KR100833882B1 - Apparatus for processing a substrate and method of maintaining the same - Google Patents

Abstract

A substrate treatment apparatus is provided to improve productivity without shutting down the entire system even when a failure occurs in one transfer module. A substrate treatment apparatus includes load lock chambers, a plurality of transfer modules(310,320,330), connecting members(500), and process chambers(400). The transfer modules are communicated with the load lock chambers to introduce or discharge substrates into and from the process chambers and are arranged in a row from one side of the load lock chambers. The connecting members separably connect the transfer modules. The process chambers are communicated with the transfer modules respectively to treat the substrates transferred from the transfer modules.

Description

Apparatus for Processing A Substrate and Method of Maintaining The Same}

1 is a plan view showing a conventional semiconductor manufacturing apparatus.

2 is a plan view illustrating a substrate processing apparatus according to an embodiment of the present invention.

3 is a plan view illustrating a maintenance method of a substrate processing apparatus according to another exemplary embodiment of the present disclosure.

4 is a flowchart illustrating a maintenance method of a substrate processing apparatus according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: semiconductor manufacturing apparatus 15: load port

20: substrate transfer module 30: load lock chamber

40, 400: process chamber 50: transfer module

51: buffer space 55: transfer robot

100: substrate processing apparatus 150: substrate transfer module

160: load port 170: wafer container

180: transfer robot 200: load lock chamber

210: loading chamber 220: unloading chamber

310: first transfer module 315: first transfer robot

320: second transfer module 325: second transfer robot

330: third transfer module 335: third transfer robot

410: first process chamber 411: first gate valve

420: second process chamber 421: second gate valve

430: third process chamber 431: third gate valve

500: connecting member

The present invention relates to a substrate processing apparatus and a maintenance method of the substrate processing apparatus, and more particularly, to a substrate processing apparatus having a plurality of transfer modules detachably connected and a maintenance method of the substrate processing apparatus.

In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical elements on a silicon wafer used as a semiconductor wafer, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.

The fab process includes a deposition process for forming a film on a wafer, a chemical mechanical polishing process for planarizing the film, a photolithography process for forming a photoresist pattern on the film, and the photoresist pattern. An etching process for forming the film into a pattern having electrical characteristics, an ion implantation process for implanting specific ions into a predetermined region of the wafer, a cleaning process for removing impurities on the wafer, and a wafer on which the film or pattern is formed Inspection process for inspecting the surface of the substrate, and the like.

In each process, the wafer is mounted and processed in a process chamber that provides optimum conditions for the progress of the process. In recent years, as semiconductor devices have been miniaturized and highly integrated, high precision, complexity, and large diameter of substrates have been required, and semiconductor devices are manufactured in a plurality of process chambers in view of the improvement in productivity associated with the increase in complex processes. do. In particular, a cluster type semiconductor manufacturing apparatus capable of collectively processing a semiconductor device manufacturing process is widely used.

1 is a plan view showing a conventional semiconductor manufacturing apparatus.

Referring to FIG. 1, a conventional semiconductor manufacturing apparatus 10 includes a load port 15 in which a container on which a substrate is loaded is placed, and a substrate transfer module 20 arranged to be adjacent to the load port 15 to carry the substrate in and out of the container. The load lock chamber 30 receives the substrate from the substrate transfer module 20, a plurality of process chambers 40 for processing the substrate, and is disposed between the load lock chamber 30 and the process chamber 40. Transfer module 50 for transferring the substrate between the chambers 40 or between the process chambers 40 and the load lock chamber 30.

The transfer module 50 includes a transfer robot 55 for transferring a substrate. The transfer module 50 has a polygonal shape and process chambers 40 are connected to each of the polygonal surfaces. In addition, the transfer module 50 may have a plurality of transfer robots 55, and a kind of buffer space 51 may be formed between the transfer robots 55.

 In the conventional semiconductor manufacturing apparatus, the transfer module and the process chambers are integrally formed like a cluster type. Therefore, if there is an error in the operation of the transfer module, the whole system should be shut down for maintenance. That is, since each process chamber 40 is dependently coupled to the transfer module, even if only the transfer module 40 needs to be repaired, there is a problem that the entire system must be stopped.

It is an object of the present invention to provide a substrate processing apparatus including a plurality of transfer modules that are detachably connected.

Another object of the present invention is to provide a maintenance method of a substrate processing apparatus that can continue the process by connecting the remaining transfer modules to each other while maintaining only the transfer module requiring maintenance.

