transport path. By controlling the current supplied to the drive coil of each transport module 301, the plurality of transport modules can be controlled as one transport path, and the transport carrier 302 can be moved continuously.

In the figure, a carrier main body 302A of a transport carrier 302 is composed of a rectangular frame, and guide grooves 303a and 303b that open laterally and have a U-shaped cross section are formed on both left and right sides of the carrier body 302A in a direction parallel to the transport direction A, respectively. It is formed along. On the other hand, roller bearings (guide rollers) 304a and 304b consisting of a plurality of roller rows are rotatably attached to the inner surfaces of the side plates 3011a and 3011b on the transport module 301 side. And each guide groove 3
The conveyance carrier 302 is supported movably in the direction of arrow A (conveyance direction) with respect to the conveyance module 301 by roller bearings 304a and 304b inserted into roller bearings 03a and 303b, respectively.

Drive magnets 305a and 305b (magnet rows) in which a plurality of magnets (permanent magnets) are arranged in a predetermined pattern are arranged on the upper surface of the carrier body 302A of the transport carrier 302 at the positions where the guide grooves 303a and 303b are formed. They are linearly arranged parallel to the substrate transport direction (progressing direction). Further, on the transport module 301 side, driving coils 306a and 306b (coil array) in which a plurality of coils are arranged in a predetermined pattern are arranged at fixed parts directly facing the driving magnets 305a and 305b. The driving magnets 305a, 305b and the driving coils 306a, 306b are arranged so as to face each other and be close to each other when the transport carrier 302 is supported by the transport module 301. The electromagnetic force acting between the driving magnets 305a, 305b on the transport carrier 302 side and the driving coils 306a, 306b on the transport module 301 side causes the transport carrier 302 to levitate, or in the direction of arrow A (transport direction). It is possible to run the vehicle.

Note that the opening width 303W of the guide grooves 303a, 303b on the transport carrier side is wider by the clearance CL than the diameter 304R of each roller bearing 304a, 304b on the transport module side (303W=304R+CL). With this configuration, the roller bearings 304a and 304b can float within the predetermined clearance CL within the guide groove.

With such a configuration, moving magnet type linear motor control can be performed. That is, by controlling the current supplied to each of the plurality of coils constituting the drive coils 306a and 306b constituting the drive system, it is possible to generate a propulsive force in the traveling direction of the conveyance carrier 302, and to generate magnetic levitation for the conveyance module 301. It can generate force. Note that it is only necessary to arrange a coil on one of the transport module and the transport carrier included in the transport mechanism, and a magnet on the other, and floating alignment of the transport carrier can be performed even with a moving coil system.

Furthermore, according to the configuration of the transport module 301 and transport carrier 302 as shown in FIG. 3, it is also possible to transport the transport carrier 302 while supporting it with rollers using roller bearings 304a and 304b. That is, the transport carrier 302 can be moved in a state where the transport carrier 302 is not magnetically levitated (a state where the transport carrier 302 sinks under its own weight and the guide grooves 303a and 303b are in contact with and supported by the roller bearings 304a and 304b). .

(Holding mechanism for glass substrate G and mask M on transport carrier)
Next, a mechanism for holding the glass substrate G on the transport carrier 302 and a mechanism for holding the mask M on the glass substrate will be explained. According to this embodiment, the glass substrate G is held by an electrostatic chuck 308 as an electrostatic chuck means, and the mask M is held by a magnetic chuck 307 as a magnetic chuck means, stacked on the transport carrier 302. has been done.

3 and 4, a chuck frame 309 in which a magnetic chuck 307 and an electrostatic chuck 308 are stacked and accommodated is attached to the lower surface of the carrier body 302A of the rectangular frame-shaped transport carrier 302. The magnetic chuck 307 magnetically attracts the mask M, and the electrostatic chuck 308 attracts the glass substrate G by electrostatic force. An electrostatic chuck control unit (control box 312) containing a built-in control unit for charging the electrostatic chuck 308 is disposed on the upper surface of the rectangular frame of the carrier body 302A.
This control box 312 is equipped with a battery, and by charging the electrostatic chuck 308 with the power stored in the battery, the glass substrate G can be attracted and held. Therefore, there is no need to connect a power line for supplying power to the transport carrier except during charging, and the transport carrier is transported and film-formed in a completely non-contact state.

As shown in FIG. 3, the magnetic adsorption chuck 307 has a chuck body 307x and a chuck body 307x that moves in the Z-axis direction (upward in the figure) from the back surface of the chuck body 307x (the side opposite to the side facing the glass substrate G) to the carrier body 302 side. ). This guide rod 307a is slidably inserted into a cylindrical guide 307b provided on the frame of the carrier body 302A, and is movable up and down within the chuck frame 309.

The magnetic adsorption chuck 307 has a connecting hook 307c that is a connecting portion that is removable from a driving side hook 307g provided at a driving side connecting end of an externally provided driving source side connecting end. The connecting hook 307c engages with the driving hook 307g and drives (moves) the driving hook 307g in the vertical direction, thereby driving the chuck body 307x in the vertical direction via the guide rod 307a. The drive side hook 307g is controlled by an actuator 307h such as a drive device using a fluid pressure cylinder or a ball screw arranged outside the device. When the magnetic chuck 307 is at the lower end position, the mask M is magnetically chucked, and when it is at the upper end position, it is unchucked.

In the illustrated example, a connecting hook 307c is provided on a cap 307i fixed to the tip of the guide rod 307a, and a positioning piece 307d extending laterally is provided on the side surface of the cap 307i. On the other hand, on the carrier main body 302A side, this positioning piece 307d can selectively engage with an upper end locking piece 307f that comes into contact at the upper end position of the chuck main body 307x, and a lower end stopper 307e that locks the lower end position. There is. The upper end lock piece 307f is movable in the horizontal direction between an engagement position where it engages with the lower surface of the positioning piece 307d at the upper end position and a retracted position where it separates from the positioning piece 307d. When the upper end locking piece 307f is in the retracted position, the positioning piece 307d becomes movable downward and comes into contact with the lower end stopper 307e, thereby regulating the downward position of the chuck body 307x with respect to the carrier body 302A. This lower limit is the position where the mask M is magnetically attracted, but a slight gap is provided between the chuck body 307x and the electrostatic chuck 308. This prevents the weight of the magnetic chuck 307 from acting on the electrostatic chuck 308.

