KR101665033B1 - Manufacturing apparatus of intenna - Google Patents

Manufacturing apparatus of intenna Download PDF

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Publication number
KR101665033B1
KR101665033B1 KR1020150048255A KR20150048255A KR101665033B1 KR 101665033 B1 KR101665033 B1 KR 101665033B1 KR 1020150048255 A KR1020150048255 A KR 1020150048255A KR 20150048255 A KR20150048255 A KR 20150048255A KR 101665033 B1 KR101665033 B1 KR 101665033B1
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KR
South Korea
Prior art keywords
intenna
insertion hole
tool horn
embedding
base
Prior art date
Application number
KR1020150048255A
Other languages
Korean (ko)
Inventor
김용환
Original Assignee
김용환
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Publication date
Application filed by 김용환 filed Critical 김용환
Priority to KR1020150048255A priority Critical patent/KR101665033B1/en
Application granted granted Critical
Publication of KR101665033B1 publication Critical patent/KR101665033B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Abstract

According to the present invention, provided is an intenna manufacturing apparatus comprising: a tool horn for inserting a lead wire for an intenna into a base for an intenna to be embedded therein; a lead wire feeding means for injecting the lead wire through a lead wire feed hole formed in the tool horn; and a tool horn adjusting means for moving the tool horn so that the lead wire for an intenna can be embedded in the base for an intenna according to a predetermined pattern of the tool horn. According to the present invention, since the manufacturing process is simple, equipment costs and manufacturing costs can be reduced, and thus productivity can be improved.

Description

TECHNICAL FIELD [0001] The present invention relates to an intenna manufacturing apparatus,

The present invention relates to an antenna manufacturing apparatus for manufacturing an antenna, which is a special antenna that is mounted inside a terminal and is designed not to protrude outward but to maintain the characteristics of the antenna.

A portable communication device including a smart phone is equipped with various kinds of antennas. For example, a main antenna, a GPS antenna, a DMB antenna, a WiFi antenna, and a Bluetooth antenna are installed in a portable communication device, for example, a smart phone. Unlike an external antenna mounted on the outside of a wireless device, an antenna mounted inside a wireless device for the purpose of transmitting and receiving electromagnetic waves is called an intenna.

Conventional intenna includes a ceramic chip intenna used for surface mounting on a circuit board, an intenna formed by pressing a metal sheet, an intenna formed by adhering a double-faced tape to a plastic body with an FPCB (Flexible Printed Circuit Board) FPCB intenna) or an inthenna (plating intenna) formed by metal plating only a part of the plastic body.

Among these intenna, ceramic chip intenna capable of surface mount (SMT) is disadvantageous in that it is complicated in manufacturing process, high in material cost, high in manufacturing cost, thin in thickness, narrow in width, and fragile and not flexible in a long length.

The FPCB intenna is formed by bonding a conductive sheet or a conductive plate such as copper with an adhesive to one surface of a base film made of polyester or polycarbonate, dry-laminating the opposite surface of the base film on which the conductive material is adhered, And etching the conductive surface of the Sybase film to form an intenna pattern, which includes an etching process to form an intenna pattern. Since the intenna pattern is integrated into a mold and the base is integrally formed There is a problem that the manufacturing process is complicated and the productivity is lowered and the manufacturing cost is increased.

In addition, an LDS (Laser direct structuring) method is widely used in which a desired pattern is formed on a thermoplastic resin product by using a laser and a copper or nickel is plated thereon to form a fine pattern on a product that implements electrical characteristics . However, this method has disadvantages such as complicated manufacturing process and high equipment investment cost.

As another example, a method may be used in which a primary material is injected into a primary mold, the base material is cured to form a base having an intenna pattern groove on one surface thereof, a base is accommodated in the secondary mold, The second material is cured to form a cellular intenna in which the intenna pattern is integrated with the pattern groove of the base, and then the intenna is manufactured through a plurality of chemical processes including an etching process There is also a method.

However, such a dual injection structure requires two molds to form an intenna pattern, and thus requires two injection processes. Therefore, the manufacturing process is troublesome, the manufacturing process is complicated, the productivity is low, and the equipment cost is high There is a problem.

