KR100835273B1 - 서비스 수명 검출 능력의 한계를 갖는 타겟을 이용하는방법 - Google Patents

서비스 수명 검출 능력의 한계를 갖는 타겟을 이용하는방법 Download PDF

Info

Publication number
KR100835273B1
KR100835273B1 KR1020060093549A KR20060093549A KR100835273B1 KR 100835273 B1 KR100835273 B1 KR 100835273B1 KR 1020060093549 A KR1020060093549 A KR 1020060093549A KR 20060093549 A KR20060093549 A KR 20060093549A KR 100835273 B1 KR100835273 B1 KR 100835273B1
Authority
KR
South Korea
Prior art keywords
consumable material
alert
material slab
value
target
Prior art date
Application number
KR1020060093549A
Other languages
English (en)
Korean (ko)
Other versions
KR20070034969A (ko
Inventor
이-리 시아오
첸-후아 유
젠 왕
로렌스 쉬유
Original Assignee
타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/427,602 external-priority patent/US8795486B2/en
Priority claimed from US11/427,618 external-priority patent/US7891536B2/en
Application filed by 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 filed Critical 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드
Publication of KR20070034969A publication Critical patent/KR20070034969A/ko
Application granted granted Critical
Publication of KR100835273B1 publication Critical patent/KR100835273B1/ko

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Safety Devices In Control Systems (AREA)
KR1020060093549A 2005-09-26 2006-09-26 서비스 수명 검출 능력의 한계를 갖는 타겟을 이용하는방법 KR100835273B1 (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US72039005P 2005-09-26 2005-09-26
US60/720,390 2005-09-26
US72872405P 2005-10-20 2005-10-20
US60/728,724 2005-10-20
US73638905P 2005-11-14 2005-11-14
US60/736,389 2005-11-14
US11/427,618 2006-06-29
US11/427,602 2006-06-29
US11/427,602 US8795486B2 (en) 2005-09-26 2006-06-29 PVD target with end of service life detection capability
US11/427,618 US7891536B2 (en) 2005-09-26 2006-06-29 PVD target with end of service life detection capability

Publications (2)

Publication Number Publication Date
KR20070034969A KR20070034969A (ko) 2007-03-29
KR100835273B1 true KR100835273B1 (ko) 2008-06-05

Family

ID=37978210

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060093549A KR100835273B1 (ko) 2005-09-26 2006-09-26 서비스 수명 검출 능력의 한계를 갖는 타겟을 이용하는방법

Country Status (3)

Country Link
JP (2) JP4560500B2 (zh)
KR (1) KR100835273B1 (zh)
TW (1) TWI337301B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350162B2 (ja) * 2009-09-30 2013-11-27 株式会社ダイヘン インピーダンス整合装置
US11754691B2 (en) 2019-09-27 2023-09-12 Taiwan Semiconductor Manufacturing Company Ltd. Target measurement device and method for measuring a target

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010071334A (ko) * 1998-05-27 2001-07-28 추후제출 탄탈륨 스퍼터링 및 그의 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH669609A5 (zh) * 1986-12-23 1989-03-31 Balzers Hochvakuum
JPH08176808A (ja) * 1993-04-28 1996-07-09 Japan Energy Corp 寿命警報機能を備えたスパッタリングタ−ゲット
JP2003099114A (ja) * 2001-09-21 2003-04-04 Olympus Optical Co Ltd メンテナンス一括管理装置
JP2004299134A (ja) * 2003-03-28 2004-10-28 Toshiba Mach Co Ltd 射出成形機における材料供給装置及び射出成形機

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010071334A (ko) * 1998-05-27 2001-07-28 추후제출 탄탈륨 스퍼터링 및 그의 제조 방법

Also Published As

Publication number Publication date
JP4560500B2 (ja) 2010-10-13
JP2010248631A (ja) 2010-11-04
KR20070034969A (ko) 2007-03-29
JP2007092171A (ja) 2007-04-12
JP5258834B2 (ja) 2013-08-07
TWI337301B (en) 2011-02-11
TW200715078A (en) 2007-04-16

Similar Documents

Publication Publication Date Title
US7842189B2 (en) Treatment device, treatment device consumable parts management method, treatment system, and treatment system consumable parts management method
KR100810704B1 (ko) 플라즈마처리장치의 감시장치 및 감시방법
US8133360B2 (en) Prediction and compensation of erosion in a magnetron sputtering target
US7891536B2 (en) PVD target with end of service life detection capability
EP0622823B1 (en) Sputtering targets having life alarm function
US20070068796A1 (en) Method of using a target having end of service life detection capability
JP2009245988A (ja) プラズマ処理装置、チャンバ内部品及びチャンバ内部品の寿命検出方法
KR100835273B1 (ko) 서비스 수명 검출 능력의 한계를 갖는 타겟을 이용하는방법
CN100560784C (zh) 侦测制程机台使用的消耗性材料厚板寿命的系统及方法
US10060023B2 (en) Backing plate for a sputter target, sputter target, and sputter device
WO2023240682A1 (zh) 靶材原位监控方法、系统、计算机设备和存储介质
US8795486B2 (en) PVD target with end of service life detection capability
JP2002060935A (ja) ターゲットエロージョン計測を可能としたスパッタリング装置
JP7509926B2 (ja) イオンミリング装置
US20240120174A1 (en) Ion Milling Device
JPH07283281A (ja) ターゲットの寿命判断方法及びスパッタ装置
JP2011040559A (ja) プロセスモニタ装置及び成膜装置、並びにプロセスモニタ方法
JPH10306369A (ja) スパッタリングターゲットおよびそれを用いたオーバースパッタの検知方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130509

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20140514

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20150512

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20160512

Year of fee payment: 9