This upper end locking piece 307f is also driven by an external driving force. For example, if the pinion provided at the tip of the rotationally driven actuator 307m is rotated and engaged with the upper end lock piece 307f or a rack provided on the movable member of the linear guide 307k, the upper end lock piece 307f can be horizontally moved. be able to.

As shown in FIG. 3, the upper end lock piece 307f is slidably supported on the upper surface of a pedestal 307j provided on the carrier body 302A via a pair of linear guides 307k spaced apart by a predetermined distance. A lower end stopper 307e is provided protruding from the upper surface of the pedestal 307j between the linear guides 307k. The positioning piece 307d has a width that allows it to pass between the linear guides 307k, and when the upper end locking piece 307f moves to the retracted position, it can move downward and comes into contact with the lower end stopper 307e.

With the glass substrate G held on the electrostatic chuck 308 of the chuck frame 309, the mask M is brought close to the glass substrate G while performing alignment, and with the mask M in contact with the glass substrate G, the magnetic chuck 307 is moved toward the mask M side. Thereby, the mask M is magnetically attracted to the magnetic attraction chuck 307 with the glass substrate G and the electrostatic chuck 308 in between. As a result, the glass substrate G and the mask M are chucked by the chuck frame 309 in a mutually aligned state, and are held by the transport carrier 302 as a result.

Next, with reference to FIG. 4, the shapes of the electrostatic chuck 308 and the magnetic chuck 307 will be described. The chuck frame 309 is a rectangular member that is one size smaller than the carrier body 302A, and holds the outer periphery of the electrostatic chuck 308, and is a member of the rectangular frame 307x1 that supports the lattice-shaped support frame 307x2 of the magnetic chuck 307. It constitutes a guide wall 309a that guides the four sides.

The electrostatic chuck 308 is a plate-shaped member made of ceramic or the like, which applies a voltage to its internal electrodes and attracts the glass substrate G by the electrostatic force acting between it and the glass substrate G. It is fixed so that it cannot be moved up and down. As shown in FIG. 4, the electrostatic chuck 308 is divided into a plurality of chuck plates 308a (six in the figure), and the sides of each chuck plate 308a are fixed to each other by a plurality of ribs 309b. The rib 309b is divided into a plurality of parts so that the support frame of the magnetic chuck 307 does not interfere with the rib 309b.

The chuck body 307x of the magnetic attraction chuck 307 includes a rectangular frame 307x1, a lattice-shaped support frame 307x2 with a pattern corresponding to the shielding pattern formed on the mask M, and an attraction magnet 31 (FIG. 9) attached to the support frame 307x2. - Fig. 14). In the attraction magnet 31, S-pole and N-pole magnets are arranged alternately in a line along a grid on the support frame 307x2 via the yoke plate 30 (FIGS. 9 to 14). Details of the magnetic attraction mechanism will be described later.

In addition to the magnetic adsorption chuck 307, mask chucks 311 as mask holding means for holding the mask M are provided at multiple locations (10 locations in the embodiment) around the chuck frame 309 on the lower surface of the transport carrier 302. . This mask chuck 311 is configured to be driven by a driving force from an actuator 311m disposed outside, and no driving source is mounted on the transport carrier 302. The mask chuck 311 holds the glass substrate G on both sides by locking the mask frame MF at the periphery of the mask M.

(manufacturing process)
Next, a process of actually fixing the mask M to the glass substrate G, vacuum-depositing an organic EL light-emitting material in a vapor deposition chamber, and discharging it will be described.

As described above, FIG. 1 shows the movement position of the transport carrier 302 (electrostatic chuck 308) that transports the glass substrate G and mask M for each manufacturing process step in the organic EL panel manufacturing line 100. In order to make it easier to understand, the transport carrier 302 is depicted with symbols C1 and C2 at each control movement position in the manufacturing process step (the meanings of the symbols will be explained later). The number of transport carriers 302 is not necessarily introduced on the transport path. The number of machines to be introduced at the same time is determined by the manufacturing process design and takt time. Further, in the figure, the transport carrier and the like move counterclockwise on the paper on the production line, but the direction is not limited to this.

In the manufacturing line 100, a magnetic drive method (linear motor method) is adopted as the driving force for the transport carrier 302 in the transport direction. Further, to support the conveyance carrier 302 in the vertical direction, either magnetic levitation or guide support using rollers is used. As mentioned above, when the transport carrier 302 is transported by magnetic levitation, less dust and dust are generated, so it is very suitable for transport in equipment that requires high vacuum and cleanliness, such as the production of organic EL panels. It is effective for

In the figure, parts where the positional relationship of each component changes are labeled with P1 to P8 as shown below.
P1: Glass substrate loading position where the glass substrate G is held on the transport carrier P2: Mask mounting position where the mask M is mounted on the glass substrate G on the transport carrier P3: Mask that separates the mask M from the glass substrate G after vapor deposition processing Separation position P4: Substrate discharge position where the glass substrate G after vapor deposition processing is separated from the transport carrier 302 and discharged P5: Carrier delivery position where the empty transport carrier 302 from which the glass substrate G has been discharged is delivered to the return transport path P6: Mask delivery position where the mask M separated after the vapor deposition process is mounted on the transport carrier 302 on the return transport path P7: Mask where the mask M is separated from the transport carrier 302 being transported on the return transport path and transported to the mask mounting position P2 Return position P8: Carrier return position (return transport path end point) where the transport carrier 302 from which the mask M has been separated is shifted from the return transport path to the glass substrate loading position P1 on the vapor deposition processing transport path

While the transport carrier 302 is moved by the transport module 301 on the production line 100, the stacking relationship of the glass substrate G, the mask M, the electrostatic chuck 308 included in the transport carrier, etc. changes at various positions on the production line. Or, the top and bottom may be reversed by 180 degrees through reversal processing. Therefore, in FIG. 1, symbols are shown for each main position to help understand the vertical relationship among the glass substrate G, mask M, and electrostatic chuck 308. That is, when the surface of the glass substrate G on which a film is to be formed (film-formed surface) is on the top, it is indicated by the symbol G1, and when the surface on which the film is not formed is on the top, it is indicated by the symbol G2. Further, when the substrate suction side of the electrostatic chuck 308 is at the top, it is denoted by C1, and when the side that does not suction the substrate is at the top, it is denoted by C2. Further, when the surface of the mask M on the film-forming side is at the top, it is indicated by the symbol M1, and when the side on which no film is to be formed is at the top, it is indicated by the symbol M2. The code indicates the state after inversion in each inversion chamber, and the state after carrying in and discharging in the loading and unloading chambers.

