WO2016153116A1

WO2016153116A1 - Elastic electric contact terminal with improved environmental resistance, and fabrication method therefor

Info

Publication number: WO2016153116A1
Application number: PCT/KR2015/006956
Authority: WO
Inventors: 김선기
Original assignee: 조인셋 주식회사; 김선기
Priority date: 2015-03-23
Filing date: 2015-07-06
Publication date: 2016-09-29
Also published as: CN105990728B; CN105990728A

Abstract

Disclosed is an elastic electric contact terminal comprising: an elastic core; a polymer film which is bonded while covering the core, with an adhesive layer being interposed therebetween; and a copper foil capable of being soldered, which is bonded while covering the polymer film. A metal plating layer is formed on every surface exposed outwardly from the copper foil.

Description

Elastic electrical contact terminal with improved environmental resistance and manufacturing method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an elastic electrical contact terminal, and more particularly, to an elastic electrical contact terminal having poor corrosion resistance, improved environmental resistance, and improved soldering strength.

In general, an elastic electrical contact terminal capable of soldering should have good electrical conductivity, excellent elastic recovery, and be able to withstand soldering temperatures.

As an example of an elastic electrical contact terminal, Korean Patent No. 783588 by the present inventors includes an insulating foam rubber having a predetermined volume; An insulating non-foaming adhesive layer that wraps and adheres to the insulating foam rubber; And a heat-resistant polymer film bonded to the insulating non-foaming adhesive layer so that one side thereof surrounds the insulating non-foaming adhesive layer, and a metal layer integrally formed on the other side thereof. .

In addition, Korean Patent No. 1001354 includes an insulating elastic heat resistant rubber core having a through hole formed in a longitudinal direction therein; An insulation heat resistant adhesive layer wrapped around the insulation elastic heat resistant rubber core and bonded to the insulation elastic heat resistant rubber core; And a heat-resistant polymer film adhered to the insulating heat-resistant adhesive layer so as to surround the insulating heat-resistant adhesive layer on one side thereof, and a metal layer integrally formed on the other side, wherein the polymer film is formed on the insulating heat-resistant adhesive layer so that both ends thereof are spaced apart from each other. A bottom surface of the insulating elastic heat-resistant rubber core is bonded to each other, and the reflow solderable elastic electrical contact terminal is formed to be inclined toward a middle portion at both ends in the width direction.

In the process of manufacturing the electrical contact terminal as described above, a silicone rubber made of a roll (Roll) is prepared, the silicone rubber adhesive is continuously interposed thereon in the longitudinal direction of the silicone rubber and the metal layer on the liquid silicone rubber adhesive The formed polymer film is wrapped so that the metal layer is exposed to the outside, the silicone rubber adhesive is cured to bond the polymer film, and then cut into a predetermined length, for example, 500 mm, and then the customer cuts the required length, for example, 3 mm, and then the metal is plated. Tape the finished product.

Here, the metal layer is formed by plating tin or silver on the copper foil or by plating tin or gold on it after nickel plating, and the thickness of the copper foil is approximately 0.01 mm, which is considerably thicker than the thickness of tin, silver, nickel or gold.

As such, a metal plating layer with better environmental resistance is formed on the copper foil of the existing contact terminal to prevent corrosion and to be well soldered by solder cream, but the contact terminal is cut to a desired length during the manufacturing process of the contact terminal. The cut surface formed on the longitudinal side of the copper foil is bound to be exposed to the outside.

In other words, since the conventional contact terminal is manufactured by cutting a polymer film having a copper foil plated with a metal layer such as tin wrapped around a core, the copper foil is naturally exposed to the outside at the cut surface.

As a result, in a reliability test such as a salt water test, the salt water contacts the copper foil exposed to the outside, so that the salt water test does not pass due to the corrosion of the salt water, or the copper foil exposed to the outside during use easily dissolves, thereby reducing the quality. The problem arises.

In addition, when the contact terminal is mounted on a circuit board by reflow soldering, copper foil is exposed on the cut surface exposed to the outside, resulting in smaller solder rise in the copper foil than the metal plating layer, resulting in weak soldering strength of the cut surface. There are disadvantages.

In addition, since the copper foil wrapped around the polymer film is bent at both ends of the lower surface of the core, the bent copper foil is small in size but is always subjected to elastic restoring force to return to its original position. In addition, when the contact terminal is mounted on the circuit board by reflow soldering, the molten solder cream acts on the copper foil, pulls the copper foil downward, and this force is added to the elastic restoring force of the copper foil itself, thereby providing both ends of the polymer film. There is a problem that can occur by peeling from the core or adhesive.

