KR20150024242A - Solderable Intenna and Method for making the same - Google Patents

Solderable Intenna and Method for making the same Download PDF

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Publication number
KR20150024242A
KR20150024242A KR20140069864A KR20140069864A KR20150024242A KR 20150024242 A KR20150024242 A KR 20150024242A KR 20140069864 A KR20140069864 A KR 20140069864A KR 20140069864 A KR20140069864 A KR 20140069864A KR 20150024242 A KR20150024242 A KR 20150024242A
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KR
South Korea
Prior art keywords
intenna
soldering
polymer film
adhesive layer
pattern portion
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KR20140069864A
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Korean (ko)
Inventor
김선기
Original Assignee
조인셋 주식회사
김선기
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Application filed by 조인셋 주식회사, 김선기 filed Critical 조인셋 주식회사
Publication of KR20150024242A publication Critical patent/KR20150024242A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

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Abstract

Soldering comprising a polymer core of a flexible three-dimensional shape, an adhesive layer which bonds the core in a width direction, and a polymer film which is adhered to the adhesive layer on one side to surround the adhesive layer and which has a metal foil on the other side A possible intenna is initiated. Wherein the metal foil has a pair of soldering portions having similar or same dimensions and formed to be electrically separated from each other at both ends in the width direction; And an intenna pattern portion electrically connected to any one of the soldering portions and extending to the other, and having an antenna characteristic, wherein one of the soldering portions is soldered to the conductive pattern of the circuit board, and the other soldering portion is soldered to the circuit board And is soldered and attached to another conductive pattern or dummy pattern.

Description

[0001] The present invention relates to an intenna capable of soldering and a manufacturing method thereof.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an intenna used in a device for wireless communication and the like, and particularly relates to an intenna soldered to a circuit board and a manufacturing method thereof.

A portable communication device including a smart phone is equipped with various kinds of antennas. For example, a main antenna, a GPS antenna, a DMB antenna, a WiFi antenna, and a Bluetooth antenna are installed in a portable communication device, for example, a smart phone. As such, unlike an external antenna mounted on the outside of a wireless device, an antenna mounted inside a wireless device for the purpose of transmitting and receiving electromagnetic waves is called an intenna.

For example, in a smartphone, these intenna can be used as an antenna such as Wi-Fi, Bluetooth or GPS.

Conventional intenna includes a ceramic chip intenna used for surface mounting on a circuit board, an intenna formed by pressing a metal sheet, a flexible printed circuit board (FPCB) bonded to a plastic body by a double-sided tape There is an intenna (plating inthenna) formed by metal plating only on the formed intenna (FPCB intenna) or a part of the plastic body.

Among these intenna, ceramic chip intenna capable of surface mount (SMT) is disadvantageous in that it is complicated in manufacturing process, high in material cost, high in manufacturing cost, thin in thickness, narrow in width,

In order to electrically connect the FPCB intenna and the plating intenna to the circuit board, an electrical connector having elasticity must be provided on the circuit board corresponding to each intenna.

Therefore, the installation cost of electrical connectors and the like is increased, and it is difficult to perform reflow soldering by surface mounting on the circuit board.

In addition, since the FPCB intenna maintains a sheet-like flat surface, a three-dimensional structure for improving the intenna performance is required to be manually attached using a double-sided adhesive tape to a plastic case and the like, .

In addition, it is difficult to continuously and automatically manufacture such a product, which has a disadvantage of high manufacturing cost.

It is difficult to manufacture a conventional intenna having a plurality of antenna characteristics for one intenna. Therefore, when a large number of intenna are required, the number of intenna corresponding thereto must be used, which increases manufacturing cost and requires a large installation space.

It is therefore an object of the present invention to provide an intenna which is easy to manufacture and install.

It is another object of the present invention to provide an intenna that is flexible and attachable to a circuit board by soldering.

Another object of the present invention is to provide an intenna capable of surface mounting by vacuum pick-up and reflow soldering by solder cream.

It is a further object of the present invention to provide an intenna that facilitates tuning of antenna characteristics.

It is another object of the present invention to provide an intenna which can be used for various purposes and purposes by manufacturing various lengths and shapes, and which has a low installation cost and a low manufacturing cost.

It is another object of the present invention to provide an intenna which is easy to form a plurality of intenna units having different antenna characteristics in one body and has a three-dimensional shape of various shapes.

