KR100850898B1 - Plasma Display Panel - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, wherein the protective layer includes a (111) oriented MgO material and a (200) oriented MgO material, thereby keeping the secondary electron emission coefficient high enough to discharge the address. The delay property is improved, and the sputtering property is also enhanced, and the wall charge trapping property is enhanced.

Such a plasma display panel according to an embodiment of the present invention includes a front substrate on which a dielectric layer is disposed, a protective layer disposed on the dielectric layer, and a rear substrate disposed between the front substrate and the front substrate and the rear substrate. And a partition wall partitioning the discharge cell, wherein the protective layer includes an MgO material having a (111) orientation and an MgO material having a (200) orientation.

Description

Plasma Display Panel

1 is a view for explaining the structure of a plasma display panel according to an embodiment of the present invention.

2 is a view for explaining an example in the case where at least one of the first electrode or the second electrode is a plurality of layers;

3 is a view for explaining an example where at least one of the first electrode and the second electrode is a single layer;

FIG. 4 is a diagram illustrating an image frame for realizing grayscales of an image in a plasma display panel according to an embodiment of the present invention. FIG.

5 is a view for explaining an example of an operation of a plasma display panel according to an embodiment of the present invention in a subfield included in an image frame;

6A to 6B are views for explaining the protective layer in more detail.

FIG. 7 is a view for explaining the content ratio of the (111) oriented MgO material included in the protective layer. FIG.

8A to 8B are views for explaining another structure of the protective layer.

9A to 9B are diagrams for explaining the phosphor layer in more detail.

<Explanation of symbols for the main parts of the drawings>

101: front substrate 102: first electrode

103: second electrode 104: upper dielectric layer

105: protective layer 111: back substrate

112: partition wall 113: third electrode

114: phosphor layer 115: lower dielectric layer

112a: second partition 112b: first partition

The present invention relates to a plasma display panel.

In general, a phosphor layer is formed in a discharge cell (Cell) partitioned by a partition, and a plurality of electrodes are formed in the plasma display panel.

The driving signal is supplied to the discharge cell through the electrode.

Then, the discharge is generated by the drive signal supplied in the discharge cell. Here, when discharged by a drive signal in the discharge cell, the discharge gas filled in the discharge cell generates vacuum ultraviolet rays, and the vacuum ultraviolet light emits the phosphor formed in the discharge cell to emit visible light. Generate. The visible light displays an image on the screen of the plasma display panel.

One embodiment of the present invention is to provide a plasma display panel which improves a response speed by improving a protective layer disposed on a front substrate, and also improves a sputtering ring characteristic of the protective layer.

Plasma display panel according to an embodiment of the present invention for achieving the above object is a front substrate on which a dielectric layer is disposed, a protective layer disposed on the dielectric layer, a rear substrate and a front substrate disposed to face the front substrate and A partition wall partitioning the discharge cells between the back substrates, and the protective layer includes an MgO material having a (111) orientation and an MgO material having a (200) orientation.

In addition, the content of the MgO material having the (111) orientation is 10% or more and 40% or less.

In addition, the protective layer is composed of a plurality of layers, at least one of the plurality of protective layers comprises a MgO material having a (111) orientation, and at least one of the remaining includes a MgO material having a (200) orientation.

In addition, the protective layer is composed of a plurality of layers, at least one of the plurality of protective layers includes an MgO material having an orientation of any one of (111) or (200), and at least one of the remaining ones has a (111) orientation It includes MgO material having and MgO material having (200) orientation together.

In addition, a phosphor layer is disposed in the discharge cell, and a lower protective layer is disposed on the surface of the phosphor layer.

The lower protective layer also includes a MgO material having a (111) orientation.

In addition, a phosphor layer is disposed in the discharge cell, and the phosphor layer includes an MgO material.

In addition, the MgO material has a (111) orientation.

Hereinafter, a plasma display panel according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view for explaining the structure of a plasma display panel according to an embodiment of the present invention.

Referring to FIG. 1, a plasma display panel according to an embodiment of the present invention includes a front substrate 101 and a front substrate 101 on which first and second electrodes 102 and Y are arranged in parallel with each other. ) And a rear substrate 111 on which the first electrode 102 (Y) and the third electrode 113 (X) intersecting the second electrode 103 (Z) are disposed.

