KR100924932B1 - Apparatus for treating substrate - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention discloses a substrate processing apparatus, which is characterized by injecting a gas to prevent the cleaning fluid from flowing out through the clearance space between the brush shaft and the process chamber wall.

According to this feature, it is possible to prevent the cleaning liquid from flowing out through the brush shaft and leaking out of the chamber, and to provide a substrate processing apparatus capable of preventing contamination of equipment outside the chamber by the cleaning liquid leaking out of the chamber. .

Substrate Cleaning, Brush, Brush Shaft, Gas Blower

Description

Substrate Processing Unit {APPARATUS FOR TREATING SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a substrate cleaning apparatus for cleaning a substrate used in the manufacture of a flat panel display element.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. This information processing apparatus has a display panel for displaying the operated information. Until now, a cathode ray tube (CRT) monitor has been mainly used as a display panel, but recently, with the rapid development of technology, the use of flat panel display panels such as liquid crystal displays (LCDs), which are light and occupy small space, is rapidly increasing.

Various processes are required for manufacturing a flat panel display panel. Among these processes, a cleaning process is a process of removing contaminants such as particles deposited on a substrate and is performed to improve device yield by minimizing device losses such as thin film transistors. Generally, cleaning processes supply water to the substrate to remove contaminants from the substrate or use a brush to physically remove contaminants from the substrate.

In a brush cleaning apparatus for cleaning a substrate using a brush, the substrate is cleaned by a rotating brush cleaning unit while moving in one direction in the process chamber by the substrate transfer unit. The brush cleaning unit has a brush, a brush shaft and a driving member for providing rotational force to the brush, and both ends of the brush shaft are supported by support members provided on the outer side of the process chamber.

The present invention is to provide a substrate processing apparatus capable of reducing the amount of cleaning liquid flowing through the brush shaft and leaking out of the chamber.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a substrate processing apparatus according to the present invention includes a chamber in which a substrate processing process is performed; A shaft member installed through the wall of the chamber; And a gas injection member for injecting a gas to block the flow of the processing fluid through the clearance space between the shaft member and the chamber wall.

In the substrate processing apparatus according to the present invention having the configuration as described above, the gas injection member is provided to surround the shaft member, and may be installed in an insertion hole formed in the chamber wall to insert the shaft member. .

The gas injection member may include a torus-shaped lower wall; A cylindrical side wall extending vertically from an edge of the lower wall and inserted into the insertion hole; A truncated cone-shaped inclined wall extending inclined inwardly from an upper end of the side wall, wherein the lower wall, the side wall, and a wall of the inclined wall are formed such that flow paths of the gas are connected to each other. A discharge port for injecting the gas to the shaft member may be formed at the end of the flow path.

The gas injection member may further include a gas inlet installed in the lower wall to supply the gas to a flow path inside the lower wall.

The gas injection member further includes a flange extending from the side wall, the outer peripheral surface of the flange may be formed with a male screw coupled to the female screw formed in the insertion hole of the chamber wall.

In order to achieve the above object, the substrate processing apparatus according to the present invention, the apparatus for cleaning the substrate, comprising: a process chamber for providing a space in which the cleaning process proceeds; A substrate transfer unit installed in the process chamber to move a substrate; A brush cleaning unit having a brush for cleaning the substrate moved by the substrate transfer unit, and a brush shaft on which the brush is mounted and penetrated through a wall of the process chamber; And a gas injection member for injecting gas to prevent the cleaning fluid from flowing out through the clearance space between the brush shaft and the process chamber wall.

In the substrate processing apparatus according to the present invention having the configuration as described above, the gas ejection member is provided to surround the brush shaft, and may be installed in an insertion hole formed in the process chamber wall to insert the brush shaft. have.

The gas injection member may include a torus-shaped lower wall; A cylindrical side wall extending vertically from an edge of the lower wall and inserted into the insertion hole; A truncated cone-shaped inclined wall extending inclined inwardly from an upper end of the side wall, wherein the lower wall, the side wall, and a wall of the inclined wall are formed such that flow paths of the gas are connected to each other. A discharge port for injecting the gas to the shaft member may be formed at the end of the flow path.