It is another object of the present invention to provide a method of manufacturing intenna capable of efficiently manufacturing the intenna.

According to an aspect of the present invention, there is provided a flexible polymer film comprising a flexible three-dimensional core, an adhesive layer which bonds the core in a width direction, a polymer film adhered to the adhesive layer to surround the adhesive layer, Wherein the core, the adhesive layer and the polymer film have heat resistance capable of withstanding soldering, and the intenna part is made of a metal material, and the intenna part is formed so as to be electrically separated from each other at both ends in the width direction A pair of soldering portions; And an intenna pattern portion electrically connected to any one of the soldering portions and extending to the other, and having an antenna characteristic, wherein one of the soldering portions is soldered to the conductive pattern of the circuit board, and the other soldering portion is soldered to the circuit board Wherein the solder is attached to another conductive pattern or a dummy pattern by soldering.

According to another aspect of the present invention, there is provided a flexible polymer film comprising: a flexible three-dimensional core; an adhesive layer which bonds the core in a width direction; a polymer film adhered to the adhesive layer to surround the adhesive layer; Wherein the core, the adhesive layer, and the polymer film have heat resistance capable of withstanding soldering, and the intenna portion is made of a metal material, and the intenna portion surrounds the polymer film in the width direction at both ends in the longitudinal direction A pair of soldering portions formed so as to be spaced apart from each other; And an intenna pattern portion electrically connected to any one of the soldering portions and extending to the other, and having an antenna characteristic, wherein one of the soldering portions is soldered to the conductive pattern of the circuit board, and the other soldering portion is soldered to the circuit board Wherein the solder is attached to another conductive pattern or a dummy pattern by soldering.

According to another aspect of the present invention, there is provided a flexible polymer film comprising: a flexible three-dimensional core; an adhesive layer which bonds the core in a width direction; a polymer film adhered to the adhesive layer to surround the adhesive layer; Wherein the core, the adhesive layer, and the polymer film have heat resistance to withstand soldering, the intenna is made of a metal material, the intenna is composed of a plurality of electrically isolated regions, Wherein the intenna portion includes a pair of soldering portions formed to be electrically separated from each other at both ends in the width direction; And an intenna pattern portion electrically connected to one of the soldering portions and having an antenna characteristic, wherein one of the soldering portions is soldered to a conductive pattern of the circuit board, and the other soldering portion is connected to another conductive pattern Or solderable to a dummy pattern. ≪ RTI ID = 0.0 > [10] < / RTI >

According to another aspect of the present invention, there is provided a method of manufacturing a heat resistant core, comprising: preparing a heat resistant core of a flexible three-dimensional shape continuous in the longitudinal direction; A heat-resistant polymer film formed integrally with the metal foil, the heat-insulating polymer film being continuous in the longitudinal direction and formed at both ends in the width direction or the longitudinal direction, and an intenna pattern portion electrically connected to at least one of the soldering portions, Preparing; Applying a liquid heat-resistant silicone rubber adhesive to the other side of the polymer film; Wrapping the other side of the polymer film in contact with the core in a state in which each of the soldering portions is positioned so as to be spaced apart from the lower surface of the core; Curing the liquid silicone rubber adhesive to adhere the core and the polymer film to continuously form an intenna bar; And cutting the intenna bar to a predetermined size to form an intenna. The present invention also provides a method of manufacturing an intenna capable of soldering.

Preferably, the soldering portions are formed on both sides of the lower surface of the intenna, and the soldering portions are formed over the entire lower surface of the intenna.

Preferably, the one soldering portion and the other soldering portion are symmetrical with respect to each other.

Preferably, the other soldering portion may be electrically disconnected or connected to the intenna pattern portion.

Preferably, the intenna pattern portion may be electrically connected to the conductive pattern of the circuit board via any one of the soldering portions.

Preferably, the intenna pattern portion may be formed by removing a part of the metal foil by chemical etching or laser, and may extend from both the side surfaces and the upper surface of the intenna from the one soldering portion. For example, the intenna pattern portion may include a zigzag first intenna pattern portion repeated in the height direction on both sides and a second intenna pattern portion formed to cover the entire upper surface. In another example, the intenna pattern portion may have a width Direction and a zigzag shape repeated in the longitudinal direction.

