KR100905896B1 - Method and apparatus of measuring resistance, and method and apparatus of trimming a thin film resistor pattern having the same - Google Patents

Abstract

The disclosed resistance measuring apparatus and method use a contact to obtain a first resistance value for which a measurement is made by applying a electrical signal to the resistance pattern by making a single contact across each of the resistance patterns. Then, second grounding values are obtained by grounding each of the electrical signals applied to the resistance pattern by being connected to each of the portions where the single contact is made using the grounding portion. Thus, the resistance value of the resistance pattern is obtained from the first resistance value and the second resistance values.

Description

Resistance measuring method and apparatus and method and apparatus for trimming thin film resistance pattern including the same {Method and apparatus of measuring resistance, and method and apparatus of trimming a thin film resistor pattern having the same}

1 is a schematic diagram illustrating a resistance measuring apparatus according to an exemplary embodiment of the present invention.

FIG. 2 is a schematic diagram illustrating a method of measuring a resistance value of a resistance pattern using the resistance measuring device of FIG. 1.

3 is a schematic diagram illustrating a trimming device of a thin film resistance pattern according to an exemplary embodiment of the present invention.

4 is a schematic flowchart illustrating a method of trimming a thin film resistance pattern using the trimming apparatus of the thin film resistance pattern of FIG. 3.

The present invention relates to a method and apparatus for measuring resistance and a method and apparatus for trimming a thin film resistance pattern including the same, and more particularly, to a method and apparatus for measuring resistance by contacting each end of a resistance pattern, and a thin film resistor including the same. A method and apparatus for trimming a pattern.

In general, in the measurement of the resistance value of the resistance pattern, a method and an apparatus for contacting terminals such as probes with each of both ends of the resistance pattern are used. In particular, in the measurement of the resistance value of the above-mentioned resistance pattern, a method and an apparatus in which two terminals are simultaneously brought into contact with both ends of the resistance pattern are used. That is, conventionally, four terminals are used to measure the resistance value of a resistance pattern.

As described above, the conventional apparatus for measuring the resistance value of the aforementioned resistance pattern includes four terminals, so that the structure of the apparatus itself is somewhat complicated.

In addition, the terminals such as the probes mentioned above are somewhat expensive because they require precision machining. Therefore, since the conventional resistance measuring apparatus includes four terminals, the cost of the apparatus itself increases.

An object of the present invention is to provide a method capable of measuring resistance even by a single contact across each of the resistance pattern.

Another object of the present invention is to provide a resistance measuring apparatus capable of implementing the aforementioned method.

Still another object of the present invention is to provide a trimming method of a thin film resistance pattern including the aforementioned resistance measuring method.

Still another object of the present invention is to provide a trimming device of a thin film resistance pattern including the aforementioned resistance measuring device.

One aspect of the present invention provides a resistance measuring method. The resistance measurement method mentioned above obtains a first resistance value at which the measurement is made by applying an electrical signal to the resistance pattern in single contact with each end of the resistance pattern. In addition, second resistance values for which measurement is performed are obtained by grounding each of the electrical signals applied to the resistance pattern in connection with each of the portions in which the single contact is made. Thus, the resistance value of the resistance pattern is obtained from the first resistance value and the second resistance values.

In some embodiments of the present invention, the connection with each of the portions where the single contact is made to obtain the second resistance values is preferably close to the both ends of the resistance pattern without directly contacting both ends of the resistance pattern. . In addition, the connection with each of the portions in which the single contact is made is preferably close to several μm to several mm from the surface of the resistance pattern.

Another aspect of the invention provides a resistance measuring device. The above-mentioned resistance measuring device has a single contact at both ends of the resistance pattern, and includes a contact for applying an electrical signal to the resistance pattern, a ground connected to each of the contacts, and grounding each of the electrical signals applied to the resistance pattern. And a measurement part connected to each of the contact part and the ground part, and configured to measure a resistance value of the resistance pattern by an electric signal transmitted from the contact part and an electric signal transmitted from the ground part.

In some embodiments of the present invention, the ground portion may be connected to the contact portion close to both ends of the resistance pattern without directly contacting both ends of the resistance pattern. In addition, the ground portion is preferably connected to the contact portion within a few μm to several mm from the surface of both ends of the resistance pattern.