The gas injection member may further include a gas inlet installed in the lower wall to supply the gas to a flow path inside the lower wall.

The gas injection member may further include a flange extending from the sidewall, and an outer thread of the flange may be formed with a male screw coupled to a female screw formed in the insertion hole of the wall of the process chamber.

According to the present invention, it is possible to prevent the cleaning liquid from flowing through the brush shaft and leaking out of the chamber.

Further, according to the present invention, it is possible to prevent contamination of the equipment outside the chamber by the cleaning liquid leaked out of the chamber.

Hereinafter, a substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

(Example)

In the present embodiment, the substrate S will be described taking as an example a substrate S used for manufacturing a flat panel display panel. Alternatively, the substrate S may be a wafer used for manufacturing a semiconductor chip.

1 is a cross-sectional view showing an example of a substrate processing apparatus according to the present invention.

Referring to FIG. 1, the substrate processing apparatus 10 according to the present embodiment includes a process chamber 100, 100 ′, 100 ″, and a substrate transfer unit 200, 200 ′, 200 ″.

The process chambers 100, 100 ′, 100 ″ provide a space for the substrate S processing process. The substrate transfer units 200, 200 ′, 200 ″ are installed in the process chambers 100, 100 ′, 100 ″, respectively. The substrate transfer unit 200, 200 ′, 200 ″ moves the substrate S in one direction between the process chambers 100, 100 ′, 100 ″ or within the process chambers 100, 100 ′, 100 ″.

The process chambers 100, 100 ', 100 "have a generally rectangular parallelepiped shape and are disposed adjacent to each other. One sidewall of the process chambers 100, 100', 100" has a substrate S formed by the process chambers 100, 100 ', 100 ". Inflow inlets 110a and 110a "are provided, and opposite sidewalls thereof are provided with outlets 110b and 110b 'through which the substrate S flows out from the process chambers 100, 100' and 100".

In each process chamber 100, 100 ′, 100 ″, a predetermined process is performed on the substrate S. A cleaning process is performed in the process chamber 100 among the process chambers 100, 100 ′, 100 ″. An etching process is performed in the process chamber 100 ′ positioned in front of the process chamber 100 where the cleaning process is performed, and a process chamber 100 ″ positioned behind the process chamber 100 where the cleaning process is performed. In the drying process may proceed.

The cleaning members 300 and 400 are installed in the process chamber 100 where the cleaning process is performed, and the cleaning members 300 and 400 clean the substrate S being moved by the substrate transfer unit 200.

2 is a plan view of a process chamber in which the cleaning process of FIG. 1 is performed, FIG. 3 is a side view of the substrate transfer unit of FIG. 2, and FIG. 4 is a side view of the brush cleaning unit of FIG. 2.

1 and 2 to 4, the substrate transfer unit 200 includes transfer shafts 210, a power transmission member 220, a driving member 230, and a guide member 240.

The transfer shafts 210 are disposed side by side at heights corresponding to the inlets 110a and the outlets 110b formed on the sidewalls of the process chamber 100. As shown in FIG. 3, the transfer shafts 210 may be inclined at an inclination angle of θ so that one end is positioned higher than the other end. In this case, a guide member 240 to be described later is disposed at the other end of the transfer shafts 210 disposed at a lower position to support the side surface of the substrate moving in an inclined state. The process of treating the substrate by spraying chemical or deionized water is usually carried out while transferring the substrate, in which the substrate is inclined at a predetermined angle so that the processing liquid that has processed the substrate is easily removed from the substrate.

Both ends of the transfer shafts 210 are supported by a rotation support member (not shown) such as a bearing. Feed rollers 212 are installed at a plurality of points in the longitudinal direction of the feed shafts 210. The transfer rollers 212 are installed to insert the transfer shaft 210 and rotate together with the transfer shaft 210.

