CN113923853B

CN113923853B - Grounding elastomer and manufacturing method thereof

Info

Publication number: CN113923853B
Application number: CN202111237391.5A
Authority: CN
Inventors: 陈木久; 陈巧; 陈方; 刘晶云
Original assignee: Shenzhen Johan Material Tech Co ltd
Current assignee: Shenzhen Johan Material Tech Co ltd
Priority date: 2021-10-22
Filing date: 2021-10-22
Publication date: 2022-07-22
Anticipated expiration: 2041-10-22
Also published as: CN113923853A

Abstract

The application relates to the technical field of electric conduction, and discloses a grounding elastomer and a manufacturing method thereof. The grounding elastomer comprises an elastic main body, a support seat and a conductive layer, wherein the elastic main body is provided with a lower surface, the support seat is made of metal, and the support seat is supported on the lower surface of the elastic main body; the conducting layer encloses a preset space, the preset space is divided into a first area and a second area, the elastic main body is filled in the first area, and the supporting seat is filled in the second area; be equipped with first tie coat between conducting layer and the elasticity main part, be equipped with the second tie coat between conducting layer and the supporting seat, be equipped with the third tie coat between elasticity main part and the supporting seat. When the grounding elastomer is produced and used, the metal supporting seat plays a role in supporting the elastic main body, the deformation of the elastic main body is stable, and the elastic main body is prevented from being distorted and deformed; through the setting of supporting seat, welding area has been improved to the welding stability of ground connection elastomer has been improved.

Description

Grounding elastomer and manufacturing method thereof

Technical Field

The application relates to the technical field of electric conduction, in particular to a grounding elastomer and a manufacturing method thereof.

Background

Currently, the grounding elastomer applied to the PCB mainly includes two forms:

the first form is that a layer of conductive film is wrapped on the outer surface of a hollow silica gel structure with a certain shape, and the conductive film is mainly used for conducting and grounding through reflow soldering; the grounding elastomer has good compression resilience, lower resistance and higher high-temperature resistance, and can play a role in shock resistance; however, in order to obtain a proper rebound curve for the hollow silica gel, the hollow part of the inner cavity needs to be matched with the hardness of the material, so that the design of a forming die is relatively complex, and particularly, under the condition that the hollow silica gel is small in size and thin in wall thickness, the process is extremely complex and the manufacturing cost is high; the binding surface of the product is usually designed into a curved surface, and positioning and complete binding are difficult during binding; moreover, the fixed forming process of the hollow silica gel is difficult to realize continuous coiled materials, and the output efficiency and the cost are influenced;

the second mode is that after a conductive film is formed on the surface of the polyimide film by electroplating, the conductive film is used for wrapping the silica gel foam; the common product structure is cuboid or cube, and the face of weld is smooth, and this often leads to SMT reflow soldering process's float (buoyant) -tin cream pressurized under the molten state of being heated spills over or climbs the tin to ground connection elastomer product edge, can influence the welding effect.

Disclosure of Invention

An object of the present application is to provide a grounding elastic body capable of solving the technical problem of instability of reflow soldering in the prior art.

The purpose of the application is realized by the following technical scheme:

a grounding elastomer comprising: the elastic body is provided with a lower surface, the supporting seat is made of metal, and the supporting seat is supported on the lower surface of the elastic body; the conducting layer is enclosed to form a preset space, the preset space is divided into a first area and a second area, the elastic main body is filled in the first area, and the supporting seat is filled in the second area; the conducting layer with be equipped with first tie coat between the elasticity main part, the conducting layer with be equipped with the second tie coat between the supporting seat, the elasticity main part with be equipped with the third tie coat between the supporting seat.

In some embodiments of the present application, the supporting base is any one of a stainless steel plate, a copper alloy plate, and an aluminum alloy plate.

In some embodiments of the present application, the supporting seat is of a sheet structure and attached to the lower surface of the elastic main body; the thickness of the supporting seat is 0.005 mm-0.1 mm.

In some embodiments of the present application, the thickness of the supporting seat is 0.05mm to 0.1 mm.

In some embodiments of the present application, the lower surface of the elastic body has a groove formed by recessing upward, and the shape of the supporting seat and the shape of the conductive layer are respectively adapted to the lower surface of the elastic body.

In some embodiments of the present application, a groove depth of the groove is 0.03mm to 0.5 mm.

In some embodiments of the present application, the lower surface of the elastic main body is integrally formed in an inverted V shape, and the supporting seat is bent in the inverted V shape adapted to the lower surface of the elastic main body; an opening which is communicated with the second area and departs from the first area is formed in the conducting layer; the supporting seat comprises two inclined and intersected supporting walls, and the joint position of the two supporting walls is located in the opening.