Preferably, an insulating material may be formed on the intenna pattern portion. For example, a portion of the intenna pattern portion may be coated with a heat-resistant polymer, or a heat-resistant polymer film may be adhered to the intenna pattern portion. The insulating material may not be formed in part.

Preferably, the intenna may be adhered to the polymer film by curing the polymer film, or may be adhered to the polymer film with a heat resistant adhesive interposed therebetween.

Preferably, the electromagnetic wave absorber layer may be formed on the polymer film surface on which the metal foil is not formed, and the electromagnetic wave absorber may be formed by coating or printing on the polymer film.

Preferably, at least one of the core and the adhesive layer may include an electromagnetic wave absorbing powder capable of absorbing electromagnetic waves.

Preferably, a plane for vacuum pick-up may be formed on the upper surface of the intenna on which the intenna pattern portion is formed.

Preferably, the core and the adhesive layer are silicone rubber, the polymer film is a polyimide film, and the intenna portion may be a copper foil whose outermost portion is plated with gold or tin.

Preferably, the cross-sectional shape of the core may be a rectangular shape in which both ends of the lower surface are convex, a sheet shape having a low height, or a tube shape having through holes in the longitudinal direction.

Preferably, the adhesive layer is formed by curing a liquid silicone rubber, and the adhesion may be achieved by the curing.

Preferably, the intenna may be reel-packaged in a carrier to enable surface mounting by vacuum pick-up and reflow soldering using a solder cream.

Preferably, the intenna is one of a main intenna, a GPS intenna, a Wi-Fi intenna, a DMB intenna, or a Bluetooth intenna, and may be used in a wireless communication device or a wireless communication system.

Preferably, another metal foil is interposed between the polymer film and the adhesive layer, and the intenna and the other metal foil may be electrically connected to each other by via holes.

Preferably, the intenna may have a dimension in the longitudinal direction larger than a dimension in the width direction.

According to the above structure and structure, the intenna can be easily manufactured and installed.

In addition, flexible intenna can be attached to a circuit board by soldering, and in particular, surface mounting by vacuum pickup and reflow soldering by solder cream are possible.

Further, the shape of the intenna pattern portion can be easily changed, and the tuning of the antenna characteristic is easy.

Further, the core having flexibility and heat resistance serving as a support can be manufactured in various shapes, and can be manufactured in various lengths and shapes, and can be used for various purposes and purposes, and installation and manufacturing costs are reduced.

Further, it is easy to form a plurality of intenna units having different antenna characteristics in one body by etching, and it is possible to have a three-dimensional shape of various shapes.

In addition, since the intenna is continuously manufactured in the longitudinal direction and then cut, it is economical and reliable in quality.

1 (a) is a perspective view, FIG. 1 (b) is a perspective view with the bottom surface facing up, and FIG. 1 (c) .
2 shows a method of mounting an intenna on a circuit board.
3 shows an intenna pattern unit according to another embodiment of the present invention.
FIG. 4 shows an intenna according to another embodiment of the present invention. FIG. 4 (a) is a perspective view, and FIG. 4 (b) is a perspective view with its bottom surface facing upward.
5 shows an intenna according to another embodiment of the present invention.
Fig. 6 shows an intenna according to another embodiment of the present invention. Fig. 6 (a) is a perspective view, and Fig. 6 (b) is a perspective view with its bottom surface facing upward.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

1 (a) is a perspective view, FIG. 1 (b) is a perspective view with the bottom surface facing up, and FIG. 1 (c) . In Fig. 1, the X direction represents the width direction and the Y direction represents the longitudinal direction, and the same applies to the following embodiments.

The intenna 100 includes a three-dimensional core 110, an adhesive layer 120 that bonds the core in a width direction, a polymer film 130 bonded to the adhesive layer 120 to surround the adhesive layer 120, And an intenna 140 formed on the polymer film 130.

Here, the core 110, the adhesive layer 120, and the polymer film 130 have heat resistance to withstand soldering, and the intenna 140 is made of a metal material.

The intenna section 140 is removed by a chemical etching or laser pattern to form the intenna pattern section 142 and the soldering sections 144 and 146. The intenna pattern section 142 includes a soldering section 142 electrically connected to the intenna pattern section 142, And another soldering portion 146 that is not electrically connected to the solder 144 is formed on the lower surface of the core 110. [

<Core 110>

The innermost core 110 provides a three-dimensional shape of the intenna 100 and is constructed of a flexible polymer material having heat resistance to withstand soldering.