<Import process>
At the glass substrate loading position P1, a glass substrate G is loaded from an external stocker into the substrate loading chamber 101 on the vapor deposition process transport path 100a, and is held by an electrostatic chuck 308 at a predetermined holding position on the transport carrier 302. Ru. At the glass substrate loading position P1, the transport carrier 302 and the transport module 301 that supports it are arranged so that the transport module 301 is on the lower side. At this time, the glass substrate holding surface (chuck surface) of the transport carrier 302 is in an upward posture. The glass substrate G is carried into the glass substrate carrying-in position P1 from above and placed on the chuck surface.

Subsequently, the transport carrier 302 holding the glass substrate is transported from the glass substrate loading position P1 to the reversing chamber 102. This conveyance is performed in roller conveyance mode. That is, the conveyance carrier 302 is generated between the driving coils 306a, 306b to which current or voltage is applied and the driving magnets 305a, 305b while the guide groove 303 is in contact with the roller bearings 304a, 304b that serve as guides. It moves in the direction of travel due to magnetic force.

<Reversal/mode switching process>
In the reversing chamber 102, the rotation support mechanism rotates the transport module 301 supporting the transport carrier 302 holding the glass substrate by 180 degrees with respect to the traveling direction. As a result, the vertical relationship between the transport carrier 302 and the transport module 301 is reversed, and the glass substrate G is placed on the lower surface side. The rotation support mechanism can rotate the transport module 301 along with the transport carrier 302 in units of 180 degrees in the traveling direction. It is preferable to configure the rotating shaft to be located at the center of gravity so as not to cause misalignment between the transport carrier 302 and the transport module 301 during the rotation operation. In the figure, arrow R indicates reversal of the transport carrier 302 and the transport module 301 in the traveling direction. Note that it is also preferable to use a locking mechanism that mechanically locks the transport module 301 and the transport carrier 302.

Here, one of the reasons why the conveyance carrier 302 is rotated together with the conveyance module 301 is that in order to guide the conveyance carrier 302, roller bearings 304a are arranged on both sides of the conveyance module in guide grooves 303a and 303b of the conveyance carrier. This is because 304b is inserted. Another reason is that the magnet on the transport carrier side and the coil on the transport module side are in a positional relationship that opposes each other, so if the structure is such that only the transport carrier is reversed, the weight of the reversal will be lighter, but the magnet on the transport carrier side will be This is because the arrangement and guide mechanism with the transport module becomes complicated.

After the reversal process in the reversal chamber, the current or voltage applied to the drive coil is controlled, and the method of supporting the conveyance carrier 302 changes from contact between the roller bearings 304a, 304b and guide grooves 303a, 303b to magnetic levitation. Can be switched. This causes a transition from the roller conveyance mode to the magnetic levitation conveyance mode. Subsequently, the transport carrier 302 is moved to the alignment chamber 103 (mask mounting position P2) in magnetic levitation transport mode.

<Alignment process>
In the alignment operation, an alignment camera images the alignment marks formed in advance on the glass substrate G and the mask M, detects the amount and direction of positional deviation between the two, and transports and drives the position of the magnetically levitated transport carrier 302. Alignment is performed while making slight movements by the system, and in a state where the positions of the glass substrate G and the mask M are accurately aligned, the mask M is attracted by the magnetic attraction chuck 307 and held on the transport carrier 302.

This holding state is locked by the mask chucks 311 at 10 locations as described above, and even if the electrostatic chuck 308 and the magnetic chuck 307 are subsequently released, the glass substrate G and the mask M remain aligned on the transport carrier. The state held at 302 is maintained.

Here, during alignment, the position with respect to the transport module 301 is finely adjusted while the transport carrier 302 is magnetically levitated. Therefore, alignment can be performed by the transport carrier drive system without separately providing a fine adjustment mechanism dedicated to alignment, which is effective in simplifying the structure and reducing the weight of the transport carrier 302.

(Processing flow)
Details of the alignment operation in the alignment chamber 103 will be described with reference to the flowchart in FIG. 5 and FIGS. 6 to 8. 6(A) to FIG. 8(D) correspond to steps S1 to S5 and S7 to S12 in FIG. 5, respectively. In order to simplify the explanation, the roller bearings 304a, 304b and the guide grooves 303a, 303b are not shown in FIGS. 6 to 8.

First, in step S1, as shown in FIG. 6(A), the mask M is carried in from the pre-alignment chamber 100g by the mask delivery mechanism 100e. The alignment chamber control unit detects the completion of loading using a sensor provided in the alignment chamber 103.

Next, in step S2, as shown in FIG. 6(B), the transport carrier 302 holding the substrate is transported from the reversing chamber 102 to the alignment chamber 103 in a magnetic levitation transport mode. The conveying direction A here is a direction from the back to the front. The alignment chamber control unit detects the position from the encoder value of the transport module 301 and stops the transport carrier 302 at a predetermined alignment position. The clearance (gap) between the mask M and the glass substrate G at this time is defined as CLS2. For example, CLS2=68 mm.

Next, in step S3, as shown in FIG. 6(C), the mask M is raised by the lifting device 202 (jacks 203a to 203d, lifting rods 204a to 204d) and stopped just before it contacts the glass substrate G. In this embodiment, four sets of jacks 203a to 203d and lifting rods 204a to 204d are provided at each of the four corners of the lower surface of the mask tray 205. In FIG. Only pairs are shown. The stop position is a position where the alignment camera can simultaneously measure the alignment marks on the glass substrate G and the mask M in the next step S4. If the clearance between the mask M and the glass substrate G at this time is CLS3, then CLS3=3 mm, for example.

Next, in step S4, as shown in FIG. 6(D), alignment marks on the glass substrate G and the mask M are simultaneously measured by the alignment camera 1310. Note that the transport carrier 302 is provided with a through hole along the optical axis direction of the alignment camera. The alignment camera can measure the alignment marks provided on the glass substrate G and the mask M through this through hole. Further, as long as the configuration allows alignment mark measurement, for example, a notch may be used instead of the through hole.

