KR100811861B1 - 촉각센서의 제조 방법 - Google Patents

촉각센서의 제조 방법 Download PDF

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Publication number
KR100811861B1
KR100811861B1 KR1020060083584A KR20060083584A KR100811861B1 KR 100811861 B1 KR100811861 B1 KR 100811861B1 KR 1020060083584 A KR1020060083584 A KR 1020060083584A KR 20060083584 A KR20060083584 A KR 20060083584A KR 100811861 B1 KR100811861 B1 KR 100811861B1
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KR
South Korea
Prior art keywords
resistor
metal layer
forming
tactile sensor
predetermined thickness
Prior art date
Application number
KR1020060083584A
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English (en)
Korean (ko)
Other versions
KR20080020281A (ko
Inventor
김종호
권현준
박연규
김민석
강대임
최재혁
Original Assignee
한국표준과학연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 한국표준과학연구원 filed Critical 한국표준과학연구원
Priority to KR1020060083584A priority Critical patent/KR100811861B1/ko
Priority to EP07746693.6A priority patent/EP2057448A4/en
Priority to PCT/KR2007/002545 priority patent/WO2008026818A1/en
Priority to CN2007800319180A priority patent/CN101512311B/zh
Priority to JP2009525478A priority patent/JP4916549B2/ja
Priority to US12/310,526 priority patent/US8049591B2/en
Publication of KR20080020281A publication Critical patent/KR20080020281A/ko
Application granted granted Critical
Publication of KR100811861B1 publication Critical patent/KR100811861B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Position Input By Displaying (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
KR1020060083584A 2006-08-31 2006-08-31 촉각센서의 제조 방법 KR100811861B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020060083584A KR100811861B1 (ko) 2006-08-31 2006-08-31 촉각센서의 제조 방법
EP07746693.6A EP2057448A4 (en) 2006-08-31 2007-05-25 TOUCH SENSOR FOR CURVED SURFACES AND METHOD OF MANUFACTURING THE SAME
PCT/KR2007/002545 WO2008026818A1 (en) 2006-08-31 2007-05-25 Tactile sensor for curved surfaces and manufacturing method thereof
CN2007800319180A CN101512311B (zh) 2006-08-31 2007-05-25 用于曲面的触觉传感器及其制备方法
JP2009525478A JP4916549B2 (ja) 2006-08-31 2007-05-25 曲面付着型触覚センサーとその製造方法
US12/310,526 US8049591B2 (en) 2006-08-31 2007-05-25 Tactile sensor for curved surface and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060083584A KR100811861B1 (ko) 2006-08-31 2006-08-31 촉각센서의 제조 방법

Publications (2)

Publication Number Publication Date
KR20080020281A KR20080020281A (ko) 2008-03-05
KR100811861B1 true KR100811861B1 (ko) 2008-03-10

Family

ID=39395324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060083584A KR100811861B1 (ko) 2006-08-31 2006-08-31 촉각센서의 제조 방법

Country Status (2)

