KR100865767B1 - 기판 슬림화 장치 및 기판 슬림화 방법 - Google Patents

기판 슬림화 장치 및 기판 슬림화 방법 Download PDF

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Publication number
KR100865767B1
KR100865767B1 KR1020070025590A KR20070025590A KR100865767B1 KR 100865767 B1 KR100865767 B1 KR 100865767B1 KR 1020070025590 A KR1020070025590 A KR 1020070025590A KR 20070025590 A KR20070025590 A KR 20070025590A KR 100865767 B1 KR100865767 B1 KR 100865767B1
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KR
South Korea
Prior art keywords
substrate
chemical liquid
support plate
etching
flow
Prior art date
Application number
KR1020070025590A
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English (en)
Korean (ko)
Inventor
이승욱
이의옥
Original Assignee
우진선행기술 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우진선행기술 주식회사 filed Critical 우진선행기술 주식회사
Priority to KR1020070025590A priority Critical patent/KR100865767B1/ko
Priority to TW096132735A priority patent/TWI394727B/zh
Priority to CN2008100963263A priority patent/CN101265030B/zh
Application granted granted Critical
Publication of KR100865767B1 publication Critical patent/KR100865767B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Surface Treatment Of Glass (AREA)
  • Weting (AREA)
KR1020070025590A 2007-03-15 2007-03-15 기판 슬림화 장치 및 기판 슬림화 방법 KR100865767B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020070025590A KR100865767B1 (ko) 2007-03-15 2007-03-15 기판 슬림화 장치 및 기판 슬림화 방법
TW096132735A TWI394727B (zh) 2007-03-15 2007-09-03 板輕量化裝置以及板輕量化方法
CN2008100963263A CN101265030B (zh) 2007-03-15 2008-03-14 基板薄化设备以及薄化基板的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070025590A KR100865767B1 (ko) 2007-03-15 2007-03-15 기판 슬림화 장치 및 기판 슬림화 방법

Publications (1)

Publication Number Publication Date
KR100865767B1 true KR100865767B1 (ko) 2008-10-28

Family

ID=39987754

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070025590A KR100865767B1 (ko) 2007-03-15 2007-03-15 기판 슬림화 장치 및 기판 슬림화 방법

Country Status (3)

Country Link
KR (1) KR100865767B1 (zh)
CN (1) CN101265030B (zh)
TW (1) TWI394727B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110132896A (ko) * 2010-06-03 2011-12-09 동우 화인켐 주식회사 경사식 에칭장치용 에칭액 조성물 및 이를 이용한 에칭방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100860294B1 (ko) * 2008-01-09 2008-09-25 주식회사 이코니 유리기판 에칭 장치와 상기 에칭 장치에 의하여 제조된유리박판
CN101514081B (zh) * 2009-01-22 2011-02-16 上海仪捷光电科技有限公司 瀑布式层流蚀刻切割方法
CN102659321B (zh) * 2012-05-14 2015-03-18 汕头市拓捷科技有限公司 一种单面多片式的玻璃薄化设备及方法
CN103508673B (zh) * 2012-06-25 2016-01-13 江西沃格光电股份有限公司 玻璃基板操作台
CN108455078A (zh) * 2017-12-21 2018-08-28 凯盛科技股份有限公司 一种大尺寸液晶面板单面减薄承载篮具
CN108874226B (zh) * 2018-06-29 2021-06-11 信利光电股份有限公司 一种触摸屏ito膜层的刻蚀方法及触摸屏组件
CN112645603A (zh) * 2021-01-15 2021-04-13 赣州帝晶光电科技有限公司 一种瀑布流式化学蚀刻专用治具及超薄玻璃的制备方法
CN113233780A (zh) * 2021-04-07 2021-08-10 合肥京东方半导体有限公司 一种液晶玻璃基板减薄蚀刻设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6189482B1 (en) 1997-02-12 2001-02-20 Applied Materials, Inc. High temperature, high flow rate chemical vapor deposition apparatus and related methods
US6784085B2 (en) 2000-11-30 2004-08-31 North Carolina State University MIIIN based materials and methods and apparatus for producing same
KR20040101619A (ko) * 2003-05-26 2004-12-03 한국디엔에스 주식회사 평판 표시 소자 제조 장치
KR20050040634A (ko) * 2003-10-29 2005-05-03 주성엔지니어링(주) 기판트레이와, 이를 이용하는 엘씨디 제조장치 및 이를이용하여 기판을 이송하는 방법
KR20060076987A (ko) * 2004-12-29 2006-07-05 엘지.필립스 엘시디 주식회사 화학기상 증착장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2207878A1 (en) * 1996-06-20 1997-12-20 Qqc, Inc. Glassy carbon coatings having water repellant and corrosion-, erosion-, and wear-resistant characteristics
JP4071220B2 (ja) * 2004-03-17 2008-04-02 西山ステンレスケミカル株式会社 ガラス基板の製造方法
JP4643384B2 (ja) * 2005-07-25 2011-03-02 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6189482B1 (en) 1997-02-12 2001-02-20 Applied Materials, Inc. High temperature, high flow rate chemical vapor deposition apparatus and related methods
US6784085B2 (en) 2000-11-30 2004-08-31 North Carolina State University MIIIN based materials and methods and apparatus for producing same
KR20040101619A (ko) * 2003-05-26 2004-12-03 한국디엔에스 주식회사 평판 표시 소자 제조 장치
KR20050040634A (ko) * 2003-10-29 2005-05-03 주성엔지니어링(주) 기판트레이와, 이를 이용하는 엘씨디 제조장치 및 이를이용하여 기판을 이송하는 방법
KR20060076987A (ko) * 2004-12-29 2006-07-05 엘지.필립스 엘시디 주식회사 화학기상 증착장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110132896A (ko) * 2010-06-03 2011-12-09 동우 화인켐 주식회사 경사식 에칭장치용 에칭액 조성물 및 이를 이용한 에칭방법
KR101674210B1 (ko) 2010-06-03 2016-11-09 동우 화인켐 주식회사 경사식 에칭장치용 에칭액 조성물 및 이를 이용한 에칭방법

Also Published As

Publication number Publication date
TWI394727B (zh) 2013-05-01
CN101265030A (zh) 2008-09-17
TW200837030A (en) 2008-09-16
CN101265030B (zh) 2011-04-06

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