KR100832381B1 - 레이저 다이오드 칩을 구비하는 레이저 - Google Patents

레이저 다이오드 칩을 구비하는 레이저 Download PDF

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KR100832381B1
KR100832381B1 KR1020037017135A KR20037017135A KR100832381B1 KR 100832381 B1 KR100832381 B1 KR 100832381B1 KR 1020037017135 A KR1020037017135 A KR 1020037017135A KR 20037017135 A KR20037017135 A KR 20037017135A KR 100832381 B1 KR100832381 B1 KR 100832381B1
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waveguide
laser
laser diode
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diode chip
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KR20040013000A (ko
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핫세마이클에이
치아렐리알레산드라오.피.
밀러토마스제이
그릴로도날드씨
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쓰리엠 이노베이티브 프로퍼티즈 캄파니
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/0632—Thin film lasers in which light propagates in the plane of the thin film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H01S3/09415—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode the pumping beam being parallel to the lasing mode of the pumped medium, e.g. end-pumping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16—Solid materials
    • H01S3/1601—Solid materials characterised by an active (lasing) ion
    • H01S3/1603—Solid materials characterised by an active (lasing) ion rare earth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16—Solid materials
    • H01S3/17—Solid materials amorphous, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
    • H01S5/1014—Tapered waveguide, e.g. spotsize converter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1053—Comprising an active region having a varying composition or cross-section in a specific direction
    • H01S5/1064—Comprising an active region having a varying composition or cross-section in a specific direction varying width along the optical axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/327—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIBVI compounds, e.g. ZnCdSe-laser

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
KR1020037017135A 2001-06-29 2002-06-25 레이저 다이오드 칩을 구비하는 레이저 Expired - Fee Related KR100832381B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US30226801P 2001-06-29 2001-06-29
US60/302,268 2001-06-29
US10/177,176 2002-06-21
US10/177,176 US6873638B2 (en) 2001-06-29 2002-06-21 Laser diode chip with waveguide
PCT/US2002/020344 WO2003003083A2 (en) 2001-06-29 2002-06-25 Laser diode chip with waveguide

Publications (2)

Publication Number Publication Date
KR20040013000A KR20040013000A (ko) 2004-02-11
KR100832381B1 true KR100832381B1 (ko) 2008-05-26

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Country Status (9)

