KR100830053B1 - Chuck for carrying substrate of non-contact type - Google Patents

Chuck for carrying substrate of non-contact type Download PDF

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Publication number
KR100830053B1
KR100830053B1 KR1020070030835A KR20070030835A KR100830053B1 KR 100830053 B1 KR100830053 B1 KR 100830053B1 KR 1020070030835 A KR1020070030835 A KR 1020070030835A KR 20070030835 A KR20070030835 A KR 20070030835A KR 100830053 B1 KR100830053 B1 KR 100830053B1
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KR
South Korea
Prior art keywords
substrate
chuck
lower plate
hole
upper plate
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Application number
KR1020070030835A
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Korean (ko)
Inventor
조남제
조재구
박문규
차문길
Original Assignee
주식회사 피앤드엠
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Priority to KR1020070030835A priority Critical patent/KR100830053B1/en
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Publication of KR100830053B1 publication Critical patent/KR100830053B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Abstract

A non-contact type substrate carrying chuck is provided to stably float and move a substrate by a plurality of nozzle portions installed on a lower plate. A non-contact type substrate carrying chuck includes a upper plate(2), a lower plate(3), and a nozzle portion(4). An air injection hole is formed in center of the upper plate. The lower plate is installed at a lower portion of the upper plate. The lower plate has a plurality of coupling holes(31). A divergence hole(32) is formed in a upper center of the lower plate corresponding to the air injection hole. The coupling holes are connected with the divergence hole via an air passage(33). The nozzle portion is inserted and fixed into the coupling hole. The nozzle portion includes an insertion pipe portion(41) and a flange portion(42). A connecting groove(411) is formed in the insertion pipe portion so that it can communicate with the air passage. The flange portion is provided at a lower portion of the insertion pipe portion.

Description

비접촉식 기판 반송용 척{ Chuck for carrying substrate of non-contact type}Chuck for carrying substrate of non-contact type}

도 1은 본 발명에 따른 비접촉식 기판 반송용 척을 나타낸 분해 사시도이다.1 is an exploded perspective view showing a non-contact substrate transfer chuck according to the present invention.

도 2는 본 발명에 따른 비접촉식 기판 반송용 척을 나타낸 저면 사시도이다.Figure 2 is a bottom perspective view showing a non-contact substrate transfer chuck in accordance with the present invention.

도 3은 본 발명에 따른 비접촉식 기판 반송용 척에 있어, 하부플레이트에 노즐부가 결합된 상태를 나타낸 사시도이다.3 is a perspective view illustrating a state in which a nozzle unit is coupled to a lower plate in the non-contact substrate transport chuck according to the present invention.

도 4는 본 발명에 따른 비접촉식 기판 반송용 척에 있어, 상부플레이트를 나타낸 저면 사시도이다.Figure 4 is a bottom perspective view of the upper plate in the non-contact substrate transfer chuck according to the present invention.

도 5는 본 발명에 따른 비접촉식 기판 본송용 척에 있어, 하부플레이트를 나타낸 저면사시도이다.Figure 5 is a bottom perspective view showing a lower plate in the non-contact substrate transfer chuck according to the present invention.

도 6은 본 발명에 따른 비 접촉식 기판 반송용 척에 있어, 노즐부를 나타낸 저면 사시도이다.6 is a bottom perspective view of the nozzle unit in the non-contact substrate conveying chuck according to the present invention.

