KR100778258B1 - 플라스마의 용적을 제어하는 방법 및 장치 - Google Patents

플라스마의 용적을 제어하는 방법 및 장치 Download PDF

Info

Publication number
KR100778258B1
KR100778258B1 KR1020027006164A KR20027006164A KR100778258B1 KR 100778258 B1 KR100778258 B1 KR 100778258B1 KR 1020027006164 A KR1020027006164 A KR 1020027006164A KR 20027006164 A KR20027006164 A KR 20027006164A KR 100778258 B1 KR100778258 B1 KR 100778258B1
Authority
KR
South Korea
Prior art keywords
magnetic
plasma
magnetic field
processing chamber
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020027006164A
Other languages
English (en)
Korean (ko)
Other versions
KR20020053854A (ko
Inventor
앤드류 디. Ⅲ 베일리
앨렌 엠. 쇼에프
니콜라스 브라이트
Original Assignee
램 리써치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 램 리써치 코포레이션 filed Critical 램 리써치 코포레이션
Publication of KR20020053854A publication Critical patent/KR20020053854A/ko
Application granted granted Critical
Publication of KR100778258B1 publication Critical patent/KR100778258B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32688—Multi-cusp fields

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
KR1020027006164A 1999-11-15 2000-11-14 플라스마의 용적을 제어하는 방법 및 장치 Expired - Lifetime KR100778258B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/439,759 US6322661B1 (en) 1999-11-15 1999-11-15 Method and apparatus for controlling the volume of a plasma
US09/439,759 1999-11-15

Publications (2)

Publication Number Publication Date
KR20020053854A KR20020053854A (ko) 2002-07-05
KR100778258B1 true KR100778258B1 (ko) 2007-11-22

Family

ID=23746030

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027006164A Expired - Lifetime KR100778258B1 (ko) 1999-11-15 2000-11-14 플라스마의 용적을 제어하는 방법 및 장치

Country Status (10)