Country Link
US (1) US6873638B2 (enExample)
EP (1) EP1402606B1 (enExample)
JP (1) JP4173806B2 (enExample)
KR (1) KR100832381B1 (enExample)
CN (1) CN1246942C (enExample)
AT (1) ATE316701T1 (enExample)
AU (1) AU2002320167A1 (enExample)
DE (1) DE60208905T2 (enExample)
WO (1) WO2003003083A2 (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6941043B1 (en) * 2001-07-10 2005-09-06 K2 Optronics, Inc. Wavelength stabilization of an external cavity laser diode (ECLD)
US6832034B2 (en) * 2002-06-21 2004-12-14 3M Innovative Properties Company Optical waveguide
WO2004038871A2 (en) * 2002-08-22 2004-05-06 Xponent Photonics Inc. Grating-stabilized semiconductor laser
US7164837B2 (en) * 2002-12-06 2007-01-16 Agency For Science, Technology And Research Method of fabricating optical waveguide devices with smooth and flat dielectric interfaces
US20050135725A1 (en) * 2003-12-23 2005-06-23 3M Innovative Properties Company Laser submounts with standoff structures
DE102004020454A1 (de) * 2004-04-27 2005-11-24 Heidelberger Druckmaschinen Ag Vorrichtung zur Zuführung von Strahlungsenergie auf einen Bedruckstoff
US7119377B2 (en) * 2004-06-18 2006-10-10 3M Innovative Properties Company II-VI/III-V layered construction on InP substrate
US7126160B2 (en) * 2004-06-18 2006-10-24 3M Innovative Properties Company II-VI/III-V layered construction on InP substrate
US7173950B2 (en) * 2004-06-25 2007-02-06 Bookham Technology Plc Low-noise high-power SHG laser system
US7508857B2 (en) * 2004-12-14 2009-03-24 Electronics And Telecommunications Research Institute Semiconductor laser diode and method of manufacturing the same
KR100710048B1 (ko) * 2004-12-14 2007-04-23 한국전자통신연구원 반도체 레이저 다이오드 및 그 제조방법
US20070084499A1 (en) * 2005-10-14 2007-04-19 Biprodas Dutta Thermoelectric device produced by quantum confinement in nanostructures
US20070084495A1 (en) * 2005-10-14 2007-04-19 Biprodas Dutta Method for producing practical thermoelectric devices using quantum confinement in nanostructures
US7559215B2 (en) * 2005-12-09 2009-07-14 Zt3 Technologies, Inc. Methods of drawing high density nanowire arrays in a glassy matrix
US8658880B2 (en) * 2005-12-09 2014-02-25 Zt3 Technologies, Inc. Methods of drawing wire arrays
JP2009518842A (ja) * 2005-12-09 2009-05-07 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 先細りにされている導波路の区域を有する光励起導波路レーザ
US20070131269A1 (en) * 2005-12-09 2007-06-14 Biprodas Dutta High density nanowire arrays in glassy matrix
US7767564B2 (en) * 2005-12-09 2010-08-03 Zt3 Technologies, Inc. Nanowire electronic devices and method for producing the same
KR101059331B1 (ko) * 2006-02-22 2011-08-24 아이디 코포레이션 입력 클래딩 모드 흡수 구조 및/또는 출력 세그먼트 테이퍼구조를 갖는 저손실 깔대기형 피엘씨 광 스플리터
US20080192794A1 (en) * 2007-02-14 2008-08-14 Jacob Meyer Hammer Lateral-Bragg-Grating-Surface-Emitting Laser/Amplifier (LBGSE)
US20080310808A1 (en) * 2007-06-18 2008-12-18 International Business Machines Corporation Photonic waveguide structure with planarized sidewall cladding layer
US7551826B2 (en) * 2007-06-26 2009-06-23 The University Of Connecticut Integrated circuit employing low loss spot-size converter
JP5250245B2 (ja) * 2007-11-21 2013-07-31 日本オクラロ株式会社 半導体レーザ
KR100958338B1 (ko) * 2007-12-18 2010-05-17 한국전자통신연구원 광 증폭기가 집적된 슈퍼루미네슨트 다이오드 및 이를이용한 외부 공진 레이저
US7693373B2 (en) * 2007-12-18 2010-04-06 Analog Devices, Inc. Bidirectional optical link over a single multimode fiber or waveguide
WO2010027580A2 (en) * 2008-09-04 2010-03-11 3M Innovative Properties Company Light source having light blocking components
EP2332223A1 (en) * 2008-09-04 2011-06-15 3M Innovative Properties Company I i-vi mqw vcsel on a heat sink optically pumped by a gan ld
EP2335293A1 (en) * 2008-09-04 2011-06-22 3M Innovative Properties Company Light source with improved monochromaticity
WO2010027581A1 (en) 2008-09-04 2010-03-11 3M Innovative Properties Company Monochromatic light source
CN101907754A (zh) * 2010-07-09 2010-12-08 浙江大学 一种用于半导体激光器的波导耦合器芯片
JP2012248812A (ja) * 2011-05-31 2012-12-13 Sumitomo Electric Ind Ltd 半導体光集積素子の製造方法
CN111221076A (zh) * 2011-09-29 2020-06-02 英特尔公司 用于平面光子电路的垂直光学耦合器
US9726536B2 (en) 2011-12-23 2017-08-08 Technion Research And Development Foundation Limited Fiber optical superconducting nanowire single photon detector
US8681594B1 (en) 2012-09-28 2014-03-25 Western Digital (Fremont), Llc Method and system for improving laser alignment and optical transmission efficiency of an energy assisted magnetic recording head
CN104184046B (zh) * 2014-08-29 2017-01-25 清华大学 用于半导体激光器与TriPleX波导耦合的耦合结构及制备方法
CN105445854B (zh) * 2015-11-06 2018-09-25 南京邮电大学 硅衬底悬空led光波导集成光子器件及其制备方法
US10020635B1 (en) 2016-04-15 2018-07-10 University Of Central Florida Research Foundation, Inc. Spectrometer device with stabilized laser and related devices and methods
US10355449B2 (en) 2016-08-15 2019-07-16 University Of Central Florida Research Foundation, Inc. Quantum cascade laser with angled active region and related methods
FR3060772B1 (fr) * 2016-12-20 2022-12-30 Thales Sa Circuit photonique integre optimise
CN108899760B (zh) * 2018-07-12 2020-06-09 中国科学院长春光学精密机械与物理研究所 一种半导体激光器及制作方法
CN110749955A (zh) * 2018-07-23 2020-02-04 上海新微技术研发中心有限公司 光波模式转换装置及其制造方法
WO2020096950A1 (en) * 2018-11-06 2020-05-14 The Regents Of The University Of California Heterogeneously integrated indium gallium nitride on silicon photonic integrated circuits
CN115152107A (zh) * 2020-02-28 2022-10-04 三菱电机株式会社 半导体激光装置
CN114843869A (zh) * 2021-02-01 2022-08-02 济南量子技术研究院 用于超短脉冲宽带倍频的非线性晶体脊型波导器件及其制备方法
WO2023046473A1 (en) * 2021-09-23 2023-03-30 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device and glasses