A dielectric layer covering the first electrodes 102 and Y and the second electrode 103 and Z on the front substrate 101 where the first electrodes 102 and Y and the second electrode 103 and Z are disposed. For example, upper dielectric layer 104 may be disposed.

This upper dielectric layer 104 limits the discharge current of the first electrode 102, Y and the second electrode 103, Z and between the first electrode 102, Y and the second electrode 103, Z. Can be insulated.

A protective layer 105 may be disposed on the upper surface of the upper dielectric layer 104 to facilitate a discharge condition. The protective layer 105 may include a material having a high secondary electron emission coefficient, such as magnesium oxide (MgO).

In addition, the protective layer 105 includes a (111) oriented MgO material and a (200) oriented MgO material. This protective layer 105 will be described in more detail later with reference to FIGS. 6A to 6B.

Meanwhile, electrodes, for example, third electrodes 113 and X are disposed on the rear substrate 111, and third electrodes 113 and X are disposed on the rear substrate 111 on which the third electrodes 113 and X are disposed. A covering dielectric layer, such as lower dielectric layer 115, may be disposed.

The lower dielectric layer 115 may insulate the third electrodes 113 and X.

In addition, a partition 112 having a discharge space, that is, a stripe type, a well type, a delta type, a honeycomb type, and the like, which partitions a discharge cell, is formed on an upper portion of the lower dielectric layer 115. Can be arranged. Accordingly, red (R), green (G), and blue (B) discharge cells may be provided between the front substrate 101 and the rear substrate 111.

In addition, in addition to the red (R), green (G), and blue (B) discharge cells, white (W) or yellow (Yellow: Y) discharge cells may be further provided.

Meanwhile, although the widths of the red (R), green (G), and blue (B) discharge cells in the plasma display panel according to an embodiment of the present invention may be substantially the same, red (R) and green (G) may be substantially the same. And the width of at least one of the blue (B) discharge cells may be different from that of the other discharge cells.

For example, the width of the red (R) discharge cell is the smallest, and the width of the green (G) and blue (B) discharge cells can be made larger than the width of the red (R) discharge cell. Here, the width of the green (G) discharge cell may be substantially the same as or different from the width of the blue (B) discharge cell.

The width of the phosphor layer 114, which will be described later, disposed in the discharge cell is then changed in relation to the width of the discharge cell. For example, the width of the blue (B) phosphor layer disposed in the blue (B) discharge cell is wider than the width of the red (R) phosphor layer disposed in the red (R) discharge cell, and at the same time in the green (G) discharge cell. The width of the green (G) phosphor layer disposed may be wider than the width of the red (R) phosphor layer disposed in the red (R) discharge cell.

Then, color temperature characteristics of the image to be implemented may be improved.

In addition, the plasma display panel according to the exemplary embodiment of the present invention may have not only the structure of the partition wall 112 shown in FIG. 1 but also the structure of the partition wall having various shapes. For example, the partition wall 112 includes a first partition wall 112b and a second partition wall 112a, where the height of the first partition wall 112b and the height of the second partition wall 112a are different from each other. Etc. may be possible.

In the case of the differential partition wall structure, the height of the first partition wall 112b among the first partition wall 112b or the second partition wall 112a may be lower than the height of the second partition wall 112a.

Meanwhile, although FIG. 1 shows and describes each of the red (R), green (G), and blue (B) discharge cells arranged on the same line, it may be arranged in a different shape. For example, a delta type arrangement in which red (R), green (G) and blue (B) discharge cells are arranged in a triangular shape may be possible. In addition, the shape of the discharge cell may also be a variety of polygonal shapes, such as pentagonal, hexagonal, as well as rectangular.

In addition, in FIG. 1, only the case where the partition wall 112 is formed on the rear substrate 111 is illustrated, but the partition wall 112 may be disposed on at least one of the front substrate 101 and the rear substrate 111.

Here, a predetermined discharge gas may be filled in the discharge cell partitioned by the partition wall 112.

In addition, a phosphor layer 114 that emits visible light for image display may be disposed in the discharge cell partitioned by the partition wall 112. For example, red (R), green (G), and blue (B) phosphor layers may be disposed.

In addition to the red (R), green (G), and blue (B) phosphors, a white (W) and / or yellow (Y) phosphor layer may be further disposed.