Country Link
KR (1) KR100811861B1 (zh)
CN (1) CN101512311B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008088898A1 (en) 2007-01-19 2008-07-24 Sierra Scientific Instruments, Inc. Micro-remote gastrointestinal physiological measurement device
WO2008133942A2 (en) * 2007-04-23 2008-11-06 Sierra Scientific Instruments, Inc. Suspended membrane pressure sensing array
KR101484944B1 (ko) * 2008-10-02 2015-01-22 삼성전자 주식회사 전자기기 케이스 및 이의 제조방법
KR101223934B1 (ko) * 2010-06-08 2013-01-22 한국표준과학연구원 가변색상용 촉각센서와 그 제조방법
EP2413120A1 (en) * 2010-07-30 2012-02-01 Delphi Technologies, Inc. Pressure sensitive transducer assembly and control method for a system including such an assembly
CN102539035B (zh) * 2012-01-17 2013-10-30 江苏物联网研究发展中心 一种点阵型柔性压力分布传感器及其制备方法
WO2015024906A1 (de) * 2013-08-19 2015-02-26 Ceramtec Gmbh Drucksensor zur kraftdetektierung
JP6494523B2 (ja) * 2013-11-28 2019-04-03 バンドー化学株式会社 伸縮性電極、センサシート及び静電容量型センサ
KR101594673B1 (ko) * 2014-05-28 2016-02-17 한양대학교 산학협력단 촉각 센서
CN104819804B (zh) * 2015-05-20 2018-04-03 清华大学 一种压阻式真空计及其制造方法
CN105865536A (zh) * 2016-06-28 2016-08-17 钱宝祥 一种可拉伸测量形变与应力的弹性传感器
CN106197803A (zh) * 2016-07-21 2016-12-07 上海与德通讯技术有限公司 跌落数据的采集方法及终端设备
CN108323001B (zh) * 2017-01-14 2020-04-14 鹏鼎控股(深圳)股份有限公司 感压柔性电路板及其制作方法
TWI664407B (zh) * 2018-04-11 2019-07-01 Yuan Ze University 具有軟性壓力感應功能的布套
CN111333022B (zh) * 2020-03-17 2023-04-07 中北大学 一种高密度微纳线圈柔性异质集成方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4492949A (en) * 1983-03-18 1985-01-08 Barry Wright Corporation Tactile sensors for robotic gripper and the like
US4521685A (en) * 1982-03-01 1985-06-04 Lord Corporation Tactile sensor for an industrial robot or the like
JPS62206423A (ja) 1986-03-07 1987-09-10 Yokohama Rubber Co Ltd:The 分布型触覚センサの触覚検出方法及びその回路
JPH0719975A (ja) * 1993-06-30 1995-01-20 Mitsui Eng & Shipbuild Co Ltd 圧力センサチップ、触覚センサ、および触覚センサの製造方法
JPH07115209A (ja) * 1993-10-18 1995-05-02 Omron Corp 半導体圧力センサ及びその製造方法並びに触覚センサ
JPH07190870A (ja) * 1993-12-24 1995-07-28 Fujitsu Ltd 触覚センサ及びその制御方法
KR100556265B1 (ko) 2004-05-28 2006-03-03 한국표준과학연구원 촉각센서 및 이의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4856993A (en) * 1985-03-29 1989-08-15 Tekscan, Inc. Pressure and contact sensor system for measuring dental occlusion
CN1028906C (zh) * 1991-06-05 1995-06-14 北京理工大学 柔性光纤阵列触觉传感器
US6886415B1 (en) * 2004-08-03 2005-05-03 Toshiba Electric Engineering Corporation Tactile sensor and gripping robot using the same
CN1796954A (zh) * 2004-12-22 2006-07-05 中国科学院合肥智能机械研究所 柔性三维力触觉传感器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4521685A (en) * 1982-03-01 1985-06-04 Lord Corporation Tactile sensor for an industrial robot or the like
US4492949A (en) * 1983-03-18 1985-01-08 Barry Wright Corporation Tactile sensors for robotic gripper and the like
JPS62206423A (ja) 1986-03-07 1987-09-10 Yokohama Rubber Co Ltd:The 分布型触覚センサの触覚検出方法及びその回路
JPH0719975A (ja) * 1993-06-30 1995-01-20 Mitsui Eng & Shipbuild Co Ltd 圧力センサチップ、触覚センサ、および触覚センサの製造方法
JPH07115209A (ja) * 1993-10-18 1995-05-02 Omron Corp 半導体圧力センサ及びその製造方法並びに触覚センサ
JPH07190870A (ja) * 1993-12-24 1995-07-28 Fujitsu Ltd 触覚センサ及びその制御方法
KR100556265B1 (ko) 2004-05-28 2006-03-03 한국표준과학연구원 촉각센서 및 이의 제조방법

Also Published As

Publication number Publication date
CN101512311A (zh) 2009-08-19
CN101512311B (zh) 2010-12-01
KR20080020281A (ko) 2008-03-05

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