KR100850093B1 - 레이저 가공 장치 및 그 조정 방법 - Google Patents
레이저 가공 장치 및 그 조정 방법 Download PDFInfo
- Publication number
- KR100850093B1 KR100850093B1 KR1020067027902A KR20067027902A KR100850093B1 KR 100850093 B1 KR100850093 B1 KR 100850093B1 KR 1020067027902 A KR1020067027902 A KR 1020067027902A KR 20067027902 A KR20067027902 A KR 20067027902A KR 100850093 B1 KR100850093 B1 KR 100850093B1
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- workpiece
- spot
- laser light
- processing device
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000003754 machining Methods 0.000 title claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 description 26
- 239000000758 substrate Substances 0.000 description 10
- 238000003672 processing method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 3
- 239000007779 soft material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0732—Shaping the laser spot into a rectangular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
Claims (10)
- 길이 방향을 갖는 스폿을 갖는 복수의 레이저 펄스를 갖는 레이저 광을 발생하는 레이저 발생부와,상기 복수의 레이저 펄스가 서로 오버랩하도록, 상기 레이저 광을 상기 길이 방향으로 피가공물에 대하여 상대적으로 이동시켜서 상기 레이저 광을 상기 피가공물에 조사시키는 구동부를 구비한레이저 가공 장치.
- 제 1 항에 있어서,상기 스폿은 타원형인레이저 가공 장치.
- 제 1 항에 있어서,상기 스폿은 장원형인레이저 가공 장치.
- 제 1 항에 있어서,상기 스폿은 직사각형인레이저 가공 장치.
- 길이 방향을 갖는 스폿을 갖는 복수의 레이저 펄스를 갖는 레이저 광을 발생하는 레이저 발생부를 구비한 레이저 가공 장치의 조정 방법에 있어서,상기 레이저 광을 피가공물에 대하여 상대적으로 이동시킴으로써 상기 레이저 광을 상기 피가공물에 조사시켜서, 상기 피가공물에 가공 흔적(mark)을 형성하는 단계와,상기 가공 흔적의 폭을 검출하는 단계와,상기 검출된 폭을 기초로 하여 상기 스폿의 상기 길이 방향의 각도를 조정함으로써 상기 가공 흔적의 폭을 최소로 하는 단계를 포함하는레이저 가공 장치의 조정 방법.
- 제 5 항에 있어서,상기 스폿은 타원형인레이저 가공 장치의 조정 방법.
- 제 5 항에 있어서,상기 스폿은 장원형인레이저 가공 장치의 조정 방법.
- 제 5 항에 있어서,상기 스폿은 직사각형인레이저 가공 장치의 조정 방법.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 구동부는 상기 레이저 광을 상기 피가공물에 조사하여 가공 흔적을 형성하고, 상기 스폿의 상기 길이 방향의 각도를 조정함으로써 상기 가공 흔적의 폭을 최소로 하는레이저 가공 장치.