In addition, the thickness of the phosphor layer 114 in at least one of the red (R), green (G), and blue (B) discharge cells may be different from other discharge cells. For example, the thickness of the phosphor layer of the green (G) discharge cell, ie the phosphor layer in the green (G) phosphor layer or the blue (B) discharge cell, ie the blue (B) phosphor layer, is It may be thicker than the thickness of the phosphor layer, ie the red (R) phosphor layer. Here, the thickness of the green (G) phosphor layer may be substantially the same as or different from the thickness of the blue (B) phosphor layer.

In the above description, only one example of the plasma display panel according to an exemplary embodiment of the present invention is illustrated and described. However, the present invention is not limited to the plasma display panel having the above-described structure. For example, the above description shows only the case where the upper dielectric layer number 104 and the lower dielectric layer number 115 are each one layer, but one or more of such upper dielectric layer and lower dielectric layer are plural layers. It is also possible to make.

In addition, a black layer (not shown) may be further disposed on the upper part of the partition wall 112 to prevent reflection of the external light due to the partition wall number 112. In addition, the black layer may be formed at a specific position on the front substrate 101 corresponding to the partition wall 112.

In addition, although the width or thickness of the third electrode 113 disposed on the rear substrate 111 may be substantially constant, the width or thickness inside the discharge cell may be different from the width or thickness outside the discharge cell. will be. For example, the width or thickness inside the discharge cell may be wider or thicker than that outside the discharge cell.

Next, FIG. 2 is a figure for demonstrating an example in the case where at least one of a 1st electrode or a 2nd electrode is a some layer.

Referring to FIG. 2, at least one of the first electrode 102 or the second electrode 103 may be formed of a plurality of layers, for example, two layers.

For example, in consideration of light transmittance and electrical conductivity, at least one of the first electrode 102 and the second electrode 103 is formed of silver (Ag) to emit light generated in the discharge cell to the outside and to secure driving efficiency. Bus electrodes 102b and 103b including a substantially opaque material, such as, and transparent electrodes 102a and 103a including a transparent material such as transparent indium tin oxide (ITO).

As such, when the first electrode 102 and the second electrode 103 include the transparent electrodes 102a and 103a, visible light generated in the discharge cell can be effectively emitted when emitted to the outside of the plasma display panel. have.

In addition, when the first electrode 102 and the second electrode 103 include the bus electrodes 102b and 103b, the first electrode 102 and the second electrode 103 include only the transparent electrodes 102a and 103a. In this case, the driving efficiency may decrease because the electrical conductivity of the transparent electrodes 102a and 103a is relatively low, and the low electrical conductivity of the transparent electrodes 102a and 103a that may cause such a reduction in driving efficiency may be compensated. Can be.

As described above, in the case where the first electrode 102 and the second electrode 103 include the bus electrodes 102b and 103b, the transparent electrodes 102a, in order to prevent reflection of external light by the bus electrodes 102b and 103b, may be used. Other black layers 220 and 221 may be further provided between the 103a and the bus electrodes 102b and 103b.

Next, FIG. 3 is a figure for explaining an example in the case where at least one of a 1st electrode or a 2nd electrode is a single layer.

Referring to FIG. 3, the first electrodes 102 and Y and the second electrode 103 and Z are one layer. For example, the first electrodes 102 and Y and the second electrodes 103 and Z may be ITO-Less electrodes in which the transparent electrodes of the number 102a or 103a are omitted in FIG. 2.

At least one of the first electrode 102 and Y or the second electrode 103 and Z may include a substantially opaque electrically conductive metal material. For example, it may include a material having excellent electrical conductivity such as silver (Ag), copper (Cu), aluminum (Al), and the like, and a material having a lower cost than a transparent material such as indium tin oxide (ITO). .

In addition, at least one of the first electrode 102 (Y) or the second electrode 103 (Z) may be darker in color than the upper dielectric layer 104 of FIG. 1.

As such, when at least one of the first electrode 102 and the second electrode 103 and Z is a single layer, the manufacturing process is simpler than in the case of FIG. 2. For example, in the case of FIG. 2, the bus electrodes 102b and 103b are formed after the transparent electrodes 102a and 103a are formed in the process of forming the first electrodes 102 and Y and the second electrodes 103 and Z. 3 again, the first electrode 102 and Y and the second electrode 103 and Z can be formed in one step because the single layer structure of FIG.

In addition, as shown in FIG. 3, when the first electrodes 102 and Y and the second electrodes 103 and Z are formed in a single layer, the manufacturing process is simplified and relatively expensive indium-tin-oxide (ITO) or the like. Since it is not necessary to use a transparent material of the manufacturing cost can be reduced.

