KR102291668B1 - manufacturing method for stretchable wire substrate using via mold integrated via wire and stretchable wire substrate manufactured thereby - Google Patents

Abstract

The present invention relates to a method for manufacturing a stretchable wiring board having a protruding electrode in which a via conductor is integrally formed in an injection molding process by applying a via mold in which via conductors are integrally formed, and to a stretchable wiring board,
An embodiment of the present invention includes the steps of: preparing a substrate mold having a plate-shaped concave portion and protrusion forming portions that are concave for forming protrusions on a bottom surface of the plate-shaped concave portion; coupling a via mold including detachably coupled via wires to the substrate mold so that the via wires are positioned at the protrusion forming portions; forming a flexible protrusion-integrated substrate having a protrusion integrally formed therein by injecting a substrate material into the substrate mold and curing the substrate; separating the via mold from the substrate mold on which the protrusion-integrated substrate is formed; forming a lower wiring layer including lower wirings connecting via conductors on a surface opposite to the surface on which the protrusions are formed of the protrusion-integrated substrate; and forming a protruding electrode by forming contact electrodes at the end of the via conductor exposed on the surface opposite to the surface on which the lower wirings are formed. A method of fabricating a retractable wiring board is provided.

Description

A method for manufacturing a stretchable wiring board having a protruding electrode using a via mold with via wires, and a stretchable wiring board {manufacturing method for stretchable wire substrate using via mold integrated via wire and stretchable wire substrate manufactured thereby}

The present invention relates to a stretchable wire substrate, and more particularly, to a strip having a protruding electrode in which a via wire is integrally formed in an injection molding process by applying a via mold in which a via wire is integrally formed. The present invention relates to a method of manufacturing a stretchable wiring board and a stretchable wiring board.

With the recent activation of research on human body-mounted devices, wearable devices, or stretchable displays for bio and health care, flexible and durable that internal electronic components or wiring do not break, disconnect or deform even when bent or stretched A stretchable substrate having

Accordingly, in the prior art, a flat polymer substrate such as PDMS is provided, and a stretchable substrate in which the electronic component is directly and electrically and mechanically mounted using solder at the electronic component mounting position of the polymer and conductive polymer substrate is provided.

However, as described above, when the electronic component is directly attached to the polymer substrate using solder, when the stretchable substrate is bent or bent, the bending or bending external force is directly transmitted to the bonding position between the polymer substrate and the electronic component, so that wiring or electronic There were problems such as cracks in the parts or separation of the polymer substrate and electronic parts.

Accordingly, Korean Patent Registration No. 10-1815886 discloses that the cross section buried with the second polymer layer 100 at the location where the electronic component is mounted such as an OLED device of the flexible second polymer layer 100 is the peeling prevention layer 300 . The first polymer layer 200 having a rigid property to be adhered was buried to provide a stress-isolated structure stretchable substrate configured to mount an electronic component on a cross-section exposed to the outside of the first polymer layer.

However, in the case of the above-described conventional stress-isolated structure stretchable substrate, the first polymer layer 200 is buried in the second polymer layer 100 and has a rigid property, thereby reducing overall flexibility.

Accordingly, in the stretchable substrate having the above configuration, damage to wiring occurs during bending and tension, or the difference in material properties between the attached electronic component and the stretchable substrate and concentration of stress on the stretchable substrate There is also a problem that the electronic component can be easily peeled off from the polymer material such as the formed first polymer layer 200 .

In addition, in the case of the prior art, when a stretchable substrate is manufactured by molding a polymer using a mold, after forming a via hole in which a via conductor will be formed during molding of the polymer substrate, after molding of the polymer substrate is completed, In order to form a via wire, an additional process for forming a via wire such as electrolytic plating, low-temperature molten metal dispensing, and vacuum suction of low-temperature molten metal must be performed. It takes time and has a problem that productivity is lowered.

Republic of Korea Patent No. 10-1815886

Therefore, an embodiment of the present invention for solving the problems of the prior art described above is a protruding electrode using a via mold having a via wire in which the via wire is integrally formed in the injection molding process by applying the via mold in which the via wire is integrally formed. An object to be solved is to provide a method for manufacturing a stretchable wiring board having

In addition, according to an embodiment of the present invention, it is possible to minimize the generation of stress at the attachment position of the electronic component and the solder during tension and bending of the stretchable wiring board on which the electronic component is mounted, so that the electronic component is transferred from the stretchable wiring board to the electronic component. Another object to be solved is to provide a method for fabricating a stretchable wiring board having a protruding electrode using a via mold with via conductors for exfoliation of components, and a stretchable wiring board.