<도면의 주요 부분에 대한 설명>Description of the main parts of the drawing

1 : 비접촉식 기판 반송용 척 2 : 상부 플레이트1: Non-contact substrate conveying chuck 2: Upper plate

3 : 하부 플레이트 4 : 노즐부3: lower plate 4: nozzle part

21 : 공기 주입구 22 : 결합공21: air inlet 22: coupling hole

31 : 체결공 32 : 분기홀31: fastening hole 32: branch hole

33 : 공기유로 34 : 결합홈33: air flow path 34: coupling groove

35 : 안착홈 331 : 경사면35: seating groove 331: slope

351 : 체결홈 41 : 끼움관부351: fastening groove 41: fitting pipe

42 : 플렌지부 43 : 지지부재42 flange portion 43 support member

411 : 연결홈 421 : 관통공411: connecting groove 421: through hole

411a : 경사면 B : 볼트411a: slope B: bolt

본 발명은 비접촉식 기판 반송용 척에 관한 것으로서, 보다 상세하게는 분기홀과 공기유로가 형성된 하부 플레이트에 다수개의 노즐부를 설치함으로써, 다수개의 노즐부가 기판을 부상,고정시켜 기판을 안정적으로 이동시킬 수 있는 비접촉식 기판 반송용 척에 관한 것이다.The present invention relates to a non-contact substrate conveying chuck, and more particularly, by installing a plurality of nozzles in the lower plate formed with a branch hole and an air flow path, the plurality of nozzles can float and fix the substrate to stably move the substrate. The present invention relates to a non-contact substrate conveying chuck.

일반적으로 LCD(Liquid Crystal Display: 액정디스플레이)나 PDP(Plasma Display Panel: 플라즈마 디스플레이 패널)와 같은 평판표시장치에 사용되는 기판은 고정밀도 가공을 요구하는 부품으로 그 제조과정에 있어서 불량방지가 매우 중요한 문제이다. 따라서 기판 생산라인에서 기판 이송 시에도 엄격한 관리가 요구되 는데 기존의 로울러 이송 방식은 기판과 로울러의 직접 접촉으로 인하여 기판에 스크래치, 정전기, 오염 입자 등이 발생하여 기판의 불량을 야기하게 되고, 이로 인한 기판의 각종 물리적 결함은 제품의 품질 및 생산수율 저하의 큰 원인이 되고 있다. In general, substrates used in flat panel display devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs) require high-precision processing, and defect prevention is very important in the manufacturing process. It is a problem. Therefore, strict management is required even when transferring the substrate in the substrate production line. In the conventional roller transfer method, scratches, static electricity, contaminant particles, etc. are generated on the substrate due to the direct contact between the substrate and the rollers, thereby causing the defect of the substrate. Various physical defects of the substrate caused by the substrate is a major cause of degradation of product quality and production yield.

상기한 문제점을 해결하고자 최근에는 얇은 시트형상으로 된 기판의 반송과, 액정 및 플라즈마 디스플레이에 사용되는 필름형상 부품을 반송하기 위해 자재를 가스 또는 공기의 흐름에 의해서 발생하는 베르누이 효과(Bernoulli effect)를 이용한 비접촉 반송장치가 제안되고 있고, 상기한 비접촉 반송장치에 사용되는 다양한 기판 반송용 척이 제안되고 있다.In order to solve the above-mentioned problems, the Bernoulli effect caused by the flow of gas or air in order to convey a thin sheet-like substrate and a film-shaped component used for liquid crystal and plasma display has recently been applied. The non-contact conveying apparatus used is proposed, and the various board | substrate conveyance chucks used for the said non-contact conveying apparatus are proposed.

본 발명은 상기한 종래 기술의 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 분기홀과 공기유로가 형성된 하부 플레이트에 다수개의 노즐부를 설치함으로써, 기판을 안정적으로 부상,이동시킬 수 있는 비접촉식 기판 반송용 척을 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems of the prior art, an object of the present invention is to provide a non-contact type that can stably float, move the substrate by installing a plurality of nozzles in the lower plate formed with the branch hole and the air flow path The object is to provide a chuck for transporting a substrate.

