KR100909934B1 - 단결정 잉곳 절단장치 - Google Patents
단결정 잉곳 절단장치 Download PDFInfo
- Publication number
- KR100909934B1 KR100909934B1 KR1020070095437A KR20070095437A KR100909934B1 KR 100909934 B1 KR100909934 B1 KR 100909934B1 KR 1020070095437 A KR1020070095437 A KR 1020070095437A KR 20070095437 A KR20070095437 A KR 20070095437A KR 100909934 B1 KR100909934 B1 KR 100909934B1
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- slurry
- nozzle
- ingot
- slurry nozzle
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (3)
- 잉곳의 절단을 위한 와이어와, 상기 와이어를 감아서 구동시키는 복수의 와이어롤러 및 상기 와이어에 슬러리를 공급하는 슬러리노즐을 포함하여 이루어진 와이어 소(Wire Saw)를 장착한 단결정 잉곳 절단장치에 있어서,와이어가 단선되었는지의 여부를 감지하기 위해 와이어에 전류가 흐르게 하고, 상기 와이어가 고속으로 회전되어 발생하는 자기장에 의해 와이어의 마모된 철 성분이 슬러리노즐에 들러붙지 않도록 슬러리노즐이 비자성재질로 형성되며,상기 슬러리노즐은,그 일측에 슬러리가 흘러나오도록 소정 패턴으로 홀이 형성되고, 상기 슬러리가 이동되는 통로인 제1유로관;상기 홀이 형성된 제1유로관을 일정간격 이격되어 감싸도록 형성된 제2유로관; 및상기 제2유로관의 일측에 연통되도록 설치되고, 제2유로관으로부터 흘러나온 슬러리를 와이어의 표면에 공급하도록 슬릿이 형성된 분사 프레임;을 구비하는 것을 특징으로 하는 단결정 잉곳 절단장치.
- 제1항에 있어서,상기 슬러리노즐은 스테인레스스틸(SUS)로 형성된 것을 특징으로 하는 단결정 잉곳 절단장치.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070095437A KR100909934B1 (ko) | 2007-09-19 | 2007-09-19 | 단결정 잉곳 절단장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070095437A KR100909934B1 (ko) | 2007-09-19 | 2007-09-19 | 단결정 잉곳 절단장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090030106A KR20090030106A (ko) | 2009-03-24 |
KR100909934B1 true KR100909934B1 (ko) | 2009-07-29 |
Family
ID=40696565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070095437A KR100909934B1 (ko) | 2007-09-19 | 2007-09-19 | 단결정 잉곳 절단장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100909934B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101222275B1 (ko) * | 2010-10-06 | 2013-01-16 | 주식회사 엘지실트론 | 슬러리 공급시스템 |
KR102446802B1 (ko) * | 2015-12-28 | 2022-09-23 | 에스케이실트론 주식회사 | 잉곳 절단 장치 |
TWI770957B (zh) * | 2021-04-26 | 2022-07-11 | 環球晶圓股份有限公司 | 切割晶碇的方法以及晶碇的切割工具 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030019409A (ko) * | 2002-11-30 | 2003-03-06 | 엠이엠씨 일렉트로닉 머티리얼스 쏘시에떼 퍼 아찌오니 | 다수의 반도체 잉곳을 절단하기 위한 와이어 톱 및 그 공정 |
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2007
- 2007-09-19 KR KR1020070095437A patent/KR100909934B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030019409A (ko) * | 2002-11-30 | 2003-03-06 | 엠이엠씨 일렉트로닉 머티리얼스 쏘시에떼 퍼 아찌오니 | 다수의 반도체 잉곳을 절단하기 위한 와이어 톱 및 그 공정 |
Also Published As
Publication number | Publication date |
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KR20090030106A (ko) | 2009-03-24 |
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