An embodiment of the present invention for achieving the above object includes the steps of: preparing a substrate mold having a plate-shaped concave portion and protrusion forming portions which are concave-formed for forming protrusions on the bottom surface of the plate-shaped concave portion; coupling a via mold including detachably coupled via wires with the substrate mold so that the via wires are positioned at the protrusion forming portions; forming a flexible protrusion-integrated substrate having a protrusion integrally formed therein by injecting and curing a substrate material into the substrate mold; separating the via mold from the substrate mold on which the protrusion-integrated substrate is formed; forming a lower wiring layer including lower wirings connecting via conductors on a surface opposite to the surface on which the protrusions are formed of the protrusion-integrated substrate; and forming a protruding electrode by forming contact electrodes at an end of a via conductor exposed on a surface opposite to the surface on which the lower wirings are formed to form a protruding electrode. to provide.

The step of injecting the substrate material may include: injecting by adjusting the amount of the substrate material so that the ratio of the height of the protrusion to the thickness of the substrate in the non-protrusion region in which the protrusions are not formed is in the range of 0.8 to 1.2; can

The forming of the lower wiring layer may include: forming a conductive metal layer by coating a conductive metal on the opposite surface of the protrusion-integrated substrate on which the protrusion is formed; and patterning the lower interconnections by removing the non-lower interconnection region of the conductive metal layer.

In the method for manufacturing a stretchable wiring board having the protruding electrode, after the step of forming the lower wiring layer, a substrate material is applied to the surface on which the lower wirings are formed, and then a process of forming a multilayer wiring is repeatedly performed to form multilayer wirings. Forming a multi-layer wiring layer made of; may be configured to further include.

The method for manufacturing a stretchable wiring board having the protruding electrodes further includes, after forming the contact electrodes, applying a solder paste to the contact electrodes and then mounting electronic components through the solder pastes. characterized by being

Another embodiment of the present invention for achieving the above object provides a stretchable wiring board having protruding electrodes manufactured by a method for manufacturing a stretchable wiring board having protruding electrodes using the via mold with via conductors. .

The protrusion may be characterized in that the via conductor inserted therein is integrally formed when the protrusion-integrated substrate is formed.

A ratio between the height of the protrusion and the thickness of the substrate in the non-protrusion region in which the protrusions are not formed may be in a range of 0.8 to 1.2.

The protruding electrode may include: the protruding portion in which the via conductor is integrally formed; and contact electrodes respectively formed at the exposed ends of the via conductors.

The stretchable wiring board having the protruding electrodes using the via mold with via conductors may further include one or more multi-layered wiring layers stacked on the lower wiring layers formed by the lower wirings.

The stretchable wiring board having the protruding electrode may further include an electronic component bonded to the protruding electrode.

According to the above-described embodiment of the present invention, a stretchable wiring board having a protruding electrode using a via mold having a via wire in which the via wire is integrally formed in the injection molding process is manufactured by applying a via mold in which the via wire is integrally formed. By doing so, after forming a via hole in which a via conductor will be formed during molding of a polymer substrate in the prior art, and after the molding of the polymer substrate is completed, electrolytic plating, low-temperature molten metal dispensing, low-temperature molten metal vacuum suction, etc. Since an additional process for forming a via conductor of

In addition, according to the above-described embodiment of the present invention, an external force including bending or tension is applied to the stretchable wiring board by mounting the electronic component using the protruding electrode having an integral protrusion on the stretchable wiring board. When applied, the protrusions prevent stress due to external force from being transmitted to the attachment position of the electronic component and the solder, and the generation of stress is prevented. It provides the effect of significantly improving the service life of the stretchable wiring board by remarkably reducing the occurrence rate of disconnection of the formed wirings.

