KR100839893B1 - Solderable elastic electric contact terminal - Google Patents

Solderable elastic electric contact terminal Download PDF

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Publication number
KR100839893B1
KR100839893B1 KR1020080021640A KR20080021640A KR100839893B1 KR 100839893 B1 KR100839893 B1 KR 100839893B1 KR 1020080021640 A KR1020080021640 A KR 1020080021640A KR 20080021640 A KR20080021640 A KR 20080021640A KR 100839893 B1 KR100839893 B1 KR 100839893B1
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South Korea
Prior art keywords
contact terminal
insulating
electrical contact
polymer film
coating layer
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KR1020080021640A
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Korean (ko)
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김선기
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조인셋 주식회사
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39771949&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100839893(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to KR1020080021640A priority Critical patent/KR100839893B1/en
Application filed by 조인셋 주식회사 filed Critical 조인셋 주식회사
Priority to PCT/KR2008/002122 priority patent/WO2009110653A1/en
Priority to TW97115015A priority patent/TW200939943A/en
Publication of KR100839893B1 publication Critical patent/KR100839893B1/en
Application granted granted Critical
Priority to MYPI20090470A priority patent/MY147054A/en
Priority to CA2653315A priority patent/CA2653315C/en
Priority to AT09001910T priority patent/ATE555644T1/en
Priority to EP09001910A priority patent/EP2099269B1/en
Priority to PL09001910T priority patent/PL2099269T3/en
Priority to TW098105965A priority patent/TWI387159B/en
Priority to US12/393,948 priority patent/US7931475B2/en
Priority to CN2009101180617A priority patent/CN101527400B/en
Priority to JP2009045556A priority patent/JP4733752B2/en
Priority to MX2009002562A priority patent/MX2009002562A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0009—Casings with provisions to reduce EMI leakage through the joining parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers

Abstract

A solderable elastic electric contact terminal is provided to allow a solder to be bonded to a printed circuit board by contacting with a metallic reinforcement bar through a gap by using the metallic reinforcement bar. A solderable elastic electric contact terminal includes an insulating elastic core(10), an insulating non-foam rubber coated layer(20), and a heat-resistance polymer film(30). The insulating elastic core is made of a tube-shaped non-foam rubber. The insulating non-foam rubber coated layer is in contact with the insulating core with surrounding it. One surface of the heat-resistance polymer film is bonded to the insulating non-foam rubber coated layer to surround the insulating non-foam rubber coated layer and a metal layer(40) is integrally formed on the other surface of the heat-resistance polymer film.

Description

솔더링 가능한 탄성 전기접촉단자{Solderable Elastic electric contact terminal}Solderable Elastic Electric Contact Terminal

본 발명은 전기접촉단자에 관한 것으로, 특히 인쇄회로기판(PCB) 등에 전기접촉단자의 일 측면이 고정되고 대향하는 대상물에 전기접촉단자의 타 측면이 탄성 접촉되어 대상물과 인쇄회로기판을 전기적 및 기구적으로 연결하는 리플로우 솔더링이 가능한 탄성 전기접촉단자에 관한 것이다. The present invention relates to an electrical contact terminal, and in particular, one side of the electrical contact terminal is fixed to a printed circuit board (PCB), and the other side of the electrical contact terminal is in elastic contact with the object to be opposed to the object and the printed circuit board The present invention relates to an elastic electrical contact terminal capable of reflow soldering, which is connected in general.

일반적으로 리플로우 솔더링(reflow soldering)이 가능한 탄성 전기접촉단자는, 전기 전도도가 좋고, 탄성 회복력이 우수하며, 리플로우 솔더링 온도에 견딜 수 있어야 한다. In general, an elastic electrical contact terminal capable of reflow soldering should have good electrical conductivity, excellent elastic resilience, and be able to withstand reflow soldering temperatures.

이를 위해 종래에는 리플로우 솔더링이 가능한 전기접촉단자로 금속 재질을 주로 사용하였다. 이 금속 재질 중에서 베릴륨 동(beryllium copper)은 탄성 회복력이 좋고, 전기 전도도가 뛰어나 전기접촉단자로 널리 사용되었다. 이를 위해, 0.3㎜ 이하의 두께와 일정한 폭을 갖는 베릴륨 동 시트를 프레스 금형을 통하여 일정한 형상으로 타발한 후 열처리 공정을 거쳐 탄성 회복력을 향상시킨 전기접촉단자를 제작하였다.To this end, conventionally, a metal material is mainly used as an electrical contact terminal capable of reflow soldering. Among these metals, beryllium copper is widely used as an electrical contact terminal because of its excellent elastic recovery and excellent electrical conductivity. To this end, a beryllium copper sheet having a thickness of 0.3 mm or less and a predetermined width was punched into a predetermined shape through a press die, and then an electrical contact terminal was manufactured to improve elastic recovery through heat treatment.

