KR100881776B1 - 더블-사이드 단일 디바이스 냉각 및 침적 용기 냉각을구비한 본딩 선 없는 파워 모듈 - Google Patents
더블-사이드 단일 디바이스 냉각 및 침적 용기 냉각을구비한 본딩 선 없는 파워 모듈 Download PDFInfo
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Abstract
Description
Claims (21)
- 개선된 냉각 능력을 갖는 복수의 반도체 패키지들을 위한 파워 모듈 조립체에 있어서,상기 복수의 반도체 패키지들 각각은, 상부 및 하부 금속 사이드 표면들을 갖는 얇은 일반적으로 직사각형의 몸체와 상기 사이드 표면들에 수직이고 상기 사이드 표면들을 연결하는 제 1 및 제 2 단부 표면들과; 상기 패키지들의 내부에 배치되고 그리고 상기 패키지의 적어도 상기 제 1 단부 표면으로부터 확장하는 복수의 단자들을 갖는 적어도 하나의 중앙 반도체 다이와, 여기서 상기 적어도 하나의 다이는 상기 상부 및 하부 금속 사이드 표면에 열적으로 연결된 제 1 및 제 2 대향 표면들과, 그리고 상기 패키지의 외면의 적어도 일부분을 둘러싸고 상기 상부 및 하부 금속 사이드 표면들로부터 상기 복수의 단자들을 절연시키는 절연 하우징을 가지며; 소정 공간에 의해 이격된 그리고 서로에 관해 동일한 공간에서 퍼지는 그리고 냉각 매체에 열 전달을 위해 노출되는 상기 패키지들의 인접하는 패키지들의 상기 상부 및 하부 금속 사이드 표면들과 이격된 평행 관계로 복수의 상기 패키지들에 연결되고 복수의 상기 패키지들을 지지하는 패키지 지지부를 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 1 항에 있어서,상기 패키지 지지부는 상기 패키지들의 인접하는 패키지들 사이에서 각 소정 공간 내에 배치된 직사각형 콤(comb) 핑거(finger)들을 갖으며, 그리고 상기 공간들의 상기 각 공간을 정의하는 상기 패키지들의 상기 사이드 표면들과 열적 접촉을 하고 있는 열적 전도성 콤을 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 1 항에 있어서,상기 패키지 지지부는 상기 패키지들의 각 패키지 내에 상기 적어도 하나의 반도체 디바이스의 상기 단자들에 인접한 상기 패키지들의 상기 단부들을 수용하고 상기 단부들에 고정되는 전도성 플레이트를 포함하며, 그럼으로써 상기 패키지들 각각을 그들의 상기 사이드들 각각으로부터 냉각시키기 위해, 냉각 액체가 인접 패키지들 사이의 상기 소정 공간을 통해 순환할 수 있는 것을 특징으로 하는 파워 모듈 조립체.
- 제 2 항에 있어서,상기 열적 전도성 콤은 상기 콤을 정의하기 위해 함께 고정된 복수의 동일 플레이트들을 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 2 항에 있어서,상기 패키지들 각각의 상기 단자들은 상기 콤의 상기 핑거들의 상기 단부들을 넘어 확장하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 2 항에 있어서,상기 패키지들 각각의 상기 단자들은 상기 콤의 상기 핑거들의 상기 사이드 에지(edge)들을 넘어 확장하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 1 항에 있어서,상기 모듈들 각각은 적어도 두 개의 반도체 다이의 코팩(copack)을 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 1 항에 있어서,상기 적어도 하나의 반도체 다이 각각은 MOS 게이트 디바이스인 것을 특징으로 하는 파워 모듈 조립체.
