KR100806261B1 - 냉각재킷 - Google Patents
냉각재킷 Download PDFInfo
- Publication number
- KR100806261B1 KR100806261B1 KR1020060029221A KR20060029221A KR100806261B1 KR 100806261 B1 KR100806261 B1 KR 100806261B1 KR 1020060029221 A KR1020060029221 A KR 1020060029221A KR 20060029221 A KR20060029221 A KR 20060029221A KR 100806261 B1 KR100806261 B1 KR 100806261B1
- Authority
- KR
- South Korea
- Prior art keywords
- liquid refrigerant
- cooling jacket
- heat
- passage
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2005-00102328 | 2005-03-31 | ||
| JP2005102328A JP2006286767A (ja) | 2005-03-31 | 2005-03-31 | 冷却ジャケット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060105617A KR20060105617A (ko) | 2006-10-11 |
| KR100806261B1 true KR100806261B1 (ko) | 2008-02-22 |
Family
ID=36499051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020060029221A Expired - Fee Related KR100806261B1 (ko) | 2005-03-31 | 2006-03-30 | 냉각재킷 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7516777B2 (enExample) |
| EP (1) | EP1710660A3 (enExample) |
| JP (1) | JP2006286767A (enExample) |
| KR (1) | KR100806261B1 (enExample) |
| TW (1) | TW200634495A (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
| US7591302B1 (en) | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
| CN100489429C (zh) * | 2006-09-29 | 2009-05-20 | 曹爱国 | 一种空调的传热水箱及其制作方法 |
| KR101496493B1 (ko) * | 2007-11-26 | 2015-02-26 | 가부시키가이샤 도요다 지도숏키 | 액냉식 냉각 장치 |
| DE102008012645A1 (de) * | 2008-03-05 | 2009-09-10 | Robert Bosch Gmbh | Gehäuse mit Kühler für Leistungselektronik |
| US9297571B1 (en) | 2008-03-10 | 2016-03-29 | Liebert Corporation | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
| JP5023020B2 (ja) * | 2008-08-26 | 2012-09-12 | 株式会社豊田自動織機 | 液冷式冷却装置 |
| JP2011054778A (ja) * | 2009-09-02 | 2011-03-17 | Furukawa-Sky Aluminum Corp | 櫛型放熱ユニットを用いた熱交換器 |
| US20110073292A1 (en) * | 2009-09-30 | 2011-03-31 | Madhav Datta | Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems |
| DE102009051864B4 (de) * | 2009-11-04 | 2023-07-13 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Kühlvorrichtung für eine elektrische Einrichtung |
| JP5813300B2 (ja) * | 2010-08-23 | 2015-11-17 | 三桜工業株式会社 | 冷却装置 |
| CN102469749B (zh) * | 2010-11-12 | 2016-01-20 | 奇鋐科技股份有限公司 | 具分流的热交换结构 |
| AU2011370980B2 (en) * | 2010-11-17 | 2015-08-27 | Tritium Power Solutions Pty Ltd | A liquid coolant heat transfer device |
| US20120152500A1 (en) * | 2010-12-21 | 2012-06-21 | Pai-Ling Kao | Flow passage structure for water-cooling device |
| USD684544S1 (en) * | 2011-05-13 | 2013-06-18 | Fuji Electric Co., Ltd. | Cooling jacket for semiconductor device |
| EP2592633B1 (en) * | 2011-11-14 | 2017-06-14 | Cressall Resistors Limited | Liquid-cooled resistor device |
| US9437903B2 (en) * | 2012-01-31 | 2016-09-06 | Johnson Controls Technology Company | Method for cooling a lithium-ion battery pack |
| USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
| US9279625B2 (en) * | 2013-10-29 | 2016-03-08 | Caterpillar Inc. | Heat sink device for power modules of power converter assembly |
