KR100877639B1 - 다층막미러, 평가방법, 노광장치 및 디바이스 제조 방법 - Google Patents
다층막미러, 평가방법, 노광장치 및 디바이스 제조 방법 Download PDFInfo
- Publication number
- KR100877639B1 KR100877639B1 KR1020070055918A KR20070055918A KR100877639B1 KR 100877639 B1 KR100877639 B1 KR 100877639B1 KR 1020070055918 A KR1020070055918 A KR 1020070055918A KR 20070055918 A KR20070055918 A KR 20070055918A KR 100877639 B1 KR100877639 B1 KR 100877639B1
- Authority
- KR
- South Korea
- Prior art keywords
- multilayer film
- substrate
- layer
- stress compensation
- film mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
- G21K1/062—Devices having a multilayer structure
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- High Energy & Nuclear Physics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Optical Elements Other Than Lenses (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006160512A JP2007329368A (ja) | 2006-06-09 | 2006-06-09 | 多層膜ミラー、評価方法、露光装置及びデバイス製造方法 |
| JPJP-P-2006-00160512 | 2006-06-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070118033A KR20070118033A (ko) | 2007-12-13 |
| KR100877639B1 true KR100877639B1 (ko) | 2009-01-08 |
Family
ID=38822379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070055918A Expired - Fee Related KR100877639B1 (ko) | 2006-06-09 | 2007-06-08 | 다층막미러, 평가방법, 노광장치 및 디바이스 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7771898B2 (enExample) |
| JP (1) | JP2007329368A (enExample) |
| KR (1) | KR100877639B1 (enExample) |
| TW (1) | TW200807020A (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090252977A1 (en) * | 2008-04-07 | 2009-10-08 | Canon Kabushiki Kaisha | Multilayer film reflector |
| EP2283396B1 (en) * | 2008-06-04 | 2013-03-13 | ASML Netherlands BV | Multilayer mirror and lithographic apparatus |
| DE102008042212A1 (de) | 2008-09-19 | 2010-04-01 | Carl Zeiss Smt Ag | Reflektives optisches Element und Verfahren zu seiner Herstellung |
| DE102009017095A1 (de) * | 2009-04-15 | 2010-10-28 | Carl Zeiss Smt Ag | Spiegel für den EUV-Wellenlängenbereich, Projektionsobjektiv für die Mikrolithographie mit einem solchen Spiegel und Projektionsbelichtungsanlage für die Mikrolithographie mit einem solchen Projektionsobjektiv |
| DE102009032779A1 (de) * | 2009-07-10 | 2011-01-13 | Carl Zeiss Smt Ag | Spiegel für den EUV-Wellenlängenbereich, Projektionsobjektiv für die Mikrolithographie mit einem solchen Spiegel und Projektionsbelichtungsanlage für die Mikrolithographie mit einem solchen Projektionsobjektiv |
| WO2012041697A1 (en) | 2010-09-27 | 2012-04-05 | Carl Zeiss Smt Gmbh | Mirror, projection objective comprising such a mirror, and projection exposure apparatus for microlithography comprising such a projection objective |
| EP2689427B1 (en) | 2011-03-23 | 2017-05-03 | Carl Zeiss SMT GmbH | Euv mirror arrangement, optical system comprising euv mirror arrangement and method for operating an optical system comprising an euv mirror arrangement |
| DE102011077983A1 (de) * | 2011-06-22 | 2012-12-27 | Carl Zeiss Smt Gmbh | Verfahren zur Herstellung eines reflektiven optischen Elements für die EUV-Lithographie |
| KR20150066966A (ko) * | 2013-12-09 | 2015-06-17 | 삼성전자주식회사 | 포토마스크, 포토마스크의 에러 보정 방법, 포토마스크를 이용하여 제조된 집적회로 소자 및 그 제조 방법 |
| DE102014201622A1 (de) | 2014-01-30 | 2015-08-20 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines Spiegelelements |
| DE102015213253A1 (de) * | 2015-07-15 | 2017-01-19 | Carl Zeiss Smt Gmbh | Spiegel, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
| JP5980388B2 (ja) * | 2015-07-23 | 2016-08-31 | キヤノン株式会社 | 電気機械変換装置 |
| DE102016207307A1 (de) * | 2016-04-28 | 2017-11-02 | Carl Zeiss Smt Gmbh | Optisches Element und optische Anordnung damit |
| DE102016209273A1 (de) * | 2016-05-30 | 2017-11-30 | Carl Zeiss Smt Gmbh | Spiegel für den euv-wellenlängenbereich |
| DE102016212373A1 (de) * | 2016-07-07 | 2018-01-11 | Carl Zeiss Smt Gmbh | Optisches System, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
| JP6186055B2 (ja) * | 2016-07-28 | 2017-08-23 | キヤノン株式会社 | 電気機械変換装置 |
| JP6597523B2 (ja) * | 2016-08-29 | 2019-10-30 | Agc株式会社 | 多層膜付基板およびその製造方法 |
| US10468149B2 (en) * | 2017-02-03 | 2019-11-05 | Globalfoundries Inc. | Extreme ultraviolet mirrors and masks with improved reflectivity |
| JP6438544B2 (ja) * | 2017-07-31 | 2018-12-12 | キヤノン株式会社 | 電気機械変換装置 |
| TW202144764A (zh) | 2020-05-19 | 2021-12-01 | 台灣積體電路製造股份有限公司 | 用於評估基板上的薄膜厚度的方法 |
| US11397078B2 (en) * | 2020-05-19 | 2022-07-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thin film metrology |