Similarly, when the polymer film and the core are adhered with an adhesive during the manufacturing process, there is a problem in that both ends of the polymer film are likely to be lifted off from the core or the adhesive by the above principle before the adhesion is completely performed.

It is therefore an object of the present invention to provide an elastic electrical contact terminal resistant to corrosion.

Another object of the present invention is to provide an elastic electrical contact terminal having improved soldering strength and improved soldering reliability.

Another object of the present invention is to provide an elastic electrical contact terminal having soldering strength that can be strongly opposed to an external force applied from the lateral direction.

Another object of the present invention is to provide an elastic electrical contact terminal which can minimize the peeling of both ends of the polymer film during the manufacturing process or after soldering.

The above object includes an elastic core, a polymer film wrapped around the core through an adhesive layer and bonded to the core, and a solderable copper foil wrapped around the polymer film and adhered to all surfaces exposed to the outside of the copper foil. It is achieved by an elastic electrical contact terminal, characterized in that the metal plating layer is formed.

Preferably, the specific gravity of the electrical contact terminal is smaller than the specific gravity of water, the electrical contact terminal may be larger than the width of the length.

Preferably, the metal plating layer may be formed by plating tin (Sn) or silver (Ag), or may be formed by plating tin (Sn) or gold (Au) after nickel (Ni) plating, and is more corrosive than copper foil. This is small.

Preferably, the thickness of the copper foil may be thicker than the thickness of the metal plating layer, and the copper foil is bonded by curing and applying a liquid polymer corresponding to the polymer film on the copper foil with electrolytic copper foil or rolled copper foil.

Preferably, when soldering, the metal plating layer is easier to solder than the copper foil.

Preferably, the elastic core is a silicone rubber in the form of a tube or foam, the adhesive is a silicone rubber adhesive, the polymer film may be polyimide (PI).

Preferably, the metal plating layer may be formed by electroless plating to increase soldering strength by increasing surface roughness.

Preferably, the electrical contact terminal is soldered to the conductive pattern of the circuit board by solder cream and electrically connected to the opposing electrically conductive object with elasticity.

Preferably, the lower surface of the core, the metal layer may be removed by a predetermined portion from both ends of the polymer film to expose the polymer film to the outside, the predetermined portion may be formed by exposing and etching the metal layer.

Preferably, at the bottom surface of the core, the metal layer is removed continuously by a predetermined width in the width direction and in the longitudinal direction at both ends of the polymer film.

Preferably, the core may be provided with at least one or more channels recessed downward in a predetermined width and depth from the upper surface thereof and extending in the longitudinal direction.

Preferably, the polymer film is adhered to the two sidewalls across the channel or in close contact with the outer surface of the core, both sidewalls of the channel can elastically support the object.

Preferably, the channel may be formed in plural, and may further include a support wall protruding at a height corresponding to both sidewalls and extending in the longitudinal direction between the channels.

Preferably, the upper surface of the support wall may be adhered to the polymer film via the adhesive layer.

Preferably, the sidewalls of the channel side of the sidewalls are inclined so that both sidewalls may be inclined toward the channel side when the object is pressed by the object.

The object includes an elastic core, a polymer film wrapped around the core and bonded through an adhesive layer, and a solderable metal layer wrapped around the polymer film and bonded thereto, wherein the metal layer comprises a metal seed on the polymer film. A metal plating layer including a copper plating layer formed by plating after sputtering) and covering the surface of the copper plating layer, both end surfaces in the width direction, and the cut surface of the copper plating layer formed by cutting the electrical contact terminals. It is achieved by an elastic electrical contact terminal, characterized in that formed.

The above object is to prepare a roll of silicone rubber; Continuously applying a liquid silicone rubber adhesive in the longitudinal direction of the silicone rubber; The other side of the polymer film bonded to the copper foil on one side wraps the silicone rubber through the liquid silicone rubber adhesive and then cures the silicone rubber adhesive to bond the silicone rubber and the polymer film to form a laminate. step; Cutting the laminate to a predetermined length; And plating a metal on the surface of the copper foil, both end surfaces in the width direction, and the cut surface of the copper foil formed by the cutting to form a metal plating layer. Is achieved.