Meanwhile, the discoloration of the front substrate 101 is prevented between the first electrodes 102 and Y and the second electrodes 103 and Z and the front substrate 101, and the first electrodes 102 and Y or the second electrode ( Another black layer 300a or 300b having a darker color than at least one of 103 and Z) may be further provided. That is, when the front substrate 101 and the first electrode 102, Y or the second electrode 103, Z directly contact each other, the first substrate 102, Y or the second electrode 103, Z may be directly contacted. Migration phenomenon may occur in which a predetermined area of the front substrate 101 in contact with the yellow color is changed. The black layers 300a to 300b may prevent the migration phenomenon to prevent discoloration of the front substrate 101. It can be.

The black layer of numbers 300a to 300b may include a black material having a substantially dark color, such as ruthenium (Ru).

As such, when the black layers 300a and 300b are provided between the front substrate 101, the first electrodes 102 and Y, and the second electrodes 103 and Z, the first electrodes 102 and Y are separated from each other. Even if the second electrodes 103 and Z are made of a material having high reflectance, generation of reflected light can be prevented.

Next, FIG. 4 is a diagram for describing an image frame for implementing gray levels of an image in a plasma display panel according to an exemplary embodiment of the present invention.

Referring to FIG. 4, an image frame for implementing gray levels of an image in a plasma display panel according to an exemplary embodiment of the present invention may be divided into a plurality of subfields having different emission counts.

Although not shown, one or more subfields among the plurality of subfields may be grayed out according to a reset period for initializing discharge cells, an address period for selecting discharge cells to be discharged, and the number of discharges. It can be divided into the sustain period to implement.

For example, when an image is to be displayed in 256 gray scales, for example, one image frame is divided into eight subfields SF1 to SF8 as shown in FIG. 4, and each of the eight subfields SF1 to SF8, respectively. Can be subdivided into a reset period, an address period and a sustain period.

The gray scale weight of the corresponding subfield may be set by adjusting the number of the sustain signals supplied in the sustain period. That is, a predetermined gray scale weight can be given to each subfield using the sustain period. For example, the gray scale weight of each subfield is 2 ⁿ by setting the gray scale weight of the first subfield to 2 ⁰ and the gray scale weight of the second subfield to 2 ¹ (where n = 0, 1). , 2, 3, 4, 5, 6, and 7) to increase the gray scale weight of each subfield. As described above, the number of sustain signals supplied in the sustain period of each subfield is adjusted according to the gray scale weight in each subfield, thereby implementing gray levels of various images.

A plasma display panel according to an embodiment of the present invention uses a plurality of image frames to implement an image, for example, to display an image of 1 second. For example, 60 image frames are used to display an image of 1 second. In this case, the length T of one image frame may be 1/60 second, that is, 16.67 ms.

In FIG. 4, only one image frame is composed of eight subfields. However, the number of subfields constituting one image frame may be variously changed. For example, one video frame may be configured with 12 subfields from the first subfield to the twelfth subfield, or one video frame may be configured with 10 subfields.

In addition, in FIG. 4, subfields are arranged in an order of increasing magnitude of gray scale weight in one image frame. Alternatively, subfields may be arranged in order of decreasing gray scale weight in one image frame. Alternatively, subfields may be arranged regardless of the gray scale weight.

Next, FIG. 5 is a diagram for explaining an example of an operation of a plasma display panel according to an embodiment of the present invention in a subfield included in an image frame.

Referring to FIG. 5, in the set-up period of the reset period for initialization, the voltage rises from the first voltage V1 to the second voltage V2 with the first electrode and then from the second voltage V2 to the third voltage. A ramp-up signal is supplied in which the voltage gradually rises to V3. Here, the first voltage V1 may be a voltage of the ground level GND.

In this setup period, a weak dark discharge, that is, setup discharge, occurs in the discharge cell by the rising ramp signal. By this setup discharge, some wall charges can be accumulated in the discharge cells.

In a set-down period after the setup period, a ramp-down signal in a direction opposite to that of the ramp ramp signal is supplied to the first electrode after the ramp ramp signal.

Here, the falling ramp signal may gradually fall from the peak voltage of the rising ramp signal, that is, the fourth voltage V4 lower than the third voltage V3 to the fifth voltage V5.