In another embodiment of the present invention, the measuring unit is connected to the contact unit, a first measuring unit for measuring a first resistance value from the electrical signal transmitted from the contact unit, and each of the grounding unit, and each of the grounding unit A second measurement unit for measuring second resistance values from an electrical signal transmitted from the second signal; and receiving the first resistance value and the second resistance values, and having the resistance pattern from the first resistance value and the second resistance values. And a display unit for receiving a resistance value from the calculator and displaying the resistance value to the outside.

Another aspect of the invention provides a method of trimming a thin film resistance pattern. The trimming method of the thin film resistance pattern mentioned above obtains a first resistance value to be measured by applying an electrical signal to the thin film resistance pattern by making single contact with each of both ends of the thin film resistance pattern formed on the substrate. In addition, second resistance values for which measurement is performed are obtained by grounding each of the electrical signals applied to the thin film resistance pattern connected to each of the portions in which the single contact is made. Thus, the resistance value of the thin film resistance pattern is obtained from the first resistance value and the second resistance values. Subsequently, when the resistance value of the thin film resistance pattern is different from the set resistance value, a portion of the thin film resistance pattern is cut to adjust the resistance value of the thin film resistance pattern within an error range of the set resistance value.

Another aspect of the present invention provides a trimming device of a thin film resistance pattern. The trimming device of the thin film resistance pattern mentioned above is capable of a single contact on each of both ends of the thin film resistance pattern formed on the substrate, and is connected to each of the contact portions and a contact portion for applying an electrical signal to the thin film resistance pattern. A ground portion for grounding each of the electrical signals applied in the pattern, and connected to each of the contact portion and the ground portion, and the resistance value of the resistance pattern by the electrical signal transmitted from the contact portion and the electrical signal transmitted from the ground portion A resistance measurement unit having a measurement unit to measure and a resistance value of the thin film resistance pattern transmitted from the resistance measurement unit, which is connected to the resistance measurement unit and is different from a set resistance value, by cutting a portion of the thin film resistance pattern to The resistance value of the thin film resistance pattern is adjusted within the error range of the set resistance value. And a cutting unit which.

In one embodiment of the present invention, it is preferable to further include a control unit connected to each of the resistance measuring unit and the cutting unit, and stops the operation of the cutting unit by the resistance value of the thin film resistance pattern transmitted from the resistance measuring unit. Do.

As described above, in the present invention, a contact portion having a single contact is provided at each of both ends of the resistance pattern, and by using this, it is possible to measure and obtain a resistance value of the resistance pattern despite having a single contact at each end of the resistance pattern.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar components. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

First, the resistance measuring apparatus will be described in detail.

Resistance measuring device

1 is a schematic diagram illustrating a resistance measuring apparatus according to an exemplary embodiment of the present invention.

Referring to FIG. 1, the resistance measuring device 100 includes contact parts 10a and 10b, ground parts 12a and 12b, a measuring part 15, and the like.

First, the contact parts 10a and 10b are members that directly contact both ends of the resistance pattern 54 when measuring the resistance value of the resistance pattern 54. That is, the contacts 10a and 10b are members that directly contact both ends of the resistance pattern 54 to apply an electrical signal to the resistance pattern 54. In particular, in an embodiment of the present invention, the contact portions 10a and 10b are provided in a structure including two terminals. Accordingly, the contact portions 10a and 10b according to the exemplary embodiment of the present invention have a configuration in which the contact portions 10a and 10b each have a single contact.

Therefore, the mentioned contacts 10a and 10b may include two terminals such as a probe or the like. In addition, the aforementioned resistance pattern 54 may be understood as a member that mainly connects the electrode patterns 52a and 52b facing each other on the printed circuit board 50 as a thin film resistance pattern. In addition, a portion where the contact portions 10a and 10b directly contact may be understood as the electrode patterns 52a and 52b.