- 제 5 항 내지 제 8 항 중 어느 한 항에 있어서,상기 피가공물에 상기 가공 흔적을 형성하는 단계는 상기 레이저 광을 피가공물에 대하여 상기 길이 방향으로 상대적으로 이동시키면서 상기 레이저 광을 상기 피가공물에 조사시켜서, 상기 피가공물에 가공 흔적을 형성하는 단계를 포함하는레이저 가공 장치의 조정 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00206440 | 2005-07-15 | ||
JP2005206440A JP2007021528A (ja) | 2005-07-15 | 2005-07-15 | レーザ加工装置およびその調整方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070052707A KR20070052707A (ko) | 2007-05-22 |
KR100850093B1 true KR100850093B1 (ko) | 2008-08-04 |
Family
ID=37668692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067027902A KR100850093B1 (ko) | 2005-07-15 | 2006-07-13 | 레이저 가공 장치 및 그 조정 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090184096A1 (ko) |
JP (1) | JP2007021528A (ko) |
KR (1) | KR100850093B1 (ko) |
CN (1) | CN100546754C (ko) |
MY (1) | MY150154A (ko) |
TW (1) | TWI300372B (ko) |
WO (1) | WO2007010810A1 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101878088B (zh) * | 2007-11-27 | 2013-08-14 | 三星钻石工业股份有限公司 | 激光加工装置 |
JP5454080B2 (ja) * | 2008-10-23 | 2014-03-26 | 住友電気工業株式会社 | レーザ加工方法およびレーザ加工装置 |
JP5340806B2 (ja) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | 半導体ウエーハのレーザ加工方法 |
JP5620669B2 (ja) * | 2009-10-26 | 2014-11-05 | 東芝機械株式会社 | レーザダイシング方法およびレーザダイシング装置 |
JP4961468B2 (ja) * | 2009-10-29 | 2012-06-27 | 三星ダイヤモンド工業株式会社 | レーザー加工方法、被加工物の分割方法およびレーザー加工装置 |
EP3922751A1 (en) | 2009-11-02 | 2021-12-15 | Sigma-Aldrich Co. LLC | Solid precursor delivery assemblies and related methods |
JP5452247B2 (ja) * | 2010-01-21 | 2014-03-26 | 東芝機械株式会社 | レーザダイシング装置 |
TWI433745B (zh) * | 2010-04-16 | 2014-04-11 | Qmc Co Ltd | 雷射加工方法及雷射加工設備 |
JP5981094B2 (ja) | 2010-06-24 | 2016-08-31 | 東芝機械株式会社 | ダイシング方法 |
EP2663419A2 (en) | 2011-01-13 | 2013-11-20 | Tamarack Scientific Co. Inc. | Laser removal of conductive seed layers |
JP5140198B1 (ja) | 2011-07-27 | 2013-02-06 | 東芝機械株式会社 | レーザダイシング方法 |
JP2014011358A (ja) | 2012-06-29 | 2014-01-20 | Toshiba Mach Co Ltd | レーザダイシング方法 |
CN103128446A (zh) * | 2013-01-29 | 2013-06-05 | 江苏益林金刚石工具有限公司 | 射频板条co2激光器二轴联动金刚石锯片焊接系统 |
CN107931829B (zh) * | 2017-11-07 | 2020-03-24 | 新代科技(苏州)有限公司 | 雷射切割功率调整系统及其方法 |
CN114101927A (zh) * | 2021-11-30 | 2022-03-01 | 郑路平 | 激光加工设备 |
Citations (1)
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KR20020066199A (ko) * | 2001-02-08 | 2002-08-14 | 가부시끼가이샤 도시바 | 레이저 가공방법 및 그 장치 |
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-
2005
- 2005-07-15 JP JP2005206440A patent/JP2007021528A/ja active Pending
-
2006
- 2006-07-12 MY MYPI20063317A patent/MY150154A/en unknown
- 2006-07-13 US US11/597,062 patent/US20090184096A1/en not_active Abandoned
- 2006-07-13 TW TW095125651A patent/TWI300372B/zh active
- 2006-07-13 KR KR1020067027902A patent/KR100850093B1/ko active IP Right Grant
- 2006-07-13 WO PCT/JP2006/313939 patent/WO2007010810A1/ja active Application Filing
- 2006-07-13 CN CNB2006800004222A patent/CN100546754C/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020066199A (ko) * | 2001-02-08 | 2002-08-14 | 가부시끼가이샤 도시바 | 레이저 가공방법 및 그 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN101031382A (zh) | 2007-09-05 |
TW200714398A (en) | 2007-04-16 |
JP2007021528A (ja) | 2007-02-01 |
KR20070052707A (ko) | 2007-05-22 |
MY150154A (en) | 2013-11-29 |
US20090184096A1 (en) | 2009-07-23 |
WO2007010810A1 (ja) | 2007-01-25 |
TWI300372B (en) | 2008-09-01 |
CN100546754C (zh) | 2009-10-07 |
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