According to the above structure, by covering the copper foil exposed at the longitudinal cutting surface with a metal plated layer having good environmental resistance, it is possible to fundamentally block the contact between the salt water and the copper foil in the reliability test, and the copper foil is not exposed to the outside during use. Since there is no fear of rust, reliability is improved.

In addition, the solder cream spreads well over the metal plating layer formed to cover the copper foil at the longitudinal cutting surface, thereby increasing the soldering strength at the cutting surface.

In addition, since the area of the metal layer formed on the lower surface of the contact terminal is small, the solder fillet is formed to a relatively higher position of the contact terminal even when the same amount of solder cream is applied, and as a result, the force applied to the contact terminal from the lateral direction. Strong against

In addition, by reducing the area occupied by the metal layer bent to the lower surface of the contact terminal, the elastic restoring force is reduced and the soldered area is also reduced, thereby preventing both ends of the polymer film from peeling away from the core or the adhesive during the bonding process or after soldering. Can be.

Moreover, even if the adhesive sticking out from both ends of the polymer film by the external pressure by the mold flows along the polymer film, the step formed by the thickness of both ends of the metal layer can block the flow of the adhesive.

In addition, the area occupied by the metal layer bent to the lower surface of the contact terminal is reduced, and the area to which the solder is bonded is also reduced, thereby forming a larger volume of space on the lower surface of the contact terminal, which acts as an additional buffer space. The elastic force is applied to the force applied from.

1 illustrates an electrical contact terminal according to an embodiment of the present invention.

2 (a) and 2 (b) show a modified example of the core, respectively.

3 illustrates a state in which an electrical contact terminal is soldered to a circuit board according to another embodiment of the present invention.

4 shows an electrical contact terminal according to another embodiment of the present invention.

FIG. 5 illustrates a bottom surface of the electrical contact terminal of FIG. 4.

6 shows the state in which the electric contact terminal is mounted on the circuit board, wherein 6 (a) is the electric contact terminal of the present invention and 6 (b) is a conventional electric contact terminal.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention;

1 shows an electrical contact terminal according to an embodiment of the present invention.

The elastic electrical contact terminal 100 is formed by sequentially stacking a core 10, an adhesive layer 20, a polymer film 30, and a metal layer 40.

The electrical contact terminal 100 is interposed between the circuit board and the electrically conductive object and serves to electrically connect, for example, is forcibly inserted between the conductive pattern and the electrically conductive object of the circuit board, or soldered to the conductive pattern of the circuit board. It can be soldered by cream to make contact with the opposing electrically conductive object.

In the case of reflow soldering, the electrical contact terminal 100 is reel taped to the carrier and supplied with reflow soldering by vacuum pickup and solder cream.

1.1 core (10)

The rubber core 10 has heat resistance and elasticity, and is preferably electrically insulating. As a result, it may be a tube-shaped non-foamed silicone rubber or a foamed rubber such as a sponge to satisfy the reflow soldering and elasticity conditions, but is not limited thereto.

The core 10 may be manufactured by, for example, an extrusion process, and is formed symmetrically so as to be balanced in the horizontal direction during soldering, thereby reducing lifting or blurring during reflow soldering by solder cream.

The top surface of the core 10 is provided with a flat surface for vacuum pick-up, and both sides of the top surface are formed in a round shape so as to be easy to handle, and the completed electrical contact terminal 100 is soldered to a printed circuit board to face each other. In the process of assembling the object to be prevented from being caught at both corners.

The core 10 may have a shape in which one or more through holes are formed inside the tube or the longitudinal direction, or may not have a through hole such as a sponge.

The thickness of both sidewalls of the through hole of the core 10 may be made thinner than the thickness of the upper and lower sidewalls, thereby improving elasticity and reducing the force required for pressing.

On the other hand, when the cross-sectional shape of the core 10 is a tube shape or a shape in which a through hole is formed therein, if the height of the electrical contact terminal 100 is 0.5 mm or less in size, it is difficult to form the through hole as well as the tube. It is difficult to manufacture in shape and the manufacturing efficiency is also low.

2 (a) and 2 (b) show a modified example of the core, respectively.

The core 110 is recessed downwardly from the top surface so that a pair of

channels

211 and 212 having a constant width and depth are spaced apart and extend along the length direction, so that the sidewalls 214 are formed between the

channels

211 and 212. 216 is formed at approximately the same height as 216.

Bottoms of the

channels

211 and 212 may be inclined like the lower surface of the core 210 to be inclined upwardly from the outer edge of the bottom to the inner side.