1 is a process diagram of a method of manufacturing a stretchable wiring board having protruding electrodes using a via mold with via conductors;
2 is a view showing lower wirings 7 and multilayer wirings 7a formed by the step of forming a multilayer wiring layer according to another embodiment of the present invention.
3 is a cross-sectional view of a stretchable wiring board having protruding electrodes using a via mold with via conductors according to an embodiment of the present invention;
Figure 4 is a view showing the fabricated prior art stretchable substrate (s).
5 is a view showing a stretchable substrate (S) according to an embodiment of the present invention.
6 is a view showing experimental conditions for finite analysis of stretchable substrates according to the above-described prior art and an embodiment of the present invention.
7 is a graph showing tensile test results of a conventional stretchable board (S) and a stretchable wiring board (A) according to an embodiment of the present invention.
8 is a view showing the stress distribution according to a tensile test of a conventional stretchable substrate (S) and a stretchable wiring substrate (A) according to an embodiment of the present invention.
9 is a graph showing the bending test results of a conventional stretchable board (S) and a stretchable wiring board (A) according to an embodiment of the present invention.
FIG. 10 is a view showing stress distribution according to a bending test of a conventional stretchable substrate (S) and a stretchable wiring substrate (A) according to an embodiment of the present invention;
11 is a graph showing a change in stress at 150% tensile strength according to a change in substrate thickness (a) and a change in thickness (height) of a protrusion (b) of a stretchable wiring board (A) according to an embodiment of the present invention;
12 is a graph showing a change in stress when a bending force is changed according to a change in substrate thickness (a) and a change in thickness of a protrusion (b) of a stretchable wiring board (A) according to an embodiment of the present invention;
13 is a graph showing a rate of change in electrical resistance at 50% tensile strength of a stretchable substrate according to an embodiment of the present invention.

In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

Since the embodiment according to the concept of the present invention may have various changes and may have various forms, specific embodiments will be illustrated in the drawings and described in detail in the present specification or application. However, this is not intended to limit the embodiment according to the concept of the present invention to a specific disclosed form, and it should be understood that the present invention includes all changes, equivalents, or substitutes included in the spirit and scope of the present invention.

When a component is referred to as being “connected” or “connected” to another component, it is understood that the other component may be directly connected or connected to the other component, but other components may exist in between. it should be On the other hand, when it is mentioned that a certain element is "directly connected" or "directly connected" to another element, it should be understood that the other element does not exist in the middle. Other expressions describing the relationship between elements, such as "between" and "immediately between" or "neighboring to" and "directly adjacent to", should be interpreted similarly.

The terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In this specification, terms such as "comprises" or "have" are intended to designate that the described features, numbers, steps, operations, components, parts, or combinations thereof exist, and include one or more other features or numbers. , it is to be understood that it does not preclude the possibility of the presence or addition of steps, operations, components, parts, or combinations thereof.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention.

1 is a process diagram of a method of manufacturing a stretchable wiring board having protruding electrodes using a via mold with via conductors.

As shown in FIG. 1, in the method for manufacturing a stretchable wiring board (A) having a protruding electrode using a via mold with an electrolytic via conductor, a plate-shaped recessed part 31 for forming the entire substrate and the plate-shaped recessed part 31 Prepare a substrate mold 30 having a protrusion forming portion 33 that is concave for forming protrusions on the bottom surface of the substrate (preparing the substrate mold (a)).

Thereafter, the via mold 40 having the via conductors 41 separably coupled to the via conductor formation position is formed by passing the via conductors 41 through the bottom surface of the substrate mold 30 to form the protrusion forming part 33 . ) and coupled with the substrate mold 30 (step (b) of coupling the via mold and the substrate mold).

Next, the substrate material 80 made of a flexible material, such as PDMS, is injected into the protrusion forming portions 33 where the plate-shaped recessed portions 31 and the via conductors 41 of the substrate mold 30 are located (the substrate). Step (c)) of injecting the material. At this time, the amount of the substrate material 80 is adjusted so that the ratio of the height of the protrusion 4 to the thickness of the substrate in the region of the non-protrusion 3 where the protrusions 4 are not formed is in the range of 0.8 to 1.2. It may be an injection step.

As described above, after the substrate material 80 is injected into the plate-shaped concave portion 31 and the protrusion forming portion 33 of the substrate mold 30 to which the via mold 40 is coupled to the bottom surface, the substrate mold A flexible protrusion-integrated substrate 1 having a via conductor 41 integrally formed therein is formed by curing in a state in which the via mold 40 is coupled to the via mold 40 (Forming a protrusion-integrated substrate) (c)).

After curing is completed and the protrusion-integrated substrate 1 is molded, the via mold 40 is removed from the substrate mold 30 (step (d) of removing the via mold 40 ).