In addition, the ground parts 12a and 12b are members for grounding an electrical signal applied to the resistance pattern 54 by the contact parts 10a and 10b when the resistance value of the resistance pattern 54 is measured. Likewise, since the contact parts 10a and 10b include two terminals, the ground parts 12a and 12b according to the exemplary embodiment of the present invention are also provided in two. Accordingly, the ground parts 12a and 12b may ground each of the electrical signals applied to the resistance pattern 54 when measuring the resistance value of the resistance pattern 54. Looking at the ground of the electrical signal mentioned above in detail with reference to Figure 2, the electrical signal is applied to the resistance pattern 54 by contacting each of the contact portions (10a, 10b) to each of the electrode patterns (52a, 52b). . That is, the electrical signal applied to the resistance pattern 54 has a path passing through the contact portion 10b, the resistance pattern 54 and the contact portion 10b. At this time, the ground of the electrical signal is made to have a path passing through the symbol ② by the grounding portion 12a connected near the contact portion end of 10a, and by the grounding portion 12b connected near the end of the contact portion 10b. The ground of the electrical signal is made to have a path through the symbol ②´. Thus, as mentioned above, the ground parts 12a and 12b may ground each of the electrical signals applied to the resistance pattern 54 when measuring the resistance value of the resistance pattern 54.

In particular, the ground portions 12a and 12b according to the exemplary embodiment of the present invention do not have a structure in which the ground portions 12a and 12b directly contact each of both ends of the resistance pattern 54 when the resistance value of the resistance pattern 54 is measured. , 10b) is connected to each of the two terminals. That is, the ground parts 12a and 12b are connected to the contact parts 10a and 10b in close proximity to both ends of the resistance pattern 54 without directly contacting both ends of the resistance pattern 54. In other words, the ground portions 12a and 12b are connected near the ends of the contact portions 10a and 10b which are in direct contact with each of both ends of the resistance pattern 54. Here, even when the ground portions 12a and 12b are connected near the ends of the contact portions 10a and 10b, the ground portions 12a and 12b are in direct contact with each of the resistance patterns 54 at both ends. It should not be in direct contact with each of the resistive patterns 54.

Therefore, in one embodiment of the present invention, when the contact portions 10a and 10b are in direct contact with each of both ends of the resistance pattern 54, the ground portion is brought into close proximity within about several μm to several mm based on the surface of both ends of the resistance pattern 54. It is preferable to connect (12a, 12b). That is, the ground portions 12a and 12b are connected to adjacent portions within about several μm to several mm based on the ends of the contact portions 10a and 10b.

As such, connecting the ground portions 12a and 12b to the ends of the contact portions 10a and 10b as close as possible to sufficiently reduce external factors such as the line resistance described later when measuring the resistance value of the resistance pattern 54. to be. That is, when the ground parts 12a and 12b are connected to the ends of the contact parts 10a and 10b somewhat apart, accurate resistance values cannot be measured due to external factors such as the mentioned line resistance.

In addition, the measuring unit 15 is a member connected to each of the contact portions 10a and 10b and the ground portions 12a and 12b, and the electrical signal transmitted from the contact portions 10a and 10b and the ground portions 12a and 12b are transmitted. The resistance value of the resistance pattern 54 can be measured from the electric signal. Here, the measurement unit 15 may include a first measurement unit 15a connected to the contact units 10a and 10b and a second measurement unit 15b connected to the ground units 12a and 12b. Accordingly, the measurement unit 15 analyzes an electrical signal transmitted from the contact units 10a and 10b using the first measurement unit 15a to measure the first resistance value, and uses the second measurement unit 15b to contact the contact unit 12a. The second resistance values may be measured by analyzing the electrical signal transmitted from 12b).

Here, the first resistance value includes not only the resistance value of the resistance pattern 54 but also the resistance value due to peripheral factors such as line resistance, and the like. The second resistance values are not the resistance values of the resistance pattern 54 but are mentioned. Resistance value due to surrounding factors.

Accordingly, the measuring unit 15 according to the exemplary embodiment of the present invention includes the calculating unit 15c to more accurately measure the resistance value of the resistance pattern 54.