According to the above-described structure, sidewalls 214 and 216 are formed at the outside of the

channels

211 and 212, and support walls 218 are formed at the inside thereof, and the object pressed to the upper side is supported by the

side walls

214 and 216. Supported by the wall 218.

Although the cross-sectional shape of the support wall 218 is not particularly limited, for example, the support wall 218 may have a trapezoidal shape that is smaller in size, and both corners of the upper end may be rounded.

As in the above embodiment, both

sidewalls

214 and 216 are formed in a shape in which the outer side of the upper end is rounded when viewed in cross section, which is pressurized by an opposite object after the completed electrical contact terminals are soldered to a printed circuit board or the like. When pressed, it can be easily pushed inward and prevents external objects from being caught at both edges.

In this embodiment, a pair of

channels

211 and 212 are formed as an example, but a single channel is not formed to form a separate support wall, or conversely, a plurality of channels may be formed. Of course, a plurality of support walls 218 may be formed.

The core 210 may be formed in a small size, for example, a width of 2 mm, a height of 0.5 mm, and a length of 1 mm, but is not limited thereto and has a size corresponding to or smaller than that.

As described above, in the core 210 having such a size, when forming a through hole in the core 210 or manufacturing the core 210 itself in a tubular shape as in the prior art, it was difficult to set the height to 0.7 mm or less. In this embodiment, since the

channel

211, 212 extending in the longitudinal direction with a constant width and depth by digging downward from the upper surface, it is possible to easily make an electrical contact terminal having a height of 0.5 mm or less.

Both

sidewalls

214 and 216 of the

sidewalls

214 and 216, ie, the inner sidewalls of the both

sidewalls

214 and 216, are perpendicular or inclined to be inclined toward the

channels

211 and 212 so that both

sidewalls

214 and 216 are pressed upon the object It is easy to incline to this

channel

211, 212 side, and it can reduce a pressing force.

Meanwhile, the polymer film 30 having the metal layer 40 laminated on the upper surface of the polymer film 30 wraps the core 210 so as to be disposed on both

sidewalls

214 and 216 and the support wall 218 as shown in FIG. As shown in 2 (b), the core 210 may be wrapped by being adhered to and adhered to the outer surface of the core 210.

In the case of FIG. 2A, the upper surface of the support wall 218 is adhered to the polymer film 230 through the adhesive layer 220 like other portions of the core 210 to prevent the polymer film 230 from lifting. can do.

The lower surface of the core 10 may be formed to be inclined toward the middle portion at both ends in the width direction. In other words, when the core 10 is vertically cut, the bottom surface of the core 10 is formed to be inclined toward the center of the bottom surface at both corners in the width direction so as to form a hypotenuse of an isosceles triangle.

The angle of inclination is not particularly limited, but it is sufficient to form a space in which the adhesive leaks from the adhesive layer 20 is accommodated in the lower surface of the core 10 so as not to affect the soldering.

According to this structure, since the lower surface of the core 10 has a hollow shape from both ends toward the middle portion, only both of the lower surfaces of the lower surface of the electrical contact terminal 100 are in uniform contact with the molten solder during reflow soldering. It can prevent the lifting phenomenon to be soldered.

In addition, since the bottom surface of the core 10 has a hollow shape toward both ends at the both ends, it provides a space for accommodating the adhesive leaking from the adhesive layer 20 to the outside during the manufacturing process to prevent soldering during reflow soldering. Minimize the phenomenon.

1.2 Adhesive Layer (20)

The adhesive layer 20 may have flexibility, elasticity, and insulation, and may have heat resistance when the electrical contact terminal 100 is applied to reflow soldering, and may be disposed between the core 10 and the polymer film 30 so that the core ( 10) and the polymer film 30 is reliably bonded.

The adhesive layer 20 may be formed by, for example, liquid silicone rubber by thermal curing, and the liquid silicone rubber may be bonded to an opposite object while curing and to form a solid adhesive layer 20 after curing. After it maintains its elasticity, it does not melt even when heat is applied again, and maintains adhesive strength even when soldering.

Preferably, the adhesive layer 20 is a silicone rubber adhesive having self-adhesion is formed by curing and the thickness is approximately 0.005mm to 0.03mm.

1.3 Polymer Films (30)

The polymer film 30 may be, for example, a polyimide (PI) film or other heat resistant polymer film having good heat resistance, and the thickness may be determined in consideration of flexibility and mechanical strength.

The polymer film 30 is a polymer film usually used for flexible flexible printed circuit boards.