After the via mold 40 is separated from the substrate mold 30 on which the protrusion-integrated substrate 1 having the protrusion 4 on which the via conductors 41 are integrally formed is formed, electrolytic plating, coating, screen printing, etc. are performed. to form a conductive metal layer for forming the lower wiring 7 connecting the via conductors 41 on the surface that becomes the lower surface of the protrusion-integrated substrate 1, and then remove the conductive metal layer in the non-lower wiring area. Step (e)) of forming a lower wiring layer composed of wirings (7).

In addition, in the step of forming the lower wiring layer (FIG. 1E), the substrate material 80 layer is formed on the upper surface on which the lower wirings 7 are formed, a conductive metal layer is formed, and thereafter, a region not to be a wiring By repeatedly performing the process of removing the conductive metal layer, the step of forming the multilayer wiring layer including the lower wiring layer and the multilayer wirings 7a forming a plurality of layers may be further performed. 2 is a view showing lower wirings 7 and multilayer wirings 7a formed by the step of forming a multilayer wiring layer according to another embodiment of the present invention.

As described above, after the lower wirings 7 are formed by electroplating, the protrusion-integrated substrate 1 is separated from the substrate mold 30 and then exposed from the opposite side of the surface on which the lower conductors 7 are formed. By forming the protruding electrode 1a by performing the step (f, g in FIG. 1) of forming the contact electrodes 8 spaced apart from each other for mounting electronic components by electrolytic plating on the end of the via conductor 41 to be , a stretchable wiring board (A) having the protruding electrode according to an embodiment of the present invention is manufactured.

In addition, in the stretchable wiring board A having protruding electrodes according to an embodiment of the present invention, as shown in FIG. 1H , after solder paste is applied to the contact electrodes 8, the electronic components 10 are soldered ( 9) may be configured to mount the electronic components 10 to the mounting through.

3 is a cross-sectional view of a stretchable wiring board A having protruding electrodes using a via mold with via conductors on which electronic components are mounted according to an embodiment of the present invention.

As shown in FIG. 3 , the stretchable wiring board A includes a protrusion-integrated substrate 1 having protrusions 4 integrally formed with via conductors 41 and electrically connecting the via conductors 41 to each other. lower wirings 7 wired to the opposite surface of the surface on which the protrusions 4 of the stretchable wiring board A are formed, and electronic components 10 mounted on the electronic component mounting surface of the protrusions 4 It may be configured to include.

As shown in FIG. 3 , the protruding electrode 1a includes the protruding part 4 and a lower wiring 7 formed on the stretchable wiring board A having one end penetrating the protruding part 4 having the protruding electrode. ), and at the ends of the via conductors 41 exposed on the mounting surface of the electronic component 10 of the protrusion 4 and the contact electrodes 8 in the form of pads formed separately from each other. ) may be included.

<Experimental example>

For comparison between a stretchable board on which electronic components are mounted on a plate-like board without a conventional protrusion and a stretchable wiring board A having protruding electrodes of the embodiments of the present invention, a conventional stretchable board After (S) and the stretchable wiring board (A) having the protruding electrodes 1a of the embodiments of the present invention were fabricated, finite analysis was performed.

FIG. 4 is a view showing a fabricated conventional stretchable substrate S, and FIG. 5 is a view showing a stretchable wiring board A according to an embodiment of the present invention.

In FIG. 4, (a) is a perspective view of a conventional stretchable substrate on which one electronic component is mounted for a tensile test, and (b) is a conventional stretchable substrate on which two electronic components are mounted for a bending test. It is a perspective view of the board|substrate S.

In the conventional stretchable substrate S of FIG. 4 , the electronic component 10 is directly attached to and mounted on the plane of the substrate S through solder paste.

And in FIG. 5 (a) is a perspective view of a stretchable wiring board (A) having a protruding electrode according to an embodiment of the present invention on which one electronic component is mounted for a tensile test, and (b) is two for a bending test. It is a perspective view of a stretchable wiring board (A) having a protruding electrode on which electronic components are mounted according to an embodiment of the present invention.

In the stretchable wiring board A having the protruding electrode on which the electronic component is mounted in FIG. 5 , the electronic components 10 are mounted through the protruding electrode 1a having a thickness 0.8 to 1.2 times that of the substrate.