1. Korean Patent Registration No. 10-1322994 2. Korean Patent Registration No. 10-1367152 3. Korean Patent Publication No. 10-2015-0031932 4. Korean Patent Publication No. 10-2015-0024242 5. Korean Patent Registration No. 10-1480680

It is an object of the present invention to provide an apparatus for manufacturing an inthenna, which is designed to solve the above-mentioned problems and which can simplify the manufacturing process, reduce the equipment cost, reduce the manufacturing cost, and improve the productivity.

The apparatus for manufacturing an inthenna according to the present invention comprises an intenna tool horn for inserting and inserting an intenna wire into an intenna base, a wire feeding means for injecting a wire through a wire feed hole formed in the tool horn, And tool horn adjusting means for moving the tool horn so that the intenna conductor can be embedded in the base for the intenna according to a predetermined pattern.

Here, the tool horn may include a needle portion for forming an insertion hole into which the intenna wire is inserted in the base for the intenna, a lead wire inserted into the insertion hole by the lead wire feed hole, .

The height of the needle portion is larger than the height of the buried portion, and the width of the needle portion is smaller than the width of the buried portion.

The needle hole is formed on one side of the tool horn bottom portion, and the supply hole is formed to penetrate the inside of the tool horn, and the lead wire supply hole is formed downward in the other direction of the one side on which the needle portion is formed It can be formed obliquely.

The wire feeding means also injects the wire according to the speed at which the tool horn moves on the base of the intenna by the tool horn adjusting means.

The apparatus may further include an ultrasonic generator connected to the tool horn for generating ultrasonic waves to vibrate the tool horn by ultrasonic waves.

The needle portion vibrates by ultrasonic waves to form the insertion hole in the base of the intenna, and the embedding portion fuses the base of the intenna on the side of the insertion hole with ultrasonic waves to embed the insertion hole. More specifically, .

According to another aspect of the present invention, there is provided an apparatus for manufacturing an inthenna, comprising: a conductor embedding means for embedding an intenna conductor in a base for an intenna to be formed and formed; Means.

The conductor embedding means includes insertion hole forming means for forming an insertion hole for inserting the intenna conductor into the base for the intenna, and insertion hole embedding means for embedding the insertion hole.

Here, the insertion hole forming means and the insertion hole embedding means are provided in one intenna manufacturing tool horn.

The height of the insertion hole forming means is larger than the height of the insertion hole embedding means and the width of the insertion hole forming means is smaller than the width of the insertion hole embedding means

The apparatus may further include an ultrasonic generator for vibrating the insertion hole forming means and the insertion hole embedding means by ultrasonic waves.

According to the intenna producing apparatus of the present invention,

It is possible to shorten the time required for pattern formation of the intenna and the completion of the intenna after the production of the molded article, thereby improving the productivity thereof.

Further, by arranging the wires in the injection mold by a special inthenna-forming tool hone and fusing the injection products to fill the wires by a single process, the manufacturing method is simplified in order to simplify the equipment and simplify the process Thereby reducing the manufacturing cost.

In addition, it does not cause environmental problems due to plating and enables various applications.

FIG. 1 schematically shows an apparatus for manufacturing an intenna according to the present invention.
Figs. 2 and 3 show a tool horn for manufacturing an intenna of an intenna manufacturing apparatus according to the present invention.
4 to 6 show various applications of a tool horn for intenna manufacture of an inthenna manufacturing apparatus according to the present invention.
FIG. 7 shows a comparison between a tool horn for intenna production and an intenna body according to the present invention.
FIG. 8 is a schematic view illustrating a process of manufacturing intenna according to the present invention.
9 is a view for explaining an intenna manufactured by the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

The apparatus for manufacturing an inthenna according to the present invention enables the insertion of the conductor for the intenna and the embedding of the insertion hole by a single process while forming the insertion hole in the base for the intenna by the tool hone for manufacturing the intenna according to the present invention, It improves productivity and reduces production cost compared to manufacturing.

FIG. 1 is a schematic view of an apparatus for manufacturing an inthenna according to the present invention. FIG. 2 is a side view of a tool horn for manufacturing an inthenna of an apparatus for manufacturing an inthenna according to the present invention. 1 to 3, an apparatus for manufacturing an inthenna according to the present invention will be described with reference to FIGS. 1 to 3. FIG.

1 to 3, an apparatus for manufacturing an inthenna according to the present invention includes a tool horn 100 for manufacturing an intenna, a wire feeding means 200, a tool horn adjusting means 400, and the like.

