KR100923249B1 - 템플릿의 캐버티들에 용융된 솔더를 주입하는 방법 및 이를수행하기 위한 장치 - Google Patents

템플릿의 캐버티들에 용융된 솔더를 주입하는 방법 및 이를수행하기 위한 장치 Download PDF

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Publication number
KR100923249B1
KR100923249B1 KR1020070135567A KR20070135567A KR100923249B1 KR 100923249 B1 KR100923249 B1 KR 100923249B1 KR 1020070135567 A KR1020070135567 A KR 1020070135567A KR 20070135567 A KR20070135567 A KR 20070135567A KR 100923249 B1 KR100923249 B1 KR 100923249B1
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KR
South Korea
Prior art keywords
nozzle
pressure
molten solder
template
cavities
Prior art date
Application number
KR1020070135567A
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English (en)
Korean (ko)
Other versions
KR20090067791A (ko
Inventor
김기돈
정준호
최대근
최준혁
이지혜
Original Assignee
세크론 주식회사
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 세크론 주식회사, 한국기계연구원 filed Critical 세크론 주식회사
Priority to KR1020070135567A priority Critical patent/KR100923249B1/ko
Priority to PCT/KR2008/002040 priority patent/WO2009082062A1/en
Priority to TW097113697A priority patent/TWI384599B/zh
Publication of KR20090067791A publication Critical patent/KR20090067791A/ko
Application granted granted Critical
Publication of KR100923249B1 publication Critical patent/KR100923249B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01093—Neptunium [Np]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020070135567A 2007-12-21 2007-12-21 템플릿의 캐버티들에 용융된 솔더를 주입하는 방법 및 이를수행하기 위한 장치 KR100923249B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020070135567A KR100923249B1 (ko) 2007-12-21 2007-12-21 템플릿의 캐버티들에 용융된 솔더를 주입하는 방법 및 이를수행하기 위한 장치
PCT/KR2008/002040 WO2009082062A1 (en) 2007-12-21 2008-04-11 Method of injecting molten solder into cavities of a template and apparatus for performing the same
TW097113697A TWI384599B (zh) 2007-12-21 2008-04-15 將熔融焊料注入模板之孔穴之方法及用以執行該方法之設備

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070135567A KR100923249B1 (ko) 2007-12-21 2007-12-21 템플릿의 캐버티들에 용융된 솔더를 주입하는 방법 및 이를수행하기 위한 장치

Publications (2)

Publication Number Publication Date
KR20090067791A KR20090067791A (ko) 2009-06-25
KR100923249B1 true KR100923249B1 (ko) 2009-10-27

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Application Number Title Priority Date Filing Date
KR1020070135567A KR100923249B1 (ko) 2007-12-21 2007-12-21 템플릿의 캐버티들에 용융된 솔더를 주입하는 방법 및 이를수행하기 위한 장치

Country Status (3)

Country Link
KR (1) KR100923249B1 (zh)
TW (1) TWI384599B (zh)
WO (1) WO2009082062A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110026151A (ko) * 2009-09-07 2011-03-15 세크론 주식회사 솔더 범프 형성 장치
KR101135562B1 (ko) * 2009-12-03 2012-04-17 세크론 주식회사 템플릿의 캐버티들에 용융된 솔더를 주입하기 위한 노즐 조립체 및 이를 포함하는 솔더 주입 장치
TWI552824B (zh) 2011-10-18 2016-10-11 千住金屬工業股份有限公司 焊料凸塊形成方法及裝置
US20130133193A1 (en) * 2011-11-28 2013-05-30 Mediatek Singapore Pte. Ltd. Surface mount technology process for advanced quad flat no-lead package process and stencil used therewith
TWI460776B (zh) * 2012-06-27 2014-11-11 D Tek Technology Co Ltd 應用於晶圓的銅柱焊料的製造方法及其設備
KR101822985B1 (ko) * 2015-01-13 2018-01-29 센주긴조쿠고교 가부시키가이샤 유체 토출 장치, 유체 토출 방법 및 유체 도포 장치
CN105108262B (zh) * 2015-10-08 2017-03-29 天津电气科学研究院有限公司 一种线路板直插器件自动焊接机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954072A (en) 1986-09-19 1990-09-04 Wolfgang Zimmerman Electrically heated pin-point gate
JPH1140937A (ja) * 1997-07-23 1999-02-12 Matsushita Electric Ind Co Ltd 半田供給方法および半田供給装置
US6615715B2 (en) 2000-07-11 2003-09-09 Matsushita Electric Industrial Co., Ltd. Screen printing apparatus, screen printing method, and paste storage container for screen printing apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666314B2 (ja) * 1991-05-31 1994-08-24 インターナショナル・ビジネス・マシーンズ・コーポレイション バンプ形成方法及び装置
US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US6231333B1 (en) * 1995-08-24 2001-05-15 International Business Machines Corporation Apparatus and method for vacuum injection molding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954072A (en) 1986-09-19 1990-09-04 Wolfgang Zimmerman Electrically heated pin-point gate
JPH1140937A (ja) * 1997-07-23 1999-02-12 Matsushita Electric Ind Co Ltd 半田供給方法および半田供給装置
US6615715B2 (en) 2000-07-11 2003-09-09 Matsushita Electric Industrial Co., Ltd. Screen printing apparatus, screen printing method, and paste storage container for screen printing apparatus

Also Published As

Publication number Publication date
KR20090067791A (ko) 2009-06-25
TWI384599B (zh) 2013-02-01
WO2009082062A1 (en) 2009-07-02
TW200929483A (en) 2009-07-01

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