- 제 1 항에 있어서,상기 패키지들 각각의 상기 단자들 상에 배치되며 그리고 상기 패키지들 각각의 동일 단자들을 서로 전기적으로 연결하는 리드 프레임 조립체를 더 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 3 항에 있어서,상기 모듈들 각각은 적어도 두 개의 반도체 다이의 코팩을 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 3 항에 있어서,상기 적어도 하나의 반도체 다이 각각은 MOS 게이트 디바이스인 것을 특징으로 하는 파워 모듈 조립체.
- 제 3 항에 있어서,상기 패키지들 각각의 상기 단자들 상에 배치되며 그리고 상기 패키지들 각각의 동일 단자들을 서로 전기적으로 연결하는 리드 프레임 조립체를 더 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 8 항에 있어서,상기 패키지들 각각의 상기 단자들 상에 배치되며 그리고 상기 패키지들 각각의 동일 단자들을 서로 전기적으로 연결하는 리드 프레임 조립체를 더 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 13 항에 있어서,세 개의 단자들 각각을 갖는 적어도 4 패키지들을 포함하며, 상기 패키지들 각각의 상기 단자들은 상기 리드 프레임 조립체에 의해 평행하게 전기적으로 연결되는 것을 특징으로 하는 파워 모듈 조립체.
- 제 3 항에 있어서,개방 상부를 갖는 냉각제 컨테이너를 더 포함하며; 상기 전도성 플레이트는 상기 개방 상부에 고정되고 그리고 상기 개방 상부를 가로질러 밀봉되고; 상기 패키지들 각각의 상기 몸체들은 상기 냉각제 컨테이너의 냉각제 내에 담그어지고; 상기 단자들은 상기 냉각제 컨테이너의 외부로 배치되는 것을 특징으로 하는 파워 모듈 조립체.
- 제 1 항에 있어서,상기 패키지들 각각은 제 1 및 제 2 DBC 웨이퍼들을 포함하며, 상기 제 1 및 제 2 DBC 웨이퍼들은 그들 사이에 상기 적어도 하나의 반도체 다이를 갖는 샌드위치를 형성하고; 상기 패키지들 각각의 상기 상부 및 하부 금속 사이드 표면들은 상기 제 1 및 제 2 DBC 웨이퍼들의 구리 플레이트들을 각각 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 1 항에 있어서,상기 패키지들 각각은 상기 상부 및 하부 금속 사이드 표면들 사이에서 5mm보다 작은 두께를 가지는 것을 특징으로 하는 파워 모듈 조립체.
- 제 1 항에 있어서,상기 상부 및 하부 표면들 각각은 길이 및 폭이 각각 10mm보다 큰 것을 특징으로 하는 파워 모듈 조립체.
- 제 17 항에 있어서,상기 상부 및 하부 표면들 각각은 길이 및 폭이 각각 10mm보다 큰 것을 특징으로 하는 파워 모듈 조립체.
- 제 19 항에 있어서,상기 패키지 지지부는 상기 패키지들의 인접하는 패키지들 사이에서 각 소정 공간 내에 배치된 직사각형 콤 핑거들을 갖으며, 그리고 상기 공간들의 상기 각 공간을 정의하는 상기 패키지들의 상기 사이드 표면들과 열적 접촉을 하고 있는 열적 전도성 콤을 포함하는 것을 특징으로 하는 파워 모듈 조립체.
- 제 19 항에 있어서,상기 패키지 지지부는 상기 패키지들의 각 패키지 내에 상기 적어도 하나의 반도체 디바이스의 상기 단자들에 인접한 상기 패키지들의 상기 단부들을 수용하고 상기 단부들에 고정되는 전도성 플레이트를 포함하며, 그럼으로써 상기 패키지들 각각을 그들의 상기 사이드들 각각으로부터 냉각시키기 위해, 냉각 액체가 인접 패키지들 사이의 상기 소정 공간을 통해 순환할 수 있는 것을 특징으로 하는 파워 모듈 조립체.
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US11/751,936 US8680666B2 (en) | 2006-05-24 | 2007-05-22 | Bond wireless power module with double-sided single device cooling and immersion bath cooling |
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