The arithmetic unit 15c mentioned above is connected to each of the first and second measuring units 15a and 15b. Accordingly, the calculator 15c may receive the first resistance value from the first measurement unit 15a and receive the second resistance values from the second measurement unit 15b. Therefore, the calculating part 15c calculates the resistance value which the resistance pattern 54 has from the 1st resistance value and the 2nd resistance value. Thus, the measurement part 15 can measure the resistance value which the resistance pattern 54 has more accurately by including the operation part 15c mentioned above. Here, the calculating part 15c mainly measures the resistance value of the resistance pattern 54 by excluding a 2nd resistance value from a 1st resistance value more accurately, for example, the microchip etc. which can perform a calculation function are mentioned. Can be.

In addition, the measurement unit 15 may include a display unit 15d capable of displaying a result of the resistance value of the resistance pattern 54. Therefore, the display unit 15d is preferably connected to the calculation unit 15c. Accordingly, the display unit 15d may receive the resistance value of the resistance pattern 54 from the calculator 15c and display it externally. Here, as an example of the display part 15d, the LED (LED) etc. which can display are mentioned. In addition, in the exemplary embodiment of the present invention, the aforementioned display unit 15d is described as being included as one component of the measurement unit. However, in some cases, the display unit 15d may be regarded as a separate component from the measurement unit 15. Can be.

As described above, the resistance measuring apparatus 100 according to the exemplary embodiment may easily measure the resistance value of the resistance pattern 54 despite having a single contact at both ends of the resistance pattern 54. That is, the resistance measurement apparatus 100 mentioned above can easily measure the resistance value of the resistance pattern 54 even if it includes only two terminals such as a probe.

Therefore, the resistance measuring apparatus 100 of the present invention can not only simplify its structure but also expect cost reduction.

And the resistance measuring method using the resistance measuring apparatus mentioned above is demonstrated.

How to measure resistance

FIG. 2 is a schematic diagram illustrating a method of measuring a resistance value of a resistance pattern using the resistance measuring device of FIG. 1.

Referring to FIG. 2, contact portions 10a and 10b are brought into contact with both ends of the resistance pattern 54. In this case, since the contact parts 10a and 10b include two terminals such as probes as mentioned above, the contact parts 10a and 10b have a structure of single contact with each of both ends of the resistance pattern 54. That is, the electrical contact is applied to the resistance pattern 54 by a single contact with each of both ends of the resistance pattern 54 using the contact portions 10a and 10b. In this case, the electrical signal applied to the resistance pattern 54 has a path ① passing through the resistance pattern 54 itself.

In this way, the first resistance value is measured by applying an electrical signal to the resistance pattern 54 by making a single contact with each of both ends of the resistance pattern 54 using the contact portions 10a and 10b. Can be obtained.

When the contact portions 10a and 10b are brought into contact with both ends of the resistance pattern 54, the electrical signal applied to the resistance pattern 54 by the ground portions 12a and 12b is grounded. At this time, the ground portions 12a and 12b are connected near the ends of the contact portions 10a and 10b as mentioned. That is, the ground portions 12a and 12b are positioned close to both ends of the resistance pattern 54 without directly contacting both ends of the resistance pattern 54. Therefore, when measuring the resistance value of the resistance pattern 54, even if the ground portions 12a and 12b are not directly in contact with both ends of the resistance pattern 54, the resistance value generated by external factors such as the line resistance, etc. 2 resistance values) can be measured almost accurately. At this time, the paths of the electrical signals that are grounded by the grounding portions 12a and 12b are ② and ② '. Specifically, an electrical signal is applied to the resistance pattern 54 by contacting each of the contact portions 10a and 10b to each of the electrode patterns 52a and 52b. That is, the electrical signal applied to the resistance pattern 54 has a path passing through the contact portion 10b, the resistance pattern 54 and the contact portion 10b. At this time, the ground of the electrical signal is made to have a path passing through the symbol ② by the grounding portion 12a connected near the contact portion end of 10a, and by the grounding portion 12b connected near the end of the contact portion 10b. The ground of the electrical signal is made to have a path through the symbol ②´. Thus, as mentioned above, the ground parts 12a and 12b may ground each of the electrical signals applied to the resistance pattern 54 when measuring the resistance value of the resistance pattern 54.

In this way, by using the grounding portions 12a and 12b connecting near the ends of the contacting portions 10a and 10b, each of the electrical signals applied to the resistance pattern 54 is grounded, thereby preventing the 2 resistance value can be measured and a second resistance value can be obtained from this.