Next, in step S5, as shown in FIG. 7(A), the alignment chamber control unit calculates the amount of positional deviation between the glass substrate G and the mask M from the measurement results in S4, and the positional deviation value falls within a predetermined tolerance range. The position of the transport carrier 302 holding the glass substrate G is adjusted so that the glass substrate G is accommodated. During position adjustment, as shown by reference numeral 331, the current or voltage applied to the drive coils 306a, 306b (see FIG. 3) is controlled to adjust the magnetic force between the drive magnets 305a, 305b. do. In this way, the alignment operation in this step is performed with the transport carrier 302 floating. Next, in step S6, the alignment camera performs measurement again, and the alignment chamber control unit determines whether the positional deviation value is within a predetermined range. If it is outside the range, the process returns to S5 and alignment is repeated until the positional deviation value falls within the range.

As described above, the alignment operation in this flow is performed by adjusting the position of the transport carrier using magnetic force while the transport carrier and the glass substrate G held therein are magnetically levitated. In this configuration, since the transport carrier and the transport module are not in contact with each other, the effects of friction and the like are suppressed, and highly accurate positioning is possible. Furthermore, since the magnetic force generated by the drive coil and drive magnet for transporting the transport carrier is used for alignment, there is no need to provide a separate drive means for alignment. As a result, it is possible to simplify the configuration of the device and reduce costs.

When the alignment operation is completed, the mask M is magnetically attracted. In this embodiment, the mask frame MF is first chucked by the mask chuck 311.
That is, in S7, the mask M is raised to be close to the glass substrate G, as shown in FIG. 7(B). When the mask M is raised, the mask M supported by the mask support section 206 is raised by raising the mask tray 205 by the lifting device 202. The mask M itself is bent as schematically shown in the figure, and the mask frame MF supported by the mask support section 206 rises and approaches the glass substrate G to a predetermined gap. If the clearance between the mask M and the glass substrate G at this time is CLS71, then CLS71=0.5 mm, for example. In addition, since the transport carrier 302 is magnetically levitated, the carrier stand portion 3
A clearance CLS72 exists between the lower end of the mask tray 205 and the mask tray 205.

Next, in S8, as shown in FIG. 7C, the magnetic levitation control is turned off and the transport carrier 302 is seated on the mask tray 205. When the magnetic levitation control is turned off, the transport carrier 302 that has lost its levitation force falls due to its own weight and is seated on the mask tray 205 . In the illustrated example, the lower end of a carrier stand portion 302A1 provided on the carrier body 302A comes into contact with the mask tray 205. If the clearance between the mask M and the glass substrate G at this time is CLS8, then CLS8=0.3 mm, for example.

Next, in S9, mask chucking is performed as shown in FIG. 7(D).
That is, the rotating shaft 311f is rotationally driven by an external drive device, and the chuck piece 311c engages with the mask frame MF to be chucked. In the illustrated example, the upper chuck piece 311b is omitted. At this point, the mask frame MF is fixed. This state is maintained even if the electrostatic chuck 308 and the magnetic chuck 307 are released.

Next, in S10, as shown in FIG. 8A, the transport carrier 302 is raised to the floating start position while the mask M is held by the mask chuck 311. The transport carrier 302 is raised by a lifting device for the mask tray 205. The floating start position is a distance between the drive coil 306 of the transport module 301 and the drive magnet 305 of the transport carrier 302 at which an attractive force is sufficient to levitate the transport carrier 302 . In this step, for example, the transport carrier 302 is raised by about 0.7 mm.

Next, in S11, as shown in FIG. 8(B), the magnetic levitation control is turned on to levitate the transport carrier 302 holding the mask M from the mask tray 205. In other words, the attraction between the drive coil 306 of the transport module 301 and the drive magnet 305 of the transport carrier 302 causes the transport carrier 302 to float a predetermined amount above the mask tray 205 . The amount of rise is, for example, about 0.5 mm. That is, if the clearance between the mask tray 205 and the lower end of the carrier stand portion 302A1 of the transport carrier 302 at this time is CLS11, then CLS11=0.5 mm, for example.

Next, in S12, as shown in FIG. 8C, the magnetic attraction chuck 307 is lowered to magnetically attract the mask M to the surface of the glass substrate G. That is, the lock piece that was locked at the rising end is rotationally driven by an external actuator, moves to the retracted position, and is unlocked in the downward direction, and the electrostatic chuck 308 where the magnetic adsorption chuck 307 holds the glass substrate G. The magnet 31 of the magnetic chuck 307 and the mask M are magnetically attracted and held with the electrostatic chuck 308 and the glass substrate G sandwiched therebetween. As a result, the aligned mask M is held in close contact with the entire surface of the glass substrate G on which the film is formed. Note that the downward movement of the magnetic adsorption chuck 307 is realized by a driving force from outside the transport carrier 302. The amount of descent of the magnetic chuck 307 at this time is, for example, 30 mm.

Next, in S13, the transport carrier 302 is carried out from the alignment chamber 103 to the acceleration chamber 104 in the transport direction A, as shown in FIG. 8(D).

Through the above flow, the aligned mask M is held by the magnetic chuck 307 on the film-forming surface of the glass substrate G held by the electrostatic chuck 308, and the mask frame MF is further chucked by the mask chuck 311. , the transport carrier 302 is carried out.

<Vapor deposition process>
Returning to FIG. 1, the explanation will be continued. After completing the alignment operation, the transport carrier discharged from the alignment chamber 103 is accelerated in the acceleration chamber 104 as described above and is carried into the deposition chamber 105. By accelerating the transport carrier before carrying it into the deposition chamber 105, it is possible to compensate for the time delay required for high-precision alignment processing in the alignment chamber 103, and to suppress a decrease in takt time.

In the deposition chamber, the organic EL light emitting material is vacuum deposited while moving the carrier in the direction of arrow B in a magnetically levitated state at a predetermined deposition rate. Thereby, film formation is performed on the surface of the glass substrate G to be film-formed using the mask M in a desired film-forming pattern. In this way, by using the magnetic levitation transport mode when transporting the carrier from the alignment chamber to the acceleration chamber and deposition chamber, or when moving it within the deposition chamber, dust and powder generation due to friction can be prevented. This makes it possible to form high-quality films.