그러나, 이와 같이 금속 시트로만 이루어진 전기접촉단자는 금속의 특성상 또는 구조상 일정 높이 이하에서는 우수한 탄성을 제공할 수 없다는 단점이 있다. 즉, 탄성을 갖기 위해서는 일정한 형상으로 절곡해야 하고, 결국 이 절곡 높이에 의해 전기접촉단자의 높이의 대부분이 결정되기 때문에 일정 높이 이하에서는 탄성을 제공하기 불가능하다. 또한, 하나의 프레스 금형으로는 한 형상의 제품만을 만들 수 있기 때문에 다른 형상의 제품을 만들려면 추가로 고가의 프레스 금형이 필요로 하다는 단점이 있다. 더욱이, 금속 시트로 이루어져 무게가 가벼워 표면 실장(Surface Mounting) 시 공급되는 바람에 의해 움직일 수 있어 불량이 나기 쉽다는 단점이 있다.However, the electrical contact terminal made of only a metal sheet as described above has a disadvantage in that it cannot provide excellent elasticity under a certain height in view of the characteristics of the metal or the structure. That is, in order to have elasticity, it is necessary to bend to a certain shape, and eventually, since most of the heights of the electrical contact terminals are determined by this bending height, it is impossible to provide elasticity below a certain height. In addition, since only one shape of the product can be made with one press mold, there is a disadvantage that an additional expensive press mold is required to make another shape of the product. In addition, since the metal sheet is light in weight and can be moved by wind supplied during surface mounting, it is easy to be defective.

또 다른 종래의 기술로는 미국 고어(Gore) 사의 유럽특허 EP 1090538이 있다. 이 특허에 의하면, 전기전도성 개스킷 재료와 솔더링이 가능한 지지층을 고정하는 수단, 즉, 별도의 접착제 등이 필요하다는 단점이 있다. 더욱이 접착 수단에 의해 전기 저항이 커진다는 단점이 있다.Another conventional technique is EP 1090538 of Gore, USA. According to this patent, there is a disadvantage in that a means for fixing an electrically conductive gasket material and a solderable support layer, that is, a separate adhesive or the like is required. Moreover, there is a disadvantage that the electrical resistance is increased by the bonding means.

또 다른 종래의 기술로는 미국 고어 사의 미국특허 7,129,421호가 있다. 이 특허에 의하면, 압축 구멍이 형성된 전기전도성 개스킷 재료의 압축 구멍과 전기전도성 개스킷 재료의 밑면에 접힘 공정(crimp)을 갖는 전기전도성 지지층이 형성되어 EMI 개스킷 어셈블리를 생산할 때 생산성이 떨어진다는 단점이 있다. 즉, 전기전도성 개스킷 재료를 제조한 후, 별도로 제조된 전기전도성 지지층을 전기전도성 개스킷 재료의 압축 구멍에 삽입한 후 눌러야 하는 번거로움이 있다. 또한 상기 압축 구멍의 치수는 EMI 개스킷 어셈블리의 치수보다 작으므로 여기에 형성된 전기전 도성 지지층의 치수도 이에 한정되어 전기전도성 개스킷 재료와 전기전도성 지지층과의 접착력이 충분하지 못하다는 단점이 있다. 즉, EMI 개스킷 어셈블리를 위쪽 방향으로 당겼을 때 전기전도성 개스킷 재료와 전기전도성 지지층의 분리가 잘 된다는 단점이 있다.Another conventional technique is U.S. Patent 7,129,421 to Gore. According to this patent, there is a disadvantage in that productivity is reduced when producing an EMI gasket assembly by forming an electrically conductive support layer having a crimp in the compression hole of the electrically conductive gasket material and the electrically conductive gasket material in which the compression hole is formed. . That is, after preparing the electrically conductive gasket material, there is a hassle of inserting the separately prepared electrically conductive support layer into the compression hole of the electrically conductive gasket material and then pressing it. In addition, since the size of the compression hole is smaller than that of the EMI gasket assembly, the size of the conductive support layer formed therein is also limited to this, and the adhesive force between the conductive gasket material and the conductive support layer is insufficient. In other words, when the EMI gasket assembly is pulled upward, the conductive gasket material is separated from the conductive support layer.

또 다른 종래의 기술로는 본 출원인이 출원하여 등록된 국내 특허등록 제783588호가 있다. 이 특허에 의하면, 코어로 일정한 체적을 갖는 절연 발포고무를 적용함으로써 사용되는 재료가 많아 제조원가가 비싸고, 절연 발포고무의 탄성을 좌우하는 발포율을 조정하는 것이 어렵다는 단점이 있다. 이와 함께, 작은 사이즈의 제품, 가령 2㎜×2㎜×2㎜의 제품의 경우 발포고무를 적용하면 압출로 생산하기 어렵고, 단면 형상이 직사각형으로 한정된다는 단점이 있다.Another conventional technique is Korean Patent No. 783588, filed and registered by the present applicant. According to this patent, there is a disadvantage in that it is difficult to adjust the foaming rate that influences the elasticity of the insulating foamed rubber, because the material used by applying the insulating foamed rubber having a constant volume as a core is expensive. In addition, in the case of a product of a small size, for example, a product of 2mm × 2mm × 2mm it is difficult to produce by extrusion foam, there is a disadvantage that the cross-sectional shape is limited to rectangular.

