KR101398441B1 - Single type cleaning apparatus for substrate - Google Patents

Abstract

A single-wafer type cleaning apparatus capable of shutting off the flow of a cleaning liquid flowing along a rotation axis is disclosed. The single wafer type cleaning apparatus includes a spin chuck for fixing a substrate, a rotary shaft provided below the spin chuck, a jet port for jetting purge gas through the rotary shaft, and a suction port for forming a negative pressure, And a flow preventing portion for preventing the outflow of the rinsing liquid flowing out of the rush. Therefore, since the flow preventing unit including the jet port and the suction port is provided on the rotary shaft, the flow of the cleaning liquid is blocked by the air curtain effect at the jet port and the suction at the suction port, .

Single wafer cleaning device, spin chuck, chuck pin

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a single-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single wafer type cleaning apparatus for a substrate, and to a single wafer type cleaning apparatus for preventing a cleaning solution from flowing along a rotation axis.

In general, a semiconductor device can be manufactured by repeatedly performing a deposition, a photolithography and an etching process using a substrate, for example, a silicon wafer. Contaminants such as various kinds of particles, metal impurities, organic impurities and the like may remain on the substrate during the processes. Since contaminants adversely affect the yield and reliability of semiconductor devices, a cleaning process is performed to remove contaminants remaining on the substrate during semiconductor manufacturing.

The cleaning method for the cleaning process can be roughly divided into a dry cleaning method and a wet cleaning method. Among them, the wet cleaning method is a cleaning method using various chemical solutions, batch type cleaning apparatus and a single wafer type cleaning apparatus for cleaning a substrate by a single unit.

In the batch type cleaning apparatus, a plurality of substrates are simultaneously immersed in a cleaning tank containing a cleaning liquid to remove contamination sources. However, the conventional batch type cleaning apparatus has a disadvantage in that it is not easy to cope with the tendency to increase the size of the substrate, and the cleaning liquid is used in many cases. Further, when the substrate is broken during the cleaning process in the batch type cleaning apparatus, the entire substrate in the cleaning tank is affected, which may cause a large number of substrate defects.

For the above reasons, a single-wafer type cleaning apparatus has recently been preferred.

A single-wafer type cleaning apparatus is a method of processing a single substrate, and is a spin type method in which a cleaning liquid is jetted onto a surface of a substrate rotated at a high speed to remove a contamination source by using a centrifugal force due to rotation of the substrate, spinning method).

Typically, a single wafer type cleaning apparatus includes a spin chuck rotating while holding a substrate and a chamber in which a substrate is accommodated and subjected to a cleaning process, and a nozzle assembly for supplying a cleaning solution containing a chemical solution, a rinsing solution, a drying gas, .

Conventional single wafer type cleaning apparatuses clean a substrate by receiving a substrate in a chamber and spraying a cleaning liquid onto a substrate surface which is fixed at a predetermined speed while being fixed to a spin chuck. Here, the cleaning liquid sprayed on the substrate during the cleaning process and scattered on the surface of the substrate is collected and collected on the side of the chamber, and the cleaning liquid flowing to the bottom of the spin chuck is collected and collected in the lower portion of the chamber.

However, since the conventional spin chuck rotates and moves up and down in the chamber, it is difficult for the chamber and the rotating shaft to be completely sealed. Then, the cleaning liquid may flow out of the chamber along the rotation axis and flow to the lower portion of the rotation axis.

In other words, various peripheral devices for operating the cleaning device are provided in the lower portion of the rotating shaft of the cleaning device. Peripheral devices under the cleaning device may be damaged due to the leakage of the cleaning liquid.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a single-wafer type cleaning apparatus capable of preventing a peripheral device from being damaged by flowing a cleaning liquid downward along a rotation axis.

According to the embodiments of the present invention, the single wafer type cleaning apparatus includes a spin chuck for fixing a substrate, a rotation shaft provided below the spin chuck, and a jet port And a flow prevention part provided on the rotary shaft and preventing the flow of the cleaning liquid flowing out through the rotary shaft.