As the falling ramp signal is supplied, a weak erase discharge, that is, a setdown discharge, occurs in the discharge cell. By this set-down discharge, wall charges such that address discharge can be stably generated in the discharge cells remain uniformly.

In the address period after the reset period, a scan bias signal that substantially maintains the lowest voltage of the falling ramp signal, that is, a voltage higher than the fifth voltage V5, for example, the sixth voltage V6, is supplied to the first electrode.

In addition, a scan signal falling by a scan voltage (Vy) from the scan bias signal may be supplied to the first electrode.

On the other hand, the width of the scan signal in units of subfields may vary. That is, the width of the scan signal in at least one subfield may be different from the width of the scan signal in another subfield. For example, the width of the scan signal in the subfield located later in time may be smaller than the width of the scan signal in the preceding subfield. In addition, the reduction of the scan signal width according to the arrangement order of the subfields may be made gradually, such as 2.6 ms (microseconds), 2.3 ms (microseconds), 2.1 ms (microseconds), 1.9 ms (microseconds), or 2.6. ㎲ (microseconds), 2.3 ㎲ (microseconds), 2.3 ㎲ (microseconds), 2.1 ㎲ (microseconds) ... 1.9 ㎲ (microseconds), 1.9 ㎲ (microseconds), etc. will be.

As such, when the scan signal is supplied to the first electrode, a data signal that rises by the magnitude of the data voltage (Vd) may be supplied to the third electrode to correspond to the scan signal.

As the scan signal and the data signal are supplied, an address discharge may be generated in the discharge cell to which the data signal is supplied while the voltage difference between the scan signal and the data signal and the wall voltage caused by the wall charges generated in the reset period are added. have.

Here, the sustain bias signal may be supplied to the second electrode to prevent the address discharge from becoming unstable due to the interference of the second electrode in the address period.

Here, the sustain bias signal may maintain a substantially constant sustain bias voltage Vz smaller than the voltage of the sustain signal supplied in the sustain period and greater than the voltage of the ground level GND.

Thereafter, in the sustain period for displaying an image, a sustain signal may be supplied to at least one of the first electrode and the second electrode. For example, a sustain signal may be alternately supplied to the first electrode and the second electrode.

When such a sustain signal is supplied, the discharge cell selected by the address discharge is sustained discharge between the first electrode and the second electrode when the sustain signal is supplied while the wall voltage in the discharge cell and the sustain voltage Vs of the sustain signal are added. , Display discharge may occur.

In this way, an image may be implemented on the screen of the plasma display panel.

On the other hand, it will be described in conjunction with Figure 6a to 6b and 7 attached to the above-mentioned protective layer as follows.

6A to 6B are views for explaining the protective layer in more detail.

7 is a figure for demonstrating the content rate of the (111) orientation MgO material contained in a protective layer.

First, referring to FIG. 6A, a dielectric layer, for example, an upper dielectric layer 104 is disposed on the front substrate 101 on which the first electrode 102 and the second electrode 103 are disposed, and the upper dielectric layer 104 is disposed. It can be seen that the protective layer 105 is disposed on the phase.

The protective layer 105 prevents damage to the upper dielectric layer 104 due to ion collision, and also serves to lower the discharge voltage in the discharge cell through secondary electron emission. When the thickness t of the protective layer 105 is excessively thin, the upper dielectric layer 104 may not be sufficiently protected, and when the thickness t is excessively thick, the discharge voltage may be excessively increased. In consideration of this, it may be advantageous that the thickness t of the protective layer 105 is 0.1 μm or more and 1 μm or less, and more preferably, 0.6 μm or more and 0.9 μm or less.

In addition, the protective layer 105 includes a (111) oriented MgO material and a (200) oriented MgO material.

For example, in the case of depositing the protective layer 105 using the vacuum deposition method, if the gas pressure ratio of hydrogen and oxygen in the vacuum chamber is changed to a certain ratio, the (111) oriented MgO material and (200 ) Orientated MgO material can be obtained.

As the method for forming the protective layer 105, in addition to the vacuum deposition method, a sputtering method, a spraying method, a spraying method, a printing method, a dispersion deposition method, a transfer method, and an electrodeposition method may be used.

As such, when the protective layer 105 includes a (111) oriented MgO material and a (200) oriented MgO material, the protective layer 105 may have a structure as shown in FIG. 6B due to a difference in crystal growth characteristics of the MgO material. .