The intenna manufacturing tool horn 100 inserts the intenna wire 520 into the intenna base 510 and inserts the intenna wire 520 into the intenna base 510 in order to manufacture the intenna by embedding the intenna wire 520 in the base 510, A tool horn adjusting means 400 for operating the intenna manufacturing tool horn 100 on the base 510 for the intenna according to a predetermined pattern and vertically and rotating the intenna manufacturing tool horn 100, .

The tool horn adjusting means 400 may include horizontal movement adjusting means operated on the xy plane, vertical movement adjusting means for moving up and down, rotation adjusting means for rotating the tool horn 100, Such adjustment is operated by a separate control unit (not shown), so that the tool horn 100 can perform a correct process.

The intenna-forming tool horn 100 operated by the tool horn adjusting means 400 includes a needle portion 110 for forming a lead insertion hole for insertion of the intenna wire 520 into the intenna base 510, And a lead wire feed hole 130 is formed to penetrate the inside of the intenna base 510 in order to insert the lead wire into the intenna base 510.

That is, an insertion hole is formed in the base 510 for the intenna by the needle unit 110, a lead wire to be injected through the lead wire feed hole 130 is inserted into the insertion hole, The intenna in which the conductor 520 is buried in the base 510 for intenna can be manufactured.

The tool horn 100 may be formed to have a constant height for precision machining, and the circumference of the bottom portion may be formed smaller than the circumference of the body portion so that the lower end of the tool hone may be formed to be inclined as a horn.

A needle portion 110 for forming an insertion hole is formed on one side of the bottom of such a tool horn 100 and the other side of the bottom portion is a buried portion 120. [

Here, the side where the needle portion 110 is formed is forward of the movement direction of the tool horn 100, so that the needle portion 110 forms the insertion hole in the intenna base 510 and the other side of the embedding portion 120 The insertion hole is formed and operated so as to fill the insertion hole.

The wire feed hole 130 is formed so as to pass through the inside of the tool horn so that the wire is injected by the wire feeding means 200 and the wire hose 100 is inserted through the lower end of the wire feed hole 130, So as to be installed.

The wire feeding means 200 allows the wire to be ejected through the lower end of the wire feeding hole 130 by controlling the roller or the like to be operated in a direction in which the wire is loosened in a state in which the wire is wound on a roller or the like. It is preferable that the control of the wire feeding means 200 is controlled such that the wires are blown out so as to be synchronized with the speed at which the tool horn is moved by the tool horn adjusting means 400.

In order to smoothly guide the wire into the insertion hole as the tool horn 100 operates on the base 510 for the intenna, the wire feed hole 130 is formed in the other side of the one side where the needle portion 110 is formed It is preferable that it is formed to be inclined downward.

The needle portion 110 of the tool horn 100 according to the present invention vibrates by the ultrasonic wave supplied by the ultrasonic wave generating means 300 to thereby form an insertion hole in the intenna base 510. [

The embedding portion 120 of the tool horn 100 according to the present invention is separated from the needle portion 110 and is coupled with the molding means to mold the insert hole to fill the insert hole, The insertion hole may be filled by taping the upper portion of the hole.

The embedding unit 120 may be coupled to the heat supply unit to embed an insertion hole formed by heat fusion of the base 510 for heat.

In the embodiment of the present invention, the embedding of the insertion hole by the embedding section 120 is vibrated by the ultrasonic wave supplied by the ultrasonic wave generating means 300, so that the intenna base 510 is fused by the ultrasonic vibration, Holes are buried.

The height of the needle portion 110 of the tool horn 100 is preferably larger than the height of the buried portion 120 and the width of the needle portion 110 is preferably smaller than the width of the buried portion 120. [

The needle portion 110 is preferably provided on the front side with respect to the moving direction of the tool horn 100 so that the width is not large so as to form an insertion hole in the intenna base 510, It is preferable that the height of the buried portion is larger than that of the buried portion.

If the height of the embedded portion 120 is not smaller than the height of the needle portion 110, the height of the embedded portion 120 may be smaller than that of the needle portion 110 because the insertion hole may not be properly filled and the conductive wire may be exposed. The width of the base 510 must be larger than the size of the insertion hole to be fused by ultrasonic vibration.