In some embodiments of the present application, a width of the opening is 0.2mm to 0.5 mm.

In some embodiments of the present application, a first plating layer is disposed on a surface of the supporting seat in the opening, and the first plating layer includes at least one of copper, nickel, tin, gold, and silver.

In some embodiments of the present application, the elastic main body is made of a silicon rubber material, and the first bonding layer, the second bonding layer and the third bonding layer are made of a silicon rubber glue.

In some embodiments of the present application, the elastic body is non-foamed silica gel or foamed silica gel cured and molded on the supporting seat.

In some embodiments of the present application, the conducting layer includes basic unit and the second cladding material that sets gradually from inside to outside, the basic unit includes at least one in copper foil, polyimide, copper-clad plate, the polyethylene terephthalate, the second cladding material includes at least one in copper, nickel, tin, gold, silver.

Another object of the present application is to provide a method for preparing the above-mentioned grounding elastomer.

A method of making a grounding elastomer, comprising:

preparing a metal support seat and an elastic main body with a lower surface;

fixing the support seat on the lower surface of the elastic main body;

cutting the fixed supporting seat and the elastic main body to form a semi-finished product with a preset width;

preparing a conductive layer capable of enclosing a predetermined space;

and wrapping the conductive layer on the outer side of the semi-finished product and curing.

In some embodiments of the present application, the supporting seat is prepared in a sheet structure; after supporting the supporting seat on the lower surface of the elastic main body, stamping the supporting seat towards the direction of the elastic main body, so that the supporting seat and the elastic main body are deformed together to form a groove.

In some embodiments of the present application, the supporting seat with after the elasticity main part takes place deformation jointly, the lower surface of elasticity main part forms the shape of falling V, the supporting seat forms the structure of buckling of falling V-arrangement.

In some embodiments of the present application, the method further comprises: and adhering the support seat on the lower surface of the elastic main body through a third adhesive, and curing the third adhesive at high temperature to form a third adhesive layer.

In some embodiments of the present application, the method further comprises: the conductive layer is adhered to the outside of the elastic body by a first adhesive, the conductive layer is adhered to the outside of the support base by a second adhesive, and the first adhesive and the second adhesive are cured by high temperature to form a first adhesive layer and a second adhesive layer, respectively.

In some embodiments, the method further comprises surface treating the inner surface of the conductive layer to form a rough surface on the inner surface of the conductive layer.

Compared with the prior art, the grounding elastomer and the manufacturing method thereof have the following beneficial effects: when the elastic body is produced and used, the metal supporting seat plays a role in supporting the elastic body, the deformation of the elastic body is stable, and the elastic body is prevented from being distorted and deformed; through the setting of supporting seat, welding area has been improved to the welding stability of ground connection elastomer has been improved.

Drawings

The present application is described in further detail below with reference to the drawings and preferred embodiments, but those skilled in the art will appreciate that the drawings are only drawn for the purpose of illustrating the preferred embodiments and should not be taken as limiting the scope of the present application. Furthermore, unless specifically stated otherwise, the drawings are intended to be conceptual in nature of the described objects or configurations and may contain exaggerated displays, and are not necessarily drawn to scale.

Fig. 1 is a schematic structural view according to embodiment 1 of the present application;

fig. 2 is a schematic view of a conductive layer structure according to embodiment 1 of the present application.

Fig. 3 is a view showing a structure of an elastic electric contact terminal of comparative example 1.

Fig. 4 is a structural view of an elastic electric contact terminal of comparative example 2.

Fig. 5 is a schematic structural view according to embodiment 2 of the present application.

In the figure, the position of the upper end of the main shaft,

100. a grounding elastic body; 110. an elastic body; 120. a supporting seat; 121. a support wall; 130. a conductive layer; 131. a first region; 132. a second region; 140. an opening;

200. an elastic electric contact terminal; 210. an elastic core; 220. a polymer film; 230. copper foil; 240. a gap;

300. an elastic electric contact terminal; 310. a resilient foam core; 320. a non-foam rubber coating layer; 330. a heat resistant polymer film; 340. a metal layer.

Detailed Description

Hereinafter, preferred embodiments of the present application will be described in detail with reference to the accompanying drawings. Those skilled in the art will appreciate that the descriptions are illustrative only, exemplary, and should not be construed as limiting the scope of the application.