Next, referring to FIG. 6B, for example, assuming that the protective layer 105 includes an MgO material having a first orientation and an MgO material having a second orientation different from that of the first orientation, the MgO material having the first orientation is formed. Crystal growth from the upper dielectric layer 104 may result in a first oriented MgO layer 105a, and second alignment-oriented MgO material may crystallize from the upper dielectric layer 104 to form a second oriented MgO layer 105b. .

The first oriented MgO material layer 105a and the second oriented MgO material layer 105b may have different heights due to differences in crystal growth characteristics. Accordingly, the surface of the protective layer 105 may have a bumpy concave-convex shape.

Here, when the first oriented MgO material layer 105a is (200) oriented, the second oriented MgO material layer 105b is (111) oriented.

6A to 6B, the reason why the protective layer 105 includes a (111) oriented MgO material and a (200) oriented MgO material is as follows.

For example, while the (111) oriented MgO material has a relatively high secondary electron emission coefficient, the sputtering property is weak and the property of trapping wall charge is relatively weak.

In addition, the secondary electron emission coefficient of the (200) oriented MgO material is relatively lower than that of the (111) oriented MgO material, while the sputtering property is strong and the property of holding the wall charge is relatively strong.

Accordingly, when the protective layer 105 is made of only (111) oriented MgO material or the protective layer 105 is made of only (200) oriented MgO material, the sputtering resistance of the protective layer 105 is weak and the wall The charge trapping property has a weak problem or a secondary electron emission coefficient has a relatively low problem.

On the other hand, in the case of including both (111) oriented MgO material and (200) oriented MgO material as in an embodiment of the present invention, the secondary electron emission coefficient is relatively large by the (111) oriented MgO material. While maintaining, the sputtering property and the wall charge trapping property in the (200) oriented MgO material can be strengthened.

Next, FIG. 7 shows the content of the MgO material having the (111) orientation included in the protective layer 105.

Here, in FIG. 7, when the protective layer 105 includes both the (111) and the (200) oriented MgO materials, the delay time of the address discharge, that is, the address, is changed while changing the content of the MgO material having the (111) orientation. Measure jitter characteristics.

In this case, the address discharge delay characteristic is a time point at which a scan signal is supplied to the first electrode and a data signal is supplied to the third electrode in the address period described above with reference to FIG. It means the time difference until.

Referring to FIG. 7, when the content of the (111) oriented MgO material is less than 10%, the address discharge delay time has a value between about 1.0 ms and 0.6 ms. In such a case, an excessively long address discharge delay time may cause an address discharge to become unstable in an address period, and an excessively long address period may result in insufficient driving time.

On the other hand, when the content of the (111) oriented MgO material is 10% or more and 40% or less, the address discharge delay time has a stable value between 0.6 mW and 2.0 mW. As a result, the address discharge can be stabilized and a shortage of driving time can be prevented.

In addition, it can be seen that when the content of the (111) oriented MgO material exceeds 40%, the address discharge delay time is saturated between approximately 2.0 ms and 1.9 ms.

In addition, when the content of the MgO material having the (111) orientation is excessively greater than 40%, the sputtering resistance and the wall charge-holding property of the protective layer 105 due to the lack of the MgO material having the (200) orientation This can be excessively weak.

Considering the data of FIG. 7, the content of the MgO material having the (111) orientation included in the protective layer 105 may be 10% or more and 40% or less.

Next, FIGS. 8A to 8B are views for explaining another structure of the protective layer.

First, referring to FIG. 8A, the protective layer 905 includes a plurality of layers.

At least one of the plurality of protective layers 905a and 905b includes a (111) oriented MgO material, and at least one of the other includes a (200) oriented MgO material.

For example, as shown in FIG. 8A, the protective layer 905 may include a first protective layer 905a disposed on the first dielectric layer 104 and a second protective layer disposed on the first protective layer 905a. 905b, wherein one of the first protective layer 905a and the second protective layer 905b comprises a (111) oriented MgO material and the other includes a (200) oriented MgO material .

Here, the (200) oriented MgO material is relatively more reactive than the (111) oriented MgO material. That is, the (100) oriented MgO material can easily react with other materials.

Accordingly, the first protective layer 905a includes a MgO material having a highly reactive (200) orientation, and the first protective layer 905b has a (111) orientation having a relatively small (111) orientation compared to (200). It may be advantageous to include.