The needle unit 110 can be implemented in various forms as long as it meets these conditions, and it is possible to form the needle unit 110 as shown in FIG. 4 to FIG.

That is, it may be formed as a pointed shape 112 as shown in FIG. 4, and it may be formed as a shape 113 of FIG. 5, which is easier to form a hole although the friction is strong, 6 < / RTI >

FIG. 7 shows a comparison of the height of the intenna base 510 with that of the intenna 110 in order to show characteristics of the structure of the needle unit 110 and the embedding unit 120.

The embedding unit 511 may be formed in advance in the intenna base 510 to specify the embedding position of the conductive line. The needle unit 110 may have a height corresponding to the height of the embedding unit 511 The buried portion 120 is formed to have a height corresponding to the height of the buried portion 511 so that the buried portion 511 protruding from the base 510 of the intenna, And the embedding portion 120 can be embedded with the embedding hole 511 by ultrasonic welding the embedding portion 511 on the upper side of the insertion hole.

The intenna 500 thus manufactured is shown in Fig. 9, and the needle portion 110 has an insertion hole 512 in the protruding buried portion 511 of the intenna base 510 After the conductive line 520 is laid, the embedding portion 120 sequentially fuses the embedded portion 511 on the upper side of the insertion hole 512 to embed the conductor in the base 510 for intenna, thereby manufacturing the intenna , The height of the buried portion 511 after the manufacturing becomes lower than the height before fusion bonding.

The buried conductor 511 is buried in the buried insulator according to the length and structure according to the frequency characteristics, and the buried portion 511 is protruded at the time of forming the base 510 for the intenna to specify the buried position of the conductor.

This may be because the thickness of the base for the intenna is taken into account according to the intenna production purpose, and the buried portion may not be formed by other specific methods.

The apparatus for manufacturing an enena according to another embodiment of the present invention may be constituted by lead wire embedding means and lead wire supply means.

The lead wire inserting means is for inserting the intenna wire into the base of the intenna to be molded and the lead wire supplying means is for inserting the intenna wire into the insertion hole formed in the base of the intenna, An insertion hole forming means for forming an insertion hole into which the intenna conductor is inserted, and an insertion hole embedding means for embedding the insertion hole.

As described above, unlike the previous embodiment, the insertion hole forming means, the insertion hole embedding means, and the wire feeding means are separately provided to manufacture the intenna.

That is, the insertion hole forming means precedes the insertion hole forming means to form an insertion hole in the base of the intenna, a lead wire is provided in the insertion hole by a separate wire feeding means, and the insertion hole is buried .

Here, the insertion hole forming means and the insertion hole embedding means may be a tool hone for manufacturing an intenna, and if so, the insertion hole forming means herein corresponds to the needle portion in the above embodiment, and the insertion hole embedding means corresponds to the embedding portion Further, the lead wire injected by the wire feeding means can be inserted into the insertion hole through the bottom of the intenna manufacturing tool horn.

INDUSTRIAL APPLICABILITY As described above, it is possible to embed a conductor at one time after a base is manufactured by a single step by means of the intenna manufacturing apparatus and the tool hone for manufacturing an intenna according to the present invention, which makes it possible to simplify the process considerably, And the manufacturing cost can be reduced and the work efficiency can be improved.

Although the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention.

100: Tool for manufacturing intenna
200: Lead wire supplying means
300: tool horn adjusting means
400: ultrasonic wave generating means

Claims (14)