First, it should be noted that the orientations of top, bottom, upward, downward, and the like referred to herein are defined with respect to the orientation in the respective drawings, are relative concepts, and thus can be changed according to different positions and different practical states in which they are located. These and other orientations, therefore, should not be used in a limiting sense.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality.

Furthermore, it should be further noted that any single technical feature described or implied in the embodiments herein, or any single technical feature shown or implied in the figures, can still be combined between these technical features (or their equivalents) to obtain other embodiments of the present application not directly mentioned herein.

It will be further understood that the terms "first," "second," and the like, are used herein to describe various information and should not be limited to these terms, which are used only to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present application.

It should be noted that in different drawings, the same reference numerals indicate the same or substantially the same components.

Example 1:

referring to fig. 1 to 2, a first aspect of embodiment 1 of the present application provides a grounding elastomer 100, including an elastic body 110, a support base 120, and a conductive layer 130; the elastic body 110 has a lower surface, the support 120 is made of metal, and the support 120 is supported on the lower surface of the elastic body 110; the conductive layer 130 encloses a predetermined space, the predetermined space is divided into a first region 131 and a second region 132, the elastic body 110 is filled in the first region 131, and the supporting seat 120 is filled in the second region 132.

In this embodiment, in use, the upper side of the conductive layer 130 is used for bearing a load, the lower side is used for grounding, the first region 131 and the second region 132 are sequentially arranged in the vertical direction, the first region 131 is close to the upper side of the conductive layer 130, and the second region 132 is close to the lower side of the conductive layer 130.

During production and use, the metal support seat 120 supports the elastic main body 110, the deformation of the elastic main body 110 is stable, and the elastic main body 110 is prevented from being distorted and deformed; through the setting of supporting seat 120, welding area has been improved to the welding stability of ground connection elastomer has been improved.

In production, a strip structure is generally first formed, and a plurality of grounding elastic bodies 100 are formed by cutting the strip structure. The present embodiment is provided with the supporting seat 120, and the long bar-shaped structure is supported during cutting, so that the long bar-shaped structure is deformed less along with the movement of the cutter during cutting, and thus the plurality of grounding elastic bodies 100 of the present embodiment can be cut and formed more conveniently.

The elastomeric body 110 may also be held in a 30% to 70% compressed state to achieve a lower resistivity, as desired. Preferably, the elastic body 110 is maintained in a 50% compressed state, when the elastic body 110 has a resistance ≦ 0.1 Ω. Wherein, the elastic body 110 is pressed by the anchor 120 and the conductive layer 130 to be maintained in a compressed state of 30% to 70%.

Further, in an embodiment, referring to fig. 1 to 2, in order to ensure that the grounding elastic body 100 of the present embodiment can be kept as a whole during multiple repeated pressing processes, a first adhesive layer is disposed between the conductive layer 130 and the elastic main body 110, a second adhesive layer is disposed between the conductive layer 130 and the supporting base 120, and a third adhesive layer is disposed between the elastic main body 110 and the supporting base 120.

Further, in an embodiment, referring to fig. 1 to 2, the supporting base 120 is any one of a stainless steel plate, a copper alloy plate and an aluminum alloy plate. In other embodiments, the material may be other materials with good hardness and less deformation, such as polymer materials.

Preferably, in one embodiment, referring to fig. 1 to 2, the supporting base 120 is a sheet structure and attached to the lower surface of the elastic body 110; the thickness of the supporting seat 120 is 0.005 mm-0.1 mm. In the thickness range of the present embodiment, the supporting seat 120 does not excessively occupy the installation region of the elastic body 110, and does not excessively occupy the incompressible portion in the overall thickness of the grounding elastic body of the present embodiment, so as to provide a sufficient space for installing the elastic body 110.

In an embodiment, referring to fig. 1 to 2, the thickness of the supporting seat 120 is 0.05mm to 0.1 mm. In the present embodiment, the minimum thickness is increased to 0.05mm, and the support seat having such a thickness is relatively easy to perform a process such as cutting or press working, and the efficiency thereof can be ensured.

Further, in one embodiment, referring to fig. 1 to 2, the lower surface of the elastic body 110 has a groove formed by being recessed upward, and the shape of the supporting base 120 and the shape of the conductive layer 130 are respectively adapted to the lower surface of the elastic body 110. When the grounding elastic body 100 of the present embodiment is soldered to the grounding position by reflow soldering, the design of the groove can accommodate the solder, so as to prevent the solder from overflowing from the outside of the conductive layer 130, i.e., prevent the solder from overflowing.