따라서 본 발명은 이러한 문제점을 해결하기 위하여 제안되는 것으로, 본 발명의 목적은 탄성 및 전기전도도가 좋고, 솔더링이 가능하며, 제조원가가 낮고 생산효율이 우수한 솔더링이 가능한 탄성 전기접촉단자를 제공하는 것이다.Therefore, the present invention has been proposed to solve such a problem, and an object of the present invention is to provide an elastic electrical contact terminal capable of good elasticity and electrical conductivity, soldering, low manufacturing cost and excellent production efficiency.

더욱이 진공픽업에 의한 표면 실장과 리플로우 솔더링이 용이한 탄성 전기접촉단자를 제공하는 것이다.Furthermore, it provides an elastic electrical contact terminal that is easy to surface mount and reflow soldering by vacuum pick-up.

본 발명의 다른 목적과 특징 및 이점은 이하에 서술되는 실시 예로부터 더욱 명확하게 이해될 것이다.Other objects, features and advantages of the invention will be more clearly understood from the embodiments set forth below.

상기의 목적은, 튜브 형상의 비발포 고무로 이루어진 절연 탄성 코어; 상기 절연 탄성 코어를 감싸며 접착되는 절연 비발포고무 코팅층; 및 한 면이 상기 절연 비발포고무 코팅층을 감싸도록 상기 절연 비발포고무 코팅층에 접착되고, 다른 면에 금속층이 일체로 형성된 내열 폴리머 필름을 포함하는 솔더링 가능한 탄성 전기접촉단자에 의해 달성된다.The above object is an insulating elastic core made of a tube-shaped non-foaming rubber; An insulating non-foaming rubber coating layer wrapped around the insulating elastic core and bonded thereto; And a heat-resistant polymer electrical contact terminal comprising a heat-resistant polymer film bonded to the insulated non-foamed rubber coating layer so that one side surrounds the insulated non-foamed rubber coating layer and a metal layer integrally formed on the other side.

또한, 상기의 목적은, 튜브 형상의 비발포 고무로 이루어진 절연 탄성 코어; 상기 절연 탄성 코어 밑면에 위치하는 금속 보강대; 상기 금속 보강대와 절연 탄성 코어를 감싸며 접착되는 절연 비발포고무 코팅층; 한 면이 상기 절연 비발포고무 코팅층을 감싸도록 상기 절연 비발포고무 코팅층에 접착되고, 다른 면에 금속층이 일체로 형성된 내열 폴리머 필름을 포함하며, 상기 내열 폴리머 필름의 양단은 일정한 간극으로 이격되는 솔더링 가능한 탄성 전기접촉단자에 의해 달성된다.In addition, the above object, the insulating elastic core made of a tube-shaped non-foaming rubber; A metal reinforcing member positioned under the insulating elastic core; An insulating non-foaming rubber coating layer bonded to surround the metal reinforcing rod and the insulating elastic core; One side is bonded to the insulated non-foamed rubber coating layer to surround the insulated non-foamed rubber coating layer, the other side includes a heat-resistant polymer film formed integrally with a metal layer, both ends of the heat-resistant polymer film are soldered spaced by a predetermined gap This is achieved by means of elastic electrical contact terminals.

바람직하게, 상기 절연 비발포고무 코팅층은, 액상의 실리콘 고무가 상기 절연 탄성 코어와 상기 내열 폴리머 필름 사이에 개재된 상태에서 경화되어 형성된다.Preferably, the insulating non-foaming rubber coating layer is formed by curing a liquid silicone rubber in a state interposed between the insulating elastic core and the heat resistant polymer film.

바람직하게, 상기 금속층의 표면에는 부식 방지 및 솔더링이 용이하게 주석(Tin)이 도금될 수 있고, 상기 내열 폴리머 필름의 재질은 폴리이미드일 수 있다.Preferably, tin may be plated on the surface of the metal layer to prevent corrosion and soldering, and the material of the heat resistant polymer film may be polyimide.

바람직하게, 상기 탄성 전기접촉단자는 진공 픽업에 의한 표면 실장과 이에 따른 리플로우 솔더링이 가능하다.Preferably, the elastic electrical contact terminal can be surface mounted by vacuum pick-up and thus reflow soldering.

상기의 구성에 의하면, 외부면이 금속층으로 이루어져 전기 전도도가 좋고 솔더링이 가능하다. According to the above configuration, the outer surface is made of a metal layer, the electrical conductivity is good and soldering is possible.