Country Link
US (1) US6322661B1 (https=)
EP (1) EP1230667B1 (https=)
JP (1) JP5331283B2 (https=)
KR (1) KR100778258B1 (https=)
CN (2) CN1225005C (https=)
AT (1) ATE420455T1 (https=)
AU (1) AU3082201A (https=)
DE (1) DE60041350D1 (https=)
TW (1) TW530523B (https=)
WO (1) WO2001037311A2 (https=)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2575293Y2 (ja) 1992-03-09 1998-06-25 豊政 與那覇 電線一括巻取装置
US6558504B1 (en) * 1998-12-21 2003-05-06 Research Triangle Institute Plasma processing system and method
US6744213B2 (en) * 1999-11-15 2004-06-01 Lam Research Corporation Antenna for producing uniform process rates
US6320320B1 (en) 1999-11-15 2001-11-20 Lam Research Corporation Method and apparatus for producing uniform process rates
US6518705B2 (en) 1999-11-15 2003-02-11 Lam Research Corporation Method and apparatus for producing uniform process rates
AU1606101A (en) * 1999-11-15 2001-05-30 Lam Research Corporation Materials and gas chemistries for processing systems
US20020142612A1 (en) * 2001-03-30 2002-10-03 Han-Ming Wu Shielding plate in plasma for uniformity improvement
US7374636B2 (en) * 2001-07-06 2008-05-20 Applied Materials, Inc. Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor
US7422654B2 (en) * 2003-02-14 2008-09-09 Applied Materials, Inc. Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
KR100988085B1 (ko) * 2003-06-24 2010-10-18 삼성전자주식회사 고밀도 플라즈마 처리 장치
EP2087778A4 (en) 2006-08-22 2010-11-17 Mattson Tech Inc INDUCTIVE PLASMA SOURCE WITH HIGH COUPLING EFFICIENCY
US8992725B2 (en) * 2006-08-28 2015-03-31 Mattson Technology, Inc. Plasma reactor with inductie excitation of plasma and efficient removal of heat from the excitation coil
US8092605B2 (en) * 2006-11-28 2012-01-10 Applied Materials, Inc. Magnetic confinement of a plasma
US7824519B2 (en) * 2007-05-18 2010-11-02 Lam Research Corporation Variable volume plasma processing chamber and associated methods
MX350703B (es) 2009-05-13 2017-09-14 Sio2 Medical Products Inc Metodo de gasificacion para inspeccionar una superficie revestida.
WO2013170052A1 (en) 2012-05-09 2013-11-14 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
WO2011022612A2 (en) * 2009-08-21 2011-02-24 Mattson Technology, Inc. Inductive plasma source
JP5367522B2 (ja) 2009-09-24 2013-12-11 東京エレクトロン株式会社 プラズマ処理装置及びシャワーヘッド
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
CN102573258B (zh) * 2010-12-15 2014-11-05 北京北方微电子基地设备工艺研究中心有限责任公司 感应耦合等离子体装置
JP5661513B2 (ja) 2011-03-03 2015-01-28 東京エレクトロン株式会社 プラズマ処理装置
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
JP5870568B2 (ja) * 2011-05-12 2016-03-01 東京エレクトロン株式会社 成膜装置、プラズマ処理装置、成膜方法及び記憶媒体
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
EP2776603B1 (en) 2011-11-11 2019-03-06 SiO2 Medical Products, Inc. PASSIVATION, pH PROTECTIVE OR LUBRICITY COATING FOR PHARMACEUTICAL PACKAGE, COATING PROCESS AND APPARATUS
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
CA2890066C (en) 2012-11-01 2021-11-09 Sio2 Medical Products, Inc. Coating inspection method
US9903782B2 (en) 2012-11-16 2018-02-27 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
JP6382830B2 (ja) 2012-11-30 2018-08-29 エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド 医療シリンジ、カートリッジ等上でのｐｅｃｖｄ堆積の均一性制御
JP5939147B2 (ja) 2012-12-14 2016-06-22 東京エレクトロン株式会社 成膜装置、基板処理装置及び成膜方法
US9662450B2 (en) 2013-03-01 2017-05-30 Sio2 Medical Products, Inc. Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
EP2971228B1 (en) 2013-03-11 2023-06-21 Si02 Medical Products, Inc. Coated packaging
US20160017490A1 (en) 2013-03-15 2016-01-21 Sio2 Medical Products, Inc. Coating method
WO2015148471A1 (en) 2014-03-28 2015-10-01 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
EP3337915B1 (en) 2015-08-18 2021-11-03 SiO2 Medical Products, Inc. Pharmaceutical and other packaging with low oxygen transmission rate
US12374531B2 (en) * 2020-09-25 2025-07-29 Tokyo Electron Limited Plasma processing apparatus
JP7607512B2 (ja) * 2020-09-25 2024-12-27 東京エレクトロン株式会社 プラズマ処理装置
CN113735632B (zh) * 2021-09-03 2022-05-17 重庆大学 一种磁控式空气等离子体制备氮肥系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078679A2 (en) * 1981-10-29 1983-05-11 Fujitsu Limited An electrode connection structure in a semiconductor device
JPH08325739A (ja) * 1995-05-30 1996-12-10 Anelva Corp プラズマ処理装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6348826A (ja) * 1986-08-19 1988-03-01 Toshiba Corp ドライエツチング装置
KR920002864B1 (ko) * 1987-07-20 1992-04-06 가부시기가이샤 히다찌세이사꾸쇼 플라즈마 처리방법 및 그 장치
US5032205A (en) * 1989-05-05 1991-07-16 Wisconsin Alumni Research Foundation Plasma etching apparatus with surface magnetic fields
US4990229A (en) 1989-06-13 1991-02-05 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5122251A (en) 1989-06-13 1992-06-16 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5429070A (en) 1989-06-13 1995-07-04 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5421891A (en) 1989-06-13 1995-06-06 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5091049A (en) 1989-06-13 1992-02-25 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US4948458A (en) 1989-08-14 1990-08-14 Lam Research Corporation Method and apparatus for producing magnetically-coupled planar plasma
JP3126405B2 (ja) * 1991-04-30 2001-01-22 株式会社日立製作所 スパッタデポジション装置
US5226967A (en) 1992-05-14 1993-07-13 Lam Research Corporation Plasma apparatus including dielectric window for inducing a uniform electric field in a plasma chamber
US5401350A (en) 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
US5484485A (en) * 1993-10-29 1996-01-16 Chapman; Robert A. Plasma reactor with magnet for protecting an electrostatic chuck from the plasma
FR2715019B1 (fr) * 1994-01-13 1996-04-05 Plasmion Dispositif pour former un plasma par application de micro-ondes afin de produire un faisceau d'ions.
JP3365067B2 (ja) 1994-02-10 2003-01-08 ソニー株式会社 プラズマ装置およびこれを用いたプラズマ処理方法
US5587038A (en) 1994-06-16 1996-12-24 Princeton University Apparatus and process for producing high density axially extending plasmas
US5540800A (en) 1994-06-23 1996-07-30 Applied Materials, Inc. Inductively coupled high density plasma reactor for plasma assisted materials processing
US5811022A (en) * 1994-11-15 1998-09-22 Mattson Technology, Inc. Inductive plasma reactor
US5810932A (en) 1995-11-22 1998-09-22 Nec Corporation Plasma generating apparatus used for fabrication of semiconductor device
TW303480B (en) * 1996-01-24 1997-04-21 Applied Materials Inc Magnetically confined plasma reactor for processing a semiconductor wafer
US6054013A (en) 1996-02-02 2000-04-25 Applied Materials, Inc. Parallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density
US5669975A (en) 1996-03-27 1997-09-23 Sony Corporation Plasma producing method and apparatus including an inductively-coupled plasma source
US6048435A (en) * 1996-07-03 2000-04-11 Tegal Corporation Plasma etch reactor and method for emerging films
US5824607A (en) * 1997-02-06 1998-10-20 Applied Materials, Inc. Plasma confinement for an inductively coupled plasma reactor
US6189484B1 (en) 1999-03-05 2001-02-20 Applied Materials Inc. Plasma reactor having a helicon wave high density plasma source
JP2001093699A (ja) * 1999-09-22 2001-04-06 Hitachi Kokusai Electric Inc プラズマ処理装置
US6341574B1 (en) 1999-11-15 2002-01-29 Lam Research Corporation Plasma processing systems