본 발명은 압축 공기에 의해 기판을 부상시켜 이송시키는 기판 이송용 척에 있어서 중앙에 공기주입구가 형성된 상부 플레이트와 상기 상부 플레이트의 하부에 설치되며, 다수개의 체결공이 구비되고 상면 중앙에는 상기 공기주입구와 대응되게 분기 홀이 형성되며, 상기 체결공과 상기 분기 홀은 공기유로를 매개로 연결된 하부플레이트와 상기 체결공에 삽입,고정되고 상기 공기유로와 연통되도록 연결홈이 형성된 끼움관부와 그 끼움관부의 하부에 구비되는 플랜지부를 포함하는 노즐부로 구성된 것을 특징으로 한다.The present invention is installed in the upper plate and the lower portion of the upper plate formed with an air inlet in the center of the substrate transfer chuck to lift and transport the substrate by the compressed air, a plurality of fastening holes are provided in the center of the upper surface and the air inlet and A branch hole is formed to correspond, and the fastening hole and the branch hole are inserted into the lower plate and the fastening hole connected through an air flow path, and a fitting groove in which a connection groove is formed so as to communicate with the air flow path and a lower portion of the fitting pipe portion. Characterized in that the nozzle portion comprising a flange portion provided in the.

또한, 상기 공기유로는 하부에 경사면이 더 형성된 것을 특징으로 한다.In addition, the air flow path is characterized in that the inclined surface further formed.

또한, 상기 연결홈에는 곡선의 경사면이 더 형성된 것을 특징으로 한다.In addition, the connection groove is characterized in that the curved inclined surface is further formed.

또한, 상기 플랜지부의 저면에는 고무재의 지지부재가 더 구비된 것을 특징으로 한다.In addition, the bottom surface of the flange is characterized in that the rubber support member is further provided.

이하, 첨부된 도면들을 참조하여 본 발명에 따른 비접촉식 기판 반송용 척의 바람직한 실시예를 첨부된 도면을 참조하여 설명한다. 이 과정에서 도면에 도시된 선들의 두께나 구성요소의 크기 등은 설명의 명료성과 편의상 과장되게 도시되어 있을 수 있다. 또한, 후술되는 용어들은 본 발명에서의 기능을 고려하여 정의된 용어들로서 이는 사용자, 운용자의 의도 또는 관례에 따라 달라질 수 있다. 그러므로, 이러한 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the non-contact substrate transport chuck according to the present invention with reference to the accompanying drawings. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or convention of a user or an operator. Therefore, definitions of these terms should be made based on the contents throughout the specification.

또한, 하기 실시예는 본 발명의 권리범위를 한정하는 것이 아니라 단지 예시로 제시하는 것이며, 본 기술 사상을 통해 구현되는 다양한 실시예가 있을 수 있다.In addition, the following examples are not intended to limit the scope of the present invention but merely presented by way of example, and there may be various embodiments implemented through the present invention.

도 1은 본 발명에 따른 비접촉식 기판 반송용 척을 나타낸 분해 사시도이고, 도 2는 본 발명에 따른 비접촉식 기판 반송용 척을 나타낸 저면 사시도이며, 도 3 은 본 발명에 따른 비접촉식 기판 반송용 척에 있어, 하부플레이트에 노즐부가 결합된 상태를 나타낸 사시도이고, 도 4는 본 발명에 따른 비접촉식 기판 반송용 척에 있어, 상부플레이트를 나타낸 저면 사시도이며, 도 5는 본 발명에 따른 비접촉식 기판 본송용 척에 있어, 하부플레이트를 나타낸 저면사시도이고, 도 6은 본 발명에 따른 비 접촉식 기판 반송용 척에 있어, 노즐부를 나타낸 저면 사시도이다.1 is an exploded perspective view showing a non-contact substrate transfer chuck according to the present invention, Figure 2 is a bottom perspective view showing a non-contact substrate transfer chuck according to the present invention, Figure 3 is a non-contact substrate transfer chuck according to the present invention 4 is a perspective view illustrating a state in which a nozzle unit is coupled to a lower plate, and FIG. 4 is a bottom perspective view showing an upper plate in a non-contact substrate conveying chuck according to the present invention, and FIG. 5 is a non-contact substrate conveying chuck according to the present invention. It is a bottom perspective view which shows the lower plate, and FIG. 6 is a bottom perspective view which shows the nozzle part in the non-contact substrate conveyance chuck which concerns on this invention.