For example, the polymer film 30 may be formed by curing after the liquid polymer is cast, and the thickness of the cured polymer film 30 is 0.007 mm to 0.030 mm.

1.4 Metal Layers (40)

One side of the metal layer 40 is adhesively formed to surround the polymer film 30, and a metal plating layer 42 is formed to cover the copper layer 41.

In other words, the metal plating layer 42 is formed on all exposed surfaces of the copper layer 41, which includes the surface of the copper layer 41, i.e., the top and side surfaces and the bottom surface, and the cut surface and both cross sections in the width direction. Includes all of them.

Here, the copper layer 41 is a copper foil of an electrolytic copper foil or a rolled copper foil, or a copper plating layer formed thereon after sputtering tungsten with a seed (seed) on one side of a polymer film. Take copper foil as an example.

The thickness of the copper foil 41 is about 10 micrometers, and the thickness of a copper plating layer is formed thin about 3 micrometers.

It should be noted that the metal plating layer 42 is less corrosive than the copper foil 41, and the thickness of the copper foil 41 is thicker than the thickness of the metal plating layer 42.

Bonding the copper foil 41 on the polymer film 30 with an adhesive to the metal layer 40 to surround the polymer film 30, or a liquid phase corresponding to the polymer film 30 on the copper foil 41 Polymer can be applied, cured and bonded.

The metal plating layer 42 is formed by plating tin (Sn) or silver (Ag), or is formed by plating tin (Sn) or gold (Au) after nickel (Ni) plating, preferably in the case of tin or silver Is approximately 2 μm, and in the case of nickel / gold, the thicknesses of nickel and gold are each 1 μm or less.

The metal plating layer 42 is formed to prevent corrosion of the surface of the copper foil 41 or to be electrically conductive and well soldered. According to this embodiment, the metal plating layer 42 is enlarged as shown in the circle of FIG. 1. ) Is formed on the copper foil 41 exposed on the cut surface of the contact terminal 100 to cover the copper foil 41.

In FIG. 1, the boundary of the copper foil 41 and the metal plating layer 42 is shown by the dotted line, and it shows that the copper foil 41 is covered by the metal plating layer 42 in a cut surface.

Therefore, conventionally, the copper foil is exposed to the outside in the cut surface formed by the cutting, so that the saline contact with the copper foil exposed in the reliability test, such as the salt test does not pass the salt test, or exposed during use Rust fell on copper foil, and reliability fell.

However, according to the present invention, by covering the copper foil 41 exposed at the cutting surface with the metal plating layer 42, it is possible to fundamentally block the contact of the brine in the reliability test, and the copper foil 41 is not exposed even during use. Since there is no fear of rust, reliability is improved.

In addition, the solder cream can be spread more well over the metal plating layer 42 formed to cover the copper foil 41 at the cutting surface during reflow soldering, which inevitably increases the soldering strength and in particular, the soldering strength is improved at the cutting surface.

In particular, when the width of the contact terminal 100 is longer than the length, the soldering strength of the cut surface is very important and the present invention is very useful in this case.

In addition, since the metal plating layer 42 is not formed on the adhesive protruding to the outside, the appearance, in particular, the upper and lower surfaces of the electrical contact terminal 100 can be easily visually selected.

In order to manufacture the electrical contact terminal 100 according to this embodiment, the core 10 is continuously wrapped with a polymer film 30 having a copper foil 41 adhered to one surface via a liquid adhesive layer 20. The contact terminal bars to be supplied are cut to a predetermined length. For example, the contact terminal bars may have a length of about 500 mm.

Thereafter, the contact terminal bars are cut to a length desired by the customer, for example, about 3 mm, to form contact terminals, and as described above, tin, silver, or nickel / gold to cover the exposed surface of the copper foil 41 of the contact terminals. The plated metal plating layer 42 is formed to manufacture the final contact terminal 100.

Here, the specific gravity of the contact terminal 100 by the silicon rubber core 10 is smaller than the specific gravity of water, and thus the metal plating layer 42 may be formed by using electroless plating in a bulk method. The electroplating may be applied without being limited.

In particular, when the metal plating layer 42 is formed by electroless plating, the surface roughness of the metal plating layer 42 is increased to roughen the surface, and as a result, the adhesive strength with the solder cream is improved and the soldering strength is increased.

As described above, the core 10 is made of non-foamed silicone rubber or foamed rubber such as a sponge, the adhesive layer 20 is formed of liquid silicone rubber by thermal curing, and the polymer film 30 is formed of a polyimide film. It is comprised, and the metal plating layer 42 is not formed in a cut surface by a plating process.