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078679A2 (en) * 1981-10-29 1983-05-11 Fujitsu Limited An electrode connection structure in a semiconductor device
JPH08325739A (ja) * 1995-05-30 1996-12-10 Anelva Corp プラズマ処理装置

Also Published As

Publication number Publication date
CN1423828A (zh) 2003-06-11
AU3082201A (en) 2001-05-30
DE60041350D1 (de) 2009-02-26
EP1230667A2 (en) 2002-08-14
EP1230667B1 (en) 2009-01-07
JP2003514386A (ja) 2003-04-15
WO2001037311A3 (en) 2001-10-11
TW530523B (en) 2003-05-01
CN100437897C (zh) 2008-11-26
JP5331283B2 (ja) 2013-10-30
CN1225005C (zh) 2005-10-26
WO2001037311A2 (en) 2001-05-25
CN1747133A (zh) 2006-03-15
US6322661B1 (en) 2001-11-27
KR20020053854A (ko) 2002-07-05
ATE420455T1 (de) 2009-01-15

Similar Documents

Publication Publication Date Title
KR100778258B1 (ko) 플라스마의 용적을 제어하는 방법 및 장치
KR100988085B1 (ko) 고밀도 플라즈마 처리 장치
US7067034B2 (en) Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma
KR100691294B1 (ko) 플라즈마의 체적을 제어하기 위해 자계를 변화시키는 방법및 장치
US5824605A (en) Gas dispersion window for plasma apparatus and method of use thereof
JP3438696B2 (ja) プラズマ処理方法及び装置
EP0786794B1 (en) Plasma reactors for processing semiconductor wafers
US6471822B1 (en) Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma
KR100515562B1 (ko) 링의 형상의 고밀도 플라스마의 생성원 및 그의 생성 방법
US6863835B1 (en) Magnetic barrier for plasma in chamber exhaust
JP4896164B2 (ja) プラズマ処理装置
JP2002289595A (ja) エッチング装置およびエッチング方法
KR100455350B1 (ko) 유도 결합형 플라즈마 발생 장치 및 방법
JPH11135297A (ja) プラズマ発生器
JP4527432B2 (ja) プラズマ処理方法及びプラズマ処理装置
JP7091074B2 (ja) プラズマ処理装置
KR102553385B1 (ko) 기판 처리 장치
JP4554117B2 (ja) 表面処理装置
JP2001093699A (ja) プラズマ処理装置
KR20040021809A (ko) 부위별로 단면적이 다른 안테나를 구비한 유도결합플라즈마 발생장치

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20020514

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20051111

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20070131

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20070920

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20071115

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20071115

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20101028

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20101028

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20111027

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20111027

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20121025

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20121025

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20131025

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20131025

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20141028

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20141028

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20151027

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20151027

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20161027

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20161027

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20171026

Year of fee payment: 11

PR1001 Payment of annual fee

Payment date: 20171026

Start annual number: 11

End annual number: 11

FPAY Annual fee payment

Payment date: 20181026

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20181026

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20191031

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20191031

Start annual number: 13

End annual number: 13

EXPY Expiration of term
PC1801 Expiration of term