In other words, when obtaining the above-mentioned second resistance value, the resistance pattern is made by using the ground portions 12a and 12b which are closely connected to both ends of the resistance pattern 54 without directly contacting both ends of the resistance pattern 54. (54) Ground the electrical signals applied to the resistance pattern 54 at portions near each end. Thus, in one embodiment of the present invention, even if not directly in contact with both ends of the resistance pattern 54, it is possible to accurately measure the second resistance values generated by external factors such as line resistance. At this time, as described above, the ground portions 12a and 12b are closely connected to each other within several μm to several mm based on the surface of both ends of the resistance pattern 54. That is, the ground portions 12a and 12b are closely connected to each other within a few μm to several mm based on the ends of the contact portions 10a and 10b.

Therefore, in one embodiment of the present invention, after obtaining the first resistance value and the second resistance values mentioned above, the resistance value of the resistance pattern 54 can be accurately obtained from the first resistance value and the second resistance values. have. In particular, despite the use of the ground connected near the ends of the contact portions 10a and 10b, the resistance value of the resistance pattern 54 can be obtained accurately. That is, in one embodiment of the present invention, although the contact portions 10a and 10b having a single contact to each of both ends of the resistance pattern 54 and the ground portions 12a and 12b connected near the ends of the contact portions 10a and 10b are used, And the resistance value which the resistance pattern 54 has can be obtained correctly.

Therefore, according to the present invention, even if only two terminals such as a probe or the like are included, the resistance value of the resistance pattern 54 can be easily measured.

Next, a trimming method and apparatus of a thin film resistance pattern including the aforementioned resistance measuring method and apparatus will be described.

Trimming device of thin film resistive pattern

3 is a schematic diagram illustrating a trimming device of a thin film resistance pattern according to an exemplary embodiment of the present invention. The trimming device of the thin film resistance pattern of FIG. 3 includes the resistance measuring device of FIG. 1 including a contact portion, a ground portion, and a measurement portion as a resistance measurement portion, and therefore, the same reference numerals are used for overlapping members, and a detailed description thereof is omitted. Let's do it.

Referring to FIG. 3, the resistance measuring part 100 includes contact parts 10a and 10b, ground parts 12a and 12b, and a measuring part 15. Briefly, the contacts 10a and 10b are members capable of a single contact at both ends of the thin film resistance pattern formed on the substrate and apply an electrical signal to the thin film resistance pattern, and the ground parts 12a and 12b are the contact parts 10a and 12b. 10b) are members connected to each other and ground each of the electrical signals applied to the thin film resistance pattern. At this time, the ground portions 12a and 12b are connected near the ends of the contact portions 10a and 10b (for example, within a few μm to several mm). In addition, the measurement unit 15 of the resistance measurement unit 100 is a member that measures the resistance value of the thin film resistance pattern from an electrical signal transmitted from each of the contact units 10a and 10b and the ground units 12a and 12b. The measuring part 15a, the 2nd measuring part 15b, the calculating part 15c, the display part 15d, etc. are included.

In addition to the resistance measuring unit 100, the trimming device 300 of the thin film resistance pattern may further include a cutting unit 31, a controller 33, and the like.

First, the cut part 31 mentioned above is connected to the resistance measuring part 100 and is a member for adjusting the resistance value of the thin film resistance pattern based on the resistance measurement value transmitted from the resistance measuring part 100. Here, the cut part 31 adjusts the resistance value which a thin film resistance pattern has by mainly cutting a part of thin film resistance pattern. As such, the cutout 31 must cut a part of the thin film resistance pattern. In particular, since the recent thin film resistance pattern has a fine structure, the cutout portion 31 is preferably a member using a laser.

Thus, the cutting part 31 of the trimming apparatus 300 according to an embodiment of the present invention may include a member for generating a laser, a member for adjusting the path of the laser to a thin film resistance pattern, and the like. In particular, examples of the member for generating the laser of the cutting part 31 include an Nd: YAG laser generating member, an Nd: YLF laser generating member, an Nd-YVO ₄ laser generating member, and the like. In addition, examples of the member for adjusting the laser path of the cutout part 31 include an optical system including a plurality of lenses.