As described above, in the electrical contact terminal 100, the metal plating layer 42 is formed on all of the copper foil 41 exposed to the outside including the surface, the cut surface and both cross sections in the width direction to form the copper foil 41. It is cut off from the outside.

Thereafter, the product on which the metal plating layer 42 is formed is automatically reeled to the carrier tape using a reel taping device.

In this way, the electrical contact terminal 100 of the present invention by covering all of the copper foil 41 with the metal plating layer 42 can fundamentally block the contact of the salt water in the reliability test, there is no fear of rust even during use, ripple The advantage of low soldering is that the solder cream spreads well on the cut surface, which can increase the soldering strength.

In particular, since the plating process is performed on the entire copper foil 41 exposed to the outside after cutting, the metal plating layer 42 is formed simultaneously on both end surfaces of the copper foil 41 located on the bottom surface of the core 10 in the width direction. As a result, the copper foil 41 is not exposed to the outside at all.

2 illustrates a state in which an electrical contact terminal is soldered to a circuit board according to another embodiment of the present invention.

In this embodiment, an electrical contact terminal 200 having a length of 1 mm and a width of 2 mm having a width larger than the length is disclosed.

As shown in the enlarged circle of FIG. 2, the electrical contact terminal 200 is soldered through the solder cream 120 on the conductive pattern 110 of the circuit board, the solder cream 120 of the copper foil 41. It spreads along the side and at the same time along the metal plating layer portion 42a covering the copper foil 41 at the cut surface of the contact terminal 200.

As a result, the solder cream 120 is continued along the metal plating layer portion 42a covering the copper foil 41 at the cutting surface of the electrical contact terminal 200, thereby improving solder ascending and improving solderability. This improves the soldering strength.

Particularly, as in this embodiment, in the case of the electrical contact terminal 200 having a width larger than the length, the area occupied by the metal plating layer portion 42a also increases as the width thereof increases, so that the lead riseability during reflow soldering is improved and the soldering is performed. Improved soldering strength improves the reliability and performance as the electrical contact terminal 200.

3 illustrates an electrical contact terminal according to another embodiment of the present invention, FIG. 4 illustrates a bottom surface of the electrical contact terminal of FIG. 3, and FIG. 5 illustrates the electrical contact terminal mounted on a circuit board. 5 (a) is an electrical contact terminal of the present invention and 5 (b) is a conventional electrical contact terminal.

In the lower surface of the contact terminal 300, the metal layer 40 is partially removed from both ends, and a portion 31 is exposed to the outside from both ends of the polymer film 30.

For example, the metal layer 40 may be removed and exposed from each end of the polymer film 30 by 0.05 mm to 0.3 mm, respectively, and the width of the metal layer 40 to be removed may vary depending on the width of the contact terminal 300. Can vary. In other words, when the width of the metal layer 40 to be removed is increased, the area to be soldered is reduced, and consequently, the soldering strength may be weakened.

That is, when the inside of the circle enlarged in FIG. 3C and FIG. 4, the metal layer 40 is continuously removed in the longitudinal direction by a predetermined distance in the width direction from both ends of the polymer film 30, and the polymer film 30 is removed. Exposed to the outside.

According to this configuration, since the area of the metal layer 40 formed on the lower surface of the contact terminal 300 is reduced, when the same amount of solder cream is applied to the contact terminal 300 of the same configuration in the same solder pattern, the contact terminal ( Since the amount of the molten solder cream spreads along the metal layer 40 of the lower surface of the 300 is reduced, the molten solder cream spreads relatively along the side, and as a result, the solder fillet 120a may be formed to a higher position. The side of the contact terminal 300 is reliably supported. As a result, it becomes possible to respond strongly to the force applied to the contact terminal 300 from the lateral direction.

In addition, since both ends of the metal layer 40 are located inside both ends of the polymer film 30, the elastic core 10 is wrapped with the polymer film 30 through a liquid polymer adhesive and cured to be brought into contact with the terminal 300. ), It is possible to greatly reduce the tendency of both ends of the polymer film 30 to peel off from the core 10 by the elastic restoring force of the metal layer 40 before the polymer adhesive is completely cured.

In addition, since the area occupied by the metal layer 40 bent to the lower surface of the contact terminal 300 decreases, the area to which the molten solder cream adheres is also reduced, so that the molten solder cream pulls the copper foil 41 downward during the soldering process. The force may also be reduced to prevent both ends of the polymer film 30 from being peeled off from the core 10.