The power transmission member 220 is connected to the transfer shafts 210. The power transmission member 220 transmits the rotational force of the driving member 230 to the transfer shaft 210. The power transmission member 220 includes pulleys 222 and belts 224. The pulleys 222 may be installed at both ends of the transfer shafts 210, and may be installed at either end of both ends of the transfer shafts 210. Pulleys 222 are connected by a belt 224. Pulleys 222 installed on adjacent transfer shafts 210 are connected in pairs by belts 224.

Alternatively, a gear may be used as the power transmission member 220. Gears may be connected to both ends or one end of the transfer shafts 210, and the transfer shafts 210 may be arranged to engage the gears. Also, in order to selectively prevent particle generation due to mechanical friction, a magnet member (not shown) that transmits rotational force by using magnetic force may be used as the power transmission member 220.

The drive member 230 is connected to any one of the pulleys 222 to provide rotational force to at least one of the power transmission members 220. A motor may be used as the driving member 230. When the rotational force of the driving member 230 is transmitted to the transfer shafts 210 by the power transmission member 220, the substrate S placed above the transfer rollers 212 of the transfer shafts 210 is transferred to the transfer rollers 212. Are moved in one direction by the rotation of the

The guide member 240 includes a guide shaft 242, a bearing member 244, and a guide roller 246. The guide shafts 242 are arranged in a line near one end of the conveying shafts 210 along the arrangement direction of the conveying shafts 210. The bearing member 244 is provided in the guide shaft 242, and the guide roller 246 surrounding the bearing member 244 is provided in the bearing member 244. In detail, the guide roller 246 may be provided as a hollow cylindrical member, and the bearing member 244 is inserted into the guide roller 246. The guide roller 246 may be made of a synthetic resin material such as polyether ether ketone (PEEK) or the like.

Referring back to FIG. 1, the substrate S is cleaned by the cleaning members 300 and 400 while being moved by the substrate transfer unit 200 in the process chamber 100. The cleaning members 300 and 400 include a steam cleaning unit 300 and a brush cleaning unit 400.

The steam cleaning unit 300 primarily cleans the substrate S by spraying high temperature and high pressure steam onto the substrate S. Contaminants, such as particles attached to the substrate S by steam, are removed from the substrate S or the adhesion to the substrate S is lowered.

The brush cleaning unit 400 secondaryly cleans the substrate S, which has been cleaned by the steam cleaning unit 300, using the physical contact force of the brush. The contaminants remaining on the substrate S are removed from the substrate S by the brush 410. Particles having a size of several micrometers or less are degraded in adhesion to the substrate S by cleaning with steam and then removed from the substrate S by cleaning with the brush 410.

Referring again to FIGS. 2 and 4, the brush cleaning unit 400 includes a first brush cleaning unit 420 and a second brush cleaning unit 440. The first and second brush cleaning units 420 and 440 are arranged side by side in the process chamber 100. Since the first and second brush cleaning units 420 and 440 have the same configuration, hereinafter, the first brush cleaning unit 420 will be described as an example and detailed description of the second brush cleaning unit 440 will be omitted.

As illustrated in FIG. 4, the first brush cleaning unit 420 includes an upper brush cleaning unit 420a for cleaning the upper surface of the substrate S and a lower brush cleaning unit 420b for cleaning the lower surface of the substrate S. FIG. ). The upper and lower brush cleaning units 420a and 420b have brushes 422 and 422 ', brush shafts 424a, 424b, 424'a and 424'b and motors 426 and 426', respectively. Brushes 422 and 422 'contact the substrate S to physically remove contaminants from the substrate S. Brushes 422 and 422 ′ have a length corresponding to the width of the substrate S and are disposed above and below the substrate S in the process chamber 100, respectively. One end of the brush shafts 424a, 424b, 424'a, 424'b is coupled to both ends of the brushes 422, 422 ', and the brush shafts of the brush shafts 424a, 424b, 424'a, 424'b. The other ends of 424b and 424'b are connected to motors 426 and 426 'installed outside the process chamber 100. Brush shafts 424a, 424b, 424'a, 424'b are rotatably supported by bearing members 425a, 425b, 425'a, 425'b.