Alternatively, at least one of the plurality of protective layers 905a and 905b together includes a (111) oriented MgO material and a (200) oriented MgO material, and at least one of the remaining ones is either (111) or (200). The orientation of MgO material may be included.

For example, the first protective layer 905a includes a MgO material having a (200) orientation, and the second protective layer 905b includes a (111) oriented Mg0 material and a (200) oriented MgO material together. can do.

Here, the crystal of the MgO material of the first protective layer 905a including the MgO material having one orientation, for example, the (200) orientation MgO material, is a (111) orientation MgO material and a (200) orientation MgO material It is preferable to have a larger single crystal structure than that of the MgO material of the second protective layer 905b including together.

As such, when the second protective layer 905b includes two MgO materials having different orientations, the second protective layer 905b may have a structure as shown in FIG. 9B due to a difference in crystal growth characteristics of the MgO material.

Next, referring to FIG. 9B, for example, assuming that the second protective layer 905b includes the MgO material having the first orientation and the MgO material having the second orientation different from the first orientation, the MgO having the first orientation The material is crystal-grown from the first protective layer 905a to form a first oriented MgO layer 905c, and the second oriented MgO material is crystal-grown from the first protective layer 905a to form a second oriented MgO layer 905d. Can be achieved. This is described in detail with reference to FIG. 6B, and thus redundant descriptions thereof will be omitted.

Next, FIGS. 9A to 9B are diagrams for describing the phosphor layer in more detail.

First, referring to FIG. 9A, the lower protective layer 1000 is disposed on a surface of the phosphor layer 114 disposed in the discharge cell partitioned by the partition wall 112.

The lower protective layer 1000 comprises a MgO material, preferably a (111) oriented MgO material having a relatively high secondary electron emission coefficient. As such, when the lower protective layer 1000 including the (111) oriented MgO material is disposed on the surface of the phosphor layer 114, the amount of secondary electrons increases during driving to increase the amount of wall charges in the discharge cell. Accordingly, the driving efficiency can be improved by driving at a relatively low voltage.

Next, referring to FIG. 9B, unlike the case of FIG. 9A, the phosphor layer 114 includes an MgO material. As such, the MgO material included in the phosphor layer 114 may also be a MgO material having a (111) orientation similarly to the case of FIG. 9A.

In the case of FIG. 9A, the lower protective layer 1000 is formed on the surface of the phosphor layer 114 again after the phosphor layer 114 is formed, whereas in the case of FIG. 9B, the phosphor layer 114 is formed. In the forming process, the phosphor material and the MgO material are mixed together to form the phosphor layer 114. In the case of FIG. 9B, the driving efficiency may be improved as in the case of FIG. 9A.

As such, the technical configuration of the present invention described above can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing detailed description, and the meaning and scope of the claims are as follows. And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

As described above in detail, in the plasma display panel according to the exemplary embodiment of the present invention, the protective layer includes a (111) oriented MgO material and a (200) oriented MgO material, thereby sufficiently increasing the secondary electron emission coefficient. The address discharge delay characteristics are improved, the sputtering characteristics are enhanced, and the characteristics of trapping wall charges are enhanced.

Claims (8)

A front substrate on which a dielectric layer is disposed; A protective layer disposed on the dielectric layer; A rear substrate disposed to face the front substrate; And A partition wall partitioning a discharge cell between the front substrate and the rear substrate; Including, The protective layer, The first orientation MgO layer whose crystal orientation is a 1st orientation surface, Forming a surface of said protective layer together with said first oriented MgO layer, and comprising a second oriented MgO layer whose crystal orientation is a second oriented plane, One of the first oriented MgO layer or the second oriented MgO layer has a crystal orientation of (111) plane and the other of (200) plane. The method of claim 1, The MgO layer in which the crystal orientation is grown to the (111) plane is 10% or more and 40% or less in the protective layer. The method of claim 1, The protective layer, A first protective layer formed on the dielectric layer; A second protective layer formed on the first protective layer, the second protective layer forming the first oriented MgO layer and the second oriented MgO layer, And the first protective layer has a crystal orientation of (111) or (200). delete The method of claim 1, A phosphor layer is disposed in the discharge cell, A lower display layer is disposed on the surface of the phosphor layer. The method of claim 5, wherein The lower protective layer includes a MgO material having a (111) orientation. The method of claim 1, A phosphor layer is disposed in the discharge cell, and the phosphor layer includes an MgO material. The method of claim 7, wherein The MgO material has a (111) orientation.

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