또한, 탄성 코어로 튜브 형상의 절연 비발포 고무는 압출 공정을 사용하여 제조함으로써, 사용되는 재료가 적어 제조원가가 낮고, 발포율을 고려할 필요가 없이 내부 관통공의 직경을 조절하여 탄성을 조절할 수 있다는 이점이 있으며, 작은 사이즈의 제품에 있어서도 어려움이 없다.In addition, the tube-shaped insulating non-foaming rubber with an elastic core is manufactured by using an extrusion process, so that the material used is low, the manufacturing cost is low, and the elasticity can be adjusted by adjusting the diameter of the inner through hole without having to consider the foaming rate. There is an advantage and there is no difficulty even for a small size product.

또한, 금속 보강대를 이용함으로써, 인쇄회로기판에 실장시 솔더가 간극을 통하여 금속 보강대와 접촉하여 강하게 접착이 된다는 이점이 있고, 릴 테이핑 시 전기접촉단자의 상부와 하부의 구별을 용이하게 할 수 있으며, 특히 금속 보강대의 자중 때문에 표면 실장 시 공급되는 바람에 의해서도 쉽게 움직이지 않는다는 이점이 있다.In addition, by using a metal reinforcing rod, when mounting on a printed circuit board, there is an advantage that the solder is strongly bonded by contacting the metal reinforcing rod through the gap, and it is easy to distinguish the upper and lower parts of the electrical contact terminal when reel taping. In particular, due to the weight of the metal reinforcement, there is an advantage that it does not move easily due to the wind supplied during surface mounting.

이하, 첨부된 도면을 참조하여 본 발명의 일 실시 예를 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention;

도 1은 본 발명의 일 실시 예에 따른 전기접촉단자(100)를 보여주는 사시도이다.1 is a perspective view showing an electrical contact terminal 100 according to an embodiment of the present invention.

도 1을 참조하면, 최내부에 위치하는 탄성 코어(core; 10)는 튜브 또는 튜브 형상의 절연 비발포 고무로, 이 실시예에서는 단면이 사각형을 이룬다. 그러나, 이에 한정되지 않고 탄성 코어(10)의 단면은 다양한 형상을 이루도록 압출할 수 있다. 바람직하게, 탄성 코어(10)의 단면에서 양 측벽의 두께는 상하 벽의 두께보다 얇게 형성하여 탄성을 좋게 할 수 있다.Referring to FIG. 1, the innermost elastic core 10 is a tube or tube-shaped insulating non-foaming rubber, in which the cross section is rectangular in this embodiment. However, the present invention is not limited thereto, and the cross section of the elastic core 10 may be extruded to form various shapes. Preferably, the thickness of both sidewalls in the cross section of the elastic core 10 may be formed thinner than the thickness of the upper and lower walls to improve elasticity.

절연 비발포 고무 코팅층(20)은 탄성 코어(10)와 내열 폴리머 필름(30) 표면 사이에 위치하여 탄성 코어(10)와 내열 폴리머 필름(30)을 신뢰성 있게 접착한다. The insulating non-foaming rubber coating layer 20 is positioned between the elastic core 10 and the surface of the heat resistant polymer film 30 to reliably adhere the elastic core 10 and the heat resistant polymer film 30.

또한, 내열 폴리머 필름(30)의 이면에는 금속층(40)이 일체로 형성되는데, 일 예로 내열 폴리머 필름(30)은 단면 연성 적층 금속판(FCCL)일 수 있다. 금속층(40)의 외면에는 가령 주석(Sn)이 도금될 수 있다. 바람직하게 금속층(40)의 두께는 유연성, 납땜성 및 접착력을 고려하여 0.002 내지 0.01 mm 사이이다.In addition, the metal layer 40 is integrally formed on the rear surface of the heat resistant polymer film 30. For example, the heat resistant polymer film 30 may be a cross-section flexible laminated metal plate (FCCL). Tin (Sn) may be plated on the outer surface of the metal layer 40. Preferably the thickness of the metal layer 40 is between 0.002 and 0.01 mm in consideration of flexibility, solderability and adhesion.

바람직하게, 내열 폴리머 필름(30) 이면에 형성된 금속층(40)은 금속 에칭작업에 의해 일정 부분을 에칭으로 제거함으로써 전기접촉단자(100)의 유연성을 향상시킬 수 있다.Preferably, the metal layer 40 formed on the rear surface of the heat resistant polymer film 30 may improve the flexibility of the electrical contact terminal 100 by removing a portion of the metal layer by etching.

바람직하게, 내열 폴리머 필름(30)은 내열성이 좋은 폴리이미드(PI) 필름이며 유연성 및 기구적 강도를 고려하여 두께는 0.01 내지 0.05㎜ 사이이다.Preferably, the heat resistant polymer film 30 is a polyimide (PI) film having good heat resistance and has a thickness of 0.01 to 0.05 mm in consideration of flexibility and mechanical strength.

이러한 구조를 갖는 전기접촉 단자의 제조방법에 대해 설명한다.The manufacturing method of the electrical contact terminal which has such a structure is demonstrated.