<Separation/export process>
The conveyance carrier discharged from the deposition chamber 105 after completing the vapor deposition process is decelerated in the deceleration chamber 106, conveyed to the mask separation chamber 107 located at the mask separation position P3, and stopped at a predetermined position. Here, the locked state of the mask M by the mask chuck 311 is released, and the mask M is separated from the glass substrate.

The separated mask M is lowered by a mechanism similar to the mask lifting device described above. The mask delivery mechanism 100c receives and holds the lowered mask M with a holding frame, and transports it to a retracted position between the vapor deposition process transport path 100a and the return transport path 100b. Then, when the empty transport carrier 302 after discharging the substrate moves to the mask receiving position P6 on the return transport path 100b, the mask M is moved to a position below the transport carrier 302. Then, the mask M is raised to the lower surface of the transport carrier 302 by a mechanism similar to the mask lifting device and held by the magnetic chuck 308. The transport carrier 302 holding the mask M in this manner is returned to the supply side.

On the other hand, the transport carrier 302 from which the masks M have been separated in the mask separation chamber 107 moves to the reversal chamber 108 while holding the glass substrate G by the locking portion of the mask chuck 311. In the reversing chamber 108, a rotation support mechanism similar to that of the reversing chamber 102 on the supply side rotates the transport carrier 302 together with the transport module 301 by 180 degrees in the traveling direction. Thereby, the glass substrate G becomes the upper surface.

After being reversed in the reversing chamber 108, the transport mode of the transport carrier 302 is switched from the magnetic levitation transport mode to the roller transport mode again. Subsequently, the transport carrier 302 is transported by roller transport to the glass substrate discharge chamber 109 at the substrate discharge position P4. At the substrate discharge position P4, the mask chuck of the glass substrate G is released, and the glass substrate G is transported to the next process by a discharge mechanism (not shown).

The transport carrier 302, which has become empty after discharging the glass substrate G in the glass substrate discharge chamber 109, is rotated 90 degrees counterclockwise when viewed in the figure together with the transport module 301. For this purpose, the glass substrate discharge chamber 109 includes a direction changing mechanism that rotates the transport module 301 in a plane direction. Subsequently, the transport carrier 302 is transferred from the transport module 301 to the carrier shifter 100d, and is transported to the carrier delivery position P5, which is the starting point of the return transport path 100b. On the other hand, after delivering the transport carrier 302 to the carrier shifter 100d, the transport module 301 is rotated 90 degrees clockwise and returned to its original direction. As a result, the transport module 301 returns to a state in which it can receive the transport carrier 302 to be next carried out from the reversing chamber 108.

The carrier shifter 100d has a transport mechanism similar to that of the transport module 301. The carrier shifter 100d is a transport module 301 rotated 90 degrees in the glass substrate discharge chamber 109.
From there, the transport carrier 302, which has become empty after discharging the substrate, is received and delivered to the direction changing mechanism (direction changing transport module) 110 arranged at the starting point of the return transport path 100b (carrier delivery position P5). The direction changing mechanism 110 rotates the transport carrier 302 by 90 degrees counterclockwise in plan view, and transports the transport carrier 302 to the transport module 301 forming the return transport path 100b. After the conveyance is completed, the direction changing mechanism 110 rotates 90 degrees clockwise and returns to its original position, and becomes ready to receive the next conveyance carrier 302 from the carrier shifter 100d.

<Return process>
The transport carrier 302 moves on the return transport path 100b in roller transport mode. In the reversing chamber 111, the rotation support mechanism rotates the transport carrier 302 along with the transport module 301 by 180 degrees in the traveling direction. As a result, the transport carrier 302 is carried into the mask receiving position P6 with the mask mounting surface of the electrostatic chuck 308 facing downward. Subsequently, the transport carrier 302 receives the mask M from the mask delivery mechanism 100c, attracts it with a magnetic chuck 307, and holds it with a mask chuck 311. Subsequently, the transport carrier 302 continues to move in the direction of arrow C in the roller transport mode while holding the mask M with the mask chuck 311.

The transport carrier 302 moves to the mask separation position P7 in the mask separation chamber 112, then stops, releases the mask chuck 311, and separates the mask M. The separated mask M is delivered to the mask delivery mechanism 100e. The mask delivery mechanism 100e roughly aligns the mask M in the pre-alignment chamber 100g between the vapor deposition process transport path 100a and the return transport path 100b, and then transports the mask M to the alignment chamber 103.

On the other hand, the transport carrier 302 from which the mask M has been separated at the mask separation position P7 is rotated 180 degrees in the advancing direction in the reversing chamber 113. This causes the glass substrate holding surface of the electrostatic chuck 308 to face upward. The transport carrier 302 is then rotated 90 degrees clockwise by the direction changing mechanism 114 located at the carrier return position P8, which is the end point of the return transport path 100b. Subsequently, the glass substrate is delivered to the carrier shifter 100f, and transported to the substrate loading chamber 101 located at the glass substrate loading position P1, which is the starting point of the vapor deposition process transport path 100a. After delivering the transport carrier 302, the direction changing mechanism 114 rotates 90 degrees counterclockwise and returns to its original state. On the other hand, the transport carrier 302 carried into the substrate carrying chamber 101 is further rotated 90 degrees counterclockwise and returns to the initial position where it can hold the next glass substrate G carried in from the outside.

By performing the above process, a series of processes for depositing an organic EL light emitting material onto glass substrates that are sequentially carried in can be carried out without a hitch.

Further, by transporting the transport carrier 302 using a magnetic levitation method, generation of dust and powder due to friction can be suppressed, which is particularly effective when carrying the transport carrier 302 into and out of the vapor deposition chamber and into and out of the vapor deposition chamber. Furthermore, according to the illustrated example, after the glass substrate G is carried into the production line 100, the glass substrate G is only transported in one direction during the process from alignment and vapor deposition to being discharged, and Although it is necessary to turn it upside down in the direction of travel, there is no need for the robot or the like to turn in a plane direction. That is, the glass substrate G is transported on a linear transport path. Therefore, since there is no need to rotate the glass substrate G in the plane direction using a robot or the like, it is possible to further reduce the possibility that dust or powder will adhere to the substrate.

Furthermore, in the illustrated example, the glass substrate G is carried into the production line with the surface on which the film is to be formed facing upward. Therefore, for example, if the glass substrate G is carried in with the surface on which no film is to be formed placed on the support mechanism, it is effective in protecting the film-forming surface when the glass substrate is mounted on the transport carrier 302.