Preferably, a groove is formed by punching the support seat 120 such that the lower surface of the elastic body 110 is depressed upward. It should be noted that the supporting seat needs to satisfy the following conditions:

1. during stamping, the supporting base 120 can be deformed irreversibly, and the elastic body 110 is deformed irreversibly.

2. After stamping, the supporting seat 120 needs to be under the elastic force of the elastic body 110 without deformation.

In a further embodiment, referring to fig. 1 to 2, the groove depth of the groove is 0.03mm to 0.5 mm.

After the lower surface of the elastic main body 110 is recessed upwards to form a groove, the volume of the elastic main body 110 is inevitably reduced, and the maximum value of the elastic force provided by the elastic main body 110 is reduced due to the reduction of the volume, therefore, the depth of the groove is limited, and after the depth of the groove is ensured to be greater than 0.03mm to leave a sufficient space for accommodating soldering tin, the depth of the groove is not deeper than 0.5mm to avoid the volume of the elastic main body 110 from being reduced too much.

Further, in an embodiment, referring to fig. 1 to 2, the lower surface of the elastic main body 110 is integrally inverted "V" shaped, and the supporting base 120 is bent in an inverted "V" shape matching with the lower surface of the elastic main body 110.

In the embodiment, the conductive layer 130 is also in an inverted V shape due to the inverted V-shaped design, and when the solder overflows into the groove, the solder entering the groove can adhere to the surface of the conductive layer 130, so that the stability of reflow soldering is improved; the conductive layer 130 is provided with an opening 140 communicated with the second region 132 and away from the first region 131; the supporting seat 120 includes two inclined and intersecting supporting walls 121, and the intersection position of the two supporting walls 121 is located in the opening 140.

In the present embodiment, the present invention can be applied to the production of a ground elastic body having a small size. The reason is as follows:

in the prior art, when the size of the elastic main body 110 is small, the intersecting surfaces of the left and right sides of the conductive layer 130 and the workpiece are not uniform, and the intersecting area of the conductive layer 130 and the workpiece on one side is small, which is easy to cause unstable connection.

Compare in prior art, among this embodiment, the soldering tin that overflows to the inside recess can be attached to the lower surface at supporting seat 120, has following advantage: 1. the welding area is enlarged, and the welding strength is improved; 2. the left and right micro conductive layers 130 are communicated through the metal support 120, so that the electric connection area is integrally enlarged, and the reliability of electric connection is objectively improved.

In another embodiment, referring to fig. 1 to 2, the width of the opening 140 is 0.2mm to 0.5 mm.

The larger the width of the opening 140 is, the more the area occupied by the intersection of the conductive layer 130 and the support base 120 is, which is not favorable for the stability of the electrical connection; the opening 140 is too small, which has too high requirement for alignment of the process, is not favorable for process stability, and reduces the yield of the product. Therefore, the width of the opening 140 of the present embodiment is set to 0.2mm to 0.5 mm.

Further, in one embodiment, referring to fig. 1 to 2, a first plating layer is disposed on a surface of the supporting base 120 in the opening 140, and the first plating layer includes at least one of copper, nickel, tin, gold, and silver.

In the present embodiment, by the arrangement of the first plating layer, when performing reflow soldering, the support wall 121 at the opening 140 can be used for soldering of solder paste, so that the soldering area of the solder paste is increased, and stable soldering is ensured; meanwhile, the support base 120 is a metal plate having good conductivity, and when solder paste is soldered to the support wall 121 at the opening 140, the grounding area of the grounding elastic body 100 of the present embodiment can be increased, and the conductive cross-sectional area of the grounding current can be increased, thereby ensuring the grounding effect.

Further, in an embodiment, referring to fig. 1 to 2, the elastic body 110 is made of a silicon rubber material, and the first bonding layer, the second bonding layer and the third bonding layer are all made of a silicon rubber.

Since the elastic body 110 is made of silicon rubber, the surface activity is low, and ordinary glue is difficult to bond, so that the silicon rubber is selected to ensure stable bonding force.

In other embodiments, the elastic body 110 is a non-foaming silicone or a foaming silicone cured and molded on the supporting base 120.

Further, in an embodiment, referring to fig. 1 to fig. 2, the conductive layer 130 includes a base layer and a second plating layer sequentially arranged from inside to outside, the base layer includes at least one of a copper foil, a polyimide, a copper clad laminate, and a polyethylene terephthalate, and the plating layer includes at least one of copper, nickel, tin, gold, and silver.

