KR100894624B1 - 직물형 반도체 소자 패키지와 그 설치방법 및 제조방법 - Google Patents

직물형 반도체 소자 패키지와 그 설치방법 및 제조방법 Download PDF

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Publication number
KR100894624B1
KR100894624B1 KR1020080002949A KR20080002949A KR100894624B1 KR 100894624 B1 KR100894624 B1 KR 100894624B1 KR 1020080002949 A KR1020080002949 A KR 1020080002949A KR 20080002949 A KR20080002949 A KR 20080002949A KR 100894624 B1 KR100894624 B1 KR 100894624B1
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KR
South Korea
Prior art keywords
semiconductor device
circuit board
printed circuit
fabric
device package
Prior art date
Application number
KR1020080002949A
Other languages
English (en)
Korean (ko)
Other versions
KR20080093856A (ko
Inventor
유회준
김용상
김혜정
Original Assignee
한국과학기술원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국과학기술원 filed Critical 한국과학기술원
Priority to DE102008011187A priority Critical patent/DE102008011187A1/de
Priority to US12/037,203 priority patent/US7638885B2/en
Priority to JP2008043931A priority patent/JP4813506B2/ja
Publication of KR20080093856A publication Critical patent/KR20080093856A/ko
Application granted granted Critical
Publication of KR100894624B1 publication Critical patent/KR100894624B1/ko
Priority to JP2011148235A priority patent/JP2011205134A/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
KR1020080002949A 2007-04-18 2008-01-10 직물형 반도체 소자 패키지와 그 설치방법 및 제조방법 KR100894624B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102008011187A DE102008011187A1 (de) 2007-04-18 2008-02-26 Textile Halbleiter-Baugruppe und Verfahren zur Montage und zur Fertigung der Baugruppe
US12/037,203 US7638885B2 (en) 2007-04-18 2008-02-26 Fabric type semiconductor device package and methods of installing and manufacturing same
JP2008043931A JP4813506B2 (ja) 2007-04-18 2008-02-26 布製半導体素子のパッケージおよびその製造方法
JP2011148235A JP2011205134A (ja) 2007-04-18 2011-07-04 布製半導体素子のパッケージ及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20070037792 2007-04-18
KR1020070037792 2007-04-18

Publications (2)

Publication Number Publication Date
KR20080093856A KR20080093856A (ko) 2008-10-22
KR100894624B1 true KR100894624B1 (ko) 2009-04-24

Family

ID=40154301

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080002949A KR100894624B1 (ko) 2007-04-18 2008-01-10 직물형 반도체 소자 패키지와 그 설치방법 및 제조방법

Country Status (2)

Country Link
JP (1) JP2011205134A (ja)
KR (1) KR100894624B1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8752285B2 (en) 2010-03-16 2014-06-17 Electronics And Telecommunications Research Institute Method for manufacturing a textile-type electronic component package
KR101635520B1 (ko) * 2015-01-09 2016-07-01 상명대학교서울산학협력단 전도성사와 제어기판의 접속구조와 그 접속방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017065270A1 (ja) * 2015-10-16 2017-04-20 国立研究開発法人科学技術振興機構 応力緩和基板及びテキスタイル型デバイス

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000015459U (ko) * 1999-03-11 2000-08-05 허주일 음을 출력할 수 있는 의복

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61198798A (ja) * 1985-02-28 1986-09-03 ソニー株式会社 布フレキシブル基板の接続方法
JPH02235387A (ja) * 1989-03-09 1990-09-18 Fujii Process Kk フレキシブル回路基板
AU1969101A (en) * 1999-10-18 2001-04-30 Massachusetts Institute Of Technology Flexible electronic circuitry and method of making same
DE10202123A1 (de) * 2002-01-21 2003-07-31 Infineon Technologies Ag Verfahren und Vorrichtung zur Integration von Elektronik in Textilien

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000015459U (ko) * 1999-03-11 2000-08-05 허주일 음을 출력할 수 있는 의복

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8752285B2 (en) 2010-03-16 2014-06-17 Electronics And Telecommunications Research Institute Method for manufacturing a textile-type electronic component package
KR101635520B1 (ko) * 2015-01-09 2016-07-01 상명대학교서울산학협력단 전도성사와 제어기판의 접속구조와 그 접속방법

Also Published As

Publication number Publication date
JP2011205134A (ja) 2011-10-13
KR20080093856A (ko) 2008-10-22

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