도면에 도시된 바와 같이 본 발명에 따른 비접촉식 기판 반송용 척(1)(이하 반송용 척)은 상부 플레이트(2)와 하부 플레이트(3)와 노즐부(4)로 구성된다.As shown in the figure, the non-contact substrate conveying chuck 1 (hereinafter conveying chuck) according to the present invention is composed of an upper plate 2, a lower plate 3, and a nozzle unit 4.

여기서, 상기 상부 플레이트(2)는 금속재로 이루어진 직사각형 형상의 판상체로써, 중앙에 공기주입구(21)가 형성되는데 상기한 공기 주입구에는 호스(도시생략)가 연결되어 외부로부터 압축공기를 공급받게 되고, 도 4에 도시된 바와 같이 다수개의 결합공(22)이 형성된다.Here, the upper plate 2 is a rectangular plate-shaped body made of a metal material, the air inlet 21 is formed in the center of the air inlet is connected to the hose (not shown) is supplied with compressed air from the outside 4, a plurality of coupling holes 22 are formed.

그리고, 상기 하부 플레이트(3)는 상기 상부 플레이트(2)와 동일한 형상과 재질로 이루어지며, 그 상부 플레이트(2)의 하부에 배치되어 볼트(B)에 의해 체결되도록 상기 결합공(22)과 대응되게 결합홈(34)이 형성되고, 상면 중앙에는 상기 공기주입구(21)와 대응되게 분기 홀(32)이 형성되고, 상기 노즐부(4)가 체결되도록 다수개의 체결공(31)이 형성되되 상기 체결공(31)과 상기 분기 홀(32)은 도 1에 도시된 바와 같이 공기유로(33)를 매개로 연결된다.In addition, the lower plate 3 is made of the same shape and material as the upper plate 2, and disposed in the lower portion of the upper plate 2 and the coupling hole 22 to be fastened by the bolt (B) and Coupling grooves 34 are formed to correspond to each other, and branch holes 32 are formed at the center of the upper surface to correspond to the air inlet 21, and a plurality of fastening holes 31 are formed to fasten the nozzle part 4. The fastening hole 31 and the branch hole 32 are connected via the air flow path 33 as shown in FIG.

이때, 상기 공기유로(33)의 하부에는 경사면(331)이 더 형성되어, 상기 분기 홀(32)의 압축공기가 상기 공기유로(33)의 경사면(331)을 따라 후술될 상기 노즐부(4)의 끼움관부로 용이하게 전달된다.At this time, the inclined surface 331 is further formed in the lower portion of the air passage 33, so that the compressed air of the branch hole 32 along the inclined surface 331 of the air passage 33 will be described later in the nozzle portion (4) It is easily delivered to the fitting tube of

또한, 상기 하부 플레이트(3)의 저면에는 상기 체결공(31)과 연통되게 다수개의 안착홈(35)이 형성되고, 그 안착홈(35)에는 다수개의 체결홈(351)이 구비되어, 후술될 상기 노즐부(4)의 플렌지부(42)가 볼트(B)체결된다.In addition, a plurality of seating grooves 35 are formed in the bottom surface of the lower plate 3 so as to communicate with the fastening holes 31, and the seating grooves 35 are provided with a plurality of fastening grooves 351, which will be described later. The flange part 42 of the nozzle part 4 to be fastened is bolted (B).