If necessary, an electromagnetic wave absorbing powder capable of absorbing electromagnetic waves may be inserted into the core 110 to form a core 110 capable of absorbing electromagnetic waves, thereby improving the characteristics of the intenna 100.

As the core 110, a polyimide (PI) resin having flexibility and no elasticity or a silicone rubber having elasticity may be used. The cross-sectional shape of the core 110 may be a rectangular shape having a slightly convex downward- And may have a shape in which the through holes are formed in the longitudinal direction.

In the cross-sectional shape as shown in Fig. 1, the upper both side edges are each formed in a round shape, so that the engagement on both sides can be prevented in the process of assembling with the opposing object.

In order to improve the reliability of soldering, the width of the core 110 can be made significantly larger than the height of the core 110.

When the cross-sectional shape of the core 110 is a tube shape, the cross-sectional shape of the through hole may be variously formed, and may be a dumbbell shape (or peanut shape), a circular shape, an elliptical shape or a trapezoid shape, Can be formed in pairs.

When the lower surface of the core 110 has a shape inclining upward from both edges toward the center, the both sides are symmetrical with respect to the center, and warping or shaking can be prevented during reflow soldering by surface mounting have.

In addition, both ends in the width direction of the core 110 are kept flat at the same level, so that the soldering portions 144 and 146 of the intenna portion 140 are flattened to the same level as described later so that the soldering can be performed reliably .

&Lt; Adhesive layer 120 >

The adhesive layer 120 is positioned between the core 110 and the polymer film 130 to reliably bond the core 110 and the polymer film 130.

As described above, the adhesive layer 120 has heat resistance that can withstand when soldering. For example, when flexibility and elasticity are required, the adhesive layer 120 is formed by curing a liquid silicone rubber.

In addition, the adhesive layer 120 may be a thermosetting adhesive that does not melt again due to heat applied during soldering, and thus maintains an adhesive force.

As in the case of the core 110, if necessary, an electromagnetic wave absorbing powder capable of absorbing electromagnetic waves may be inserted into the adhesive to form an adhesive layer 120 capable of absorbing electromagnetic waves to improve antenna characteristics.

Further, the average thickness of the adhesive layer 120 may be 10 탆 to 100 탆.

&Lt; Polymer film (130) >

The polymer film 130 may be a polyimide (PI) film having flexibility and heat resistance to withstand soldering, for example, and having good heat resistance, as described above.

The thickness of the polymer film 130 may be approximately 5 [mu] m to 50 [mu] m.

As described above, an electromagnetic wave absorbing layer can be formed on the surface of the polymer film 130 adhered to the adhesive layer 120, if necessary. For example, a liquid-state electromagnetic wave absorber may be coated on the surface of the polymer film 130 or may be printed and cured to form an electromagnetic wave absorbing layer.

<Intenna part (140)>

1 (c), the intenna part 140 includes a pair of soldering parts 144 and 146 formed to be electrically separated from each other at both ends in the width direction, and one of soldering parts 144 and 146 And an intenna pattern portion 142 electrically connected to the other end portion 146 and having an antenna characteristic.

The intenna 140 is formed on the surface exposed to the outside of the polymer film 130. For example, the polymer film 130 may be formed by casting and curing a liquid polyimide (PI) on a metal foil constituting the intenna 140, The intenna 140 can be adhered to the polymer film 130 and formed.

Alternatively, the polymer film 130 and the intenna 140 made of a metal may be adhered to each other via a heat-resistant adhesive.

In particular, such a structure composed of the polymer film 130 and the metal foil is a well-known technique as a flexible laminated film (FCCL).

As the intenna part 140, a copper foil having an excellent elongation and capable of soldering, for example, about 6 to 30 占 퐉 may be used. The copper foil may be plated with gold, tin or silver to prevent corrosion or solder well. As described above, by using the copper foil, it is possible to prevent a crack from being generated even when repeatedly pressed.

When a copper foil is used, the solder strength is better and the electrical conductivity is lower than that of metal film by sputtering metal or metal plating on the polymer film, resulting in better antenna characteristics. Particularly, when the width of the intenna pattern portion 142 is narrow, the copper foil is more efficient.