delete An intenna manufacturing tool horn for inserting and inserting an intenna wire into an intenna base;
A wire feeding means for injecting a wire through a wire feeding hole formed in the tool horn; And
And tool horn adjusting means for moving the tool horn so that the intenna conductor can be embedded in the base for the intenna according to a predetermined pattern,
The tool horn
A needle portion for forming an insertion hole for inserting the intenna wire into the base for the intenna;
And a buried portion for embedding the insertion hole after the lead wire is inserted into the insertion hole by the lead wire supply hole. The method of claim 2,
Wherein the height of the needle portion is larger than the height of the embedding portion, and the width of the needle portion is smaller than the width of the embedding portion. The method of claim 2,
Wherein the needle portion is formed on one side of the tool horn bottom portion. The method of claim 4,
Wherein the supply hole is formed through the inside of the tool horn, and the lead wire supply hole is inclined downward in the other direction of the one side where the needle portion is formed. The method of claim 5,
Wherein the wire feeding means injects the wire according to the speed at which the tool horn moves on the base of the intenna by the tool horn adjusting means. The method of claim 2,
And an ultrasonic wave generator connected to the tool horn to generate ultrasonic waves to vibrate the tool horn by ultrasonic waves. The method of claim 7,
The needle portion vibrates by ultrasonic waves to form the insertion hole in the base of the intenna,
Wherein the embedding unit fuses the base of the intenna on the side of the insertion hole by ultrasonic welding to embed the insertion hole. delete Conductor embedding means for embedding an intenna conductor in a base for intenna to be molded and formed; And
And wire feeding means for laying the intenna wire in an insertion hole formed in the base of the intenna,
The lead wire embedding means,
Insertion hole forming means for forming an insertion hole for inserting the intenna conductor into the base for the intenna; And
And insertion hole embedding means for embedding the insertion hole. The method of claim 10,
Wherein the insertion hole forming means and the insertion hole embedding means are provided in a single tool horn for intenna production. The method of claim 11,
Wherein the intenna tool horn is provided with a wire feed hole penetrating the insertion hole to insert a wire to be inserted by the wire feeding means into the insertion hole. The method of claim 12,
Wherein the height of the insertion hole forming means is larger than the height of the insertion hole embedding means and the width of the insertion hole forming means is smaller than the width of the insertion hole embedding means. 14. The method of claim 13,
And an ultrasonic generator for vibrating the insertion hole forming means and the insertion hole embedding means by ultrasonic waves.
KR1020150048255A 2015-04-06 2015-04-06 Manufacturing apparatus of intenna KR101665033B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190061575A (en) * 2017-11-28 2019-06-05 신혜중 Embedding head for forming an antenna wire

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KR101322994B1 (en) 2013-07-12 2013-10-29 이현욱 Manufacturing method of intenna
KR101367152B1 (en) 2013-09-16 2014-02-26 주식회사 다이나트론 Method of manufacturing an intenna
KR101480680B1 (en) 2014-11-18 2015-01-14 주식회사 화인엠티 Manufaturing method of intenna using printed circuit boards
KR20150024242A (en) 2013-08-26 2015-03-06 조인셋 주식회사 Solderable Intenna and Method for making the same
KR20150031932A (en) 2013-09-17 2015-03-25 김무용 Manufacturing method of intenna for portable device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070035433A (en) * 2005-09-27 2007-03-30 주식회사 엘지화학 Method for forming buried contact electrode of semiconductor device having pn junction and optoelectronic semiconductor device using the same
KR20110032970A (en) * 2009-09-23 2011-03-30 홍국선 Card type wireless device antenna coil and method for manufacturing communication
KR101078027B1 (en) * 2011-08-25 2011-10-31 홍국선 Antenna coil fixing apparatus
KR101322994B1 (en) 2013-07-12 2013-10-29 이현욱 Manufacturing method of intenna
KR20150024242A (en) 2013-08-26 2015-03-06 조인셋 주식회사 Solderable Intenna and Method for making the same
KR101367152B1 (en) 2013-09-16 2014-02-26 주식회사 다이나트론 Method of manufacturing an intenna
KR20150031932A (en) 2013-09-17 2015-03-25 김무용 Manufacturing method of intenna for portable device
KR101480680B1 (en) 2014-11-18 2015-01-14 주식회사 화인엠티 Manufaturing method of intenna using printed circuit boards

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190061575A (en) * 2017-11-28 2019-06-05 신혜중 Embedding head for forming an antenna wire
WO2019107798A1 (en) * 2017-11-28 2019-06-06 신혜중 Wire embedding head for forming antenna cable comprising multiple wires
KR102001243B1 (en) * 2017-11-28 2019-07-17 신혜중 Embedding head for forming an antenna wire
CN111406346A (en) * 2017-11-28 2020-07-10 慎惠重 Wire embedding head for forming antenna cable containing multiple wires
US11069966B2 (en) 2017-11-28 2021-07-20 Hye Joong Shin Wire embedding head for forming antenna cable comprising multiple wires
CN111406346B (en) * 2017-11-28 2022-11-25 慎惠重 Wire embedding head for forming an antenna cable comprising a plurality of wires

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