Since the transfer shafts 210 are arranged to be inclined at an inclination angle of θ so that one end is positioned higher than the other end, as shown in FIG. 3, the substrate S moved by the transfer shafts 210 is also inclined angle of θ. Is moved inclined by. Thus, as shown in FIG. 4, the brush 422 and brush shafts 424a and 424b of the upper brush cleaning unit 420a, and the brush 422 'and brush shafts of the lower brush cleaning unit 420b. (424'a, 424'b) are also inclined at an inclination angle of θ. In order to maintain the contact area between the brushes 422 and 422 'uniformly, the brushes 422 and 422' are preferably provided such that the distance between the brushes 422 and 422 'is the same along the longitudinal direction.

As described above, the substrate S is moved in a state inclined at an inclination angle of θ with respect to the ground. For this reason, the washing | cleaning liquid (for example, deionized water DIW etc.) supplied to the inclined board | substrate S at the time of a washing | cleaning process progresses flows in the direction inclined downward with respect to the surface. At this time, the cleaning liquid may flow through the brushes 422 and 422 'and the brush shafts 424b and 424'b in contact with the substrate and leak out of the process chamber (refer to reference numeral 100 of FIG. 1). To prevent this, the liquid membrane members 427 and 427 'are installed on the brush shafts 424b and 424'b. The liquid blocking members 427 and 427 'have a flange shape.

However, the liquid film members 427 and 427 'may block only a part of the cleaning liquid flowing through the brush shafts 424b and 424'b, and the unblocked cleaning liquid flows through the brush shafts 424b and 424'b. It may leak to the outside of the chamber 100. In order to solve this problem, the present invention is provided with a gas injection member (430, 450). The gas injecting members 430 and 450 inject gas to prevent the cleaning liquid from flowing out through the gap space between the sidewall 110 of the process chamber 100 and the brush shafts 424b and 424'b.

5 is an enlarged view of a portion “A” of FIG. 4, FIG. 6 is a perspective view of the gas injection member of FIG. 5, and FIG. 7 is a cross-sectional view of the gas injection member of FIG. 6.

5 through 7, gas injection members 430 and 450 are provided to surround the brush shafts 424b and 424'b, and the insertion holes 112 formed in the sidewall 110 of the process chamber 100. Is installed. The gas injection members 430 and 450 have the same configuration, and the gas injection members 430 will be described below.

The gas injection member 430 has a torus shaped lower wall 431. The side wall 432 extends vertically from the edge of the lower wall 431, and the inclined wall 433 extends inclined inward from the top of the side wall 432. The side wall 432 has a cylindrical shape with open top and bottom, and the inclined wall 433 has a truncated cone shape with open top and bottom.

Inside the wall of the lower wall 431, the side wall 432, and the inclined wall 433, a gas flow path P is formed, and the flow paths P are connected to each other. At the end of the flow path of the inclined wall 433, a discharge port 433a for injecting gas is formed. The lower wall 431 is provided with a gas inlet 434 through which gas is introduced. A gas supply line 435 is connected to the gas inlet 434, and a gas supply line 435 is connected to the gas source 436. Gas supplied from the gas source 436 enters the flow path of the lower wall 431 through the gas supply line 435 and the gas inlet 434. The gas flows along the flow path of the lower wall 431, the side wall 432, and the inclined wall 433, and is injected through the discharge port 433a of the inclined wall 433.

The outer side of the side wall 432 is provided with a flange 437 extending radially from the side wall 432, the male screw 437a is formed on the outer peripheral surface of the flange 437. As the male screw 437a of the flange 437 is screwed into the female screw formed in the insertion hole 112 of the side wall 110 of the process chamber 100, the gas injection member 430 is formed into the side wall 110 of the process chamber 100. Is installed on.

8 is a view for explaining a process of blocking the leakage of the cleaning liquid by using the gas injection member 430.