Moreover, even if an adhesive sticking out from both ends of the polymer film 30 by the external pressure by the mold flows along the polymer film 30, the step formed by both ends of the copper foil 41 is not soldered. As a result, the soldering strength is improved and the phenomenon such as lifting is reduced.

In addition, as the area occupied by the metal layer 40 bent to the lower surface of the contact terminal 300 is reduced, the area occupied by the solder cream on the lower surface of the contact terminal 300 is reduced, and as a result, a relatively larger area is provided on the lower surface of the contact terminal. A volume space is formed to elastically receive the force applied from the outside.

The copper foil 41 constituting the metal layer 40 is attached to a predetermined portion 31 of the polymer film 30 by a process such as exposure and etching in a state where the copper foil 41 is formed on the polymer film 30, for example. The corresponding copper foil 41 may be removed.

After the copper foil 41 is removed, the metal plating layer 42 is formed by plating tin or silver on the copper foil 41 or plating nickel or gold after nickel plating, as in the above embodiment.

Referring to FIG. 5 (a), the molten solder cream is spread along the metal layer 40 surrounding the lower surface and the side surface of the contact terminal, and both ends of the polymer film 30 and both ends of the metal layer 40 are melted. Since the solder cream is mainly spread along the metal layer 40 formed on the lower surface, relatively

small solder fillets

122 and 122a are formed on the side surface.

Therefore, the contact terminals may be easily separated from the

conductive patterns

110 and 112 because they do not sufficiently correspond to the force applied from the lateral direction. In addition, the lower surface of the metal layer 40 is pulled downward by the molten solder cream during the soldering process, the polymer film adhered to the core 10 by the resilience of the metal layer 40 and the pulling force of the molten solder cream ( Both ends of 30) rise and fall.

On the other hand, Figure 5 (b) showing the soldered state of the electrical contact terminal of the present invention, the polymer film 30 is exposed from the both ends of the polymer film 30, a portion 31 is exposed to the outside contact terminal 300 Since the area of the metal layer 40 formed on the lower surface of the () is small, relatively the same amount of the molten solder cream 120 is further spread along the side of the contact terminal 300, and as a result the side of the contact terminal 300 Accordingly, the solder fillet 120a is formed to a higher position.

Therefore, even if a force is applied to the contact terminal from the lateral direction, the solder fillet 120a formed on the side of the contact terminal 300 sufficiently corresponds to this, thereby reducing the peeling of the contact terminal 300 from the

conductive patterns

110 and 112. Can give

In addition, the lower surface of the metal layer 40 is pulled downward by the molten solder cream during soldering. Since both ends of the metal layer 40 are located inward from both ends of the polymer film 30, the pulling force is caused by the molten solder cream. Not only does this decrease, but also the area of the metal layer 40 is reduced, thereby reducing the inherent elastic restoring force, and as a result, both ends of the polymer film 30 adhered to the core 10 are pulled downward by the metal layer 40 to fall off. The phenomenon can be prevented.

On the other hand, when the polymer film 30 is adhered to the core 10 by compression and thermal curing while wrapping the core 10 with the adhesive polymer film 30 and passing through a mold (not shown), Even though the adhesive sticking out from both ends of the polymer film 30 due to the external pressure flows along the polymer film 30, both ends of the metal layer 40 form a step, thereby preventing the adhesive flow. Since the adhesive is not soldered by the solder cream, this step improves the soldering strength of the contact terminal and reduces the lifting phenomenon.

In the above embodiment, the case in which the electrical contact terminals (100, 200, 300) is soldered to the conductive pattern of the circuit board by the solder cream to contact the opposing electrically conductive object as an example, but is not limited thereto. As such, it may be installed by forcibly sandwiched between the conductive pattern of the circuit board and the electrically conductive object. In this case, there is no process such as reflow soldering, so the material of the component does not have to be heat resistant.

In the above description, the embodiment of the present invention has been described, but various changes or modifications can be made at the level of those skilled in the art. Such changes and modifications may belong to the present invention without departing from the scope of the present invention. It is intended that the scope of the invention be determined by the claims set forth below.