Here, in the evaporation chamber, the evaporation material is vaporized or sublimated in vacuum using PVD or CVD to form a film, so the evaporation material must be placed below. Therefore, during vapor deposition, it is necessary to control the attitude of the glass substrate so that the surface on which the film is to be formed faces downward. According to the configuration of this embodiment, the mask M is raised from the bottom toward the film-forming surface of the glass substrate G held by the transport carrier 302 with the film-forming surface facing downward. Then, it is attached to the glass substrate G through an alignment process. Therefore, at the time when the mask M is worn, the position is such that the above-mentioned vapor deposition material can be vapor deposited.

An electrostatic chuck 308 is used to hold the glass substrate on the transport carrier 302, and a magnetic chuck 307 and a mechanical mask chuck 311 are used to hold the mask. The electrostatic chuck 308 and the magnetic chuck 307 are built into a chuck frame 309, and the magnetic chuck 307 can be changed into a chucked state or a non-chucked state by vertical movement within the chuck frame 309 (movement of the magnet 31 toward and away from the mask M). can be switched. First, the mask M is elastically held on the transport carrier 302 with the glass substrate G sandwiched therebetween by a mechanical mask chuck 311 . Thereafter, by lowering the magnetic chuck 307, chucking of the mask M is completed. According to the configuration of this embodiment, these three types of chucks can be compactly incorporated into the transport carrier 302.

An electrostatic chuck control unit that controls the electrostatic chuck of this embodiment is housed in a control box 312 together with a rechargeable power source and a wireless communication means for communicating commands from the control system, and is incorporated into a transport carrier. Therefore, in the manufacturing process, there is no need to connect a power supply cable, a communication cable, etc. to the transport carrier 302 from the outside.

In the embodiment described above, the driving magnets 305a and 305b are provided on the upper surface of the transport carrier 302, and the driving coils 306a and 306b arranged above the transport module 301 so as to face the driving magnets 305a and 305b are arranged on the upper surface of the transport carrier 302. It is designed to be sucked in from. However, the arrangement of the magnet unit and the coil unit is not limited to this. A driving magnet may be arranged on the side surface of the transport carrier 302, a plurality of coils may be arranged on the transport module 301 facing the driving magnet, and a plurality of coils may be arranged on the transport carrier 302. It is also possible to hold it from the side by magnetic levitation.

According to this embodiment, before the glass substrate G and the mask M are held by the transport carrier 302 and are magnetically levitated in the alignment chamber, they are aligned by magnetic force before being deposited in the deposition chamber. This enables highly accurate positioning. Further, since the control is performed by applying current or voltage to the coil that is the means for transporting the transport carrier, there is no need to provide a separate means for alignment, and the apparatus can be realized simply and at low cost.

<Characteristic configuration and excellent points of this embodiment>
The mask holding mechanism according to this embodiment will be described with reference to FIGS. 9 to 14.
FIG. 9 shows the arrangement of the magnetic attraction magnet 307 as a mask holding mechanism and the density of attraction force (adsorption force) for the mask M. 9 shows a part of the magnetic attraction magnet 307, FIG. 9(A) shows a bottom view (schematic view of the magnetic attraction magnet 307 seen from the mask M side), and FIG. 9(B) shows a side view. 9(C) shows the suction force density of the mask M.

The magnetic attraction magnet 307 is composed of a permanent magnet 31 and a yoke 30.
The yoke 30 has a lattice shape corresponding to a shielding portion of a mask M for shielding a region to be deposited in a deposition pattern to be deposited on a glass substrate G.
A plurality of permanent magnets 31 are arranged in the linear portions of the lattice shape of the mask M at predetermined pitch intervals along the direction in which the linear portions extend. The plurality of permanent magnets 31 arranged in a row are arranged so that the magnetic poles on the mask side alternate between adjacent permanent magnets as S poles and N poles, that is, the magnetization directions are alternated. Each permanent magnet 31 described below has a rectangular parallelepiped shape, and is configured to have the same height from the yoke 30.
The yoke 30 and the permanent magnet 31 are attracted to each other by magnetic attraction, and a groove is dug at the position where the permanent magnet 31 is placed to determine the position of the permanent magnet 31.
In this embodiment, the width of the straight part of the yoke 30 and the width of the permanent magnet 31 are configured to be the same size, and the straight part of the yoke 30 has a hole on the mask M side that extends in the width direction of the straight part and is open at both ends. A permanent magnet 31 is attached to the groove.

In order to generate a uniform attraction force on the mask M, as shown in FIG. 9(A), the width of the permanent magnet 31 and the yoke 30 should be smaller than the width of the shielding part of the mask M (the dotted line part in FIG. 9(A)). It is desirable to make it large because a larger adsorption force can be obtained. However, when sufficient attraction force is obtained, the widths of the permanent magnet 31 and the yoke 30 may be smaller than the width of the shielding portion of the mask M.

The attraction force density showing the force to attract the mask M per unit area shown in FIG. 9(C) is the result of magnetic field analysis using the finite element method. Attraction force is generated periodically. As a condition for bringing the glass substrate G and mask M into close contact without creating a gap, the attraction force per unit area of the magnetic adsorption chuck 307 is at least 1 times or more the weight per unit area of the mask M over the entire area of the mask M. It is necessary to give it to In this embodiment, the attraction force per unit area of the magnetic attraction chuck 307 is configured to be three times or more the weight per unit area of the mask M.

FIG. 10 shows the permanent magnet arrangement at the intersection of the magnetic attraction magnets. 10(A) shows a schematic diagram of the entire magnetically attracting magnet 307, FIG. 10(B) shows the permanent magnet arrangement of the T-shaped intersection 3070 of the magnetically attracting magnet 307, and FIG. 10(C) shows the magnetically attracting magnet 307. A permanent magnet arrangement at a corner intersection 3071 of the attraction magnet 307 is shown.

In FIGS. 10(B) and 10(C), the shielding portion of the mask M is indicated by a dotted line as in FIG. 9(A). The device positions of the magnetic attraction magnet 307 and the mask M are such that the center of the T-shaped intersection 3070 and the center of the corner intersection 3071 match the center of the shielding part of the mask M. Specifically, when the magnetic attraction magnet 307 and the mask M are projected in the adsorption direction of the mask M to the glass substrate G, the center of the width of the linear part in the shielding part of the mask M and the straight line in the lattice shape of the magnetic attraction magnet 307 It is positioned so that the center of the width of the part coincides with the center of the width of the part.