The soldering portion 144 electrically connected to the intenna pattern portion 142 is soldered to the conductive pattern of the circuit board and the soldering portion 146 not electrically connected to the intenna pattern portion 142 is soldered to the conductive pattern of the circuit board, And is soldered to another conductive pattern or dummy pattern.

1 (a), the soldering portions 144 and 146 are formed on both sides of the lower surface of the intenna 100, and are formed over the entire length of the intenna 100, respectively. In other words, it can be formed to cover all of the spaced apart portions of the bottom surface of the intenna 100 in the longitudinal direction.

The soldering portions 144 and 146 to be soldered to the circuit board may be symmetrical to each other. In such a structure, since the soldered portions have the same area and the same shape, reliability of soldering can be ensured.

For example, it is possible to prevent shaking or warping during soldering by surface mounting that is easy to mass-produce, and it is easy to provide the same soldering strength on both sides.

In this embodiment, although the soldering portion 146 is electrically separated from the intenna pattern portion 142 as an example, the soldering portion 146 can be electrically connected depending on the antenna characteristics and applications required. That is, the pair of soldering portions 144 and 146 are electrically connected to the intenna pattern portion 142.

The intenna pattern portion 142 located between the soldering portions 144 and 146 is formed by removing a portion of the intenna portion 140 by etching or laser and is formed from the soldering portion 144 electrically connected to the other soldering portion 144 146 so as to extend over both sides of the actual intenna 100 and the upper surface thereof.

In this embodiment, the intenna pattern portion 142 has a zigzag shape repeated in the longitudinal direction, but the present invention is not limited thereto. The shape of the intenna pattern portion 142 may be variously designed according to the performance of the intenna 100 required . For example, an intenna pattern portion 142 such as a patch intenna, a spiral intenna, or the like.

In addition, the intenna pattern portion 142 is electrically connected to the conductive pattern of the circuit board through the soldering portion 144 electrically connected thereto.

Most of the intenna pattern portion 142 is protected by a heat-resistant insulating material that can not be soldered so that the intenna pattern portion 142 is protected from the external environment or impact. Particularly, when the intenna pattern portion 142 is formed on the side surface It is possible to prevent the soldering from occurring and lead rise of the lead or change of the antenna characteristic.

For example, the intenna pattern portion 142 may be coated with a heat-resistant polymer such as a heat-resistant photosensitive insulating resin (PSR) or a heat-resistant polymer film to protect the intenna pattern portion 142 from insulation, I will.

In this case, a portion of the intenna pattern portion 142, for example, the upper surface may be electrically connected to the outside by preventing the insulating material from being formed, or the performance of the intenna 100 may be tuned after the intenna 100 is manufactured Can be easily performed.

An example of a method of manufacturing the intenna 100 having the above structure will be described below.

First, a flexible three-dimensional core 110 and a polymer film 130 having a constant width and being continuous in the longitudinal direction are prepared.

An intenna 140 is formed on the polymer film 130. The intenna 140 includes at least one of a pair of soldering portions 144 and 146 and a pair of soldering portions 144 and 146, And an intenna pattern portion 142 electrically connected to the other end 146 and extending to the other end.

Next, a liquid silicone rubber adhesive is applied to one side of the polymer film 130, and the soldering portions 144 and 146 of the intenna 140 are aligned so as to be spaced apart from the lower surface of the core 110 , And the surface of the polymer film 130 coated with the adhesive is continuously wrapped around the core 110 so as to be in contact with each other.

Next, the liquid silicone rubber adhesive is cured to form the adhesive layer 120, whereby the core 110 and the polymer film 130 are bonded to form a continuous intenna bar.

Finally, the intenna 100 is formed by cutting the intenna bar to a predetermined size so that the intenna pattern portion 142 is positioned at a predetermined position.

At this time, the intenna 100 can be stably mounted on the circuit board by cutting so that the longitudinal dimension of the intenna 100 is larger than the dimension in the width direction.

In other words, even if the land on which the intenna 100 is soldered on the circuit board has the same shape, when the intenna 100 having a larger length of the portion covered by the polymer film 130 than the width of the cross section on which the core 110 is exposed is applied The soldering can be performed more stably and the separation by the external force can be minimized.

The dimensions of the intenna 100 are not particularly limited. For example, the width may be 1.5 mm to 5 mm, the length may be 1 mm to 30 mm, and the height may be 0.5 mm to 3 mm.