The controller 33 is connected to each of the resistance measuring unit 100 and the cutting unit 31, and the control unit 33 is connected to each of the cutting unit 31 by the resistance value of the thin film resistance pattern cut from the resistance measuring unit 100. It is a member to stop the operation. That is, the control unit 33 stops the operation of the cutting unit 31 when the resistance value of the thin film resistance pattern transmitted from the resistance measuring unit 100 is within an error range of the set resistance value.

Thus, the trimming apparatus 300 according to an embodiment of the present invention measures the resistance value of the thin film resistance pattern using a member including only two terminals, such as a probe, and the like, and based on the resistance value of the thin film resistance pattern. It can be easily adjusted within the error range of the set resistance value.

Therefore, the trimming device 300 according to the exemplary embodiment of the present invention also has a simple device configuration, and through this, it is possible to expect cost reduction for the device.

How to Trim Thin Film Resistor Patterns

4 is a schematic flowchart illustrating a method of trimming a thin film resistance pattern using the trimming apparatus of the thin film resistance pattern of FIG. 3.

Referring to FIG. 4, the contact portions 10a and 10b of the resistance measuring unit 100 are contacted to both ends of the thin film resistance pattern, and a first resistance value is measured by applying an electrical signal. In this case, since the contact portions 10a and 10b of the resistance measuring unit 100 include two terminals, such as a probe, as described above, the contact portions 10a and 10b have a structure of single contact with both ends of the resistance pattern.

When the contact portions 10a and 10b of the resistance measuring unit 100 are in contact with both ends of the thin film resistance pattern, the electrical signal applied by the ground portions 12a and 12b of the resistance measuring unit 100 to the thin film resistance pattern is Grounding is made. In particular, as mentioned, the ground parts 12a and 12b of the resistance measuring part 100 are located near the ends of the contact parts 10a and 10b to ground the electrical signal applied to the thin film resistance pattern. As described above, the second resistance value is measured by an external factor such as a line resistance by grounding each of the electrical signals applied to the thin film resistance pattern using the grounding portions 12a and 12b of the resistance measuring unit 100. From this, a second resistance value can be obtained. (S43)

Subsequently, in an embodiment of the present invention, after obtaining the aforementioned first and second resistance values, the resistance value of the thin film resistance pattern is obtained from the first and second resistance values (S45). In this case, the resistance value of the thin film resistance pattern uses the calculation unit 15c of the resistance measurement unit 100 mentioned above. In addition, the display unit 15d of the resistance measuring unit 100 may display the resistance value of the currently obtained thin film resistance pattern.

The resistance value of the currently obtained thin film resistance pattern is transmitted to the controller 33. Then, the controller 33 determines whether the resistance value of the currently obtained thin film resistance pattern is similar to the set resistance value (S47). That is, the resistance value of the currently obtained thin film resistance pattern is within an error range of the set resistance value. To judge whether it satisfies.

Here, when the resistance value of the currently obtained thin film resistance pattern satisfies within an error range of the set resistance value, the subsequent process is performed without trimming the thin film resistance pattern.

However, when the resistance value of the currently obtained thin film resistance pattern does not satisfy the error range of the set resistance value, the control unit 33 transmits a control signal to the cutting unit 31, and the cutting unit receives the control signal mentioned above. 31 cuts a part of the thin film resistance pattern and adjusts the resistance value of the thin film resistance pattern so as to be within an error range of the set resistance value (S49).

Here, the thin film resistance pattern is a member mainly formed on an embedded printed circuit board. The thin film resistance pattern is formed to have a resistance value somewhat lower than the set resistance value, and is adjusted to have a set resistance value by trimming a part of the thin film resistance pattern mentioned above. .

Therefore, in the present invention, the resistance measurement unit 100 accurately measures the resistance value of the current thin film resistance pattern, and based on this, the resistance value of the thin film resistance pattern using the control unit 33 and the cutting unit 31 and the like. Is adjusted to satisfy the error range of the set resistance value.

As described above, according to the present invention, both the resistance measuring device and the trimming device including the same can easily measure the resistance value of the resistance pattern even using two terminals such as a probe.