In an embodiment, the flow prevention portion has a ring shape provided on the outer side of the rotation axis, and the inner side of the flow prevention portion is spaced apart from the rotation axis surface by a predetermined distance.

In an embodiment, the injection port has a slit shape or a plurality of hole shapes formed so as to inject purge gas in the radial direction of the rotation axis along the inside of the flow prevention portion. The suction port is formed parallel to the jet port and has a slit shape or a plurality of hole shapes.

In an embodiment, the suction port is formed above the ejection port. A suction port is provided at a lower portion of the injection port.

According to the present invention, first, by providing a ring-shaped flow prevention portion outside the rotation axis, it is possible to prevent the cleaning liquid from flowing to the lower portion of the cleaning device along the rotation axis, and to prevent the peripheral device from being damaged due to the cleaning liquid.

Secondly, the flow prevention portion sucks the cleaning liquid from the suction port, and blocks the flow of the cleaning liquid by the air curtain effect by the purge gas injection at the ejection port, thereby effectively preventing the leakage of the cleaning liquid.

In addition, since the cleaning liquid is forced into the suction port as the purge gas is injected from the ejection port, the flow of the cleaning liquid can be effectively blocked.

Thirdly, the flow preventing portion can prevent not only leakage of the cleaning liquid but also outside air into the chamber.

The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or limited by the embodiments.

1 is a longitudinal sectional view for explaining a single-wafer type cleaning apparatus according to an embodiment of the present invention. Fig. 2 is a sectional view for explaining the flow preventing portion of Fig. 1, and Fig. 3 is an exploded perspective view of the flow preventing portion of Fig.

Fig. 4 is an exploded perspective view for explaining a modified embodiment of the flow preventing portion of Fig. 2; Fig. 5 is a cross-sectional view for explaining another modified embodiment of the flow preventing portion of FIG.

Hereinafter, a single-wafer type cleaning apparatus according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 5. FIG.

Referring to FIG. 1, the single wafer type cleaning apparatus 100 includes a chamber 110, a spin chuck 120, a nozzle assembly 140, and a flow prevention portion 150.

The chamber 110 serves to prevent scattering of the cleaning liquid provided on the substrate W while the cleaning process is performed on the substrate W and to recover the cleaning liquid. For example, the chamber 110 has a bowl shape so as to surround the spin chuck 120, and the upper part of the chamber 110 can be opened to allow the substrate W to enter and exit.

Here, the substrate W may be a silicon wafer to be a semiconductor substrate. However, the present invention is not limited thereto, and the substrate W may be a glass substrate for a flat panel display device such as a liquid crystal display (LCD) or a plasma display panel (PDP). In addition, the shape and size of the substrate W are not limited by the drawings, and may have substantially various shapes and sizes such as circular and rectangular plates. The size and shape of the chamber and the spin chuck 120 may also be changed according to the shape and size of the substrate W.

The nozzle assembly 140 includes an injection nozzle 141 disposed on the substrate W for spraying a cleaning liquid onto the upper surface of the substrate W and a cleaning liquid supply unit 145 for supplying the cleaning liquid to the spray nozzle 141, . The nozzle assembly 140 is provided on the substrate W so as to be capable of swinging with respect to the cleaning liquid supply unit 145 or linearly moving in the forward and backward directions with respect to the substrate W, And a nozzle driving unit (not shown) for driving the nozzle assembly 140 may be provided.

The cleaning liquid includes a chemical liquid determined according to the type of the substrate W and a substance to be removed, and a mixed liquid in which pure water or the pure water and chemical liquids are mixed at a predetermined ratio. And a purge gas which is not in a liquid state but is used in the cleaning process of the substrate W. [

The spin chuck 120 is provided in the chamber 110 so as to be rotatable while the substrate W is fixed.

In detail, the spin chuck 120 has a circular plate shape corresponding to the substrate W, and the wafer W is mounted on the spin chuck 120, and a chuck pin 121 Respectively.

The chuck pin 121 protrudes from the upper surface of the spin chuck 120 at a predetermined height so as to support the substrate W at a predetermined distance from the surface of the spin chuck 120.

