CN101319775B - 功率型led灯具的高导热柔性填隙材料 - Google Patents
功率型led灯具的高导热柔性填隙材料 Download PDFInfo
- Publication number
- CN101319775B CN101319775B CN2008101321220A CN200810132122A CN101319775B CN 101319775 B CN101319775 B CN 101319775B CN 2008101321220 A CN2008101321220 A CN 2008101321220A CN 200810132122 A CN200810132122 A CN 200810132122A CN 101319775 B CN101319775 B CN 101319775B
- Authority
- CN
- China
- Prior art keywords
- heat
- led
- thermal conductivity
- high thermal
- aluminium base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000565 sealant Substances 0.000 title claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 31
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000012530 fluid Substances 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000004094 surface-active agent Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract 6
- 239000004411 aluminium Substances 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000002923 metal particle Substances 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 6
- 230000000704 physical effect Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 10
- 230000008030 elimination Effects 0.000 abstract 2
- 238000003379 elimination reaction Methods 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000003786 synthesis reaction Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 239000013528 metallic particle Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008101321220A CN101319775B (zh) | 2008-07-18 | 2008-07-18 | 功率型led灯具的高导热柔性填隙材料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008101321220A CN101319775B (zh) | 2008-07-18 | 2008-07-18 | 功率型led灯具的高导热柔性填隙材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101319775A CN101319775A (zh) | 2008-12-10 |
CN101319775B true CN101319775B (zh) | 2010-06-09 |
Family
ID=40179966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101321220A Expired - Fee Related CN101319775B (zh) | 2008-07-18 | 2008-07-18 | 功率型led灯具的高导热柔性填隙材料 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101319775B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101718424B (zh) * | 2010-01-09 | 2013-05-29 | 沙振春 | 大功率led灯的镁合金散热结构 |
CN102141232A (zh) * | 2010-02-02 | 2011-08-03 | 上海三思电子工程有限公司 | Led照明光源的封装结构及其制作方法 |
CN111076103A (zh) * | 2019-11-28 | 2020-04-28 | 中国科学院宁波材料技术与工程研究所 | 一种荧光模组及激光照明系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2849473Y (zh) * | 2004-10-01 | 2006-12-20 | 沈锦祥 | 一种发光二极管射灯 |
CN101038795A (zh) * | 2001-10-18 | 2007-09-19 | 霍尼韦尔国际公司 | 导电膏及传热材料 |
-
2008
- 2008-07-18 CN CN2008101321220A patent/CN101319775B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101038795A (zh) * | 2001-10-18 | 2007-09-19 | 霍尼韦尔国际公司 | 导电膏及传热材料 |
CN2849473Y (zh) * | 2004-10-01 | 2006-12-20 | 沈锦祥 | 一种发光二极管射灯 |
Also Published As
Publication number | Publication date |
---|---|
CN101319775A (zh) | 2008-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101349417B (zh) | Led灯具散热技术的高导热填隙材料 | |
CN201918430U (zh) | 一种led基板整体式散热结构 | |
CN102135248A (zh) | 基于液态金属散热的螺纹连接结构的大功率led光源 | |
CN102280569A (zh) | 高导热基板及led器件及led组件 | |
TWM507138U (zh) | 散熱電路板 | |
CN202405323U (zh) | 一种将led芯片直接封装在均温板的结构及其灯具 | |
CN202196815U (zh) | 高导热基板及led器件及led组件 | |
CN101319775B (zh) | 功率型led灯具的高导热柔性填隙材料 | |
CN101350390B (zh) | 一种led封装结构 | |
CN101740678A (zh) | 固态发光元件及光源模组 | |
CN106098919A (zh) | 一种高导热高绝缘的led光引擎封装结构及制备方法 | |
CN201766098U (zh) | 一种大功率led与散热器的零热阻结构及led灯 | |
CN203309836U (zh) | 一种led光源、背光源、液晶显示装置 | |
CN102005530A (zh) | 一种大功率led散热单元 | |
CN103824928B (zh) | Led横向流体散热cob光源及其封装工艺 | |
CN101924178A (zh) | 一种led散热装置 | |
CN202474027U (zh) | 一种复合式led基板 | |
CN202473912U (zh) | 无电路基板led阵列光源 | |
CN204516803U (zh) | 大功率led低热阻散热结构 | |
CN202058730U (zh) | 一种led高导热绝缘基座封装的器件 | |
CN201303004Y (zh) | 新型led封装支架 | |
CN203596351U (zh) | 一种led-cob光源 | |
CN201788999U (zh) | 一种led散热装置 | |
CN209401650U (zh) | 一种led的cob光源封装结构 | |
CN217903138U (zh) | 一种基于cob封装的降低led芯片结温的led光源结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: DONGGUAN DONGHAILONG ENVIRONMENTAL SCIENCE + TECHN Free format text: FORMER OWNER: DU GUOPING Effective date: 20090612 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090612 Address after: The postcode of Lang Chau Cun, Changping Town, Guangdong City, Dongguan Province, China: 523589 Applicant after: Dongguan ESD Environmental Protection Technology Co., Ltd. Address before: Postal code of donghailong Industrial Park, Langzhou village, Changping Town, Dongguan City, Guangdong Province, China: 523589 Applicant before: Du Guo Ping Co-applicant before: Luo Guohao |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High thermal conductivity flexible sealant of power type LED lamp Effective date of registration: 20121126 Granted publication date: 20100609 Pledgee: Bank of Dongguan, Limited by Share Ltd, Changping branch Pledgor: Dongguan ESD Environmental Protection Technology Co., Ltd. Registration number: 2012990000733 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PP01 | Preservation of patent right |
Effective date of registration: 20151123 Granted publication date: 20100609 |
|
RINS | Preservation of patent right or utility model and its discharge | ||
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice |
Addressee: Dongguan ESD Environmental Protection Technology Co., Ltd. Document name: Notice of preservation procedure |
|
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice |
Addressee: Wang Jinhua Document name: Notice of preservation procedure |
|
PD01 | Discharge of preservation of patent | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20201123 Granted publication date: 20100609 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100609 Termination date: 20150718 |
|
CF01 | Termination of patent right due to non-payment of annual fee |