As shown in FIG. 10(B), a permanent magnet 31a (second permanent magnet) is placed at the center of the T-shaped intersection 3070 of the magnetic attraction magnet 307.
Specifically, in the magnetic attraction magnet 307, the permanent magnet 31a (second permanent magnet) has a straight line part (second straight line) extending in the vertical direction in the figure in a straight line part (first straight line) extending in the horizontal direction in the figure. The areas where the tips of the parts (parts) face each other are arranged as intersections. A plurality of permanent magnets are arranged at predetermined pitch intervals along the extending direction of the horizontal straight section (first straight section) of the magnetic attraction magnet 307, and among the permanent magnets, the horizontal straight section The permanent magnet 31a arranged at the intersection connecting the section (first straight section) and the longitudinal straight section (second straight section) corresponds to the second permanent magnet of the present invention, and the remaining permanent magnets correspond to the second permanent magnet of the present invention. Corresponds to the first permanent magnet. Permanent magnets 31b (third permanent magnets) are also arranged at predetermined pitch intervals along the extending direction of the vertical straight portion (second straight portion) of the magnetic attraction magnet 307.
In the extending direction (first direction) of the horizontal straight section (first straight section), the width center of the permanent magnet 31a (second permanent magnet) at the intersection is the same as the permanent magnet of the vertical straight section (second straight section). 31b (third permanent magnet) (or the width center of the vertical straight section (second straight section)) (each located on one imaginary straight line along the extending direction of the second straight section) ).
At this time, in order to obtain a more uniform attraction force, the magnetic pole of the permanent magnet 31a (second permanent magnet) at the center of the intersection on the mask side and the adjacent permanent magnet 31b (first permanent magnet) on the mask side It is preferable to arrange the magnetic poles so that the magnetic poles are different from each other.

As shown in FIG. 10C, like the T-shaped intersection 3070, the corner intersection 3071 also has a permanent magnet 31c (second permanent magnet) arranged at the center of the corner intersection 3071. The method of determining the center is the same as that in FIG. 10(B), and a detailed explanation will be omitted. In this case as well, the mask-side magnetic pole of the permanent magnet 31c at the center of the intersection and the mask-side magnetic pole of the adjacent permanent magnet 31d, similar to the T-shaped intersection 3070, are arranged so that they have different polarities. It is preferable.

FIG. 11 shows a comparison of permanent magnet arrangements at intersections of magnetic attraction magnets. FIG. 11(A) shows an example of the permanent magnet arrangement according to this embodiment, and FIG. 11(B) shows an arrangement example where the permanent magnets are shifted from the center of the T-shaped intersection as a comparative example. FIG. 11(C) shows a comparison between this example and a comparative example of the attractive force density due to the permanent magnet arrangement, and shows the attractive force density 41 just above the AA cross section in FIG. 11(A) and the attractive force density 41 in FIG. 11(B). The suction force density 42 immediately above the BB cross section of is shown, respectively.

When the magnetic poles on the mask side of the permanent magnets are arranged so that the S and N poles alternate, two adjacent permanent magnets with different polarities (the magnetization directions are opposite to each other) form a pair and form a magnet between them. Magnetic flux flows. Therefore, in the arrangement of the permanent magnets as shown in FIG. 11(B), the magnetic flux density of the permanent magnets 31f and 31g arranged on both sides of the center of the intersection and the permanent magnet 31h next to them cannot be balanced, and the attractive force The density 42 is asymmetrical about the center of the intersection. Therefore, it is difficult to make the attractive force density uniform just by adjusting the size of a specific permanent magnet.

On the other hand, in the arrangement shown in FIG. 11A to which the present invention is applied, the attraction force density 41 has a symmetrical characteristic with respect to the center of the intersection, and the attraction force density value has a peak at areas other than the center of the intersection. This matches the target value of 40. By making the size of the permanent magnet 31e (second permanent magnet) located at the center of the T-shaped intersection larger than the other permanent magnets (first permanent magnet), the symmetry of the attractive force density is maintained. The attraction density can be increased at areas other than the center of the intersection, and the difference between the attraction density at the center of the intersection and the area other than the center of the intersection can be reduced, making it possible to reduce the difference between the attraction density at the center of the intersection and the area other than the center of the intersection. The suction force density of the entire 307 can be made uniform.

FIG. 12 shows the relationship between the size of the permanent magnet at the intersection of the magnetic attraction magnets 307 and the uniformity of the attractive force density. In this example, when the horizontal direction of the figure is the longitudinal direction of the mask M (extending direction of the first straight section: first direction), and the length of the magnet in the longitudinal direction is defined as the width of the magnet, the center of the intersection is Let W be the width of the permanent magnet 31x (second permanent magnet) placed in the permanent magnet 31 The width (width in the second direction) of a certain permanent magnet 31y (third permanent magnet) was 15 mm. When the width of the other permanent magnet (first permanent magnet) is 10 mm, the relationship between the width W of the permanent magnet 31x (second permanent magnet) and the uniformity of the attractive force density in areas 1 to 5 is shown in the lower part of FIG. This is shown by the characteristics of When the width W of the permanent magnet 31x (second permanent magnet) was 15 mm, the difference in attractive force density between areas 1 to 5 was the smallest. In this embodiment, the width of the permanent magnet 31x (second permanent magnet) placed at the center of the intersection, and the width (in the second direction) of the permanent magnet 31y (third permanent magnet placed in the second straight part) are When the width (width) was 15 mm and the width (width in the first direction) of the other permanent magnet (the first permanent magnet placed in the first straight section) was 10 mm, it was possible to make the attractive force density uniform. .

FIG. 13 shows the relationship between average attractive force density and permanent magnet pitch. It is difficult to arrange the permanent magnet at the center of the intersection as described above while keeping the pitch P between the magnetic poles on the mask side of the permanent magnet constant. For example, as shown in FIG. 13, the distance X between the permanent magnets 30i and 30j at the center of the intersection is different from the distance X' between the permanent magnets 30j and 30k, and the difference is the pitch P between the magnetic poles. If the pitch is not a multiple of , the pitch P between the magnetic poles and the pitch P' between the magnetic poles cannot be made the same.