6 is a view showing experimental conditions for the above-described finite analysis.

As shown in Figure 6, in order to manufacture the conventional stretchable substrate and the stretchable substrate of the present invention, the substrate material has a Young's modulus of 0.5e ³ KPa, a Poison ratio of 0.49, and a density of 7.85 PDMS with e ^-6 kg/mm ³ was applied. For electronic components, a silicon LED having a Young's modulus of 130.4e ⁶ KPa, a Poison ratio of 0.36, and a density of 52e ^-6 kg/mm ^{3 was applied.} SAC305 solder having a Young's modulus of 52.77e ⁶ KPa, a Poison ratio of 0.36, and a density of 0.6e ^-6 kg/mm ³ was applied.

Thereafter, compared to the initial PDMS length, a tensile test was performed by applying a force only on the x-axis at 110, 120, 130, and 140%, and a bending test was performed with the PDMS radius of curvature R15, R10, and R5 to perform finite element analysis. carried out.

7 is a graph showing the tensile test results of a conventional stretchable substrate (S) and a stretchable wiring board (A) according to an embodiment of the present invention, and FIG. 8 is a conventional stretchable substrate (S). ) and the stress distribution by the tensile test of the stretchable wiring board (A) according to the embodiment of the present invention.

As shown in FIG. 7 , in the conventional stretchable substrate S, when the tensile rate increases, the stress increases rapidly, and as a result, as shown in FIG. It was confirmed that the solder 9 and the electronic component 10 were separated by being concentrated at the junction of the solder paste 9 and the solder 9 .

On the other hand, in the case of the stretchable wiring board A according to the embodiment of the present invention, the stress hardly increased even when the tensile rate was increased, and the stress St was distributed to the protruding electrode 1a. The separation of the solder 9 and the electronic component 10 did not occur by this.

9 is a graph showing the bending test results of a conventional stretchable substrate (S) and a stretchable wiring board (A) according to an embodiment of the present invention, and FIG. 10 is a conventional stretchable substrate (S). ) and a diagram showing the stress distribution according to the bending test of the stretchable wiring board (A) according to the embodiment of the present invention.

As shown in FIG. 9, in the stretchable substrate S of the prior art, when the radius of curvature increases, the stress increases rapidly, and as a result, as shown in FIG. It was confirmed that the solder 9 and the electronic component 10 were separated from each other by being concentrated at the junction of the solder 9 and the solder 9 .

On the other hand, in the case of the stretchable wiring board A according to the embodiment of the present invention, the stress hardly increased even when the radius of curvature was increased, and the stress St was not distributed in the protruding electrode 1a. The separation of the solder 9 and the electronic component 10 did not occur by this.

11 is a graph showing the change in stress at 150% tension according to the change in the substrate thickness (a) and the change in the thickness (height) of the protrusion (b) of the stretchable wiring board (A) according to the embodiment of the present invention; 12 is a graph illustrating a stress change when a bending force is changed according to a change in the substrate thickness (a) and a change in the thickness of the protrusion (b) of the stretchable wiring board A according to an embodiment of the present invention.

Specifically, in FIG. 11 (a), the thickness of the substrate in the stretchable wiring board (A) having protrusion heights of 1 mm (T1), 2 mm (T2), and 3 mm (T3) is variable to 1 mm, 2 mm, and 3 mm. and is a graph showing the change in stress when 150% tensile force is applied, (b) is the height of the protrusion in the stretchable wiring boards having the substrate thicknesses of 1 mm (t1), 2 mm (t2), and 3 mm (t3) It is a graph showing the change in stress when 150% of tensile force is applied while changing to 1mm, 2mm, and 3mm.

And, in FIG. 12 (a), in a stretchable wiring board having protrusion heights of 1 mm (T1), 2 mm (T2), and 3 mm (T3), the thickness of the substrate was varied to 1 mm, 2 mm, and 3 mm, and bending force was applied. It is a graph showing the stress change in the case, (b) is the thickness of the substrate in stretchable substrates having 1 mm (t1), 2 mm (t2), and 3 mm (t3), the height of the protrusion is varied to 1 mm, 2 mm and 3 mm It is a graph showing the change in stress when a bending force is applied.

As shown in FIGS. 11 and 12, when tensile or bending force is applied, the smaller the substrate thickness and the smaller the height of the protrusion, the smaller the stress distribution occurred within the range of 0.8 to 1.2, and the ratio of the substrate thickness to the height of the protrusion was close to 1:1. The lowest stress distribution was possible.