Claims

An elastic core, a polymer film wrapped around the core and bonded through an adhesive layer, and a solderable copper foil wrapped around the polymer film and bonded to each other,

Elastic electrical contact terminal, characterized in that the metal plating layer is formed on all surfaces exposed to the outside of the copper foil.
The method according to claim 1,

Elastic electrical contact terminal, characterized in that the specific gravity of the electrical contact terminal is smaller than the specific gravity of water.
The method according to claim 1,

The metal plating layer is formed by plating tin (Sn) or silver (Ag), or is formed by plating tin (Sn) or gold (Au) after nickel (Ni) plating.
The method according to claim 1,

The metal plating layer is elastic electrical contact terminal, characterized in that less corrosive than the copper foil.
The method according to claim 1,

Elastic copper contact terminal, characterized in that the thickness of the copper foil is thicker than the thickness of the metal plating layer.
The method according to claim 1,

The copper foil is an electrolytic copper foil or a rolled copper foil, and the elastic electrical contact is characterized in that the liquid polymer corresponding to the polymer film is coated on the copper foil and cured to be bonded to the polymer film or adhered to the polymer film through an adhesive. Terminals.
The method according to claim 1,

When soldering, the metal plating layer is an elastic electrical contact terminal, characterized in that the soldering is made easier than the copper foil.
The method according to claim 1,

The elastic core is a silicone rubber in the form of a tube or foam, the adhesive layer is a silicone rubber adhesive layer, the polymer film is an elastic electrical contact terminal, characterized in that the polyimide (PI).
The method according to claim 1,

The metal plated layer is formed by electroless plating, and thus the surface roughness is increased, thereby improving soldering strength.
The method according to claim 1,

The electrical contact terminal is an elastic electrical contact terminal, characterized in that the width is greater than the length.
The method according to claim 1,

The electrical contact terminal is elastically electrically contacted terminal, characterized in that it is electrically connected to the electrically conductive object to be opposed by being soldered to the conductive pattern of the circuit board by the solder cream.
The method according to claim 1,

The said exposed surface is the elastic electrical contact terminal characterized by including the cut surface of the said copper foil formed by cut | disconnecting both the cross section of the surface of the said copper foil and the width direction, and the said electrical contact terminal.
The method according to claim 1,

In the lower surface of the core, the elastic electrical contact terminal, characterized in that the metal layer is removed by a predetermined portion from both ends of the polymer film to expose the polymer film to the outside.
The method according to claim 13,

And at the bottom surface of the core, the metal layer is removed at both ends of the polymer film by a predetermined width in the width direction and continuously in the longitudinal direction.
The method according to claim 13,

The predetermined portion is formed by exposing and etching the metal layer, the elastic electrical contact terminal.
The method according to claim 1,

The core has an at least one channel recessed in a predetermined width and depth downward from its upper surface, and has at least one channel extending in the longitudinal direction.
The method according to claim 16,

The polymer film is stretched over the sidewalls across the channel or adhered to the outer surface of the core in close contact with each other, wherein both sidewalls of the channel elastically support the object.
The method according to claim 16,

The channel is formed of a plurality, the elastic electrical contact terminal, characterized in that further comprising a support wall extending in the longitudinal direction and protruding to a height corresponding to the both side walls between the channel.
The method according to claim 18,

The upper surface of the support wall is elastic electrical contact terminal, characterized in that bonded to the polymer film via the adhesive layer.
The method according to claim 16,

The channel side surfaces of the both side walls are inclined so that both side walls are inclined toward the channel side when pressed by the object.
An elastic core, a polymer film covering and encapsulating the core via an adhesive layer, and a solderable metal layer encapsulating and adhering the polymer film, wherein the metal layer is formed by sputtering a metal seed on the polymer film. It includes a copper plating layer formed by plating on,

An elastic electrical contact terminal, characterized in that the metal plating layer is formed to cover the surface of the copper plating layer, both end surfaces in the width direction and the cut surface of the copper plating layer formed by cutting the electrical contact terminal.
Preparing a roll of silicone rubber;

Continuously applying a liquid silicone rubber adhesive in the longitudinal direction of the silicone rubber;

The other side of the polymer film bonded to the copper foil on one side wraps the silicone rubber through the liquid silicone rubber adhesive and then cures the silicone rubber adhesive to bond the silicone rubber and the polymer film to form a laminate. step;

Cutting the laminate to a predetermined length; And

And forming a metal plated layer by plating a metal on the surface of the copper foil, both end surfaces in the width direction, and the cut surface of the copper foil formed by the cutting.
The method according to claim 22,

The metal plating layer is formed by electroless plating, so that the surface roughness increases the soldering strength, characterized in that the manufacturing method of the elastic electrical contact terminal.