In order to achieve the object of the present invention, a substrate processing apparatus according to the present invention includes a load lock chamber, a plurality of transfer modules in communication with the load lock chamber, a connecting member detachably connecting the transfer modules, and the transfer module. And a process chamber in communication with each other to process the substrate transferred from the transfer module. In this case, the connecting member may include a slot valve.

In order to achieve the another object of the present invention, a method of servicing a substrate processing apparatus according to the present invention comprises the steps of connecting a plurality of transfer modules, each in communication with a process chamber, in series to process a substrate, while processing the substrate. Separating the transfer module requiring maintenance and connecting the separated transfer module and adjacent transfer modules to each other.

According to an embodiment of the present invention, the method may further include maintaining the separated transfer module and connecting the maintained transfer module with the transfer modules arranged in a line.

The substrate processing apparatus according to the present invention configured as described above includes a plurality of transfer modules detachably connected, so that only a transfer module requiring maintenance may be separated and the remaining transfer modules may be connected to each other to continue the process. Thus, even if a single transfer module fails, productivity can be improved by continuing the process without shutting down the entire system.

Hereinafter, with reference to the accompanying drawings will be described in detail a substrate processing apparatus and a maintenance method of the substrate processing apparatus according to an embodiment of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, operation, component, part, or combination thereof described on the specification, but one or more other features or numbers. It is to be understood that the present invention does not exclude, in advance, the possibility of the presence or the addition of an operation, a component, a part, or a combination thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and, unless expressly defined in this application, are construed in ideal or excessively formal meanings. It doesn't work.

2 is a plan view illustrating a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 2, the substrate processing apparatus 100 according to an embodiment of the present invention may detachably connect the load lock chamber 200, the plurality of transfer modules 310, 320, and 330, and the transfer modules. It includes a connection member 500 and a plurality of process chambers 400 in communication with the transfer module, respectively.

The plurality of transfer modules 310, 320, and 330 include a first transfer module 310, a second transfer module 320, and a third transfer module 330. The first transfer module 310 is connected to the second transfer module 320, and the second transfer module 320 is connected to the third transfer module 330. According to an embodiment of the present invention, the plurality of transfer modules may be arranged in a line.

The load lock chamber 200 is disposed adjacent to and connected to one side of the first transfer module 310. In addition, the load lock chamber 200 is connected to a substrate transfer module 150 such as an equipment front end module (EFEM).

A plurality of load ports 160 are formed at one side of the substrate transfer module 150, and a wafer container 170 in which substrates such as a wafer are loaded is disposed at the load port 160. For example, the wafer container 170 includes a front opening integrated pod (FOUP) incorporating a carrier having a plurality of slots and a transfer tool such as a carrier box for transporting the carrier in a stacked state. Pod) can be used.

The FOUP is loaded on the load port 160 of the substrate transfer module 150, and the substrate is transferred to the load lock chamber 200 through the substrate transfer module 150 one by one. Specifically, the substrate transfer module 150 includes a transfer robot 180, through which the substrate in the FOUP is loaded into a load lock chamber maintained at a low vacuum of about 10 ⁻³ torr.

The load lock chamber 200 includes a loading chamber 210 in which substrates transferred to the process chambers 400 are temporarily placed, and an unloading chamber 220 in which substrates received from the process chambers 400 are temporarily placed after the process is completed. ). When the substrate is transferred into the load lock chamber 200, a controller (not shown) depressurizes the interior of the load lock chamber 200 to an initial low vacuum state, whereby an external material is transferred to the process chambers and the transfer module. Can be prevented from entering.

 The first transfer module 310 is disposed on one side of the load lock chamber. According to an embodiment of the present invention, first process chambers 410 are disposed at both sides of the first transfer module 310, and the first transfer module 310 is disposed through a first gate valve 411. Can communicate with each other.

The second transfer module 320 is disposed on one side of the first transfer module 310. According to an embodiment of the present invention, second process chambers 420 are disposed at both sides of the second transfer module 320, respectively, and the second transfer module 320 is provided through a second gate valve 421. Can communicate with each other.

The third transfer module 330 is disposed on one side of the second transfer module 320. According to an embodiment of the present invention, third process chambers 430 are disposed at both sides of the third transfer module 330, respectively, and the third transfer module 430 is provided through a third gate valve 431. Can communicate with each other.

The first transfer module 310 may be detachably connected to each other through the second transfer module 320 and the connection member 500. For example, the connecting member may comprise a slot valve. A channel is formed through the slot valve, and the substrate is transferred through the channel. In addition, the second transfer module 320 may be detachably connected to each other through the third transfer module 33 and a slot valve.

