KR100782235B1 - 소결된 금속 플레이크 - Google Patents

소결된 금속 플레이크 Download PDF

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Publication number
KR100782235B1
KR100782235B1 KR1020047001319A KR20047001319A KR100782235B1 KR 100782235 B1 KR100782235 B1 KR 100782235B1 KR 1020047001319 A KR1020047001319 A KR 1020047001319A KR 20047001319 A KR20047001319 A KR 20047001319A KR 100782235 B1 KR100782235 B1 KR 100782235B1
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KR
South Korea
Prior art keywords
flakes
transfer material
heat transfer
heat
edges
Prior art date
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KR1020047001319A
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English (en)
Korean (ko)
Other versions
KR20040051582A (ko
Inventor
이그나티우스 제이. 라시아
Original Assignee
허니웰 인터내셔날 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 허니웰 인터내셔날 인코포레이티드 filed Critical 허니웰 인터내셔날 인코포레이티드
Publication of KR20040051582A publication Critical patent/KR20040051582A/ko
Application granted granted Critical
Publication of KR100782235B1 publication Critical patent/KR100782235B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • B22F3/1103—Making porous workpieces or articles with particular physical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
KR1020047001319A 2001-10-18 2001-10-18 소결된 금속 플레이크 KR100782235B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/032544 WO2003041165A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface

Publications (2)

Publication Number Publication Date
KR20040051582A KR20040051582A (ko) 2004-06-18
KR100782235B1 true KR100782235B1 (ko) 2007-12-05

Family

ID=21742921

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047001319A KR100782235B1 (ko) 2001-10-18 2001-10-18 소결된 금속 플레이크

Country Status (7)

Country Link
EP (1) EP1436835A2 (zh)
JP (1) JP4202923B2 (zh)
KR (1) KR100782235B1 (zh)
CN (2) CN1319162C (zh)
CA (1) CA2454155A1 (zh)
TW (1) TW578180B (zh)
WO (1) WO2003041165A2 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100529112B1 (ko) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 디스플레이 장치
TW200923975A (en) * 2007-10-12 2009-06-01 Cheil Ind Inc Composition for fabrication of electrode, electrode fabricated using the same, plasma display panel, and associated methods
US8968608B2 (en) 2008-01-17 2015-03-03 Nichia Corporation Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device
CN101319775B (zh) * 2008-07-18 2010-06-09 东莞东海龙环保科技有限公司 功率型led灯具的高导热柔性填隙材料
EP2405449B1 (en) * 2009-03-06 2017-08-16 Toyo Aluminium Kabushiki Kaisha Electrically conductive paste composition and electrically conductive film formed by using the same
US20130137322A1 (en) * 2010-08-31 2013-05-30 Polymatech Co., Ltd. Thermally Conductive Sheet
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
KR102360575B1 (ko) 2015-05-08 2022-02-09 헨켈 아이피 앤드 홀딩 게엠베하 소결성 필름 및 페이스트, 및 그의 사용 방법
WO2020189445A1 (ja) * 2019-03-20 2020-09-24 住友ベークライト株式会社 熱伝導性組成物および半導体装置
CN112207481A (zh) * 2020-09-09 2021-01-12 中山大学 一种低温无压烧结微米银焊膏及其制备方法和应用
CN113492281A (zh) * 2021-05-27 2021-10-12 中山大学 一种在裸铜上低温无压直接烧结的微米银焊膏及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118701A (ja) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk フレーク状金属粉末、金属多孔体およびフレーク状金属粉末の製造方法
JPH09162336A (ja) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp 放熱シート
JPH1060206A (ja) * 1996-06-27 1998-03-03 W L Gore & Assoc Inc 熱伝導性のポリテトラフルオロエチレン物品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (ja) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk 多孔型放熱体
CN1019760B (zh) * 1987-06-11 1992-12-30 国家机械工业委员会上海材料研究所 由球形金属粉末制造多孔元件的方法
JPH08213026A (ja) * 1994-11-28 1996-08-20 Katayama Tokushu Kogyo Kk 電池電極基板用金属多孔体、電池電極板およびその製造方法
JP4174088B2 (ja) * 1997-07-14 2008-10-29 住友ベークライト株式会社 導電性樹脂ペースト及びこれを用いて製造された半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118701A (ja) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk フレーク状金属粉末、金属多孔体およびフレーク状金属粉末の製造方法
JPH09162336A (ja) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp 放熱シート
JPH1060206A (ja) * 1996-06-27 1998-03-03 W L Gore & Assoc Inc 熱伝導性のポリテトラフルオロエチレン物品

Also Published As

Publication number Publication date
TW578180B (en) 2004-03-01
JP2005509293A (ja) 2005-04-07
JP4202923B2 (ja) 2008-12-24
WO2003041165A2 (en) 2003-05-15
CN101038795A (zh) 2007-09-19
CN1545731A (zh) 2004-11-10
KR20040051582A (ko) 2004-06-18
WO2003041165A3 (en) 2003-07-24
CN1319162C (zh) 2007-05-30
EP1436835A2 (en) 2004-07-14
CA2454155A1 (en) 2003-05-15

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