이면에 금속층(40)이 형성된 일정한 폭을 갖는 내열 폴리머 필름(30)의 절연된 표면 위에 습기나 열에 의해 경화되는 액상 실리콘 고무를 두께 0.02㎜ 내지 0.5㎜로 코팅층을 형성하면서, 이 코팅층 위에 압출 공정에 의해 롤(roll) 형태로 제조된 탄성 코어(10)를 올려놓고 일정한 모양의 지그를 통하면서 감싼다. Extrusion process on the coating layer while forming a coating layer with a thickness of 0.02 mm to 0.5 mm on the back surface of the heat-resistant polymer film 30 having a constant width, the metal layer 40 is formed on the back surface of the liquid silicone rubber cured by moisture or heat By placing the elastic core (10) manufactured in the form of a roll (roll) and wraps through a jig of a predetermined shape.

여기서, 탄성 코어로 튜브형상의 절연 비발포 고무를 이용함으로써, 사용되는 재료가 적어 제조원가가 낮으며, 발포율을 고려할 필요가 없이 내부 관통공의 직경을 조절하여 탄성을 조절할 수 있다는 이점이 있다. 또한, 작은 사이즈의 제품에 있어서도 어려움이 없다.Here, by using a tubular insulating non-foamed rubber as the elastic core, the material used is low, the production cost is low, there is an advantage that the elasticity can be adjusted by adjusting the diameter of the inner through-hole without having to consider the foaming rate. In addition, there is no difficulty even in a small size product.

상기에서, 액상 실리콘 고무의 코팅층의 두께가 너무 얇으면 탄성 코어(10)와 내열 폴리머 필름(30) 사이에 접착력이 나빠지며, 코팅층의 두께가 너무 두꺼우면 액상의 실리콘 고무가 경화하는데 시간이 오래 걸린다는 단점이 있다. 또한, 습기에 의해 경화되는 액상 실리콘 고무로 코팅층을 형성하는 경우는 질소 혹은 진공 중에서 코팅하는 것이 바람직하다. In the above, if the thickness of the coating layer of the liquid silicone rubber is too thin, the adhesion between the elastic core 10 and the heat-resistant polymer film 30 is bad, if the thickness of the coating layer is too thick it takes a long time for the liquid silicone rubber to cure The disadvantage is that it takes. In addition, when forming a coating layer with the liquid silicone rubber hardened by moisture, it is preferable to coat in nitrogen or a vacuum.

이후 탄성 코어(10)를 감싼 내열 폴리머 필름(30)을 탄성 코어(10)의 치수와 유사한 치수를 갖는 금형에 위치시켜 사이에 개재된 액상의 실리콘 고무 코팅층을 경화시키면, 액상의 실리콘 고무층은 경화되면서 절연 비발포 고무 코팅층(20)으로 변화된다. 이때 절연 비발포 고무 코팅층(20)은 탄성 코어(10)와 내열 폴리머 필름(30)을 접착시켜주는 역할을 한다. 즉, 액상의 실리콘 코팅층은 일정한 치수의 금형 내부에서 경화 후 탄성 코어(10)와 내열 폴리머 필름(30)을 접착시키는 접착제 역할을 하면서 탄성을 갖는 절연 비발포 고무 코팅층(20)으로 된다. Then, the heat-resistant polymer film 30 wrapping the elastic core 10 is placed in a mold having dimensions similar to those of the elastic core 10 to cure the liquid silicone rubber coating layer interposed therebetween, and the liquid silicone rubber layer is cured. While being changed to an insulating non-foamed rubber coating layer (20). At this time, the insulating non-foaming rubber coating layer 20 serves to bond the elastic core 10 and the heat resistant polymer film 30. That is, the liquid silicone coating layer serves as an insulating non-foaming rubber coating layer 20 having elasticity while acting as an adhesive for bonding the elastic core 10 and the heat resistant polymer film 30 after curing in a mold having a predetermined dimension.

액상의 실리콘 고무는 한번 경화되면 열에 의해 다시 용융되지 않기 때문에 전기접촉단자(100)를 솔더링 할 때도 원래의 접착 성능을 유지한다. 이때 금형 내부에 위치한 액상 실리콘 고무의 경화 속도를 빠르게 하기 위하여 금형의 온도를 약 60℃ 정도로 유지하고 주변의 습도를 60% 정도로 유지한다. Since the liquid silicone rubber does not melt again by heat once cured, the original adhesive performance is maintained even when the electrical contact terminal 100 is soldered. At this time, in order to accelerate the curing rate of the liquid silicone rubber located inside the mold, the temperature of the mold is maintained at about 60 ℃ and the ambient humidity is maintained at about 60%.

