KR100806261B1 - 냉각재킷 - Google Patents

냉각재킷 Download PDF

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Publication number
KR100806261B1
KR100806261B1 KR1020060029221A KR20060029221A KR100806261B1 KR 100806261 B1 KR100806261 B1 KR 100806261B1 KR 1020060029221 A KR1020060029221 A KR 1020060029221A KR 20060029221 A KR20060029221 A KR 20060029221A KR 100806261 B1 KR100806261 B1 KR 100806261B1
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KR
South Korea
Prior art keywords
liquid refrigerant
cooling jacket
heat
passage
members
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020060029221A
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English (en)
Korean (ko)
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KR20060105617A (ko
Inventor
슈이치 데라카도
아츠오 니시하라
시게오 오하시
린타로 미나미타니
다카시 나가나와
Original Assignee
가부시끼가이샤 히다치 세이사꾸쇼
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Publication of KR20060105617A publication Critical patent/KR20060105617A/ko
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Publication of KR100806261B1 publication Critical patent/KR100806261B1/ko
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020060029221A 2005-03-31 2006-03-30 냉각재킷 Expired - Fee Related KR100806261B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00102328 2005-03-31
JP2005102328A JP2006286767A (ja) 2005-03-31 2005-03-31 冷却ジャケット

Publications (2)

Publication Number Publication Date
KR20060105617A KR20060105617A (ko) 2006-10-11
KR100806261B1 true KR100806261B1 (ko) 2008-02-22

Family

ID=36499051

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060029221A Expired - Fee Related KR100806261B1 (ko) 2005-03-31 2006-03-30 냉각재킷

Country Status (5)

Country Link
US (1) US7516777B2 (enExample)
EP (1) EP1710660A3 (enExample)
JP (1) JP2006286767A (enExample)
KR (1) KR100806261B1 (enExample)
TW (1) TW200634495A (enExample)

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CN100489429C (zh) * 2006-09-29 2009-05-20 曹爱国 一种空调的传热水箱及其制作方法
KR101496493B1 (ko) * 2007-11-26 2015-02-26 가부시키가이샤 도요다 지도숏키 액냉식 냉각 장치
DE102008012645A1 (de) * 2008-03-05 2009-09-10 Robert Bosch Gmbh Gehäuse mit Kühler für Leistungselektronik
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
JP5023020B2 (ja) * 2008-08-26 2012-09-12 株式会社豊田自動織機 液冷式冷却装置
JP2011054778A (ja) * 2009-09-02 2011-03-17 Furukawa-Sky Aluminum Corp 櫛型放熱ユニットを用いた熱交換器
US20110073292A1 (en) * 2009-09-30 2011-03-31 Madhav Datta Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems
DE102009051864B4 (de) * 2009-11-04 2023-07-13 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung für eine elektrische Einrichtung
JP5813300B2 (ja) * 2010-08-23 2015-11-17 三桜工業株式会社 冷却装置
CN102469749B (zh) * 2010-11-12 2016-01-20 奇鋐科技股份有限公司 具分流的热交换结构
AU2011370980B2 (en) * 2010-11-17 2015-08-27 Tritium Power Solutions Pty Ltd A liquid coolant heat transfer device
US20120152500A1 (en) * 2010-12-21 2012-06-21 Pai-Ling Kao Flow passage structure for water-cooling device
USD684544S1 (en) * 2011-05-13 2013-06-18 Fuji Electric Co., Ltd. Cooling jacket for semiconductor device
EP2592633B1 (en) * 2011-11-14 2017-06-14 Cressall Resistors Limited Liquid-cooled resistor device
US9437903B2 (en) * 2012-01-31 2016-09-06 Johnson Controls Technology Company Method for cooling a lithium-ion battery pack
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
US9279625B2 (en) * 2013-10-29 2016-03-08 Caterpillar Inc. Heat sink device for power modules of power converter assembly
CA2897598C (en) 2014-07-16 2018-03-06 Bronswerk Marine Inc. Modular refrigeration system, e.g., for ships
US10462939B2 (en) * 2015-01-22 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
US9693487B2 (en) * 2015-02-06 2017-06-27 Caterpillar Inc. Heat management and removal assemblies for semiconductor devices
US9301422B1 (en) * 2015-04-01 2016-03-29 John O. Tate Heat sink with internal fan
WO2016191374A1 (en) * 2015-05-22 2016-12-01 Teza Technologies LLC Fluid cooled server and radiator
KR101815947B1 (ko) * 2016-06-30 2018-01-08 조선대학교 산학협력단 액체금속을 이용한 열제어 장치
TWI632650B (zh) * 2017-09-28 2018-08-11 雙鴻科技股份有限公司 水冷散熱系統及水冷頭
DE102018208232A1 (de) * 2018-05-24 2019-11-28 Volkswagen Aktiengesellschaft Bauteil mit einer durch ein Einlegeelement optimierten Kühlleistung und Kraftfahrzeug mit zumindest einem Bauteil
JP7118788B2 (ja) * 2018-07-19 2022-08-16 株式会社フジクラ コールドプレート及びコールドプレートの製造方法
CN109193070A (zh) * 2018-09-05 2019-01-11 江苏奥吉瑞斯新能源有限公司 一种冷媒冷却液混合型动力电池散热板
TWI686580B (zh) * 2019-02-20 2020-03-01 龍大昌精密工業有限公司 冷凝器之散熱結構
KR20210135570A (ko) 2019-03-28 2021-11-15 미쯔이가가꾸가부시끼가이샤 냉각 유닛, 냉각 장치, 전지 구조체 및 전동 차량
CN110134214A (zh) * 2019-05-29 2019-08-16 英业达科技有限公司 可携式电子装置
US11278978B2 (en) * 2019-06-21 2022-03-22 International Business Machines Corporation Pattern bonded finned cold plate
US11280561B2 (en) * 2020-02-06 2022-03-22 Ldc Precision Engineering Co., Ltd. Current stabilization and pressure boosting device for evaporator
US11686539B2 (en) * 2020-03-09 2023-06-27 Raytheon Company Coldplate with heat transfer module
CN215935363U (zh) * 2020-09-02 2022-03-01 春鸿电子科技(重庆)有限公司 液冷头
WO2022099089A1 (en) * 2020-11-05 2022-05-12 Deeia, Inc. Loop thermosyphon devices and systems, and related methods
US12453042B2 (en) 2022-06-21 2025-10-21 Deeia Inc. Metallic thermal interface materials and associated devices, systems, and methods
CN115654987B (zh) * 2022-11-08 2025-07-08 珠海格力电器股份有限公司 一种换热管、换热器和空调器
CA3201617A1 (en) * 2022-11-09 2024-05-09 Haifeng GUO Liquid cooling heat dissipation plate and liquid cooling electronic device
CN221802601U (zh) * 2024-01-18 2024-10-01 泰硕电子股份有限公司 一体式液冷均温模块