As another example, intenna 100 may be provided with a width of about 2 mm and a length of about 100 mm to provide intenna 100 having a narrow width and a long length. Such intenna 100 may be, for example, As shown in FIG.

2 shows a method of mounting an intenna on a circuit board.

The intenna 100 thus manufactured is reel-packed and supplied to the carrier, vacuum picked up by a pickup device, surface-mounted on the circuit board 10, and reflow soldered by applying a solder cream.

As described above, the soldering portion 144 of the intenna portion 140 is soldered to the conductive pattern 12 to electrically connect the intenna pattern portion 142 to the conductive pattern 12 of the circuit board 10, The portion 146 is soldered to another conductive pattern or the dummy pattern 14.

The intenna 100 may be used as a main intenna, a GPS intenna, a Wi-Fi intenna, a DMB intenna or a Bluetooth intenna, and the circuit board 10, in which the intenna 100 is mounted by reflow soldering, Or may be mounted in a wireless communication system.

According to the intenna 100 described above, when the intenna pattern portion 142 is exposed to the outside, there is an advantage that it is easy to trim the intenna pattern portion 142 when the antenna characteristic is corrected.

It is also possible to mount the intenna 100 on the conductive patterns 12 and 14 of the circuit board 10 by soldering and use a separate electrical connector for electrically connecting the circuit board 10 and the intenna 100 There is an advantage that it is not necessary.

Also, the intenna 100 can easily have various shapes and three-dimensional structures by the core 110 having a three-dimensional structure, and thus it is easy to improve antenna characteristics. That is, it is possible to provide antenna characteristics that are more various than the two-dimensional shape intenna.

In addition, since the intenna 100 is directly soldered to the conductive patterns 12 and 14 of the circuit board 10, the electrical contact resistance is very small and the antenna characteristics can be improved.

3 shows an intenna pattern unit according to another embodiment of the present invention.

According to this embodiment, unlike FIG. 1, the intenna pattern portion 242 has a zigzag shape repeated in the width direction.

In addition, it may have a spiral shape twisted into a square spiral toward the center.

FIG. 4 shows an intenna according to another embodiment of the present invention. FIG. 4 (a) is a perspective view, and FIG. 4 (b) is a perspective view with its bottom surface facing upward.

The intenna formed on the exposed surface of the polymer film 330 includes soldering portions 344 and 346 formed at both ends in the longitudinal direction and an intenna pattern portion 342 electrically connected to the soldering portion 344 and separated from the soldering portion 346 .

The intenna pattern portion 342 has a zigzag shape repeated in the width direction across both side surfaces and the upper surface of the intenna 300.

In the case of this structure, the length of the intenna pattern portion 342 can be made long to sufficiently exhibit desired antenna characteristics.

The present invention is also applicable to a case where the conductive pattern to which the soldering portion 344 is soldered and the conductive pattern or the dummy pattern to which the soldering portion 346 is soldered are somewhat apart.

5 shows an intenna according to another embodiment of the present invention.

The intenna 400 includes a heat resistant core 410, a heat resistant adhesive layer 420, a heat resistant polymer film 430 adhered to the adhesive layer 420 to surround the adhesive layer 420, and an intenna portion formed on the polymer film 430 .

A part of the metal foil is removed by etching or laser to constitute the intenna pattern portion 442 and the soldering portions 444 and 446 are formed on the lower surface of the intenna 400 to be soldered.

In this embodiment, zigzag intenna pattern portions 442a repeated in the height direction are formed on both sides of the intenna 400, and a sheet-like intenna pattern portion 442b is formed on the entire upper surface of the intenna 400 .

According to this structure, it is possible to provide the intenna 400 having various characteristics by combining the zigzag shape and the sheet shape with ease by vacuum pick-up by the intenna pattern portion 442b formed on the upper surface.

Fig. 6 shows an intenna according to another embodiment of the present invention. Fig. 6 (a) is a perspective view, and Fig. 6 (b) is a perspective view with its bottom surface facing upward.

According to this embodiment, the intenna portion formed on the polymer film 530 is composed of three regions that are etched and electrically separated, and each region includes intenna pattern portions 542, 552, and 562, The number of areas can be added or subtracted as needed.

The intenna pattern portions 542, 552 and 562 together with the corresponding soldering portions 544, 546 (554, 556) 564, 566 constitute an intenna unit having different antenna characteristics.