The average value of the attractive force density generated in the section of the pitch P between the magnetic poles of the permanent magnet is defined as the average attractive force density, and the characteristic diagram of the relationship between the average attractive force density and the pitch P between the magnetic poles of the permanent magnet is shown at the bottom of Fig. 13. It shows. In the case of this example, when the pitch P between the magnetic poles of the permanent magnet is increased from 17 mm, the average attractive force density increases, but when the pitch P between magnetic poles is between 25 mm and 33 mm, the average attractive force density remains almost constant. The value is . Therefore, first, the positions of the permanent magnets 30i, 30j, and 30k are determined so as to be in the center of the intersection. By adjusting the pitches P and P' between the magnetic poles to any position between 25 mm and 33 mm, it is possible to obtain the effects of the present invention, and it is possible to obtain a uniform pitch over the entire surface of the magnetic adsorption magnet 307. Can provide suction power density.

FIG. 14 shows another example of permanent magnet arrangement.
FIG. 14A shows an arrangement example in which the permanent magnet (second permanent magnet) to be arranged at the center of the intersection is divided into two, a permanent magnet 31m and a permanent magnet 31n. The divided permanent magnets are made to have the same polarity, and the direction in which the horizontal straight part (first straight part) extends (the first straight part) is arranged symmetrically in one direction). Even if a permanent magnet is not placed at the center of the intersection, if the magnetic circuit is equivalent, a uniform attractive force density can be obtained as in the configuration of the above-described embodiment.
In this case, the size of the permanent magnet 31m and the permanent magnet 31n can be made at least the same size as other permanent magnets (first permanent magnets) arranged along the direction in which they are arranged (in the first direction). width is the same). Therefore, the number of sizes of permanent magnets to be prepared can be reduced, and costs can be reduced.
FIG. 14(B) shows an example of the arrangement of permanent magnets in a case where the mutually orthogonal linear portions of the magnetic attraction magnets 307 cross each other in a criss-cross pattern. Even when the linear portions of the magnetic attraction magnets 307 intersect in a cross, the above-described permanent magnet arrangement is possible.
Note that in this embodiment, a configuration in which the first straight portion and the second straight portion intersect at a right angle (that is, they intersect perpendicularly) has been described; However, the present invention is also applicable. That is, the angle at which the first straight line part and the second straight line part intersect is not limited to a right angle, and the present invention can be applied to a configuration in which the first straight line part and the second straight line part intersect at an angle that causes the above-mentioned magnetic interference even if it is not a right angle. Therefore, the same effects as in this embodiment can be achieved.

[Example 2]
Example 2 of the present invention will be described with reference to FIG. 15. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and a redundant explanation will be omitted. Items in the second embodiment that are not particularly explained here are the same as those in the first embodiment.

In the first embodiment, the case where the mask to be sucked is an open mask has been described, but the present invention is also applicable to fine metal masks. In the case of a fine metal mask, permanent magnets are often arranged so that the magnetic poles on the mask side alternate between S and N poles over the entire surface of the mask. However, as the amount of permanent magnets and yokes used increases, the weight of the movable part including the magnetic attraction magnet increases. If the weight of the movable part is large, not only is there a load to transport the substrate, but also the rigidity of the entire device needs to be increased, leading to a significant increase in cost. Therefore, it is often required to reduce the weight of the movable part, and it is important to reduce the weight of the magnetic attraction magnet that is a component of the movable part.

As shown in FIG. 13, in the case of this embodiment, as the pitch P between the magnetic poles of the permanent magnet is increased, the average attraction force density increases until the pitch P between the magnetic poles reaches 25 mm. Therefore, even if the amount of permanent magnets used is reduced by the increase in the average attraction force density, the same attraction force of the mask can be obtained.
FIG. 15 shows an example in which the present invention is applied to a fine metal mask. The magnetic attraction chuck 307a that attracts the fine metal mask FM has a distance between the magnetic poles of the permanent magnets, and the amount of permanent magnets used is reduced by increasing the average attraction force density. Furthermore, by providing the gap 3072, the weight of the magnetically attracted chuck 307a is reduced. Furthermore, as explained with reference to FIG. 12, the permanent magnets (all S poles in the example of FIG. 15) at the center of the T-shaped intersection where the attractive force decreases and the center of the corner intersection are made larger. This makes the suction power density uniform.

307: Magnetic adsorption chuck, 30: Yoke plate (yoke), 31: Permanent magnet, G: Glass substrate, M: Mask

Claims (4)

A mask holding mechanism that uses magnetic force to attract and hold a mask for forming a desired film formation pattern on the surface of the film formation object, the mask holding mechanism comprising:
The mask is disposed on the opposite side of the film-forming object from the mask, and has a lattice shape corresponding to a shielding portion of the mask for shielding a film-forming region of the film-forming object in the film-forming pattern. York and
A plurality of first permanent magnets attached to the mask side of the yoke, of the first linear portions and second linear portions that intersect with each other in the lattice shape of the yoke, the first linear portion extends a plurality of first permanent magnets arranged at intervals along the direction and arranged so that the magnetization directions of adjacent first permanent magnets are alternated;
In a mask holding mechanism comprising:
a second permanent magnet disposed at an intersection connecting the first linear portion and the second linear portion that are different in direction in the lattice shape of the yoke;
The second permanent magnet has a magnetization direction opposite to the magnetization direction of adjacent first permanent magnets among the plurality of first permanent magnets,
The second permanent magnet disposed at the intersection connecting the first straight section and the second straight section is divided into two along the first direction in which the first straight section extends at the intersection. A mask holding mechanism, characterized in that the mask holding mechanism is arranged symmetrically in the first direction with respect to the center of the width of the second straight section in the first direction. The mask holding mechanism according to claim 1, wherein the first permanent magnet and the second permanent magnet have the same size. a mask for forming a desired film formation pattern on a film formation target;
The mask holding mechanism according to claim 1 or 2 ,
a deposition chamber in which a deposition material is deposited on the film-forming object to which the mask is adsorbed by the mask holding mechanism;
A vapor deposition apparatus comprising: An electronic device manufacturing apparatus, characterized in that the electronic device is manufactured by forming a film on the object to be formed using the vapor deposition apparatus according to claim 3 .

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