| CN119001940A (zh) * | 2024-08-15 | 2024-11-22 | 中国科学院半导体研究所 | 薄膜镜面及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999042901A1 (en) * | 1998-02-20 | 1999-08-26 | The Regents Of The University Of California | Method to adjust multilayer film stress induced deformation of optics |
| KR20000024882A (ko) * | 1998-10-02 | 2000-05-06 | 전주범 | 박막형 광로 조절 장치의 제조 방법 |
| WO2002084671A1 (en) * | 2001-04-11 | 2002-10-24 | Nikon Corporation | Multi-layered film reflector manufacturing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6134049A (en) | 1998-09-25 | 2000-10-17 | The Regents Of The University Of California | Method to adjust multilayer film stress induced deformation of optics |
| US6387572B1 (en) * | 1999-09-13 | 2002-05-14 | Intel Corporation | Low CTE substrate for reflective EUV lithography |
| US6756163B2 (en) * | 2002-06-27 | 2004-06-29 | Intel Corporation | Re-usable extreme ultraviolet lithography multilayer mask blank |
| US7056627B2 (en) * | 2002-08-23 | 2006-06-06 | Hoya Corporation | Method of manufacturing a reflection type mask blank and method of manufacturing a reflection type mask |
| US7326502B2 (en) * | 2003-09-18 | 2008-02-05 | Intel Corporation | Multilayer coatings for EUV mask substrates |
-
2006
- 2006-06-09 JP JP2006160512A patent/JP2007329368A/ja not_active Withdrawn
-
2007
- 2007-06-08 US US11/760,155 patent/US7771898B2/en not_active Expired - Fee Related
- 2007-06-08 KR KR1020070055918A patent/KR100877639B1/ko not_active Expired - Fee Related
- 2007-06-08 TW TW096120781A patent/TW200807020A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999042901A1 (en) * | 1998-02-20 | 1999-08-26 | The Regents Of The University Of California | Method to adjust multilayer film stress induced deformation of optics |
| KR20000024882A (ko) * | 1998-10-02 | 2000-05-06 | 전주범 | 박막형 광로 조절 장치의 제조 방법 |
| WO2002084671A1 (en) * | 2001-04-11 | 2002-10-24 | Nikon Corporation | Multi-layered film reflector manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| US7771898B2 (en) | 2010-08-10 |
| TW200807020A (en) | 2008-02-01 |
| JP2007329368A (ja) | 2007-12-20 |
| KR20070118033A (ko) | 2007-12-13 |
| US20070287076A1 (en) | 2007-12-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100877639B1 (ko) | 다층막미러, 평가방법, 노광장치 및 디바이스 제조 방법 | |
| TWI239033B (en) | Adjustment method and apparatus of optical system, and exposure apparatus | |
| JP5485262B2 (ja) | アライメントフィーチャ、プリ・アライメント方法、及びリソグラフィ装置 | |
| KR100942324B1 (ko) | 측정장치, 노광장치, 및 디바이스 제조방법 | |
| US20080117512A1 (en) | Mirror unit, method of producing the same, and exposure apparatus and method using the mirror unit | |
| JP2009141177A (ja) | Euv用ミラー及びそれを有するeuv露光装置 | |
| JP4532991B2 (ja) | 投影光学系、露光装置及びデバイス製造方法 | |
| EP1441257A2 (en) | Illumination apparatus, projection exposure apparatus, and device fabricating method | |
| US7126673B2 (en) | Illumination optical system and exposure apparatus having the same | |
| US7543948B2 (en) | Multilayer mirror manufacturing method, optical system manufacturing method, exposure apparatus, and device manufacturing method | |
| JP3958261B2 (ja) | 光学系の調整方法 | |
| US20050237502A1 (en) | Exposure apparatus | |
| US7027131B2 (en) | Exposure apparatus | |
| EP1471389B1 (en) | Projection optical system | |
| US20230185204A1 (en) | Optical apparatus and lithographic apparatus using the optical apparatus | |
| JP3870118B2 (ja) | 結像光学系、該光学系を有する露光装置、収差低減方法 | |
| JP2009162851A (ja) | マスク及びその製造方法、露光方法及び装置、並びにデバイス製造方法 | |
| KR20040098592A (ko) | 투영광학계 | |
| JP2006073905A (ja) | 光学系及び当該光学系の調整方法、露光装置、並びにデバイス製造方法 | |
| JP2006351990A (ja) | 露光装置及びデバイス製造方法 | |
| JP4908807B2 (ja) | 処理装置、露光装置、およびデバイス製造方法 | |
| CN113848680A (zh) | 制造透过型的光学元件的制造方法、曝光装置、物品制造方法以及透过型的光学元件 | |
| JP2007250875A (ja) | 露光装置及びデバイス製造方法 | |
| JP2008066578A (ja) | 結像光学系の設計方法、結像光学系、露光装置及びデバイス製造方法 | |
| JP2006330635A (ja) | フォトマスク及び露光方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20121121 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20131126 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20141126 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20151125 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20161124 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20171124 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20181126 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| FPAY | Annual fee payment |
Payment date: 20191219 Year of fee payment: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 14 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 15 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20231231 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20231231 |