더욱이 전기접촉단자(100)는 이면에 금속층(40)이 형성된 내열 폴리머 필름(30)을 사용하여 제조하기 때문에 긴 길이의 제품은 구겨짐 등 문제점이 있어 통상 1m 이하의 길이로 제조한 후 최종적으로 필요로 하는 길이인 3㎜ 내지 30㎜ 길이로 절단하여 사용하므로 액상 실리콘 고무가 완전 경화하기 전에 해당 길이만큼 절단하여 경화 시간을 단축할 수 있다. 또한, 습기에 의해 경화되는 액상 실리콘 고무 대신에 열에 의해 경화되는 액상 실리콘 고무를 사용하면 작업시간을 단축할 수 있다. In addition, since the electrical contact terminal 100 is manufactured using the heat-resistant polymer film 30 having the metal layer 40 formed on the back side, long-length products have problems such as wrinkles. Since it is used by cutting to a length of 3mm to 30mm, the length of the liquid silicone rubber can be cut by the length before the complete curing to shorten the curing time. In addition, the use of the liquid silicone rubber cured by heat instead of the liquid silicone rubber cured by moisture can reduce the working time.

이와 같이 제작된 전기접촉단자(100)의 외부 표면은 금속층(40)으로 이루어져 전기 전도도가 0.01Ω 이하로 매우 좋고 솔더링이 잘 된다. 이 실시 예에서 내열 폴리머 필름(30)으로 폴리이미드를 사용하였고, 탄성 코어(10)와 절연 비발포 고무 코팅층(20)은 실리콘 고무를 사용하였기 때문에 솔더링 시 원래의 성능을 유지한다. 또한, 탄성 코어(10)나 절연 비발포 고무 코팅층(20)은 실리콘 고무이므로 탄성 회복력이 뛰어나다.The outer surface of the electrical contact terminal 100 manufactured as described above is made of a metal layer 40, the electrical conductivity is very good to less than 0.01 Ω and soldering well. In this embodiment, since the polyimide is used as the heat resistant polymer film 30 and the elastic core 10 and the insulating non-foaming rubber coating layer 20 use silicon rubber, the original performance is maintained when soldering. In addition, since the elastic core 10 or the insulating non-foaming rubber coating layer 20 is silicone rubber, the elastic recovery force is excellent.

바람직하게 내열 폴리머 필름(30)의 밑면은 인쇄회로기판과 접촉이 많이 되도록 수평을 이루게 하고, 윗면은 수평을 이루게 하여 진공 픽업에 의한 표면 실장에 의한 리플로우 솔더링이 가능하도록 할 수 있다.Preferably, the bottom surface of the heat-resistant polymer film 30 may be horizontal so as to be in contact with the printed circuit board, and the top surface may be horizontal to allow reflow soldering by surface mounting by vacuum pickup.

도 2는 본 발명의 다른 실시 예에 따른 전기접촉단자(110)를 보여주는 단면도이다. 탄성 코어(10)의 밑면에 금속 보강대(50)를 위치시킨 후, 탄성 코어(10)와 금속 보강대(50)를 포함하는 전체를 절연 비발포 고무 코팅층(20)을 개재하여 이면에 금속층(40)이 형성된 내열 폴리머 필름(30)으로 감싼다. 이때, 내열 폴리머 필름(30)의 양단을 서로 이격시켜 간극(42)을 형성함으로써 솔더링시 솔더 크림이 금속 보강대(50)와 접촉하도록 한다. 따라서, 간극(42)에는 당연히 절연 비발포 고무 코팅층(20)이 형성되지 않는다.2 is a cross-sectional view showing an electrical contact terminal 110 according to another embodiment of the present invention. After placing the metal reinforcement 50 on the bottom of the elastic core 10, the entire metal including the elastic core 10 and the metal reinforcement 50 is interposed between the insulating non-foamed rubber coating layer 20 and the metal layer 40 on the back. ) Is wrapped with the heat-resistant polymer film 30 formed. At this time, the both ends of the heat-resistant polymer film 30 are spaced apart from each other to form a gap 42 so that the solder cream contacts the metal reinforcement 50 during soldering. Therefore, the insulating non-foaming rubber coating layer 20 is naturally not formed in the gap 42.

이 실시예에 의하면, 인쇄회로기판에 실장시 솔더 크림이 간극(42)을 통하여 금속 보강대(50)와 접촉하여 솔더링 후 강한 접착력을 갖는다는 이점이 있다. 또 한, 전기접촉단자(110)의 상부와 하부의 구별을 용이하여 릴 테이핑 작업이 용이하며, 특히 금속 보강대(50)의 자중 때문에 진공 픽업에 의한 표면 실장 시 공급되는 바람에 의해서도 쉽게 움직이지 않는다는 이점이 있다.According to this embodiment, when mounted on a printed circuit board, the solder cream has the advantage of having a strong adhesive force after soldering in contact with the metal reinforcing bar 50 through the gap 42. In addition, the reel taping operation is easy because the upper and lower portions of the electrical contact terminal 110 are easily distinguished, and in particular, due to the weight of the metal reinforcing rod 50, it does not move easily due to the wind supplied when the surface is mounted by the vacuum pickup. There is an advantage.