A second aspect of the present invention provides a method for manufacturing a grounding elastic body 100, which includes preparing a metal supporting base 120 and an elastic body 110 having a lower surface; fixing the support base 120 on the lower surface of the elastic body 110; cutting the fixed support seat 120 and the elastic body 110 to form a semi-finished product with a predetermined width; the conductive layer 130 is wrapped on the outside of the semi-finished product.

The grounding elastic body 100 of the prior art is generally manufactured by a mold, and therefore, the size of the mold is limited, and the volume of the grounding elastic body 100 of the prior art is generally large.

In the manufacturing method of this embodiment, a mold is not required, and the supporting seat 120 is disposed, so that the elastic body 110 is well supported during the manufacturing process, the conductive layer 130 can be directly wrapped on the outer sides of the elastic body 110 and the supporting seat 120, the mold opening cost is reduced, and the manufacturing cost of the grounding elastic body 100 of this embodiment is greatly reduced.

In addition, in the grounding elastic body in the prior art, after the elastic core is formed by injection molding, the elastic core is directly used for supporting. In contrast to the prior art, in this embodiment, the elastic body 110 is supported and pressed by the supporting base 120, and the elastic body 110 is compressed and then used for supporting. Thus, the present embodiment, by virtue of being pre-compressed, can provide a greater spring force than the prior art resilient core, per deformation of the same size volume, when supported.

Further, in one embodiment, referring to fig. 1 to 2, the supporting seat 120 is prepared to have a sheet structure; after the supporting seat 120 is supported on the lower surface of the elastic body 110, the supporting seat 120 is pressed towards the elastic body 110, so that the supporting seat 120 and the elastic body 110 are deformed together to form a groove.

The grooves are generally formed by molding in the prior art.

Likewise, the present embodiment does not require the use of a mold. In the present embodiment, the recess is formed by the unrecoverable deformation of the support base 120, and the recess is formed without using a mold, thereby reducing the cost of mold opening and greatly reducing the manufacturing cost of the grounding elastic body 100 of the present embodiment.

Further, in an embodiment, referring to fig. 1 to 2, after the supporting seat 120 and the elastic body 110 are deformed together, the lower surface of the elastic body 110 forms an inverted V shape, and the supporting seat 120 forms an inverted V-shaped bending structure.

Specifically, the support seat 120 may be formed into an inverted V-shaped bent structure by a V-shaped stamping head.

Further, in an embodiment, please refer to fig. 1 to fig. 2, further comprising: the support base 120 is adhered to the lower surface of the elastic body 110 by a third adhesive, and the third adhesive is cured by a high temperature to form a third adhesive layer.

In the embodiment, the high-temperature curing process time is short, and the process operation is relatively simple.

Further, in an embodiment, please refer to fig. 1 to fig. 2, further comprising: the conductive layer 130 is adhered to the outside of the elastic body 110 by a first adhesive, the conductive layer 130 is adhered to the outside of the supporting seat 120 by a second adhesive, and the first adhesive and the second adhesive are cured by a high temperature to form a first adhesive layer and a second adhesive layer, respectively.

Further, in an embodiment, referring to fig. 1 to 2, the method further includes performing a surface treatment on an inner surface of the conductive layer 130 to form a rough surface on the inner surface of the conductive layer 130.

Specifically, a rough surface may be formed on the inner surface of the conductive layer 130 by corona treatment.

At present, because the base layer of the conductive layer 130 is made of a metal material, the surface of the conductive layer is smooth, the surface tension is low, and the adhesive layer is difficult to adhere to the conductive layer 130, that is, the conductive layer 130 is difficult to adhere to the elastic main body 110 directly through the adhesive layer; therefore, in order to improve the bonding strength between the conductive layer 130 and the elastic body 110 in the prior art, a polymer film is often disposed between the conductive layer 130 and the elastic body 110, a sputtering layer is formed by sputtering metal on an outer surface of the polymer film, and the conductive layer 130 is disposed on the sputtering layer, so that the conductive layer 130 and the sputtering layer can be stably connected, and on the other hand, the conductive layer 130 and the elastic body 110 are indirectly connected by the polymer film by being adhered to the elastic body 110 by an adhesive on an inner surface of the polymer film by an adhesive. This approach has the following disadvantages: firstly, the structure is complex, and a polymer film needs to be additionally arranged; secondly, the arrangement of the polymer film increases the overall volume of the grounding elastic body 100, and the installation space of the grounding elastic body 100 is larger; third, the polymer film increases the surface area of the conductive layer 130, so that the path required for conducting the ground current increases, that is, the resistance of the ground current increases, and the grounding effect is reduced.