| CA2897598C (en) | 2014-07-16 | 2018-03-06 | Bronswerk Marine Inc. | Modular refrigeration system, e.g., for ships |
| US10462939B2 (en) * | 2015-01-22 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
| US9693487B2 (en) * | 2015-02-06 | 2017-06-27 | Caterpillar Inc. | Heat management and removal assemblies for semiconductor devices |
| US9301422B1 (en) * | 2015-04-01 | 2016-03-29 | John O. Tate | Heat sink with internal fan |
| WO2016191374A1 (en) * | 2015-05-22 | 2016-12-01 | Teza Technologies LLC | Fluid cooled server and radiator |
| KR101815947B1 (ko) * | 2016-06-30 | 2018-01-08 | 조선대학교 산학협력단 | 액체금속을 이용한 열제어 장치 |
| TWI632650B (zh) * | 2017-09-28 | 2018-08-11 | 雙鴻科技股份有限公司 | 水冷散熱系統及水冷頭 |
| DE102018208232A1 (de) * | 2018-05-24 | 2019-11-28 | Volkswagen Aktiengesellschaft | Bauteil mit einer durch ein Einlegeelement optimierten Kühlleistung und Kraftfahrzeug mit zumindest einem Bauteil |
| JP7118788B2 (ja) * | 2018-07-19 | 2022-08-16 | 株式会社フジクラ | コールドプレート及びコールドプレートの製造方法 |
| CN109193070A (zh) * | 2018-09-05 | 2019-01-11 | 江苏奥吉瑞斯新能源有限公司 | 一种冷媒冷却液混合型动力电池散热板 |
| TWI686580B (zh) * | 2019-02-20 | 2020-03-01 | 龍大昌精密工業有限公司 | 冷凝器之散熱結構 |
| KR20210135570A (ko) | 2019-03-28 | 2021-11-15 | 미쯔이가가꾸가부시끼가이샤 | 냉각 유닛, 냉각 장치, 전지 구조체 및 전동 차량 |
| CN110134214A (zh) * | 2019-05-29 | 2019-08-16 | 英业达科技有限公司 | 可携式电子装置 |
| US11278978B2 (en) * | 2019-06-21 | 2022-03-22 | International Business Machines Corporation | Pattern bonded finned cold plate |
| US11280561B2 (en) * | 2020-02-06 | 2022-03-22 | Ldc Precision Engineering Co., Ltd. | Current stabilization and pressure boosting device for evaporator |
| US11686539B2 (en) * | 2020-03-09 | 2023-06-27 | Raytheon Company | Coldplate with heat transfer module |
| CN215935363U (zh) * | 2020-09-02 | 2022-03-01 | 春鸿电子科技(重庆)有限公司 | 液冷头 |
| WO2022099089A1 (en) * | 2020-11-05 | 2022-05-12 | Deeia, Inc. | Loop thermosyphon devices and systems, and related methods |
| US12453042B2 (en) | 2022-06-21 | 2025-10-21 | Deeia Inc. | Metallic thermal interface materials and associated devices, systems, and methods |
| CN115654987B (zh) * | 2022-11-08 | 2025-07-08 | 珠海格力电器股份有限公司 | 一种换热管、换热器和空调器 |
| CA3201617A1 (en) * | 2022-11-09 | 2024-05-09 | Haifeng GUO | Liquid cooling heat dissipation plate and liquid cooling electronic device |
| CN221802601U (zh) * | 2024-01-18 | 2024-10-01 | 泰硕电子股份有限公司 | 一体式液冷均温模块 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010027876A (ko) * | 1999-09-16 | 2001-04-06 | 김형벽 | 고효율 수냉식 히트싱크 구조 |
| JP2002098454A (ja) | 2000-07-21 | 2002-04-05 | Mitsubishi Materials Corp | 液冷ヒートシンク及びその製造方法 |
| JP2004295718A (ja) | 2003-03-28 | 2004-10-21 | Hitachi Ltd | 情報処理装置の液例システム |
| JP2005011928A (ja) * | 2003-06-18 | 2005-01-13 | Matsushita Electric Ind Co Ltd | 液冷循環システム |
| KR20050034526A (ko) * | 2003-10-08 | 2005-04-14 | 가부시키가이샤 히타치세이사쿠쇼 | 액체 냉각 재킷 |
| KR20050051530A (ko) * | 2003-11-27 | 2005-06-01 | 엘에스전선 주식회사 | 판형 열전달 장치 |
| KR20050081842A (ko) * | 2004-02-16 | 2005-08-19 | 가부시키가이샤 히타치세이사쿠쇼 | 액랭 시스템 및 그를 구비한 전자 기기 |
| KR20060036249A (ko) * | 2004-10-25 | 2006-04-28 | 삼성전자주식회사 | 냉각장치 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3327776A (en) * | 1965-10-24 | 1967-06-27 | Trane Co | Heat exchanger |