The first, second and third transfer modules 310, 320, 330 include transfer robots 315, 325, 335, respectively. Specifically, the first transfer robot 315 of the first transfer module transfers the substrate from the load lock chamber 200 to the first process chamber 410 or vice versa, and the second transfer robot of the second transfer module. 325 and the substrate is replaced.

The second transfer robot 325 of the second transfer module transfers the substrate from the first transfer module 310 to the second process chamber 420 or vice versa, and the third transfer robot 335 of the third transfer module. ) And board.

In addition, the third transfer robot 335 of the third transfer module transfers the substrate from the second transfer module 320 to the third process chamber 430 or vice versa.

When a fourth transfer module (not shown) is disposed on one side of the third transfer module, the fourth transfer module may be detachably connected to each other through the slot valve.

The process chambers 400 may be composed of a plurality of chambers for performing various substrate processes. For example, process chambers 400 may include a chemical vapor deposition (CVD) chamber configured to supply reactant gases for deposition of a material film on a substrate, an etching chamber configured to supply gas for etching of the deposited material film, or a photographic process. And an ashing chamber or the like configured to remove the photoresist layer remaining on the substrate.

3 is a plan view illustrating a maintenance method of a substrate processing apparatus according to another exemplary embodiment of the present disclosure. 4 is a flowchart illustrating a maintenance method of a substrate processing apparatus according to another embodiment of the present invention. In the maintenance method according to the present embodiment, the substrate processing apparatus includes substantially the same components as the substrate processing apparatus 100 of the embodiment of FIG. Therefore, the same components are denoted by the same reference numerals, and repeated descriptions of the same components are omitted.

3 and 4, the substrate processing apparatus 100 according to the present invention includes first, second, and third transfer modules 310, 320, and 330, each of which includes a substrate. Process chambers 400 for processing are each in communication.

In detail, first process chambers 410 communicate with both sides of the first transfer module 310. Second process chambers 420 communicate with both sides of the second transfer module 320. Third process chambers 430 communicate with both sides of the third transfer module 330, respectively.

First, the first transfer module 310 is connected to each other through the second transfer module 320 and the connecting member 500, and the second transfer module 320 and the third transfer module 330 It is connected to each other through the connection member 500 (S100).

When a failure occurs in the second transfer module 320 while processing the substrate in each process chamber, the second transfer module 320 requiring maintenance is separated (S200).

Specifically, the second process chambers are separated from the slot valve installed between the second transfer module 320 and the first and third transfer modules 310 and 330 adjacent thereto, and communicated with the second transfer module. 420 is also separated from the system.

Thereafter, the remaining first and third transfer modules 310 and 330 are connected to each other through the slot valve (S300). At this time, the entire system is not stopped, and the first and third transfer modules 310 and 330 which are normally operated may be connected to each other to temporarily operate the system.

When the separated second transfer module 320 is maintained, the second transfer module 320 is connected to each other again through the third transfer module () and the slot valve. Thus, the transfer modules can be connected to each other to operate the entire system.

As described above, the substrate processing apparatus according to the preferred embodiment of the present invention includes a plurality of transfer modules detachably connected, so that only the transfer modules requiring maintenance are separated and the remaining transfer modules are connected to each other to continue the process. Can be.

Thus, even if a single transfer module fails, productivity can be improved by continuing the process without shutting down the entire system.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims (6)

Respectively communicating with the process chambers to process the substrates, bringing the substrates into and out of the process chambers, and connecting the plurality of transfer modules arranged in a row from one side of the load lock chamber to each other in a line through slot valves. step; Separating the failed transfer module using the slot valve to maintain the failed transfer module among the transfer modules while processing the substrate in the process chamber; And Connecting the separated transfer module and adjacent transfer modules to each other through the slot valve to temporarily operate the process chamber; Servicing the separated transfer module; And Connecting the serviced transfer module with the transfer modules arranged in a line to operate the entire system. delete delete A load lock chamber; A plurality of transfer modules in communication with the load lock chamber to bring the substrate into and out of the process chamber, the plurality of transfer modules arranged in a row from one side of the load lock chamber; A connection member detachably connecting the transfer modules; And And a process chamber in communication with the transfer module, respectively, for processing a substrate transferred from the transfer module, The connecting member includes a slot valve, The faulty transfer module is separated using the slot valve to maintain a failed transfer module among the transfer modules while the substrate is processed in the process chamber, and is disposed adjacent to the separated transfer module. And transfer the plurality of transfer modules to each other through the slot valve to temporarily operate the process chamber. delete 5. The substrate processing apparatus of claim 4, wherein the transfer module includes a transfer robot for transferring the substrate to an adjacent transfer module or a process chamber.

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