In the present embodiment, the roughness and the surface tension of the inner wall surface of the conductive layer 130 are increased by the corona treatment process, so that the adhesive layer can be directly adhered to the inner wall surface of the conductive layer 130, and is not easily detached. Compared with the prior art, the embodiment can achieve the adhesion of the conductive layer 130 and the elastic body 110 without a polymer film, and the structure is simplified.

Hereinafter, effects of the method for manufacturing the grounding elastic body 100 provided in the first aspect and the grounding elastic body 100 provided in the second aspect of the present application will be described with reference to comparative example 1 and comparative example 2, respectively.

Referring to fig. 3, an elastic electric contact terminal 200 of comparative example 1 includes an elastic core 210, a polymer film 220 and a solderable copper foil 230, the polymer film 220 is sandwiched by an adhesive layer to cover the elastic core 210 and is bonded, the copper foil 220 is covered by the polymer film 220 and is bonded, all surfaces of the copper foil 230 exposed to the outside are formed with a metal plating layer, a specific gravity of the electric contact terminal 200 is smaller than that of water, and an exposed surface of the copper foil 230 includes: a surface and both end surfaces in a width direction of the copper foil 230 and a cut surface of the copper foil formed by cutting the electric contact terminal; wherein, the elastic core 210 is a hollow structure; the copper foil 230 forms a gap 240 on the lower surface of the elastic core 210, and the elastic core 210 is exposed through the gap 240. In the manufacturing method, comparative example 1 was manufactured by a mold.

Compared with comparative example 1, the grounding elastic body 100 provided by the first aspect of the present embodiment has the following beneficial effects:

1. the overall structure of the grounding elastic body 100 provided by the first aspect of the present embodiment is more stable due to the arrangement of the supporting base 120, whereas the problems of distortion and difficulty in positioning are easily generated in comparative example 1 due to the hollow arrangement of the elastic core 210.

2. In the grounding elastic body 100 provided by the first aspect of the present embodiment, the lower surface of the supporting seat 120 is coated with the first plating layer, which can be soldered on the grounding position by using solder paste, so that the soldering area is increased, and the mounting stability of the grounding elastic body 100 is improved; the gap of comparative example 1 exposes the surface of the elastic core, which is not available for soldering of solder paste, and thus soldering stability is weak.

Compared with comparative example 1, the method for manufacturing the grounding elastic body 100 provided by the second aspect of the present embodiment has the following beneficial effects:

1. the groove of the embodiment is formed without using a special die, while the groove or the hollow structure of the comparative example 1 needs to be formed by the special die, and the die opening cost is higher, so the manufacturing method of the embodiment has lower cost.

Referring to fig. 4, an elastic electric contact terminal 300 of comparative example 2, the elastic electric contact terminal 300 includes a sheet-shaped elastic foam core 310, a non-foam rubber coating layer 320, a heat-resistant polymer film 330, and a metal layer 340 wrapped outside the heat-resistant polymer film 330; the non-foam rubber coating layer 320 is adhered to the upper and lower surfaces of the elastic foam core 310 and extends along any one side surface of the elastic foam core 310; one side of the heat-resistant polymer film 330 is adhered to the non-foam rubber coating layer 320 in a surrounding manner, and the other side of the heat-resistant polymer film 330 is integrally formed with the metal layer 340; the heat-resistant polymer film 330 is bent in an arc shape at a portion corresponding to the any one side surface of the elastic foam core 310, and the elastic foam core 310 is not adhered to the non-foam rubber coating layer 320 at the any one side surface, thereby creating a space between the non-foam rubber coating layer 320 and the elastic foam core 310; wherein a support sheet may be inserted and adhered between any one of the upper and lower surfaces of the insulating elastic core 310 and the insulating non-foam rubber coating layer 320.

Compared with comparative example 2, the grounding elastic body 100 provided by the first aspect of the present embodiment has the following beneficial effects:

in the comparative example 2, the welding surface is flat during welding, so that the tin-climbing phenomenon is easy to occur in the reflow soldering process, and the reflow soldering is unstable; in the embodiment, when performing reflow soldering, the lower surface of the elastic body 110 is recessed upwards to form a groove, so that solder paste does not creep and soldering is stable.

Example 2:

the only differences in this example 1 are: the lower surface of the elastic body 110 is flat and does not sink upward to form a groove.

The shape of the supporting seat 120 and the shape of the conductive layer 130 in this embodiment are also respectively matched with the lower surface of the elastic body 110, so that the supporting seat 120 and the conductive layer 130 are both flat.

Compared with the embodiment 1, when the elastomer with a relatively large size is manufactured, the embodiment has the following beneficial effects:

1. the conductivity is better. The contact area between the elastic grounding body and the grounding position is larger, so that the resistance is reduced, and the grounding current is increased.