이상에서는 본 발명의 일 실시 예를 중심으로 설명하였지만, 당업자 수준에서 다양한 변경이나 변형을 가할 수 있다. 이러한 변경과 변형이 본 발명의 범위를 벗어나지 않는 한 본 발명에 속한다고 할 수 있다. 본 발명의 권리범위는 이하에 기재되는 청구범위에 의해 판단되어야 할 것이다. Although the above description has been made with reference to an embodiment of the present invention, various changes or modifications can be made at the level of those skilled in the art. Such changes and modifications may belong to the present invention without departing from the scope of the present invention. It is intended that the scope of the invention be determined by the claims set forth below.

도 1은 본 발명의 일 실시 예에 따른 전기접촉단자(100)를 보여주는 사시도이다.1 is a perspective view showing an electrical contact terminal 100 according to an embodiment of the present invention.

도 2는 본 발명의 다른 실시 예에 따른 전기접촉단자(110)를 보여주는 사시도이다.2 is a perspective view illustrating an electrical contact terminal 110 according to another embodiment of the present invention.

Claims (6)

튜브 형상의 비발포 고무로 이루어진 절연 탄성 코어;An insulating elastic core made of a tube-shaped non-foaming rubber; 상기 절연 탄성 코어를 감싸며 접착되는 절연 비발포고무 코팅층; 및An insulating non-foaming rubber coating layer wrapped around the insulating elastic core and bonded thereto; And 한 면이 상기 절연 비발포고무 코팅층을 감싸도록 상기 절연 비발포고무 코팅층에 접착되고, 다른 면에 금속층이 일체로 형성된 내열 폴리머 필름을 포함하는 것을 특징으로 하는 솔더링 가능한 탄성 전기접촉단자.A solderable elastic electrical contact terminal, comprising: a heat-resistant polymer film bonded to the insulated non-foamed rubber coating layer so that one side surrounds the insulated non-foamed rubber coating layer, and a metal layer is integrally formed on the other side. 튜브 형상의 비발포 고무로 이루어진 절연 탄성 코어;An insulating elastic core made of a tube-shaped non-foaming rubber; 상기 절연 탄성 코어 밑면에 위치하는 금속 보강대;A metal reinforcing member positioned under the insulating elastic core; 상기 금속 보강대와 절연 탄성 코어를 감싸며 접착되는 절연 비발포고무 코팅층; An insulating non-foaming rubber coating layer bonded to surround the metal reinforcing rod and the insulating elastic core; 한 면이 상기 절연 비발포고무 코팅층을 감싸도록 상기 절연 비발포고무 코팅층에 접착되고, 다른 면에 금속층이 일체로 형성된 내열 폴리머 필름을 포함하며,A heat-resistant polymer film adhered to the insulated non-foamed rubber coating layer so that one side surrounds the insulated non-foamed rubber coating layer, and a metal layer is integrally formed on the other side, 상기 내열 폴리머 필름의 양단은 일정한 간극으로 이격 되는 것을 특징으로 하는 솔더링 가능한 탄성 전기접촉단자.Both ends of the heat-resistant polymer film is a solderable elastic electrical contact terminal, characterized in that spaced apart by a predetermined gap. 청구항 1 또는 2에 있어서, The method according to claim 1 or 2, 상기 절연 비발포고무 코팅층은, 액상의 실리콘 고무가 상기 절연 탄성 코어와 상기 내열 폴리머 필름 사이에 개재된 상태에서 경화되어 형성되는 것을 특징으로 하는 솔더링 가능한 탄성 전기접촉단자.The insulating non-foaming rubber coating layer is a solderable elastic electrical contact terminal, characterized in that the liquid silicone rubber is cured in the state interposed between the insulating elastic core and the heat-resistant polymer film. 청구항 1 또는 2에 있어서, The method according to claim 1 or 2, 상기 금속층의 표면에는 주석이 도금되는 것을 특징으로 하는 솔더링 가능한 탄성 전기접촉단자.The solderable elastic electrical contact terminal, characterized in that the surface of the metal layer is plated tin. 청구항 1 또는 2에 있어서, The method according to claim 1 or 2, 상기 내열 폴리머 필름의 재질은 폴리이미드인 것을 특징으로 하는 솔더링 가능한 탄성 전기접촉단자.Solderable elastic electrical contact terminal, characterized in that the material of the heat-resistant polymer film is polyimide. 청구항 1 또는 2에 있어서,The method according to claim 1 or 2, 상기 탄성 전기접촉단자는 진공 픽업에 의한 표면 실장과 이에 따른 리플로우 솔더링이 가능한 것을 특징으로 하는 솔더링이 가능한 탄성 전기접촉단자 The elastic electrical contact terminal is solderable elastic electrical contact terminal, characterized in that the surface mounting by the vacuum pickup and thereby reflow soldering is possible.
KR1020080021640A 2008-03-07 2008-03-07 Solderable elastic electric contact terminal KR100839893B1 (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
KR1020080021640A KR100839893B1 (en) 2008-03-07 2008-03-07 Solderable elastic electric contact terminal
PCT/KR2008/002122 WO2009110653A1 (en) 2008-03-07 2008-04-15 Solderable elastic electric contact terminal
TW97115015A TW200939943A (en) 2008-03-07 2008-04-24 Solderable elastic electric contact terminal
MYPI20090470A MY147054A (en) 2008-03-07 2009-02-06 Solderable elastic electric contact terminal
CA2653315A CA2653315C (en) 2008-03-07 2009-02-09 Solderable elastic electric contact terminal
PL09001910T PL2099269T3 (en) 2008-03-07 2009-02-11 Solderable elastic electric contact terminal
AT09001910T ATE555644T1 (en) 2008-03-07 2009-02-11 WELDABLE ELASTIC ELECTRICAL CONTACT TERMINAL
EP09001910A EP2099269B1 (en) 2008-03-07 2009-02-11 Solderable elastic electric contact terminal
TW098105965A TWI387159B (en) 2008-03-07 2009-02-25 Solderable elastic electric contact terminal
US12/393,948 US7931475B2 (en) 2008-03-07 2009-02-26 Solderable elastic electric contact terminal
CN2009101180617A CN101527400B (en) 2008-03-07 2009-02-27 Solderable elastic electric contact terminal
JP2009045556A JP4733752B2 (en) 2008-03-07 2009-02-27 Solderable elastic electrical contact terminals
MX2009002562A MX2009002562A (en) 2008-03-07 2009-03-06 Solderable elastic electric contact terminal.