The soldering portions 544, 546 (554, 556) 564, 566 may be soldered to a conductive pattern or a dummy pattern corresponding to each circuit pattern.

The intenna pattern portion 542 is used as a GPS intenna because the intenna pattern portions 542, 552, and 562 have different antenna characteristics by electrically insulated and separated intenna pattern portions 542, 552, and 562, May be used as a WiFi antenna, and the intenna pattern portion 562 may be used as a Bluetooth antenna.

In other words, it is possible to construct an antenna 500 comprising an intenna constituted by a plurality of antenna units each performing a separate function on one member composed of the core 510, the adhesive layer 520, and the polymer film 530 have.

In this case, there is an advantage that a plurality of intensities having various uses can be mounted on a circuit board having a small area at a time.

Meanwhile, in the above embodiments, another metal foil may be interposed between the polymer film and the adhesive layer and adhered to the polymer film. In this case, the other metal foil and the intenna may be electrically connected to each other by via holes.

In this case, there is an advantage that it is possible to easily provide intenna having more various characteristics at the same dimension.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Accordingly, the scope of the present invention should not be construed as being limited to the embodiments described above, but should be construed in accordance with the following claims.

100, 300, 400, 500: Intenna
110, 310, 410, 510: core
120, 320, 420, 520: adhesive layer
130, 230, 330, 430, 530: polymer film
140: Intenna part
142, 242, 342, 442, and 542:
144, 146, 244, 246, 344, 346, 444, 446, 544, 546:

Claims (31)