상기 노즐부(4)는 상기 체결공(31)에 삽입,고정되어 상기 분기 홀(32)로부터 압축공기를 전달받아 이동시킬 기판(도시생략)을 부상,고정시키는 것으로, 이에 이와 같은 노즐부(4)는 상기 공기유로(33)와 연통되도록 연결홈(411)이 형성된 관통된 구조의 끼움관부(41)가 형성되고 그 끼움관부(41)의 하부에는 플랜지부(42)가 형성되어 상기 안착홈(35)에 안착되고, 상기 플랜지부(42)에는 그 안착홈(35)의 체결홈(351)에 볼트(B)체결되도록 다수개의 관통공(421)이 형성된다.The nozzle unit 4 is inserted into and fixed in the fastening hole 31 to lift and fix a substrate (not shown) to receive and move compressed air from the branch hole 32. 4) the fitting pipe portion 41 of the penetrating structure formed with a connection groove 411 is formed so as to communicate with the air flow path 33 and the flange portion 42 is formed at the lower portion of the fitting pipe portion 41 is the seating Seated in the groove 35, a plurality of through-holes 421 are formed in the flange portion 42 to fasten the bolt (B) to the fastening groove 351 of the seating groove (35).

이때, 상기 연결홈(411)에는 곡선의 경사면(411a)이 형성되어, 상기 공기유로(33)를 통해 유입되는 공기가 상기 경사면(411a)을 따라 상기 끼움관부(41)의 내부로 강하게 와류(渦流)되며 유입됨으로써, 상기 끼움관부(41)에 강한 흡인력이 발생되어 기판을 견고히 부상,고정시킬 수 있게 된다.In this case, a curved inclined surface 411a is formed in the connection groove 411, and the air flowing through the air flow path 33 strongly vortex into the fitting pipe part 41 along the inclined surface 411a. As it flows in and out, a strong suction force is generated in the fitting pipe portion 41, so that the substrate can be firmly floated and fixed.

또한, 상기 플랜지부(42)의 저면에는 고무재의 지지부재(43)가 접착, 나사체결 및 억지끼움 등의 방법으로 설치되어 상기 노즐부(4)에 부상,고정되는 기판이 파손 또는 흡집이 발생되는 것을 방지하게 된다.In addition, a rubber support member 43 is installed on the bottom of the flange portion 42 by means of adhesion, screwing, and interference fitting, so that the substrate floating or fixed on the nozzle portion 4 is damaged or collected. To prevent it.

상기와 같은 구성을 갖는 비접촉식 기판 반송용 척(1)은 그 상부 즉 상부플레이트(2)의 상부를 이동장치(도시생략)에 연결,설치함으로써, 상기 이동장치를 구동시켜 상기 노즐부(4)에 기판을 부상,고정시킨 다음 재차 상기 이동장치의 구동에 의해 그 기판을 원하는 위치에 이동시킬 수 있게 된다. 또한, 상기 상부 플레이 트(2)의 공기주입구(21)에는 외부의 압축공기가 상기 노즐부에 전달되도록 호스(도시생략)가 장,탈착가능하게 연결된다.The non-contact substrate transfer chuck 1 having the above-described configuration is connected to and installed at an upper portion of the upper plate 2, ie, a moving device (not shown), thereby driving the moving device to the nozzle unit 4. The substrate is floated and fixed, and then the substrate can be moved to a desired position by driving the moving device again. In addition, a hose (not shown) is detachably connected to the air inlet 21 of the upper plate 2 so that external compressed air is delivered to the nozzle unit.