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KR100888238B1 (en) 2008-06-09 2009-03-12 조인셋 주식회사 Reflow solderable electric contact terminal
KR100920469B1 (en) 2008-12-30 2009-10-08 두성산업 주식회사 Conductive elastic block
WO2010134734A2 (en) 2009-05-18 2010-11-25 두성산업주식회사 Conductive contact terminal to be mounted on a substrate surface
KR101001354B1 (en) * 2008-07-01 2010-12-14 조인셋 주식회사 Reflow solderable electric contacts having elasticity
KR101018735B1 (en) * 2008-12-15 2011-03-04 조인셋 주식회사 Solderable Elastic Conductive Contact Terminal
KR101022037B1 (en) 2009-05-21 2011-03-16 조인셋 주식회사 Electric and Elastic Contact Terminal
KR101040594B1 (en) * 2010-04-16 2011-06-10 최철수 Surface mount gasket and method for preparing the same
KR101043283B1 (en) 2009-04-15 2011-06-22 주식회사 이노칩테크놀로지 Electric conductive gasket and method for manufacturing the same
KR101046765B1 (en) 2009-01-09 2011-07-06 조인셋 주식회사 Solderable Elastic Electrical Contact Terminals
KR101084282B1 (en) * 2011-06-15 2011-11-17 김선기 Solderable elastic electric contact terminal
KR101201410B1 (en) 2011-05-31 2012-11-14 주식회사 이엔씨테크 Elastic electric contact terminal for the printed circuit board
US8461455B2 (en) 2010-04-28 2013-06-11 Joinset Co., Ltd. Elastic electric contact terminal

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Publication number Priority date Publication date Assignee Title
KR100888238B1 (en) 2008-06-09 2009-03-12 조인셋 주식회사 Reflow solderable electric contact terminal
KR101001354B1 (en) * 2008-07-01 2010-12-14 조인셋 주식회사 Reflow solderable electric contacts having elasticity
KR101018735B1 (en) * 2008-12-15 2011-03-04 조인셋 주식회사 Solderable Elastic Conductive Contact Terminal
KR100920469B1 (en) 2008-12-30 2009-10-08 두성산업 주식회사 Conductive elastic block
KR101046765B1 (en) 2009-01-09 2011-07-06 조인셋 주식회사 Solderable Elastic Electrical Contact Terminals
KR101043283B1 (en) 2009-04-15 2011-06-22 주식회사 이노칩테크놀로지 Electric conductive gasket and method for manufacturing the same
WO2010134734A2 (en) 2009-05-18 2010-11-25 두성산업주식회사 Conductive contact terminal to be mounted on a substrate surface
KR101022037B1 (en) 2009-05-21 2011-03-16 조인셋 주식회사 Electric and Elastic Contact Terminal
KR101040594B1 (en) * 2010-04-16 2011-06-10 최철수 Surface mount gasket and method for preparing the same
US8461455B2 (en) 2010-04-28 2013-06-11 Joinset Co., Ltd. Elastic electric contact terminal
KR101201410B1 (en) 2011-05-31 2012-11-14 주식회사 이엔씨테크 Elastic electric contact terminal for the printed circuit board
KR101084282B1 (en) * 2011-06-15 2011-11-17 김선기 Solderable elastic electric contact terminal
US8853536B2 (en) 2011-06-15 2014-10-07 Joiset Co., Ltd Solderable elastic electric contact terminal

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CN101527400B (en) 2011-08-17
TW200939943A (en) 2009-09-16
WO2009110653A1 (en) 2009-09-11

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