A polymer film adhered to the adhesive layer so as to surround the adhesive layer; and an intenna section formed on the polymer film,
Wherein the core, the adhesive layer and the polymer film have heat resistance and flexibility to withstand soldering and the intenna is made of a metal material capable of soldering,
In the intenna section,
A pair of soldering portions formed to be electrically separated from each other at both ends in the width direction; And
And an intenna pattern portion electrically connected to any one of the soldering portions and extending to the other one, and having an antenna characteristic,
Wherein the intenna pattern portion is formed on at least one side surface of the polymer film,
Wherein one of the soldering portions is soldered to a conductive pattern of the circuit board and the other soldering portion is soldered to another conductive pattern or dummy pattern of the circuit board. The method according to claim 1,
Wherein the soldering portion is formed on both sides of the lower surface of the intenna. The method of claim 2,
Wherein the soldering portion is formed over the entire lower surface of the intenna. The method according to claim 1,
Wherein the one soldering portion and the another soldering portion are symmetrical with respect to each other. The method according to claim 1,
And the other soldering portion is electrically disconnected or connected to the intenna pattern portion. The method according to claim 1,
Wherein the intenna pattern portion is formed by removing a metal foil by chemical etching or laser. The method according to claim 1,
Wherein the intenna pattern portion is electrically connected to the conductive pattern of the circuit board through one of the soldering portions. The method according to claim 1,
Wherein the intenna pattern portion extends from the one soldering portion through both side surfaces of the intenna and an upper surface thereof. The method of claim 8,
Wherein the intenna pattern portion comprises a zigzag first intenna pattern portion repeated on the both sides in the height direction and a second intenna pattern portion formed to cover the entire upper surface. The method of claim 8,
Wherein the intenna pattern portion has a staggered shape repeated in the width direction and the longitudinal direction. The method according to claim 1,
Wherein a heat-resistant insulating material is formed on the intenna pattern portion so as not to be soldered. The method of claim 11,
Wherein the insulating material is not formed on a part of the intenna pattern portion except a portion connected to the soldering portion. The method of claim 11,
Wherein the intenna pattern portion is coated with a heat-resistant polymer or a heat-resistant polymer film is bonded to the intenna pattern portion. The method according to claim 1,
Wherein the intenna is bonded to the polymer film by curing the polymer film or is adhered to the polymer film with a heat resistant adhesive interposed therebetween. The method according to claim 1,
Wherein an electromagnetic wave absorbing layer is formed on a surface of the polymer film adhered to the adhesive layer. 16. The method of claim 15,
Wherein the electromagnetic wave absorbing layer is formed by coating or printing the electromagnetic wave absorber on the polymer film. The method according to claim 1,
Wherein at least one of the core and the adhesive layer includes an electromagnetic wave absorbing powder capable of absorbing electromagnetic waves. The method according to claim 1,
Wherein a plane for vacuum pick-up is formed on an upper surface of the intenna on which the intenna pattern portion is formed. The method according to claim 1,
Wherein the core and the adhesive layer are silicone rubber, the polymer film is a polyimide film, and the intenna is a copper foil whose outermost portion is plated with gold or tin. The method according to claim 1,
Wherein the cross-sectional shape of the core is a rectangular shape having convex sides at both ends, a sheet shape having a low height, or a tube shape having through holes in the longitudinal direction. The method according to claim 1,
Wherein the adhesive layer is formed by curing a liquid silicone rubber, and the bonding is performed by the curing. The method according to claim 1,
Wherein the intenna is reel-packed into a carrier and is capable of reflow soldering using a surface mount by vacuum pick-up and a solder cream. The method according to claim 1,
Wherein the intenna is one of a main intenna, a GPS intenna, a Wi-Fi intenna, a DMB intenna, and a Bluetooth intenna, and is used in a wireless communication device or a wireless communication system. A polymer film adhered to the adhesive layer so as to surround the adhesive layer; and an intenna section formed on the polymer film,
Wherein the core, the adhesive layer and the polymer film have heat resistance and flexibility to withstand soldering and the intenna is made of a metal material capable of soldering,
In the intenna section,
A pair of soldering portions formed at both ends in the longitudinal direction so as to surround the polymer film in the width direction; And
And an intenna pattern portion electrically connected to any one of the soldering portions and extending to the other one, and having an antenna characteristic,
Wherein the intenna pattern portion is formed on at least one side surface of the intenna,
Wherein one of the soldering portions is soldered to a conductive pattern of the circuit board and the other soldering portion is soldered to another conductive pattern or dummy pattern of the circuit board. 27. The method of claim 24,
And the other soldering portion is electrically disconnected or connected to the intenna pattern portion. 27. The method of claim 24,
Wherein a heat-resisting insulating material is formed on the intenna pattern portion so as not to be soldered. A polymer film adhered to the adhesive layer so as to surround the adhesive layer; and an intenna section formed on the polymer film,
Wherein the core, the adhesive layer and the polymer film have heat resistance and flexibility to withstand soldering and the intenna is made of a metal material capable of soldering,
Wherein the intenna portion is composed of a plurality of regions electrically separated,
In each of the above-mentioned regions,
A pair of soldering portions formed to be electrically separated from each other at both ends in the width direction; And
And an intenna pattern portion electrically connected to one of the soldering portions and having an antenna characteristic,
Wherein the intenna pattern portion is formed on at least one side surface of the intenna,
Wherein one of the soldering portions is soldered to the conductive pattern of the circuit board and the other soldering portion is soldered to another conductive pattern or dummy pattern of the circuit board. The method of any one of claims 1, 24 and 27,
Wherein another metal foil is interposed between the polymer film and the adhesive layer, and the intenna and the other metal foil are electrically connected to each other by via holes. The method of any one of claims 1, 24 and 27,
Wherein the intenna has a dimension in the longitudinal direction larger than a dimension in the width direction. The method of any one of claims 1, 24 and 27,
Wherein the adhesive layer is a thermosetting adhesive that is not melted again by heat. Preparing a heat-resistant core of a flexible three-dimensional shape continuous in the longitudinal direction;
A soldering portion continuous in the longitudinal direction and formed at both ends in the width direction or the longitudinal direction, and an intenna pattern portion electrically connected to at least one of the soldering portions and extended to the other one and having an insulating material formed thereon Preparing a flexible heat-resistant polymer film formed integrally with the metal foil;
Applying a liquid heat-resistant silicone rubber adhesive to the other side of the polymer film to a predetermined thickness;
Wrapping the other side of the polymer film in contact with the core in a state in which each of the soldering portions is positioned so as to be spaced apart from the lower surface of the core;
Curing the liquid silicone rubber adhesive to adhere the core and the polymer film to continuously form an intenna bar; And
And cutting the intenna bar to a predetermined size so as to continuously provide the soldering portion and the intenna pattern portion, thereby forming an intenna.
KR20140069864A 2013-08-26 2014-06-10 Solderable Intenna and Method for making the same KR20150024242A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101665033B1 (en) 2015-04-06 2016-10-11 김용환 Manufacturing apparatus of intenna

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101665033B1 (en) 2015-04-06 2016-10-11 김용환 Manufacturing apparatus of intenna

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