상기와 같이 이동장치에 설치됨과 아울러 외부의 호스와 연결되어 압축공기를 전달 받는 기판 반송용 척(1)에 기판이 부상,고정되는 작동상태를 설명하면 먼저, 이동장치의 구동에 의해 기판과 근접한 거리로 상기 기판 반송용 척(1)이 이동되고, 호스를 통해 압축공기가 순차적으로 상기 공기주입구(21)와 상기 분기홀(32)과 그 분기홀(32)에서 분기되는 다수개의 공기유로(33)를 통해 상기 노즐부(4)의 끼움관부(41)의 내부로 전달되는데, 이때 상기 공기유로(33)에는 저면에는 경사면(331)이 형성되어 압축공기가 그 경사면(331)을 따라 보다 용이하게 상기 끼움관부(41)의 연결홈(411)으로 이동하게 된다. 다시 말해 상기 공기유로(33)가 상기 분기홈(32)에서 상기 연결홈(411)으로 이동될수록 그 높이가 줄어들게 됨으로써, 상기 연결홈(411)을 지나는 압축공기의 속도가 상기 분기홈(32) 지나는 압축공기의 속도보다 빠르게 되어 상기 끼움관부(41)에 내부로 빠르게 압축공기를 전달할 수 있게 된다.Referring to the operation state in which the substrate is injured and fixed to the substrate conveying chuck 1 which is installed in the moving device and connected to the external hose and receives the compressed air, first, the driving device moves closer to the substrate. The substrate conveying chuck 1 is moved at a distance, and a plurality of air passages through which the compressed air is sequentially branched from the air inlet 21, the branch hole 32, and the branch hole 32 through a hose ( It is transmitted to the inside of the fitting pipe portion 41 of the nozzle portion 4 through 33, wherein the air flow path 33 has an inclined surface 331 is formed on the bottom surface so that the compressed air is along the inclined surface 331 It is easily moved to the connecting groove 411 of the fitting pipe portion 41. In other words, as the air flow path 33 moves from the branch groove 32 to the connection groove 411, its height decreases, so that the speed of the compressed air passing through the connection groove 411 is increased in the branch groove 32. Passing faster than the speed of the compressed air it is possible to quickly deliver the compressed air to the fitting pipe portion 41 inside.

다음, 연결홈(411)으로 이동된 압축공기는 상기 연결홈(411)에 구비된 경사면(411a)을 따라 그 끼움관부(41)의 내부에 와류를 발생시키며 이동하게 됨으로써, 상기 끼움관부(41) 내부에 강한 흡인력이 발생되어 기판을 부상,고정시키게 된다.Next, the compressed air moved to the connection groove 411 is moved along the inclined surface 411a provided in the connection groove 411 to generate the vortex inside the fitting pipe portion 41, thereby the fitting pipe portion 41 ) A strong suction force is generated inside to lift and fix the board.

상기에서는 상기 하부 플레이트(3)의 사방 모서리 부분에 체결공(31)이 형성되어 그 체결공(31)에 노즐부(4)가 설치되는 것으로 설명 및 도면에 나타내고 있지만 이에 한정되는 것은 아니다.In the above description, although the fastening hole 31 is formed at four corners of the lower plate 3 and the nozzle part 4 is installed in the fastening hole 31, it is not limited thereto.

예를 들어, 상기 하부 플레이트(3)의 분기홀(32)을 중심으로 원호형상 갖도록 다수개의 체결공(31)이 형성시켜 그 체결공(31)에 노즐부(4)를 설치함으로써, 안정적으로 기판을 부상,고정시키는 것도 가능하다.For example, a plurality of fastening holes 31 are formed to have an arc shape around the branch hole 32 of the lower plate 3, and the nozzle portion 4 is installed in the fastening holes 31, thereby stably. It is also possible to float and fix the substrate.

상기와 같이 구성되는 본 발명에 의한 비접촉식 기판 반송용 척은 분기홀과 공기유로가 형성된 하부 플레이트에 다수개의 노즐부를 설치함으로써, 다수개의 노즐부가 기판을 부상,고정시켜 기판을 안정적으로 이동시킬 수 있는 효과가 있다.In the non-contact substrate conveying chuck according to the present invention configured as described above, by installing a plurality of nozzles in the lower plate formed with the branch hole and the air flow path, the plurality of nozzles can float and fix the substrate to stably move the substrate. It works.