Citations (8)

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KR20010027876A (ko) * 1999-09-16 2001-04-06 김형벽 고효율 수냉식 히트싱크 구조
JP2002098454A (ja) 2000-07-21 2002-04-05 Mitsubishi Materials Corp 液冷ヒートシンク及びその製造方法
JP2004295718A (ja) 2003-03-28 2004-10-21 Hitachi Ltd 情報処理装置の液例システム
JP2005011928A (ja) * 2003-06-18 2005-01-13 Matsushita Electric Ind Co Ltd 液冷循環システム
KR20050034526A (ko) * 2003-10-08 2005-04-14 가부시키가이샤 히타치세이사쿠쇼 액체 냉각 재킷
KR20050051530A (ko) * 2003-11-27 2005-06-01 엘에스전선 주식회사 판형 열전달 장치
KR20050081842A (ko) * 2004-02-16 2005-08-19 가부시키가이샤 히타치세이사쿠쇼 액랭 시스템 및 그를 구비한 전자 기기
KR20060036249A (ko) * 2004-10-25 2006-04-28 삼성전자주식회사 냉각장치

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US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010027876A (ko) * 1999-09-16 2001-04-06 김형벽 고효율 수냉식 히트싱크 구조
JP2002098454A (ja) 2000-07-21 2002-04-05 Mitsubishi Materials Corp 液冷ヒートシンク及びその製造方法
JP2004295718A (ja) 2003-03-28 2004-10-21 Hitachi Ltd 情報処理装置の液例システム
JP2005011928A (ja) * 2003-06-18 2005-01-13 Matsushita Electric Ind Co Ltd 液冷循環システム
KR20050034526A (ko) * 2003-10-08 2005-04-14 가부시키가이샤 히타치세이사쿠쇼 액체 냉각 재킷
KR20050051530A (ko) * 2003-11-27 2005-06-01 엘에스전선 주식회사 판형 열전달 장치
KR20050081842A (ko) * 2004-02-16 2005-08-19 가부시키가이샤 히타치세이사쿠쇼 액랭 시스템 및 그를 구비한 전자 기기
KR20060036249A (ko) * 2004-10-25 2006-04-28 삼성전자주식회사 냉각장치

Also Published As

Publication number Publication date
TW200634495A (en) 2006-10-01
TWI317862B (enExample) 2009-12-01
US20060219388A1 (en) 2006-10-05
JP2006286767A (ja) 2006-10-19
EP1710660A3 (en) 2010-11-03
KR20060105617A (ko) 2006-10-11
US7516777B2 (en) 2009-04-14
EP1710660A2 (en) 2006-10-11

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