Therefore, the present invention can further simplify the device configuration of the resistance measuring device and the trimming device including the same, and can thereby expect cost reduction for the device configuration. In addition, even by using a simplified resistance measuring apparatus and a trimming apparatus including the same, the resistance value of the resistance pattern can be accurately measured, and even the trimming of the thin film resistance pattern can be accurately performed.

Therefore, the present invention can be more actively applied to the latest resistance measuring apparatus and method and the trimming apparatus and method including the same, requiring simplicity and cost competitiveness.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims (10)

A contact portion capable of a single contact across each of the resistance patterns, for applying an electrical signal to the resistance pattern; A ground part connected to each of the contact parts and grounding each of the electrical signals applied to the resistance pattern; And And a measurement unit connected to each of the contact unit and the ground unit, and configured to measure a resistance value of the resistance pattern by an electrical signal transmitted from the contact unit and an electrical signal transmitted from the ground unit. The resistance measuring apparatus of claim 1, wherein the ground part is connected to the contact part in proximity to both ends of the resistance pattern without directly contacting both ends of the resistance pattern. The resistance measuring apparatus of claim 1, wherein the grounding portion is connected to the contact portion in a range of several μm to several mm from a surface of both ends of the resistance pattern. The method of claim 3, wherein the measuring unit, A first measurement unit connected to the contact unit and configured to measure a first resistance value from an electrical signal transmitted from the contact unit; A second measuring part connected to each of the ground parts and measuring second resistance values from an electrical signal transmitted from each of the ground parts; An operation unit receiving the first resistance value and the second resistance value and calculating a resistance value of the resistance pattern from the first resistance value and the second resistance value; And And a display unit receiving the resistance value from the calculator and displaying the resistance value to the outside. Obtaining a first resistance value at which measurement is performed by applying an electrical signal to the thin film resistance pattern by single contacting each of both ends of the thin film resistance pattern formed on the substrate; Obtaining second resistance values measured by grounding each of the electrical signals applied to the thin film resistance pattern connected to each of the portions in which the single contact is made; Obtaining a resistance value of the thin film resistance pattern from the first resistance value and the second resistance values; And When the resistance value of the thin film resistance pattern is different from the set resistance value, cutting a portion of the thin film resistance pattern to adjust the resistance value of the thin film resistance pattern within an error range of the set resistance value. How to trim. 6. The method of claim 5, wherein in the obtaining of the second resistance values, the connection with each of the portions in which the single contact is made is close to the surface of the thin film resistance pattern within a few μm to several mm. How to trim. A single contact is possible at each of both ends of the thin film resistance pattern formed on the substrate, and a contact portion for applying an electrical signal to the thin film resistance pattern, and a ground of each electrical signal connected to each of the contact portions and applied to the thin film resistance pattern, respectively. A resistance measuring part including a grounding part connected to each of the contact part and the ground part and measuring a resistance value of the resistance pattern by an electrical signal transmitted from the contact part and an electrical signal transmitted from the ground part. ; And When the resistance value of the thin film resistance pattern transmitted from the resistance measuring unit is different from the set resistance value, the resistance value of the thin film resistance pattern is cut by cutting a portion of the thin film resistance pattern. Trimming device of a thin film resistance pattern comprising a cutting portion for adjusting within the error range of the value. The trimming device of claim 7, wherein the ground part of the resistance measuring part is connected to the contact part within a range of several μm to several mm from a surface of both ends of the resistance pattern. The method of claim 7, wherein the measurement unit of the resistance measuring unit, A first measurement unit connected to the contact unit and configured to measure a first resistance value from an electrical signal transmitted from the contact unit; A second measuring part connected to each of the ground parts and measuring second resistance values from an electrical signal transmitted from each of the ground parts; An operation unit receiving the first resistance value and the second resistance value and calculating a resistance value of the resistance pattern from the first resistance value and the second resistance value; And And a display unit configured to receive a resistance value from the calculator and display the resistance value to the outside. The method of claim 7, further comprising a control unit connected to each of the resistance measuring unit and the cutting unit and stopping the operation of the cutting unit by a resistance value of the thin film resistance pattern transmitted from the resistance measuring unit. Trimming device of thin film resistive pattern.

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