Claims (4)

압축 공기에 의해 기판을 부상시켜 이송시키는 기판 이송용 척에 있어서,In the substrate transfer chuck for floating the substrate by compressed air, 중앙에 공기주입구가 형성된 상부 플레이트;An upper plate having an air inlet formed in the center thereof; 상기 상부 플레이트의 하부에 설치되며, 다수개의 체결공이 구비되고 상면 중앙에는 상기 공기주입구와 대응되게 분기 홀이 형성되며, 상기 체결공과 상기 분기 홀은 공기유로를 매개로 연결된 하부플레이트; 및A lower plate installed at a lower portion of the upper plate and provided with a plurality of fastening holes and having a branch hole at a center thereof to correspond to the air inlet, wherein the fastening hole and the branch hole are connected to each other via an air flow path; And 상기 체결공에 삽입,고정되고 상기 공기유로와 연통되도록 연결홈이 형성된 끼움관부와 그 끼움관부의 하부에 구비되는 플랜지부를 포함하는 노즐부로 구성된 것을 특징으로 하는 비접촉식 기판 반송용 척.The non-contact substrate transfer chuck, characterized in that consisting of a nozzle portion including a fitting portion which is inserted into the fastening hole, the connection groove is formed so as to communicate with the air flow path and a flange portion provided below the fitting tube portion. 제 1 항에 있어서,The method of claim 1, 상기 공기유로는 하부에 경사면이 더 형성된 것을 특징으로 하는 비접촉식 기판 반송용 척.The air flow passage chuck for contactless substrate characterized in that the inclined surface is further formed on the lower portion. 제 1 항에 있어서,The method of claim 1, 상기 연결홈에는 곡선의 경사면이 더 형성된 것을 특징으로 하는 비접촉식 기판 반송용 척.The connection groove chuck for the non-contact substrate characterized in that the curved inclined surface is further formed. 제 1 항에 있어서,The method of claim 1, 상기 플랜지부의 저면에는 고무재의 지지부재가 더 구비된 것을 특징으로 하는 비접촉식 기판 반송용 척.A non-contact substrate transfer chuck, characterized in that the bottom surface of the flange portion is further provided with a support member of rubber material.
KR1020070030835A 2007-03-29 2007-03-29 Chuck for carrying substrate of non-contact type KR100830053B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102794773A (en) * 2011-05-26 2012-11-28 北京北方微电子基地设备工艺研究中心有限责任公司 Grabbing component for grabbing chips and grabbing device with grabbing component
US20140048994A1 (en) * 2012-08-14 2014-02-20 Scientech Corp. Non-Contact Substrate Chuck and Vertical Type Substrate Supporting Apparatus Using the Same
WO2019061574A1 (en) * 2017-09-29 2019-04-04 富准精密电子（鹤壁）有限公司 Vacuum suction disc

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Publication number Priority date Publication date Assignee Title
JP2004265962A (en) 2003-02-28 2004-09-24 Hirata Corp Substrate turn device
KR20040098586A (en) * 2003-05-14 2004-11-20 호야 가부시키가이샤 Substrate holding tool, substrate treating apparatus, substrate testing apparatus, and method for using these

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004265962A (en) 2003-02-28 2004-09-24 Hirata Corp Substrate turn device
KR20040098586A (en) * 2003-05-14 2004-11-20 호야 가부시키가이샤 Substrate holding tool, substrate treating apparatus, substrate testing apparatus, and method for using these

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102794773A (en) * 2011-05-26 2012-11-28 北京北方微电子基地设备工艺研究中心有限责任公司 Grabbing component for grabbing chips and grabbing device with grabbing component
US20140048994A1 (en) * 2012-08-14 2014-02-20 Scientech Corp. Non-Contact Substrate Chuck and Vertical Type Substrate Supporting Apparatus Using the Same
WO2019061574A1 (en) * 2017-09-29 2019-04-04 富准精密电子（鹤壁）有限公司 Vacuum suction disc

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