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5720893A (en) * 1994-05-31 1998-02-24 Lucent Technologies Inc. Tapered beam expander waveguide integrated with a diode lasesr
US5870417A (en) * 1996-12-20 1999-02-09 Sdl, Inc. Thermal compensators for waveguide DBR laser sources
US6181722B1 (en) * 1996-06-28 2001-01-30 Alcatel Optical semiconductor component with a deep ridged waveguide

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4875216A (en) * 1987-11-30 1989-10-17 Xerox Corporation Buried waveguide window regions for improved performance semiconductor lasers and other opto-electronic applications
US5144634A (en) 1989-09-07 1992-09-01 International Business Machines Corporation Method for mirror passivation of semiconductor laser diodes
US5585957A (en) * 1993-03-25 1996-12-17 Nippon Telegraph And Telephone Corporation Method for producing various semiconductor optical devices of differing optical characteristics
US5613995A (en) 1993-04-23 1997-03-25 Lucent Technologies Inc. Method for making planar optical waveguides
US5389396A (en) 1993-08-11 1995-02-14 Northwestern University InGaAsP/GaAs diode laser
EP0689067A3 (en) * 1994-06-22 1997-04-09 Fujitsu Ltd Manufacturing process for an optical waveguide system, optical component and optical coupler with its use, optical network and optical circuit board
US5764842A (en) * 1995-03-23 1998-06-09 Hitachi, Ltd. Semiconductor guided-wave optical device and method of fabricating thereof
US5879962A (en) 1995-12-13 1999-03-09 Minnesota Mining And Manufacturing Company III-V/II-VI Semiconductor interface fabrication method
FR2747192B1 (fr) * 1996-04-04 1998-04-30 Commissariat Energie Atomique Dispositif de detection de gaz a distance comportant un microlaser
DE19626130A1 (de) * 1996-06-28 1998-01-08 Sel Alcatel Ag Optisches Halbleiterbauelement mit tiefem Rippenwellenleiter
JPH1048789A (ja) * 1996-08-02 1998-02-20 Fuji Photo Film Co Ltd ハロゲン化銀カラー写真感光材料の処理方法
DE19652533C1 (de) 1996-12-17 1998-04-30 Siemens Ag Optoelektronischer Modul
EP0867985B1 (en) * 1997-03-27 2001-02-14 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Erbium-doped planar waveguide
US6087725A (en) * 1997-09-29 2000-07-11 Matsushita Electric Industrial Co., Ltd. Low barrier ohmic contact for semiconductor light emitting device
US6052397A (en) * 1997-12-05 2000-04-18 Sdl, Inc. Laser diode device having a substantially circular light output beam and a method of forming a tapered section in a semiconductor device to provide for a reproducible mode profile of the output beam
US6160660A (en) * 1997-12-31 2000-12-12 Pirelli Cavi E Sistemi S.P.A. Bidirectional optical transmission system for dense interleaved wavelength division multiplexing
JPH11218641A (ja) 1998-02-04 1999-08-10 Furukawa Electric Co Ltd:The レンズ付き光ファイバとレーザモジュール
US6137117A (en) * 1999-06-21 2000-10-24 The United States Of America As Represented By The Secretary Of The Navy Integrating multi-waveguide sensor
US6312581B1 (en) 1999-11-30 2001-11-06 Agere Systems Optoelectronics Guardian Corp. Process for fabricating an optical device
US6580850B1 (en) 2000-11-24 2003-06-17 Applied Wdm, Inc. Optical waveguide multimode to single mode transformer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5720893A (en) * 1994-05-31 1998-02-24 Lucent Technologies Inc. Tapered beam expander waveguide integrated with a diode lasesr
US6181722B1 (en) * 1996-06-28 2001-01-30 Alcatel Optical semiconductor component with a deep ridged waveguide
US5870417A (en) * 1996-12-20 1999-02-09 Sdl, Inc. Thermal compensators for waveguide DBR laser sources

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Publication number Publication date
US20030007535A1 (en) 2003-01-09
DE60208905T2 (de) 2006-08-10
WO2003003083A2 (en) 2003-01-09
AU2002320167A1 (en) 2003-03-03
ATE316701T1 (de) 2006-02-15
CN1246942C (zh) 2006-03-22
EP1402606B1 (en) 2006-01-25
WO2003003083A3 (en) 2003-08-14
DE60208905D1 (de) 2006-04-13
CN1524325A (zh) 2004-08-25
EP1402606A2 (en) 2004-03-31
JP2004531904A (ja) 2004-10-14
KR20040013000A (ko) 2004-02-11
JP4173806B2 (ja) 2008-10-29
US6873638B2 (en) 2005-03-29

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