Referring to FIG. 8, the cleaning liquid supplied to the substrate is in contact with the brush 422 during the substrate cleaning process, and flows obliquely through the brush 422 and the brush shaft 424b. This is because the brush 422 and the brush shaft 424b are inclined. The cleaning liquid flowing through the brush 422 and the brush shaft 424b is primarily blocked by the member 427, and the blocked cleaning liquid drops downward. However, only a portion of the cleaning liquid whose flow is blocked by the member 427 is blocked. Since the brush shaft 424b rotates during the process, the cleaning liquid passes over the member 427 due to the rotational force of the brush shaft 424b. Thus, the cleaning liquid in which the liquid film is not blocked by the member 427 continues to flow through the brush shaft 424b. At this time, when the gas is injected to the brush shaft 424b through the gas injection member 430, the cleaning liquid flowing through the brush shaft 424b is blocked by the injection pressure of the gas, and is separated from the brush shaft 424b. By falling down. Due to the action of the gas injection member 430, leakage of the cleaning liquid through the sidewall 110 of the process chamber 100 may be blocked. In addition, when the leakage of the cleaning liquid is blocked, the conventional problem that the external equipment of the process chamber 100 is contaminated by the leaked cleaning liquid can be solved.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

1 is a cross-sectional view showing an example of a substrate cleaning apparatus according to the present invention;

2 is a plan view of a process chamber in which the cleaning process of FIG. 1 is performed;

3 is a side view of the substrate transfer unit of FIG. 2;

4 is a side view of the brush cleaning unit of FIG. 2, FIG.

5 is an enlarged view of a portion “A” of FIG. 4;

6 is a perspective view of the gas injection member of FIG. 5, FIG.

7 is a cross-sectional view of the gas injection member of FIG.

8 is a view for explaining a process of blocking the leakage of the cleaning liquid by using a gas injection member.

<Description of Symbols for Main Parts of Drawings>

100: process chamber 200: substrate transfer unit

400: brush cleaning unit 422: brush

424b: brush shaft 430: gas injection member

Claims (10)

delete delete A chamber in which a substrate processing process is performed; A shaft member installed through the wall of the chamber; A gas injection member for injecting gas to block outflow of processing fluid through the clearance space between the shaft member and the chamber wall, The gas injection member is provided to surround the shaft member and is installed in an insertion hole formed in the chamber wall to insert the shaft member, The gas injection member, A torus shaped lower wall; A cylindrical side wall extending vertically from an edge of the lower wall and inserted into the insertion hole; Including a truncated conical inclined wall extending inclined inwardly from the top of the side wall, The lower wall, the side wall, and the wall of the inclined wall are formed so that the gas flow paths are connected to each other, and a discharge port for injecting the gas to the shaft member is formed at the end of the flow path of the inclined wall. Substrate processing apparatus. The method of claim 3, wherein The gas injection member, And a gas inlet installed in the lower wall to supply the gas to a flow path inside the lower wall. The method of claim 4, wherein The gas injection member, Further comprising a flange extending from the side wall, And a male screw formed on an outer circumferential surface of the flange to engage with a female screw formed in the insertion hole of the chamber wall. delete delete In the apparatus for cleaning a substrate, A process chamber providing a space in which the cleaning process proceeds; A substrate transfer unit installed in the process chamber to move a substrate; A brush cleaning unit having a brush for cleaning the substrate moved by the substrate transfer unit, and a brush shaft on which the brush is mounted and penetrated through a wall of the process chamber; A gas ejection member for injecting gas to block outflow of cleaning fluid through the clearance space between the brush shaft and the process chamber wall, The gas injection member is provided to enclose the brush shaft and is installed in an insertion hole formed in the process chamber wall to insert the brush shaft, The gas injection member, A torus shaped lower wall; A cylindrical side wall extending vertically from an edge of the lower wall and inserted into the insertion hole; And a truncated cone-shaped inclined wall extending inclined inwardly from an upper end of the side wall. The lower wall, the side wall, and the wall of the inclined wall are formed so that the gas flow paths are connected to each other, and a discharge port for injecting the gas to the brush shaft is formed at the end of the flow path of the inclined wall. Substrate processing apparatus. The method of claim 8, The gas injection member, And a gas inlet installed in the lower wall to supply the gas to a flow path inside the lower wall. The method of claim 9, The gas injection member, Further comprising a flange extending from the side wall, And an external thread formed on an outer circumferential surface of the flange to engage with an internal thread formed in the insertion hole of the process chamber wall.

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