Further, the chuck pin 121 is disposed to stably support the substrate W. For example, the chuck pin 121 is disposed on the circumference corresponding to the edge of the substrate W in the spin chuck 120. In addition, at least three or more chuck pins 121 are provided to stably support the substrate W.

The spin chuck 120 includes a rotating shaft 130 for rotating the spin chuck 120 and a driving unit 135 provided below the rotating shaft 130 to generate rotational driving force to the spin chuck 120 Respectively.

The flow preventing portion 150 is provided on the rotating shaft 130. For example, the flow prevention part 150 has a ring shape that can be coupled to the outside of the rotation shaft 130.

The flow preventing part 150 is provided with an inner side surface spaced apart from the surface of the rotating shaft 130 by a predetermined distance and injects purge gas into the gap between the rotating shaft 130 and the inner side surface of the flow preventing part 150 And has an injection port 151 and a suction port 152 for forming a negative pressure in the gap. The flow prevention unit 150 includes a purge gas supply unit 161 for supplying a purge gas to the injection port 151 and a suction pump 162 for forming a negative pressure in the suction port 152.

The jet port 151 can block the flow of the cleaning liquid from flowing along the rotation axis 130 due to the jet pressure of the purge gas and the air curtain effect by the purge gas injection by jetting the purge gas onto the surface of the rotation shaft 130 . In addition, the flow prevention part 150 has an effect of preventing the outside air from flowing into the chamber 110 along the rotation shaft 130.

The suction port 152 can draw a cleaning liquid flowing along the rotation shaft 130 by forming a negative pressure in a gap between the rotation shaft 130 and the flow prevention part 150.

Here, the suction port 152 is disposed on the upper portion of the jet port 151 to improve the flow-out blocking effect of the flow preventer 150. The suction port 152 is disposed at an upper portion of the ejection port 151. The opened end of the suction port 152 is located at a position higher than the open end of the ejection port 151, Quot;). ≪ / RTI > Even if the washing liquid can not be completely sucked in the suction port 152, even if the remaining washing liquid flows along the rotating shaft 130, the flow of the washing liquid by the jet port 151 can be prevented, Lt; RTI ID = 0.0 > downward < / RTI > 2, the purge gas injected from the injection port 151 is scattered toward both sides of the injection port 151 with the surface of the rotation shaft 130 colliding with the purge gas, The cleaning liquid can be forced into the suction port 152 by the flow.

2 and 3, the injection port 151 and the suction port 152 are formed in a direction perpendicular to the rotation axis 130 and the flow prevention part 150 Shaped slit formed along the inner side of the slit. The injection port 151 and the suction port 152 are formed parallel to each other and are spaced apart from each other by a predetermined distance in the vertical direction inside the flow prevention portion 150.

The flow prevention part 150 includes the injection port 151 and the suction port 152. The suction port 152 is disposed above the injection port 151 and the suction port 152 And the ejection port 151 block the flow of the washing liquid, the effect of preventing the washing liquid from leaking can be improved.

The ejection port 151 and the suction port 152 are formed in a slit shape so that the ejection port 151 forms a circular purge gas injection area with respect to the rotation axis 130, (152) also forms a circular suction area on the surface of the rotating shaft (130). Therefore, the flow prevention part 150 prevents the occurrence of a rectangular area in which the injection area and the suction area are not formed, and effectively prevents the flow of the cleaning liquid flowing on the rotation shaft 130.

On the other hand, the flow preventing portion according to the modified embodiment of the above-described embodiment is shown in Fig. The embodiments described below are substantially the same as those of the embodiment described with reference to FIGS. 1 to 3 except for the flow prevention portion, and the same components are denoted by the same reference numerals, and redundant description will be omitted.

4, the flow prevention part 250 has a ring shape in which the rotation shaft 130 is coupled to the rotation shaft 130 and includes a jet port 251 for jetting purge gas to the rotation shaft 130, And a suction port 252 that forms a negative pressure in the suction port 130. A purge gas supply unit 261 for supplying a purge gas to the injection port 251 and a suction pump 262 for forming a negative pressure in the suction port 252 are provided.