2. The processing is convenient. Compared with the method for manufacturing the grounding elastic body in embodiment 1, the grounding elastic body in this embodiment does not need to be deformed by pressing the supporting seat 120 during the manufacturing process.

When the products of the above embodiments and comparative examples are subjected to performance tests, that is, after the product is welded to the chassis, the resistance between the head of the product and the chassis is used as the vertical resistance after welding, the force acting on the product on the clamp and perpendicular to the product at an angle is used as the welding pulling force, the probability of the bottom of the product floating after the product is welded to the chassis is used as the risk of bottom floating, the probability of the side of the product overflowing solder after the product is welded to the chassis is used as the risk of side solder overflowing, and the manufacturing cost of the product is used as the product cost.

When the products of the above examples and comparative examples are subjected to performance tests, the following conditions need to be satisfied:

1. samples were prepared by respective corresponding processes, sample size: the width is 6mm, the length is 2mm, and the height is 3 mm;

2. the outer conductive layers are all composite films of tin plating and polyimide on the surfaces of copper foils;

3. the application adopts SMT reflow soldering technique to be soldered on the PCB;

4. the number of samples was 20 pieces and then observed for performance and statistical data analysis.

The data are as follows:

from the comparison of the above data, it can be seen that:

1. the vertical resistance after welding was the smallest and the conductivity was the best in example 1. Since the lower sides of both example 1 and comparative example 1 are provided with grooves, the post-welding vertical resistance of example 1 and comparative example 1 is smaller than that of example 2 and comparative example 2, respectively; the opening of the example 1 can be welded by soldering tin, the opening of the comparative example 1 cannot be welded by soldering tin, and the larger the welding area is, the smaller the vertical resistance after welding is, so that the vertical resistance after welding of the example 1 is the minimum.

2. The welding drawing force of example 1 was the largest and the mounting stability was the best. The opening of the comparative example 1 can not be welded by soldering tin, and the opening of the example 1 can be welded by soldering tin, so the welding drawing force of the example 1 is greater than that of the comparative example 1; further, although example 2 and comparative example 2 have a larger bonding area than comparative example 1, tin overflow easily occurs in example 2 and comparative example 2, and therefore the bonding pullout force is smaller than that of example 1 and larger than that of comparative example 1 in both example 2 and comparative example 2.

3. The risk of side-flash was minimal for example 1 and comparative example 1. Since the grooves for the solder to enter are formed in the embodiment 1 and the comparative example 1, the solder of the embodiment 1 and the comparative example 1 does not overflow from the side surface; the bottom surfaces of the embodiment 2 and the comparative example 2 are both flat surfaces, and during welding, the soldering tin below the bottom surfaces is easy to overflow from the side surfaces; in example 2, since the bottom surface is provided with the support seat to attach the example 2 to the bonding surface, the risk of the side solder overflowing is lower in example 2 than in comparative example 2.

4. The risk of bottom floating is minimal for example 1 and comparative example 1. Since the grooves for the soldering tin to enter are formed in the embodiment 1 and the comparative example 1, the soldering tin has a large welding area and high stability, and bottom floating cannot occur; the bottom surfaces of the embodiment 2 and the comparative example 2 are both planes, so that the welding instability is high, and the floating is easy; among them, since the support seat is provided on the bottom surface of example 2 to attach example 2 to the welding surface, the bottom floating risk of example 2 is lower than that of comparative example 2.

5. Comparative example 1 requires mold opening and has a long research and development period. Comparative example 1 requires injection molding using a mold, and development of the mold requires a long time, generally 30 days; in contrast, in each of examples 1 and 2 and comparative example 2, a mold is not required, and the development time is short.

6. The product cost of example 2 and comparative example 2 is lowest. In production, comparative example 1 requires the use of a mold, and therefore is the most costly; in contrast, example 1 requires a stamping process, and therefore, although the cost is lower than that of comparative example 1, the cost is higher than that of example 2 and comparative example 2; the production process of the comparative example 2 and the example 2 is similar, and the cost is similar.

In summary, in comparison with comparative examples 1 and 2, examples 1 and 2 can obtain good vertical resistance after welding, welding drawing force, side tin overflow risk, bottom floating risk, and product cost at lower cost without mold opening.