13 is a graph showing a rate of change in electrical resistance at 50% tensile strength of a stretchable wiring board according to an embodiment of the present invention.

As shown in FIG. 13 , in the case of the stretchable wiring boards according to an embodiment of the present invention, it was confirmed that the electrical resistance change rate showed superior performance of 5% or less even at 50% tension.

Although the technical idea of the present invention described above has been specifically described in the preferred embodiment, it should be noted that the embodiment is for the purpose of explanation and not for the limitation thereof. In addition, those of ordinary skill in the technical field of the present invention will understand that various embodiments are possible within the scope of the technical spirit of the present invention. Accordingly, the true technical protection scope of the present invention should be defined by the technical spirit of the appended claims.

A: Stretchable wiring board
S: Stretchable substrate of the prior art
1: Protrusion integrated board
1a: protruding electrode
2: plate board
3: Non-Protrusion
4: protrusion
7: lower wiring
7a: multi-layer wiring
8: contact electrode
9: Solder
10; Electronic parts
30: substrate mold
31: plate recessed part
33: protrusion forming part
40: via mold
41: via wire
80: substrate material (PDMS)

Claims (11)

preparing a substrate mold having a plate-shaped concave portion and protrusion forming portions that are concave for forming protrusions on a bottom surface of the plate-shaped concave portion;
coupling a via mold including detachably coupled via wires to the substrate mold so that the via wires are positioned at the protrusion forming portions;
forming a flexible protrusion-integrated substrate having a protrusion integrally formed therein by injecting a substrate material into the substrate mold and curing the substrate;
separating the via mold from the substrate mold on which the protrusion-integrated substrate is formed;
forming a lower wiring layer including lower wirings connecting via conductors on a surface opposite to the surface on which the protrusions are formed of the protrusion-integrated substrate; and
forming a protruding electrode by forming contact electrodes at the end of the via conductor exposed on the surface opposite to the surface on which the lower wirings are formed; A method of manufacturing a chuble wiring board. According to claim 1, wherein the step of injecting the substrate material,
controlling the amount of the substrate material and injecting the substrate material so that the ratio of the height of the protrusion to the thickness of the substrate in the non-protrusion region in which the protrusions are not formed is in the range of 0.8 to 1.2; A method of manufacturing a stretchable wiring board having a protruding electrode using The method of claim 1 , wherein the forming of the lower wiring layer comprises:
forming a conductive metal layer by applying a conductive metal to the opposite surface of the protrusion-integrated substrate on which the protrusion is formed; and
and patterning the lower interconnections by removing the non-lower interconnection region of the conductive metal layer. According to claim 1, After forming the lower wiring layer,
A multi-layer wiring layer forming step of forming a multi-layer wiring layer composed of multi-layer wirings by repeatedly performing a process of forming a multi-layer wiring after applying a substrate material to the surface on which the lower wirings are formed; A method of manufacturing a stretchable wiring board having a protruding electrode using a via mold with via wires. The method of claim 1, wherein after forming the contact electrodes,
Method of manufacturing a stretchable wiring board having protruding electrodes using a via mold with via conductors, characterized in that it further comprises: applying solder paste to the contact electrodes and then mounting the electronic components through the solder pastes. . It is manufactured by the method of manufacturing a stretchable wiring board having a protruding electrode using the via mold with a via conductor of claim 1,
The protruding portion is a stretchable wiring board having a protruding electrode, characterized in that the via conductor inserted therein is integrally formed when the protruding portion-integrated substrate is formed. delete 7. The method of claim 6,
A stretchable wiring board having a protruding electrode, wherein a ratio of the height of the protrusion to the thickness of the substrate in the non-protrusion region in which the protrusions are not formed is in the range of 0.8 to 1.2. The method of claim 6, wherein the protruding electrode,
the protrusion on which the via conductor is integrally formed; and
and contact electrodes respectively formed at the exposed ends of the via conductors. 7. The method of claim 6,
The stretchable wiring board having a protruding electrode, characterized in that it further comprises one or more multi-layered wiring layers stacked on the lower wiring layer formed by the lower wirings. 7. The method of claim 6,
The stretchable wiring board having a protruding electrode, characterized in that it further comprises an electronic component bonded to the protruding electrode.

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