The injection port 251 may be a plurality of holes formed so as to inject purge gas toward the rotation shaft 130. The injection port 251 is formed to be capable of injecting a purge gas in a direction perpendicular to the rotation axis 130 from the inside of the flow prevention part 250, Is disposed on the same plane as the one end surface of the second electrode 130.

Also, the suction port 252 is formed in a plurality of holes formed along the inner side of the flow prevention part 250, and is spaced apart from the injection port 251 by a predetermined distance in the vertical direction.

On the other hand, a flow prevention portion according to a modified embodiment of the above-described embodiment is shown in Fig. The embodiments described below are substantially the same as those of the embodiment described with reference to FIGS. 1 to 3 except for the flow prevention portion, and the same constituent elements are denoted by the same reference numerals, and redundant description will be omitted.

5, the flow prevention part 350 includes a jet port 351 for jetting purge gas to the rotation shaft 130 and suction ports 352 and 353 for forming a negative pressure. The flow prevention unit 350 includes a purge gas supply unit 361 for supplying a purge gas to the injection port 351 and a suction pump 362 for forming a negative pressure in the suction ports 352 and 353 .

The injection port 351 is formed in a slit shape that injects purge gas in a direction perpendicular to the rotation axis 130 along the inside of the flow prevention portion 350. The injection port 351 injects purge gas into the rotation shaft 130 to form an air curtain.

The suction ports 352 and 353 are formed in a slit shape spaced apart from the ejection port 351 by a predetermined distance and parallel to the ejection port 351.

The suction ports 352 and 353 and the injection port 351 are not limited to slits but may include a plurality of holes arranged along the inner side of the flow prevention portion 350, Or the like.

The suction ports 352 and 353 include an upper suction port 352 formed on the upper portion of the ejection port 351 and a lower suction port 353 formed below the ejection port 351.

The upper suction port 352 serves to suck the cleaning liquid flowing along the rotation shaft 130. The lower suction port 353 serves to block the outside air flowing into the chamber 110 from the rotation shaft 130.

In other words, the purge gas injected from the injection port 351 is scattered on both sides of the injection port 351 with the surface of the rotation shaft 130 being collided with the suction ports 352 and 353, The cleaning liquid flowing along the rotation shaft 130 is forcedly introduced into the upper suction port 352 by the flow of the purge gas dispersed upwardly in the rotary shaft 130. [ The purge gas dispersed in the downward direction from the rotary shaft 130 flows into the lower suction port 353 to further enhance the air curtain effect of the purge gas and to prevent the outside air from being introduced into the chamber 110 have.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the following claims It can be understood that

1 is a longitudinal sectional view for explaining a single wafer type cleaning apparatus according to an embodiment of the present invention;

Fig. 2 is a sectional view of the main portion of the flow preventing portion of Fig. 1; Fig.

Fig. 3 is an exploded perspective view of the flow preventing portion of Fig. 2; Fig.

Fig. 4 is an exploded perspective view for explaining a modified embodiment of the flow preventing portion of Fig. 2; Fig.

Fig. 5 is a main cross-sectional view for explaining another modified embodiment of the flow preventing portion of Fig. 2;

Description of the Related Art

100: single wafer type cleaning device 110: chamber

120: spin chuck 130: rotating shaft

135: driving part 140: nozzle assembly

141: jet nozzle 145: cleaning liquid supply unit

150: flow prevention part 151: injection port

152: Suction port 161:

162: suction portion W: substrate

Claims (5)

Spin chuck; A rotating shaft provided below the spin chuck; And A flow preventing part having a jet port for jetting the purge gas in the radial direction of the rotary shaft and a suction port for forming a negative pressure around an outer peripheral surface of the rotary shaft; Lt; / RTI > Wherein the injection port has a slit shape or a plurality of hole shapes and is formed along an inner side of the flow prevention portion, Wherein the suction port has a slit shape or a plurality of hole shapes and is formed in parallel with the ejection port and is formed above the ejection port. The method according to claim 1, Wherein the flow preventing portion has a ring shape provided outside the rotating shaft and an inner side of the flow preventing portion is spaced apart from the rotating shaft surface at a predetermined interval. delete delete The method according to claim 1, And a suction port is further provided at a lower portion of the ejection port.

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