This written description discloses the application with reference to the drawings and also enables one of ordinary skill in the art to practice the application, including making and using any devices or systems, using suitable materials, and using any incorporated methods. The scope of the present application is defined by the claims and includes other examples that occur to those skilled in the art. Such other examples are to be considered within the scope of the claims as long as they include structural elements that do not differ from the literal language of the claims, or that they include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

1. A grounded elastomer, comprising: an elastic main body, a support base and a conductive layer,

the elastic main body is provided with a lower surface, the supporting seat is made of metal, and the supporting seat is supported on the lower surface of the elastic main body;

the conducting layer is enclosed to form a preset space, the preset space is divided into a first area and a second area, the elastic main body is filled in the first area, and the supporting seat is filled in the second area;

a first bonding layer is arranged between the conductive layer and the elastic main body, a second bonding layer is arranged between the conductive layer and the supporting seat, and a third bonding layer is arranged between the elastic main body and the supporting seat;

the lower surface of the elastic main body is provided with a groove formed by upward sinking, and the shape of the supporting seat and the shape of the conducting layer are respectively matched with the lower surface of the elastic main body; after the supporting seat is supported on the lower surface of the elastic main body, the supporting seat is stamped towards the direction of the elastic main body, so that the supporting seat and the elastic main body are deformed together to form the groove, and the elastic main body is in a compressed state.

2. The grounding elastic body as claimed in claim 1, wherein the support base is any one of a stainless steel plate, a copper alloy plate and an aluminum alloy plate.

3. The grounding elastomer as claimed in claim 1, wherein the supporting base is of a sheet structure and attached to the lower surface of the elastic body; the thickness of the supporting seat is 0.005 mm-0.1 mm.

4. The grounding elastomer according to claim 3, wherein the thickness of the support base is 0.05mm to 0.1 mm.

5. The grounding elastomer according to claim 4, wherein the groove has a groove depth of 0.03mm to 0.5 mm.

6. The grounding elastic body as claimed in claim 3, wherein the lower surface of the elastic body is integrally formed into an inverted "V" shape, and the supporting seat is bent into an inverted "V" shape adapted to the lower surface of the elastic body;

an opening which is communicated with the second area and departs from the first area is formed in the conducting layer;

the supporting seat comprises two inclined and intersected supporting walls, and the joint position of the two supporting walls is positioned in the opening.

7. The grounding elastomer according to claim 6, wherein the width of the opening is 0.2mm to 0.5 mm.

8. The grounding elastomer of claim 6, wherein the surface of the support base in the opening is provided with a first plating layer, and the first plating layer comprises at least one of copper, nickel, tin, gold, and silver.

9. The grounding elastomer as claimed in claim 1, wherein the elastic body is made of silicone rubber, and the first, second and third adhesive layers are made of silicone glue.

10. The grounding elastomer as claimed in claim 1, wherein the elastic body is a non-foamed silicone rubber or a foamed silicone rubber cured and molded on the supporting seat.

11. The grounding elastomer of claim 1, wherein the conductive layer comprises a base layer and a second plating layer sequentially arranged from inside to outside, the base layer comprises at least one of copper foil, polyimide, copper-clad plate and polyethylene terephthalate, and the second plating layer comprises at least one of copper, nickel, tin, gold and silver.

12. A method of making a grounded elastomer, comprising:

preparing a metal support seat and an elastic main body with a lower surface;

fixing the support seat on the lower surface of the elastic main body;

preparing a conductive layer capable of enclosing a predetermined space;

wrapping the conducting layer on the outer side of the semi-finished product and curing;

after the supporting seat is supported on the lower surface of the elastic main body, the supporting seat is stamped towards the direction of the elastic main body, so that the supporting seat and the elastic main body are jointly deformed to form a groove, and the elastic main body is in a compressed state.

13. The method of manufacturing a grounding elastomer according to claim 12,

the prepared supporting seat is of a sheet structure.

14. The method as claimed in claim 13, wherein the support base and the elastic body are deformed together, the lower surface of the elastic body is formed into an inverted V shape, and the support base is formed into an inverted V-shaped bent structure.

15. The method of manufacturing a grounding elastomer according to claim 13, wherein; further comprising:

and adhering the support seat on the lower surface of the elastic main body through a third adhesive, and curing the third adhesive at high temperature to form a third adhesive layer.

16. The method of making a grounding elastomer as in claim 15, further comprising:

the conductive layer is adhered to the outside of the elastic body by a first adhesive, the conductive layer is adhered to the outside of the support base by a second adhesive, and the first adhesive and the second adhesive are cured by high temperature to form a first adhesive layer and a second adhesive layer, respectively.

17. The method of claim 16, further comprising surface treating an inner surface of the conductive layer to form a roughened surface on the inner surface of the conductive layer.