| US4894709A (en) * | 1988-03-09 | 1990-01-16 | Massachusetts Institute Of Technology | Forced-convection, liquid-cooled, microchannel heat sinks |
| JPH06266474A (ja) | 1993-03-17 | 1994-09-22 | Hitachi Ltd | 電子機器装置及びラップトップ型電子機器装置 |
| JPH0750494A (ja) * | 1993-08-06 | 1995-02-21 | Mitsubishi Electric Corp | 冷却装置 |
| JP3385482B2 (ja) | 1993-11-15 | 2003-03-10 | 株式会社日立製作所 | 電子機器 |
| US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
| TW556074B (en) * | 1998-12-15 | 2003-10-01 | Foxconn Prec Components Co Ltd | Heat sink and the manufacturing method thereof |
| DE60140837D1 (de) * | 2000-04-19 | 2010-02-04 | Thermal Form & Function Inc | Kühlplatte mit Kühlrippen mit einem verdampfenden Kühlmittel |
| US6578626B1 (en) * | 2000-11-21 | 2003-06-17 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
| US7128131B2 (en) * | 2001-07-31 | 2006-10-31 | The Furukawa Electric Co., Ltd. | Heat sink for electronic devices and heat dissipating method |
| US6446709B1 (en) * | 2001-11-27 | 2002-09-10 | Wuh Choung Industrial Co., Ltd. | Combination heat radiator |
| DE102005025381A1 (de) * | 2005-05-31 | 2006-12-07 | Behr Industry Gmbh & Co. Kg | Vorrichtung zur Kühlung von elekronischen Bauelementen |
-
2005
- 2005-03-31 JP JP2005102328A patent/JP2006286767A/ja active Pending
-
2006
- 2006-03-06 TW TW095107455A patent/TW200634495A/zh not_active IP Right Cessation
- 2006-03-30 KR KR1020060029221A patent/KR100806261B1/ko not_active Expired - Fee Related
- 2006-03-31 US US11/393,783 patent/US7516777B2/en not_active Expired - Fee Related
- 2006-03-31 EP EP06006968A patent/EP1710660A3/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010027876A (ko) * | 1999-09-16 | 2001-04-06 | 김형벽 | 고효율 수냉식 히트싱크 구조 |
| JP2002098454A (ja) | 2000-07-21 | 2002-04-05 | Mitsubishi Materials Corp | 液冷ヒートシンク及びその製造方法 |
| JP2004295718A (ja) | 2003-03-28 | 2004-10-21 | Hitachi Ltd | 情報処理装置の液例システム |
| JP2005011928A (ja) * | 2003-06-18 | 2005-01-13 | Matsushita Electric Ind Co Ltd | 液冷循環システム |
| KR20050034526A (ko) * | 2003-10-08 | 2005-04-14 | 가부시키가이샤 히타치세이사쿠쇼 | 액체 냉각 재킷 |
| KR20050051530A (ko) * | 2003-11-27 | 2005-06-01 | 엘에스전선 주식회사 | 판형 열전달 장치 |
| KR20050081842A (ko) * | 2004-02-16 | 2005-08-19 | 가부시키가이샤 히타치세이사쿠쇼 | 액랭 시스템 및 그를 구비한 전자 기기 |
| KR20060036249A (ko) * | 2004-10-25 | 2006-04-28 | 삼성전자주식회사 | 냉각장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200634495A (en) | 2006-10-01 |
| TWI317862B (enExample) | 2009-12-01 |
| US20060219388A1 (en) | 2006-10-05 |
| JP2006286767A (ja) | 2006-10-19 |
| EP1710660A3 (en) | 2010-11-03 |
| KR20060105617A (ko) | 2006-10-11 |
| US7516777B2 (en) | 2009-04-14 |
| EP1710660A2 (en) | 2006-10-11 |
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St.27 status event code: A-5-5-P10-P19-oth-PG1701 Patent document republication publication date: 20080411 Republication note text: Request for Correction Notice (Document Request) Gazette number: 1008062610000 Gazette reference publication date: 20080222 |
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